JP2001203306A - Radiating device for heat generating component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiating device for a heat generating component of an L shape having a high radiating efficiency without increasing the thermal resistance at a bent part. SOLUTION: The radiating device for the heating component is formed by connecting two flat plate-like radiating plates 1, 2 each having good thermal conductivity of an aluminum, a copper, an iron or the like by a joint 3 having a bent part 31, and connecting ends 32, 33 and forming it in a desired shape such as an L shape or the like. Since the joint 3 is manufactured in the L shape by extrusion molding, mold molding or the like, a molecular structure of the metal of the bent part is not changed, and its thermal resistance is not increased. The plates 1, 2 are engaged with U-shaped grooves formed on the ends 32, 33 of the joint 3, and the heat generating component such as a transistor, an IC or the like is mounted on the plate 1 in a closely contacted state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
More specifically, the present invention relates to an L-shaped heat radiating device for radiating heat generated by a heat-generating component such as C, and more particularly, to an L-shaped heat-generating component capable of minimizing the thermal resistance of a bent portion using an L-shaped joint. It relates to a heat dissipation device.

[0002]

2. Description of the Related Art As a conventional radiator for radiating heat generated inside a heat-generating component such as a transistor or an IC, FIG.
A heat dissipation device as shown in FIG. 4 is known. In the heat radiating device shown in FIG. 3, a heat radiating plate 11 made of a flat plate made of aluminum, copper, iron, or the like is attached to a printed circuit board 13, and a heat-generating component 14 is attached to the heat radiating plate 11 in a state where the flat surfaces are in close contact with each other. The mounting and the heat-generating component 14 were cooled. FIG.
As shown in FIG. 2, there is also known a device in which the heat radiating plate 12 has an L-shaped cross section to secure a heat radiating area of the heat radiating plate 12.

[0003]

By the way, with the miniaturization of the power supply, a heat radiating device using a flat heat radiating plate as shown in FIG. 3 cannot secure a sufficient area for heat radiation by increasing the output. . Also, an L-shaped heat sink as shown in FIG. 4 as an improved type of FIG. 3 is generally formed by bending a flat plate made of aluminum, copper, iron, or the like at substantially right angles. However, when a metal plate is bent, the thermal resistance at the bent portion increases, a temperature difference of about 15 ° C. occurs before and after bending, and the effect of merely increasing the area of the heat sink does not occur. In some cases, a heat radiation effect could not be obtained. Therefore, an object of the present invention is to provide a heat radiating device for a heat generating component having a high heat radiating effect without increasing a thermal resistance at a bent portion.

[0004]

Means for Solving the Problems The present invention has been made to achieve the above object, and a first technical means is a heat radiating device for a heat generating component, wherein two flat radiating plates are connected. It is characterized by being formed in an L shape by the portion.

According to a second technical means, in the heat radiating device for a heat-generating component according to the first technical means, the connecting portion comprises an L-shaped joint.

According to a third technical means, in the heat radiating device for a heat generating component according to the second technical means, a U-shaped groove is formed at a connection end of the L-shaped joint, and the U-shaped groove is formed in the U-shaped groove. An end of the flat heat radiating plate is fitted.

According to a fourth technical means, in the heat radiating device for a heat generating component according to the third technical means, irregularities are formed on an inner surface of the U-shaped groove or an end of the heat radiating plate.

(Function) In the present invention, instead of directly bending the heat sink, the two heat sinks are joined to each other by a joint having a bent portion and a connection end to form a desired shape, and a maximum area is obtained with a minimum area. It is possible to provide a heat radiating device for a heat generating component having a limited heat radiating effect.

[0009]

1 and 2 show an embodiment of the present invention.
A description will be given based on the embodiment shown in FIG. FIG. 1 is a side view showing a heat radiating structure using a heat radiating device for a heat generating component according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view showing a joint part shown in FIG. In the following description, portions different from the heat dissipation structure of the conventional example shown in FIGS. 3 and 4 will be mainly described.

The heat radiating device of the present embodiment does not directly bend a flat plate as in the conventional example shown in FIG. They are connected by the provided joint 3 to form a desired shape such as an L-shape. The joint 3 is not formed by bending a metal plate, but is formed by using a material having good thermal conductivity such as aluminum, copper, iron or the like, for example, by extrusion molding or die molding, similarly to the heat sink 1. I do. According to such a manufacturing method, the molecular structure of the metal at the bent portion does not change, and the thermal conductivity of the metal material does not change, so that the thermal resistance is almost maintained at the thermal resistance of the metal material, The thermal resistance of the bent part can be minimized.

FIG. 2 is an enlarged perspective view showing the joint 3 in detail, wherein a U-shaped groove is formed on the end surfaces of the connecting ends 32 and 33 of the bent portion 31 forming substantially 90 ° of the joint 3. Then, fine irregularities are provided on the entire inner surface of the U-shaped groove. Fitting 3
In order to attach the heat radiating plates 1 and 2 to the heat sink, press-fitting, crimping, and the like can be considered, the adhesion between the connecting ends 32 and 33 and the heat radiating plates 1 and 2 is improved, and the heat resistance at the connecting ends 32 and 33 is improved. Increase can be minimized. Fine irregularities may be provided on the heat radiating plates 1 and 2 side, and may be provided on both the connection end portions 32 and 33 and the heat radiating plates 1 and 2 side so that both are fitted more closely. Thus, the heat radiating device formed by joining the heat radiating plates 1 and 2 with the joint 3 can be a heat radiating device having the maximum heat radiating effect with the minimum area. In addition,
In order to further improve the heat radiation effect, fins can be formed on the heat radiation plates 1 and 2 and the joint 3.

The heat radiating device for a heat-generating component having the above-mentioned structure is mounted on the printed circuit board 4 by using screws 5, and the heat-generating component 6 such as a transistor or an IC is mounted on the heat radiating plate 1 in a state of being in close contact therewith. In this embodiment, the heat sink 1 is L
The L-shape may be formed by bending, and is not essential because the heat radiating device is used for attaching the heat radiating device to the printed circuit board 4 with the screw 5.

[0013]

According to the present invention having the above-described configuration, the heat resistance of the bent portion of the L-shaped heat radiating device is smaller than that of the conventional L-shaped heat radiating plate, and the heat radiating device has the same heat radiating capacity. In this case, a heat radiating plate having a smaller area can be used, and a heat radiating plate of the same size has a larger heat radiating capacity and can be used for a power supply of a higher output type. In addition, by standardizing the joint, the mold to be manufactured can be simplified, the cost of the mold can be reduced, and the cost of the joint can be reduced, thereby providing an inexpensive and efficient heat dissipation device. can do.

[Brief description of the drawings]

FIG. 1 is a side view showing a heat radiating structure using a heat radiating device for a heat generating component of the present invention.

FIG. 2 is an enlarged partial perspective view showing a connection portion of the heat-radiating component heat radiating device of the present invention.

FIG. 3 is a perspective view showing a heat dissipation structure using a conventional flat heat dissipation plate.

FIG. 4 is a perspective view showing a heat dissipation structure using a conventional L-shaped heat dissipation plate.

[Explanation of symbols]

Reference numerals 1 and 2 radiator plates, 3 joints, 4 printed circuit boards, 5 screws, 6 heat generating components, 31 bent portions, 32, 33 connection end portions.

Claims (4)

[Claims] 1. The two flat heat radiating plates are connected to each other by a connecting portion.
A heat radiating device for a heat-generating component, which is formed in a letter shape. 2. The heat-dissipating device for a heat-generating component according to claim 1, wherein said connecting portion comprises an L-shaped joint. 3. The heat radiating device for a heat generating component according to claim 2, wherein a U-shaped groove is formed at a connection end of the L-shaped joint, and the U-shaped groove is provided with the flat plate radiating plate. A heat dissipating device for a heat-generating component, the end of which is fitted. 4. The heat radiating device for a heat generating component according to claim 3, wherein irregularities are formed on an inner surface of the U-shaped groove or an end of the heat radiating plate.