JP2001196811A - High frequency waveguide - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high frequency waveguide capable of preventing a high frequency circuit from being erroneously operated by reducing a coupling amount between adjacent waveguides. SOLUTION: In the high frequency waveguide, a plurality of waveguide adopting strip lines or square windows are provided in a dielectric and plural through holes passing through both sides of the dielectric substrate are formed between adjacent plural waveguides. The arranging interval of the through holes is defined as about 1/4 of the wavelength of a high frequency signal passing through the waveguide, thus the coupling amount between the adjacent waveguides is reduced to prevent the high frequency circuit from being erroneously operated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency waveguide for forming a high-frequency circuit in a communication device and a radar system using a high-frequency signal, for example.

[0002]

2. Description of the Related Art FIG. 9 shows a conventional high-frequency waveguide. In the figure, reference numeral 1 denotes a dielectric substrate, 2a denotes a first waveguide, 2b denotes a second waveguide, and 3 denotes front and back conductive through holes arranged at an interval Wt.

FIG. 10 is a diagram showing the coupling characteristics of adjacent waveguides in a conventional high-frequency waveguide. In the figure, a curve a represents a characteristic in a case where the distance Wt between the front and back conductive through holes 3 is other than approximately 及 び and 波長 wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b, and a curve b.
Indicates that the distance Wt between the front and back conductive through holes 3 is the first and second
Of the high-frequency signal passing through the waveguides 2a and 2b
The characteristic in the case of two wavelengths, F0 is the first and second waveguides 2a
And 2b.

Next, the operation and characteristics of the conventional high-frequency waveguide will be described. In FIG. 9, the first waveguide 2a and the second waveguide 2b conduct high-frequency signals. The front and back conductive through holes 3 are formed by the first waveguide 2a and the second waveguide 2a.
The coupling amount of the high-frequency signal between b is reduced. The degree of this coupling changes depending on the arrangement interval Wt and the number of the front and back conductive through holes 3 and the like. As shown in FIG. 10, when the arrangement interval Wt is set to a value other than approximately 及 び and 波長 wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b, the coupling amount as shown by a curve a Can be reduced, but when the wavelength is approximately 概略 wavelength, the coupling amount becomes remarkably large as shown by the curve b. As described above, in the conventional high-frequency waveguide, since the arrangement interval Wt of the front and back conductive through holes 3 is not controlled, the coupling amount between the two waveguides becomes extremely large depending on the arrangement interval Wt, and the malfunction of the high-frequency circuit occurs. And so on, which is a problem.

[0005]

As described above, in the conventional high-frequency waveguide, the arrangement interval of the front and back conductive through holes provided to reduce the coupling amount of the high-frequency signal between the plurality of waveguides is not controlled. Therefore, there is a problem that the coupling amount becomes extremely large depending on the arrangement interval, which causes a malfunction or the like of the high-frequency circuit.

It is an object of the present invention to provide a high-frequency waveguide capable of reducing the amount of coupling between adjacent waveguides and preventing malfunction of a high-frequency circuit. is there.

[0007]

A high-frequency waveguide according to a first aspect of the present invention has an interval of approximately 1/4 wavelength of a high-frequency signal passing through the waveguide between a plurality of adjacent waveguides provided in a dielectric. A plurality of front and back conductive through holes are provided.

The high-frequency waveguide according to the second invention is
A plurality of grounded front and back conductive through-holes are arranged on a microstrip substrate in parallel with the strip line, and a plurality of ground through-holes are provided in the direction perpendicular to the strip line at intervals of approximately １ ／ wavelength of a high-frequency signal passing through the strip line. It is provided.

In the high-frequency waveguide according to the third aspect of the present invention, a plurality of grounding front and back conductive through-holes are arranged in parallel with the strip line on the triplate substrate, and pass through the strip line in a direction perpendicular to the strip line. A plurality of high-frequency signals are provided at intervals of approximately 1/4 wavelength.

A high-frequency waveguide according to a fourth aspect of the present invention comprises:
On the coplanar substrate, a plurality of grounded front and back conductive through holes are arranged in parallel with the strip line, and a plurality of ground through holes are provided in the direction perpendicular to the strip line with an interval of approximately 1/4 wavelength of a high frequency signal passing through the strip line. It is a thing.

A high-frequency waveguide according to a fifth aspect of the present invention provides a waveguide formed by providing a rectangular or circular hole in the thickness direction of a dielectric substrate provided with a ground conductor pattern on the front and back surfaces, and further laminating the hole. Around this waveguide, through-holes for grounding on the front and back are formed to approximately 1/4 of the high-frequency signal passing through the waveguide.
A plurality is provided with a wavelength interval.

A high-frequency waveguide according to a sixth aspect of the present invention comprises:
A waveguide is formed by laminating a dielectric substrate provided with a grounding conductor pattern around a square or circular window for conducting high-frequency signals, and a front-back conduction through-hole for grounding is formed around the waveguide.高周波 of high-frequency signal passing through
A plurality is provided with a wavelength interval.

A high frequency waveguide according to a seventh aspect of the present invention is provided with a groove for conducting a high frequency signal on the first dielectric substrate,
A waveguide is formed by laminating the first dielectric substrate or a second dielectric substrate provided with a ground conductor pattern on the front and back surfaces to form a waveguide. Around this waveguide, front and back conductive through holes for grounding are formed. A plurality of high-frequency signals passing through the waveguide are provided at intervals of approximately 1/4 wavelength.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a configuration diagram of a high-frequency waveguide according to a first embodiment of the present invention.
Denotes a dielectric substrate, 2a denotes a first waveguide, 2b denotes a second waveguide, and 3 denotes front and back conduction through holes arranged at an interval Wt.

FIG. 2 is a diagram showing the coupling characteristics of the high-frequency waveguide of FIG. In the drawing, a curve c indicates that the distance Wt between the front and back conductive through holes 3 is different from that of the first and second waveguides 2.
F0 is the characteristic of the high-frequency signal passing through the first and second waveguides 2a and 2b in the case of approximately 1/4 wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b.

Next, the operation and characteristics will be described. In FIG. 1, a first waveguide 2a and a second waveguide 2b conduct a high-frequency signal. The front and back conduction through holes 3 reduce the amount of coupling of high-frequency signals between the first waveguide 2a and the second waveguide 2b. The degree of this coupling varies depending on the arrangement interval Wt and the number of the front and back conductive through holes 3,
When the arrangement interval Wt is set to approximately １ ／ wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b, the degree of coupling can be minimized as shown by a curve c in FIG. As described above, the arrangement interval Wt of the front and back conductive through holes 3 is set to the first value.
In addition, by setting the wavelength of the high-frequency signal passing through the second waveguides 2a and 2b to be approximately 波長 wavelength, malfunction of the high-frequency circuit can be prevented.

Embodiment 2 FIG. FIG. 3 is a configuration diagram of a high-frequency waveguide according to a second embodiment of the present invention, wherein 1 is a dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, and 3 is arranged at an interval Wt. The front and back conductive through holes 4 are ground conductor patterns provided on the back surface of the dielectric substrate 1,
A microstrip substrate is constituted by 2a, 2b and 4.

Next, the operation and characteristics will be described. In FIG. 3, a first waveguide 2a and a second waveguide 2b formed on the surface of a dielectric substrate 1 conduct high-frequency signals. The front and back conductive through holes 3 from the ground conductor pattern 4 provided on the back surface of the dielectric substrate 1 are connected to the first waveguide 2a and the second
The coupling amount of the high-frequency signal between the waveguides 2b is reduced. The arrangement interval Wt of the front and back conductive through holes 3 is set to the first
When the wavelength is approximately 概略 of the high-frequency signal passing through the second waveguides 2a and 2b, the coupling amount can be minimized as shown by the curve c in FIG. As described above, the arrangement interval Wt of the front and back conductive through holes 3 is set to the first and second waveguides 2.
By making the wavelength of the high-frequency signal passing through a and 2b approximately 1/4 wavelength, malfunction of the high-frequency circuit can be prevented.

Embodiment 3 FIG. 4 is a configuration diagram of a high-frequency waveguide according to a third embodiment of the present invention, wherein 1 is a dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, and 3 is arranged at an interval Wt. The front and back conductive through holes 4 are ground conductor patterns provided on the back surface of the dielectric substrate 1,
2a, 2b and 4 constitute a triplate substrate.

Next, the operation and characteristics will be described. In FIG. 4, a first waveguide 2a and a second waveguide 2b formed in a dielectric substrate 1 sandwiched between two ground conductor patterns 4 conduct high-frequency signals. The front-to-back conduction through hole 3 from the ground conductor pattern 4 is the first waveguide 2a.
And the amount of high frequency signal coupling between the second waveguide 2b and the second waveguide 2b. The arrangement interval W of the front and back conductive through holes 3
When t is set to approximately １ ／ wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b, the coupling amount can be minimized as shown by a curve c in FIG. As described above, the arrangement interval Wt of the front and back conductive through holes 3 is set to approximately ４ of the high-frequency signal passing through the first and second waveguides 2a and 2b.
By setting the wavelength, malfunction of the high-frequency circuit can be prevented.

Embodiment 4 FIG. FIG. 5 is a configuration diagram of a high-frequency waveguide according to a fourth embodiment of the present invention, wherein 1 is a dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, and 3 is arranged at an interval Wt. The front and back conductive through holes 4 are ground conductor patterns provided on the back surface of the dielectric substrate 1,
A coplanar substrate is constituted by 2a, 2b and 4.

Next, the operation and characteristics will be described. In FIG. 5, a first waveguide 2a and a second waveguide 2a formed on the surface of a dielectric substrate 1 together with a ground conductor pattern 4 are shown.
b conducts a high frequency signal. The front and back conductive through holes 3 from the ground conductor pattern 4 reduce the amount of coupling of high-frequency signals between the first waveguide 2a and the second waveguide 2b. The arrangement interval Wt of the front and back conductive through holes 3 is set to the first
When the wavelength is approximately １ ／ of the high-frequency signal passing through the second waveguide, the coupling amount can be minimized as shown by the curve c in FIG. Thus, the front and back conductive through holes 3
By setting the arrangement interval Wt to be approximately 波長 wavelength of the high-frequency signal passing through the first and second waveguides 2a and 2b, malfunction of the high-frequency circuit can be prevented.

Embodiment 5 FIG. 6 is a configuration diagram of a high-frequency waveguide according to a fifth embodiment of the present invention, wherein 1 is a dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, and 3 is arranged at an interval Wt. The front and back conductive through-holes 4 are ground conductor patterns, and a high-frequency waveguide is formed in a square hole in the dielectric by 1-4.

Next, the operation and characteristics will be described. In FIG. 6, the first dielectric substrate 1
The waveguide 2a and the second waveguide 2b (square hole) conduct high-frequency signals. The front and back conductive through holes 3 are the first
Of the high-frequency signal between the second waveguide 2a and the second waveguide 2b. This front and back conduction through hole 3
Is approximately 1/4 wavelength of the high-frequency signal passing through the first waveguide 2a and the second waveguide 2b, the coupling degree can be minimized as shown by the curve c in FIG. it can. As described above, by setting the arrangement interval Wt of the front and back conductive through holes 3 to be approximately 波長 wavelength of the high frequency signal passing through the first and second waveguides 2a and 2b, malfunction of the high frequency circuit can be prevented. Becomes

Embodiment 6 FIG. FIG. 7 is a configuration diagram of a high-frequency waveguide according to a sixth embodiment of the present invention, wherein 1 is a dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, and 3 is arranged at an interval Wt. The front and back conductive through holes 4 are ground conductor patterns, and the first waveguide 2a and the second waveguide 2b are formed by laminating square windows surrounded by the ground conductor pattern 4 on the front and back surfaces of the dielectric substrate 1. It is composed.

Next, the operation and characteristics will be described. In FIG. 7, the first dielectric substrate 1
The waveguide 2a and the second waveguide 2b (portion surrounded by the front and back conduction through holes) conduct high frequency signals. The front and back conduction through holes 3 reduce the amount of coupling of high-frequency signals between the first waveguide 2a and the second waveguide 2b. Assuming that the arrangement interval Wt of the front and back conduction through holes 3 is approximately 波長 wavelength of the high frequency signal passing through the first waveguide 2a and the second waveguide 2b, the coupling degree is as shown by a curve c in FIG. Can be minimized. As described above, by setting the arrangement interval Wt of the front and back conduction through holes 3 to be approximately 波長 wavelength of the high frequency signal passing through the first and second waveguides 2a and 2b, malfunction of the high frequency circuit can be prevented. Becomes

Embodiment 7 FIG. 8 is a configuration diagram of a high-frequency waveguide according to a seventh embodiment of the present invention.
A dielectric substrate, 1b is a second dielectric substrate, 2a is a first waveguide, 2b is a second waveguide, 3 is a front-back conduction through hole arranged at an interval Wt, and 4 is a ground conductor pattern. The first waveguide 2a and the second waveguide 2b are formed by providing grooves for conducting high-frequency signals in the first dielectric substrate 1a and the second dielectric substrate 1b, and laminating the grooves. ing.

Next, the operation and characteristics will be described. In FIG. 8, the first waveguide 2a and the second waveguide 2b formed in the laminated first dielectric substrate 1a and second dielectric substrate 1b conduct high-frequency signals. The front and back conduction through holes 3 are formed by the first waveguide 2a and the second waveguide 2a.
The coupling amount of the high-frequency signal during b is reduced. Assuming that the arrangement interval Wt of the front and back conduction through holes 3 is approximately 波長 wavelength of the high frequency signal passing through the first waveguide 2a and the second waveguide 2b, the coupling degree is as shown by a curve c in FIG. Can be minimized. As described above, the arrangement interval Wt of the front and back conduction through holes 3 is set to the first and second waveguides 2a.
And 2b, it is possible to prevent malfunction of the high-frequency circuit by making it approximately 1/4 wavelength of the high-frequency signal.

[0029]

According to the first aspect of the present invention, a plurality of front and back conductive through holes are provided between a plurality of adjacent waveguides provided in a dielectric with an interval of approximately 1/4 wavelength of a high frequency signal passing through the waveguides. With the provision, the coupling between the adjacent waveguides can be reduced, so that malfunction of the high-frequency circuit can be prevented.

According to the second aspect of the present invention, a plurality of front and back conductive through holes for grounding are provided in the microstrip substrate in parallel with the strip line, and the microstrip substrate passes through the strip line in a direction perpendicular to the strip line. By providing a plurality of high-frequency signals at intervals of approximately 1/4 wavelength, the coupling between adjacent waveguides can be reduced, so that malfunction of the high-frequency circuit can be prevented.

According to the third aspect of the present invention, a plurality of grounding front and back conductive through holes are provided in the triplate substrate in parallel with the strip line, and the high-frequency signal passing through the strip line in a direction perpendicular to the strip line. Outline 1/4 of
Since a plurality of waveguides are provided at intervals of the wavelength, coupling between adjacent waveguides can be reduced, so that malfunction of the high-frequency circuit can be prevented.

According to the fourth aspect of the invention, a plurality of front and back conductive through holes for grounding are provided in the coplanar substrate in parallel with the strip line, and the high-frequency wave passing through the strip line in a direction perpendicular to the strip line. Signal summary 1 /
By providing a plurality of waveguides at intervals of four wavelengths, the coupling between adjacent waveguides can be reduced, so that malfunction of the high-frequency circuit can be prevented.

According to the fifth aspect of the present invention, a hole is provided in the thickness direction of the dielectric substrate having the ground conductor pattern on the front and back surfaces, and the hole is further laminated thereon to form a waveguide. ,
By providing a plurality of grounding front and back conduction through holes at intervals of approximately 波長 wavelength of a high-frequency signal passing through the waveguide, coupling between adjacent waveguides can be reduced, so that a high-frequency circuit malfunctions Can be prevented.

According to the sixth aspect of the present invention, a waveguide is formed by laminating a dielectric substrate having a ground conductor pattern provided around a window for conducting a high-frequency signal, and a waveguide is formed around the waveguide.
By providing a plurality of grounding front and back conduction through holes at intervals of approximately 波長 wavelength of a high-frequency signal passing through the waveguide, coupling between adjacent waveguides can be reduced, so that a high-frequency circuit malfunctions Can be prevented.

According to the seventh aspect of the present invention, the first dielectric substrate is provided with a groove for conducting high-frequency signals, and the first dielectric substrate or the second dielectric substrate provided with the ground conductor pattern on the front and back surfaces. By forming a waveguide by laminating body substrates and the like, and providing a plurality of grounding front and back conduction through holes around this waveguide with an interval of about 1/4 wavelength of a high frequency signal passing through the waveguide Since the coupling between the adjacent waveguides can be reduced, malfunction of the high-frequency circuit can be prevented.

[Brief description of the drawings]

FIG. 1 is a first embodiment of a high-frequency waveguide according to the present invention;
FIG.

FIG. 2 is a diagram showing characteristics of a high-frequency waveguide according to the present invention.

FIG. 3 is a second embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 4 is a third embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 5 is a fourth embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 6 is a fifth embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 7 is a sixth embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 8 is a seventh embodiment of the high-frequency waveguide according to the present invention;
FIG.

FIG. 9 is a diagram showing a conventional high-frequency waveguide.

FIG. 10 is a diagram showing characteristics of a conventional high-frequency waveguide.

[Explanation of symbols]

1a first dielectric substrate, 1b second dielectric substrate, 2
a 1st waveguide, 2b 2nd waveguide, 3 front and back conduction through holes, 4 ground conductor patterns.

Claims (7)

[Claims] In a high-frequency waveguide for transmitting a high-frequency signal, a conductive through-hole is formed between a plurality of adjacent waveguides provided in a dielectric with an interval of approximately 1/4 wavelength of a high-frequency signal passing through the waveguide. A high-frequency waveguide, wherein a plurality of the high-frequency waveguides are provided. 2. A high-frequency waveguide for transmitting a high-frequency signal, comprising: a microstrip substrate having a signal line formed by a strip line on a dielectric surface and a metal ground conductor pattern disposed on a back surface; A high-frequency waveguide comprising: a plurality of holes provided in parallel with the strip line; and a plurality of holes provided in a direction perpendicular to the strip line at an interval of approximately 1/4 wavelength of a high-frequency signal passing through the strip line. . 3. A high-frequency waveguide for transmitting a high-frequency signal, comprising: a triplate substrate having a signal line formed by a strip line in a dielectric sandwiched between upper and lower ground conductor patterns; A high-frequency waveguide comprising: a plurality of holes provided in parallel with the strip line; and a plurality of holes provided in a direction perpendicular to the strip line at an interval of approximately 1/4 wavelength of a high-frequency signal passing through the strip line. . 4. A high-frequency waveguide for transmitting a high-frequency signal, comprising: a coplanar substrate having a signal line formed by a strip line on a dielectric surface and a ground conductor pattern parallel to the strip line; , A plurality of the high-frequency waveguides are provided in parallel with the strip line, and are provided in a direction perpendicular to the strip line at an interval of approximately 波長 wavelength of a high-frequency signal passing through the strip line. 5. A high-frequency waveguide for transmitting a high-frequency signal, wherein a hole for conducting a high-frequency signal is provided in a thickness direction of a dielectric substrate provided with a grounding conductor pattern on the front and back surfaces, and the dielectric substrates are laminated. Forming a waveguide, and providing a plurality of front and back conductive through holes connected to the ground conductor pattern around the waveguide at intervals of approximately 1/4 wavelength of a high frequency signal passing through the waveguide. Waveguide. 6. A high-frequency waveguide for transmitting a high-frequency signal, wherein a waveguide is formed by laminating a dielectric substrate provided with a ground conductor pattern around a window through which the high-frequency signal is conducted. A high-frequency waveguide, wherein a plurality of front and back conductive through-holes connected to the ground conductor pattern are provided at intervals of approximately 1/4 wavelength of a high-frequency signal passing through the waveguide. 7. A high-frequency waveguide for transmitting a high-frequency signal, wherein a groove having a ground conductor pattern on the bottom surface is provided in the first dielectric substrate for conducting the high-frequency signal, and the first dielectric substrate or the front and back surfaces are provided. A waveguide is formed by laminating a second dielectric substrate or the like on which the ground conductor pattern is provided, and the front and back conductive through holes connected to the ground conductor pattern pass through the waveguide around this waveguide. A high-frequency waveguide comprising a plurality of high-frequency signals provided at intervals of approximately 1/4 wavelength.