JP2001191696A - Silver clay and discriminating method therefor - Google Patents
Silver clay and discriminating method thereforInfo
- Publication number
- JP2001191696A JP2001191696A JP2000000591A JP2000000591A JP2001191696A JP 2001191696 A JP2001191696 A JP 2001191696A JP 2000000591 A JP2000000591 A JP 2000000591A JP 2000000591 A JP2000000591 A JP 2000000591A JP 2001191696 A JP2001191696 A JP 2001191696A
- Authority
- JP
- Japan
- Prior art keywords
- silver clay
- silver
- gold
- mass
- clay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、白色の銀粘土塊
の少なくとも表面に黄金色の金箔または/および金粉を
貼り付けることにより銀粘土の種類を識別できるように
した銀粘土およびその銀粘土の包装体、並びに銀粘土の
種類を識別する方法に関するものであり、作者が造形中
に使用する銀粘土の種類を常に把握できることを目的と
したものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silver clay having a golden clay or a gold powder attached to at least the surface of a white silver clay mass so that the type of the silver clay can be identified. The present invention relates to a package and a method for identifying the type of silver clay, and is intended to allow the author to always know the type of silver clay used during modeling.
【0002】[0002]
【従来の技術】貴金属粘土は、美術工芸や趣味の分野に
おいて、自由な発想によりイメージした形状を手軽に造
形して造形体を作製し、この造形体を焼くことにより簡
単に美術工芸品、装飾品などを作ることができるところ
から広く使用されており、特に銀粘土は価格が比較的安
価なところから最も広く使用されている。この銀粘土
は、通常、図4の断面図(a)に示されるように、銀粘
土塊1をビニール袋などの透明なラップフィルム2に包
み込んで包装体4としたものが市販されている。銀粘土
の使用に際しては、図4の断面図(b)に示されるよう
に、包装体4のラップフィルム2を剥がして銀粘土塊1
を取り出し、図4の断面図(c)に示されるように、こ
れを指で適当な大きさにちぎるなどして造形する。2. Description of the Related Art In the field of arts and crafts and hobbies, precious metal clays are used to easily create shapes by freely shaping the shape imagined by free thinking, and easily burn arts and crafts and decorations by baking these shapes. Silver clay is widely used because of its ability to make goods and the like, and silver clay is most widely used because of its relatively low price. As shown in the cross-sectional view (a) of FIG. 4, this silver clay is generally commercially available as a package 4 in which a silver clay mass 1 is wrapped in a transparent wrap film 2 such as a plastic bag. When using the silver clay, as shown in the cross-sectional view (b) of FIG.
Then, as shown in the cross-sectional view (c) of FIG.
【0003】図4の断面図(a)に示されるラップフィ
ルム2に包み込まれた銀粘土塊1の包装体4は、図5の
斜視図に示されるように、容器3内に収納し蓋をして販
売されている。近年、容器3に収納して販売されている
銀粘土は、1種類ではなく、特性の異なった数種類の銀
粘土を揃えてセットで売り出されている。例えば、図5
の斜視図に示されるように、通常の純銀粉末を添加した
銀粘土塊の包装体41、多孔質燒結体を得るために比較
的少量の純銀粉末を添加した銀粘土塊の包装体42、緻
密な燒結体を得るために比較的多量の純銀粉末を添加し
た銀粘土塊の包装体43などを容器3に収納しセットで
市販されており、購入者はこれら種類の異なった粘土を
組合せて造形し、所望の造形体に仕上げ、これを焼成し
て美術工芸品、装飾品などを作っている。A package 4 of a silver clay mass 1 wrapped in a wrap film 2 shown in a sectional view (a) of FIG. 4 is housed in a container 3 as shown in a perspective view of FIG. And sold. In recent years, not only one kind of silver clay, which is sold in the container 3, but several kinds of silver clay having different characteristics are arranged and sold as a set. For example, FIG.
As shown in the perspective view of FIG. 1, a package 41 of a silver clay lump to which ordinary pure silver powder is added, a package 42 of a silver clay lump to which a relatively small amount of pure silver powder is added to obtain a porous sintered body, In order to obtain a sintered body, a package of silver clay mass 43 to which a relatively large amount of pure silver powder is added is stored in the container 3 and is sold as a set. Then, the desired shaped body is finished and fired to produce arts and crafts, ornaments and the like.
【0004】[0004]
【発明が解決しようとする課題】造形作業中に包装体の
ラップフィルムを剥がして銀粘土塊を取り出し、これを
指で適当な大きさにちぎりながら造形しているうちに、
銀粘土の色はすべて白色であるから、造形者は現在造形
に使用している粘土はどの種類の銀粘土であるのか見分
けがつかなくなることがある。例えば、図5に示される
前記銀粘土塊の包装体41、42、43から銀粘土塊を
取り出し、3種類の粘土を使用して造形すると、銀粘土
の色はすべて白色であるから、現在造形に使用している
銀粘土は、いかなる特性を有する種類の銀粘土であるの
か見分けがつかなくなることがある。During the molding operation, the wrapping film of the package is peeled off and the silver clay mass is taken out.
Since the colors of silver clay are all white, sculptors may not be able to tell what kind of silver clay is currently being used for modeling. For example, when the silver clay mass is taken out from the silver clay mass packaging bodies 41, 42, and 43 shown in FIG. 5 and molded using three types of clay, the color of the silver clay is all white. The silver clay used in the method may be indistinguishable from what kind of silver clay it has.
【0005】これらの問題点を解決するために、銀粘土
に色をつけることも考えられるが、色を付けた銀粘土は
造形中に手に付いた顔料がほかの銀粘土に付着して好ま
しくなく、また焼成しても色が残ることがあるので好ま
しくない。In order to solve these problems, it is conceivable to add color to silver clay. However, colored silver clay is preferred because pigments attached to the hands during molding adhere to other silver clay. It is not preferable because the color may remain even after firing.
【0006】[0006]
【課題を解決するための手段】そこで、本発明者等は、
これらの課題を解決すべく研究した結果、(イ)図1の
平面図に示されるように銀粘土塊11の表面に金箔5を
貼り付けたり、図2の平面図に示されるように銀粘土塊
12の表面に金粉6を貼り付けたり、さらに図3の平面
図に示されるように銀粘土塊13の表面に金箔5および
金粉6を貼り付けたりしておくと、銀粘土商品としての
高級感を増加させるとともに、ラップフィルムを剥がし
た後でもこれから使用しようとする銀粘土塊の種類を理
解することができ、造形作業中でも残りの銀粘土塊の種
類を識別することができる、(ロ)前記銀粘土塊の表面
に金箔または/および金粉を貼り付けた銀粘土は、金箔
または/および金粉が極めて少量であるから、銀粘土の
燒結特性などに影響を与えることは無い、(ハ)銀粘土
の造形品を燒結しても金箔または/および金粉は燒結時
に素地に吸収されて銀の持つ色調を損なうことは無い、
などの知見を得たのである。Means for Solving the Problems Accordingly, the present inventors have
As a result of studying to solve these problems, (a) the gold foil 5 is stuck on the surface of the silver clay mass 11 as shown in the plan view of FIG. If the gold powder 6 is pasted on the surface of the lump 12 or the gold foil 5 and the gold powder 6 are pasted on the surface of the silver clay lump 13 as shown in the plan view of FIG. In addition to increasing the feeling, it is possible to understand the type of silver clay lumps to be used even after the wrap film has been peeled off, and to identify the type of remaining silver clay lumps during molding work. (B) The silver clay in which gold foil and / or gold powder is adhered to the surface of the silver clay mass does not affect the sintering characteristics of silver clay since the amount of gold foil and / or gold powder is extremely small. Sintering clay shaped objects Gold leaf and / or gold powder also it does not impair the color tone that has been absorbed into the matrix during the sintering of the silver,
The knowledge was obtained.
【0007】この発明は、かかる知見に基づいてなされ
たものであって、(1)銀粘土塊の少なくとも表面に金
箔を貼り付けた銀粘土、(2)銀粘土塊の少なくとも表
面に金粉を貼り付けた銀粘土、(3)銀粘土塊の少なく
とも表面に金箔および金粉を貼り付けた銀粘土、に特徴
を有するものである。[0007] The present invention has been made based on such knowledge, and (1) silver clay having gold foil adhered to at least the surface of a silver clay mass, and (2) gold powder applied to at least the surface of the silver clay mass. And (3) silver clay in which gold foil and gold powder are adhered to at least the surface of the silver clay mass.
【0008】銀粘土塊の少なくとも表面に貼り付ける金
属箔または/および粉末は、色の付いた金属、例えば銅
箔または/および銅粉であっても銀粘土の種類の識別は
可能であるが、銅のように酸化または/および硫酸化し
やすい金属箔および金属粉は、長期間保存する内に酸化
または/および硫酸化して色が変わるので好ましくな
い。また、銅箔または/および銅粉を使用した場合、銀
よりも安価な金属が混入して不純物が入った作品ができ
るとの印象を与えるところから、高級感が損なわれるの
で好ましくない。これに反して、金箔または/および金
粉であれば、銀よりも一層の高級感を与えるので好まし
い。[0008] Even if the metal foil and / or powder applied to at least the surface of the silver clay mass is a colored metal such as copper foil and / or copper powder, the type of silver clay can be identified, Metal foils and metal powders that are easily oxidized or / and sulfated like copper are not preferred because they change color by being oxidized or / and sulfated during long-term storage. Further, the use of copper foil and / or copper powder is not preferable because it gives the impression that a work containing impurities is produced due to the incorporation of a metal that is less expensive than silver, and the sense of quality is impaired. On the other hand, gold foil and / or gold powder is preferable because it gives a higher quality than silver.
【0009】金箔または/および金粉は銀粘土塊の埋没
しても良いが、その場合でも少なくとも表面には金箔ま
たは/および金粉を貼り付けられていることが必要であ
る。銀粘土塊の少なくとも表面に金箔または/および金
粉が存在することにより識別が可能となるからである。
銀粘土塊の少なくとも表面に貼り付ける金箔または/お
よび金粉は多量であっても良いがコストがかかるだけで
あって識別能力に差が生じることは無い。したがって、
銀粘土塊の少なくとも表面に貼り付ける金箔は識別可能
であれば可及的薄くて良く、また金粉は可及的に少なく
て良い。The gold foil and / or gold powder may be buried in the silver clay mass, but in such a case, it is necessary that the gold foil and / or gold powder is adhered to at least the surface. This is because the presence of the gold foil and / or the gold powder on at least the surface of the silver clay mass enables identification.
The amount of gold foil and / or gold powder to be attached to at least the surface of the silver clay mass may be large, but it is only costly and there is no difference in discrimination ability. Therefore,
The gold foil attached to at least the surface of the silver clay mass may be as thin as possible as long as it can be identified, and the gold powder may be as small as possible.
【0010】この発明の銀粘土塊の少なくとも表面に金
箔または/および金粉を貼り付けた銀粘土は、銀粘土塊
の少なくとも表面に金箔または/および金粉をふりか
け、軽く押さえるだけで銀粘土塊の表面に金箔または/
および金粉が付着し製造することができる。銀粘土塊の
少なくとも表面に貼り付ける金箔は任意の燐片状の金箔
で十分であるが、星型などの形状に切り取った金箔であ
っても良い。また、この発明の識別方法は、貼り付けら
れた金箔の数、金粉の分布状態などによっても実施する
ことができる。このようにして製造した銀粘土は図4
(a)に示されるように従来と同様にして透明なラップ
フィルムで包んで包装体とし保存または販売される。[0010] The silver clay of the present invention in which gold foil and / or gold powder is adhered to at least the surface of the silver clay mass is sprinkled with at least the surface of the silver clay mass with the gold foil and / or gold powder, and is gently pressed down. Gold leaf or /
And gold powder can be produced. The gold foil to be stuck to at least the surface of the silver clay mass may be any scaly gold foil, but may be a gold foil cut into a star shape or the like. Further, the identification method of the present invention can also be carried out depending on the number of gold foils attached, the distribution state of gold powder, and the like. The silver clay produced in this way is shown in FIG.
As shown in (a), it is wrapped with a transparent wrap film and stored or sold as a package in the same manner as before.
【0011】[0011]
【発明の実施の形態】通常粒度の平均粒径:20μmを
有する純銀粉末を含む銀粘土塊11、通常より粗大な粒
度の平均粒径:60μmを有する純銀粉末を含む銀粘土
塊12、および通常より微細な粒度の平均粒径:5μm
の純銀粉末を含む銀粘土塊13を用意した。前記銀粘土
塊11の表面に、図1に示されるように、厚さ:0.1
μmの金箔片5を貼り付けることにより本発明銀粘土1
を作製した。前記銀粘土塊12の表面に、図2に示され
るように、平均粒径:6μmの金粉6を貼り付けること
により本発明銀粘土2を作製した。さらに、前記銀粘土
塊13の表面に、図3に示されるように、厚さ:0.1
μmの金箔片5および平均粒径:6μmの金粉6を貼り
付けることにより本発明銀粘土3を作製した。BEST MODE FOR CARRYING OUT THE INVENTION A silver clay mass 11 containing pure silver powder having an average particle size of normal size: 20 μm, a silver clay mass 12 containing pure silver powder having an average particle size of more than 60 μm, and usually Average particle size of finer particle size: 5 μm
A silver clay mass 13 containing pure silver powder was prepared. On the surface of the silver clay mass 11, as shown in FIG.
The silver clay 1 of the present invention can be obtained by attaching a gold foil piece 5 of μm.
Was prepared. As shown in FIG. 2, a silver clay 2 of the present invention was prepared by adhering gold powder 6 having an average particle size of 6 μm to the surface of the silver clay mass 12. Further, as shown in FIG. 3, the thickness of the silver clay mass 13 is 0.1
The silver clay 3 of the present invention was produced by attaching a gold foil piece 5 of μm and a gold powder 6 of average particle size: 6 μm.
【0012】これら本発明銀粘土1〜3をラップフィル
ムで包んで包装体を作製し、1年間経過後、包装体のラ
ップフィルムを除去して銀粘土塊11〜13を取り出し
たところ、金箔または/および金粉による銀粘土塊の種
類の識別が可能であり、造形作業中に銀粘土塊の種類の
識別ができなくなることは無かった。The silver clays 1 to 3 of the present invention are wrapped with a wrap film to prepare a package. After one year, the wrap film of the package is removed to remove the silver clay masses 11 to 13. / And the type of the silver clay mass could be identified by the gold powder, and the type of the silver clay mass could not be identified during the modeling operation.
【0013】[0013]
【発明の効果】前述のように、この発明の銀粘土を使用
すると、造形体の異なった個所の造形を、その個所に適
した種類の銀粘土で迷うことなく造形することができる
ところから、銀粘土を効率良く有効利用できるという優
れた効果を奏するものである。As described above, when the silver clay of the present invention is used, it is possible to form a molding at a different place of a molded body with a type of silver clay suitable for the place without being lost. It has an excellent effect that silver clay can be used efficiently and effectively.
【図1】銀粘土塊の少なくとも表面に金箔を貼り付けた
この発明の銀粘土の平面図である。FIG. 1 is a plan view of a silver clay of the present invention in which a gold foil is stuck to at least the surface of a silver clay mass.
【図2】銀粘土塊の少なくとも表面に金粉を貼り付けた
この発明の銀粘土の平面図である。FIG. 2 is a plan view of the silver clay of the present invention in which gold powder is attached to at least the surface of a silver clay mass.
【図3】銀粘土塊の少なくとも表面に金箔および金粉を
貼り付けたこの発明の銀粘土の平面図である。FIG. 3 is a plan view of the silver clay of the present invention in which gold foil and gold powder are attached to at least the surface of a silver clay mass.
【図4】銀粘土塊を包装体から取り出して使用する従来
の方法を示す断面説明図である。FIG. 4 is an explanatory sectional view showing a conventional method of taking out a silver clay mass from a package and using it.
【図5】従来の銀粘土包装体を箱に詰めた状態を示す斜
視説明図である。FIG. 5 is a perspective explanatory view showing a state where a conventional silver clay package is packed in a box.
1 銀粘土塊 11 銀粘土塊 12 銀粘土塊 13 銀粘土塊 2 ラップフィルム 3 容器 4 包装体 41 包装体 42 包装体 43 包装体 5 金箔 6 金粉 1 Silver Clay Lump 11 Silver Clay Lump 12 Silver Clay Lump 13 Silver Clay Lump 2 Wrap Film 3 Container 4 Package 41 Package 42 Package 43 Package 5 Gold leaf 6 Gold powder
Claims (5)
けたことを特徴とする銀粘土。1. A silver clay characterized in that a gold foil is stuck to at least the surface of a silver clay mass.
けたことを特徴とする銀粘土。2. A silver clay characterized in that gold powder is stuck to at least the surface of a silver clay mass.
粉を貼り付けたことを特徴とする銀粘土。3. A silver clay characterized in that a gold foil and a gold powder are attached to at least the surface of a silver clay mass.
なラップフィルムで包んでなる銀粘土包装体。4. A silver clay package comprising the silver clay according to claim 1, 2 or 3 wrapped with a transparent wrap film.
および金粉を貼り付けることを特徴とする銀粘土の識別
方法。5. The method according to claim 5, wherein at least the surface of the silver clay mass has a gold leaf or /
And a method of identifying silver clay, which comprises attaching gold powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000000591A JP2001191696A (en) | 2000-01-06 | 2000-01-06 | Silver clay and discriminating method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000000591A JP2001191696A (en) | 2000-01-06 | 2000-01-06 | Silver clay and discriminating method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001191696A true JP2001191696A (en) | 2001-07-17 |
Family
ID=18529916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000000591A Pending JP2001191696A (en) | 2000-01-06 | 2000-01-06 | Silver clay and discriminating method therefor |
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Country | Link |
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JP (1) | JP2001191696A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012092375A (en) * | 2010-10-25 | 2012-05-17 | Mitsubishi Materials Corp | Method for manufacturing silver sintered body and copper oxide-containing clay-like composition |
JP2013036059A (en) * | 2011-08-04 | 2013-02-21 | Mitsubishi Materials Corp | Method of manufacturing sintered silver-copper alloy body |
JP2013049875A (en) * | 2011-08-30 | 2013-03-14 | Mitsubishi Materials Corp | Clay composition for forming silver-copper alloy sintered compact, powder for the clay composition for forming silver-copper alloy sintered compact, method for producing the clay composition for forming silver-copper alloy sintered compact, method for producing silver-copper alloy sintered compact, and the silver-copper alloy sintered compact |
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JP2012092375A (en) * | 2010-10-25 | 2012-05-17 | Mitsubishi Materials Corp | Method for manufacturing silver sintered body and copper oxide-containing clay-like composition |
US9194025B2 (en) | 2010-10-25 | 2015-11-24 | Mitsubishi Materials Corporation | Method of manufacturing sintered silver alloy body and copper oxide-containing clay-like composition |
JP2013036059A (en) * | 2011-08-04 | 2013-02-21 | Mitsubishi Materials Corp | Method of manufacturing sintered silver-copper alloy body |
JP2013049875A (en) * | 2011-08-30 | 2013-03-14 | Mitsubishi Materials Corp | Clay composition for forming silver-copper alloy sintered compact, powder for the clay composition for forming silver-copper alloy sintered compact, method for producing the clay composition for forming silver-copper alloy sintered compact, method for producing silver-copper alloy sintered compact, and the silver-copper alloy sintered compact |
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