JP2001151336A - Parts incorporating structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a parts incorporating structure capable of well incorporating parts in an inner hole of a fixed pipe. SOLUTION: A first tapered portion 1b which has a depth D1 being somewhat larger than the length Lc of chip parts CC and the maximum diameter R3 being somewhat smaller than the length Lc of the chip parts CC and the minimum diameter corresponding to an inner hole diameter R2 of the fixed pipe 1 is formed at the upper end of an inner hole 1a of the fixed pipe 1. Therefore, if the moving speed of a movable pipe 2 is increased to quicken a goods incorporating cycle, the operation of incorporating stored parts CC into the inner hole 1a of the fixed pipe 1 is accelerated by the first tapered portion 1b, whereby the probability of incorporataing the stored parts CC into the inner hole 1a of the fixed pipe 1 with the vertical movement of the movable pipe 2 is increased to permit the parts to be incorporated in the inner hole 1a very well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component take-in structure for taking electronic components stored in a bulk state in a storage room one by one in a lengthwise direction into an inner hole of a fixed pipe.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. Hei 8-48419 by the present applicant discloses a structure for taking in such a part. The component take-in structure disclosed in the publication is
The storage room has a pipe insertion hole on the bottom surface, a movable pipe movably disposed in the pipe insertion hole, and a fixed pipe disposed in an inner hole of the movable pipe. Electronic components such as chip components are stored in a bulk state in the storage chamber, and the movable pipe can reciprocate up and down by a driving mechanism.
In order to regulate the direction of the electronic component to be taken into the inner hole of the fixed pipe in the length direction, the inner hole diameter is set so that the maximum dimension of the end face of the electronic component <the inner hole diameter <the length of the electronic component.

When the movable pipe is reciprocated in the vertical direction, the vertical movement of the movable pipe mainly causes the electronic components on the movable pipe to be released, thereby causing the electronic components in the storage chamber to become longer. One by one enters the inner hole of the fixed pipe in the direction, and the inner hole moves downward by its own weight while maintaining the same direction.

[0004]

In the above-described component taking-in structure, when the moving speed of the movable pipe for speeding up the component taking-in cycle is increased, the probability of taking in the component into the inner hole of the fixed pipe is reduced. Therefore, measures must be taken to prevent this phenomenon in order to more stably take in components.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a component take-in structure capable of satisfactorily taking components into an inner hole of a fixed pipe. .

[0006]

To achieve the above object, the present invention provides a storage room having a pipe insertion hole on a bottom surface,
A movable pipe movably disposed in a pipe insertion hole, and a fixed pipe disposed in an inner hole of the movable pipe, and an electronic component of a predetermined shape stored in a bulk state in a storage chamber is moved up and down by the movable pipe. In the component take-in structure, which can be taken one by one into the inner hole of the fixed pipe in the length direction by using the electronic component, the upper end of the inner hole of the fixed pipe has a depth larger than the length dimension of the electronic component. The maximum diameter of the first tapered portion is slightly smaller than the length of the electronic component, and the minimum diameter is the inner hole diameter of the fixed pipe. And that is the feature.

According to this component take-in structure, the depth dimension is larger than the length dimension of the electronic component, the maximum diameter is slightly smaller than the length dimension of the electronic component, and the minimum diameter is the fixed pipe. Since the first tapered portion corresponding to the inner hole diameter of the fixed pipe is formed at the upper end of the inner hole of the fixed pipe, even if the moving speed of the movable pipe for accelerating the cycle of taking in parts is increased, the storage is not performed. The action of the part being taken into the inner hole of the fixed pipe can be promoted by the first tapered portion.

According to another aspect of the present invention, there is provided a storage chamber having a pipe insertion hole on a bottom surface, a movable pipe movably disposed in the pipe insertion hole, and an inner hole of the movable pipe. A fixed pipe is provided, and electronic components of a predetermined shape stored in a bulk state in a storage chamber can be taken into the inner hole of the fixed pipe one by one in a length direction by using up and down movement of a movable pipe. In the parts taking-in structure, the raised position of the movable pipe substantially coincides with the bottom surface of the storage room.

According to this part structure, since the movable pipe rise position is substantially coincident with the bottom surface of the storage room, even if the moving pipe moving speed for speeding up the cycle of taking in parts is increased, the movable pipe is moved. It is possible to prevent the upper electronic component from being strongly jumped up, and to promote the action of the storage component being taken into the inner hole of the fixed pipe.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0011]

1 to 6 show an embodiment of the present invention. In the figure, reference numeral 1 denotes a fixed pipe, 2 denotes a movable pipe,
Reference numeral 3 denotes a component storage, 4 denotes a drive lever for a movable pipe, 5 denotes a component guide, and 6 denotes a movable belt.

This component transport structure is, for example, a quadrangular prism-shaped electronic component as shown in FIG. 3, specifically, a chip component C such as a chip resistor, a chip capacitor or a chip inductor.
C is used to take C from the component storage 3 into the fixed pipe 1. The chip component CC has a quadrangular prism shape as a whole, and has external electrodes CCe at both ends in the length direction.
This chip component CC has a predetermined length Lc and a width W
c, the height dimension Tc, the end face diagonal dimension Dc1, and the side face diagonal dimension Dc2, and the magnitude relation between these dimensions is Dc2>
Lc>Dc1> Wc = Tc.

The fixed pipe 1 is made of metal, hard resin or the like. The lower end of the fixed pipe 1 is inserted into the pipe support hole 5a of the component guide 5 and fixed. The upper part is inserted into the center of a pipe insertion hole 3a to be described later. ing. As shown in FIG. 2, the upper end position Hp of the fixed pipe 1 substantially coincides with the bottom surface of the storage room SC (the upper end of the pipe insertion hole 3a) described later.

As shown in FIGS. 4A and 4B,
The fixed pipe 1 is formed of a round pipe having a predetermined outer diameter R1, and has an inner hole 1a at the center having an inner diameter R2 larger than the diagonal dimension Dc1 of the end face of the chip component CC. The inner diameter R2 of the inner hole 1a is the diagonal dimension Dc of the end face of the chip component CC.
1 is larger than the chip component CC in FIG.
(B) is taken in the posture shown by the broken line. Also,
The basic thickness of the fixed pipe 1 is (R1-R2) / 2,
It is smaller than the end face diagonal dimension Dc1 of the chip component CC. Further, an inverted truncated cone-shaped first tapered portion 1b having a depth dimension of D1 is formed at an upper end portion of the inner hole 1a of the fixed pipe 1, and a depth dimension of D2 is formed at an upper end of the first tapered portion 1b. And a second tapered portion 1c having an inverted truncated cone shape having the following shape.

The depth D1 of the first tapered portion 1b is slightly larger than the length Lc of the chip component CC. Also,
The maximum diameter R3 of the first tapered portion 1b is slightly smaller than the length Lc of the chip component CC, and the minimum diameter is equal to the inner hole diameter R2 of the fixed pipe 1. On the other hand, the depth dimension D2 of the second tapered portion 1c is equal to the length dimension L of the chip component CC.
smaller than c. Also, the maximum diameter R of the second tapered portion 1c
4 is slightly larger than the length Lc of the chip component CC, and the minimum diameter R3 (same as the maximum diameter R3 of the first tapered portion) is slightly smaller than the length Lc of the chip component CC.

If a specific numerical value is shown as an example, the length L
c, a chip component CC having a reference dimension of 1.6 mm, 0.8 mm, 0.8 mm for each of the width dimension Wc and the height dimension Tc.
Each dimension of the fixed pipe 1 when handling
R1 is about 2.2 mm, R2 is about 1.2 mm, and D1 is about 2
mm, D2 is about 0.3 mm, R3 is about 1.4 mm, R4
Is about 1.8 mm. In addition, the first in FIG.
The angle θ1 of the tapered portion 1b is 10 degrees, and the angle formed by the left inclined surface and the right inclined surface of the first tapered portion 1b in FIG. 4A, the angle θ2 formed by the left inclined surface and the right inclined surface of the first tapered portion 1b with the axis of the fixed pipe 1 is 45 degrees.

The movable pipe 2 is made of metal or hard resin, and is disposed outside the fixed pipe 1 so as to be movable up and down. The upper part of the movable pipe 2 is inserted into a pipe insertion hole 3a to be described later. As shown in FIG. 2, the lower position of the movable pipe is set at the bottom of the storage room SC (to be described later).
a).

The movable pipe 2 comprises a round pipe having an outer diameter slightly smaller than the inner diameter of a pipe insertion hole 3a described later, and has an inner hole 2a slightly larger than the outer diameter R1 of the fixed pipe 1 at the center. ing. The basic thickness of the movable pipe 2 is larger than the end face diagonal dimension Dc1 of the chip component CC. At the upper end of the movable pipe 2, a guide portion 2b having an inverted truncated cone shape is formed from the outer peripheral surface to the inner hole 2a. Further, collars 2c and 2d are formed integrally or separately at the lower end and the upper side of the movable pipe 2, and a coil spring S1 is provided between the lower collar 2c and the upper collar 2d.
Is mounted, and between the upper collar 2d and the component storage 3 is a coil spring S2 having a smaller spring elasticity than the coil spring S1.
Is installed.

The component storage 3 has a storage room SC for storing a large number of chip components CC in a bulk state. A pipe insertion hole 3 a having an inner diameter slightly larger than the outer diameter of the movable pipe 2 is formed at the deepest portion of the V-shaped or U-shaped bottom surface of the storage room SC. Further, a component replenishing port (no reference numeral) is formed at the upper end of the storage room SC, and the component replenishing port is provided with a lid 3b that can be opened and closed by sliding.

The drive lever 4 has a U-shaped groove 4a formed at its end inserted between the lower collar 2c of the movable pipe 2 and the coil spring S1. The drive lever 4 is moved up and down by driving an operation end (not shown).

The component guide 5 is provided with an inner hole 1a of the fixed pipe 1.
And a curved passage 5b having a rectangular cross section continuous with the curved passage 5b and a lateral passage 5c having a rectangular cross section continuous with the curved passage 5b. In the illustrated structure, the lower surface of the lateral passage 5 c is constituted by the surface of the movable belt 6.

The movable belt 6 is composed of a timing belt or a flat belt made of synthetic rubber, soft resin, or the like, and is intermittently moved leftward in FIG. 1 by a drive mechanism (not shown). Incidentally, the moving amount of the movable belt 6 per one time is larger than the length dimension Lc of the chip component CC.

In the standby state shown in FIGS. 1 and 2, the movable pipe 2 is at the lowered position, an annular space is formed on the guide surface 2b of the movable pipe 2, and a small number of chip components CC are located in the space. I'm stuck.

When the drive lever 4 is moved upward in the standby state shown in FIGS. 1 and 2, as shown in FIG.
The movable pipe 2 rises from the lowered position against the urging force of
When the drive lever 4 is moved downward in the state shown in FIG. 5, the movable pipe 2 descends from the raised position and returns to the standby state shown in FIG.

Due to the vertical movement of the movable pipe 2, the chip component CC on the movable pipe 2 mainly receives the action of the storage component CC, and thereby the chip component C in the storage room SC is affected.
C enters the inner hole 1a of the fixed pipe 1 one by one in the length direction. Since the first tapered portion 1b having the shape of an inverted truncated cone is formed at the upper end of the inner hole 1a of the fixed pipe 1, the action of the storage component CC being taken into the inner hole 1a of the fixed pipe 1 is controlled by the first tapered portion 1b. Can be promoted by

In the fixed pipe 1, the maximum diameter R4 of the second tapered portion 1c is equal to the length Lc of the chip component CC.
6 is theoretically larger than
(A) and (B), as shown by the solid line, the chip component CC may lie on the fixed pipe 1 to close the upper end opening of the inner hole 1a, but due to the vibration caused by the vertical movement of the movable pipe 2, As shown by broken lines in FIGS. 6A and 6B, the chip component CC can be positively inclined by the second tapered portion 1c and dropped into the first tapered portion 1b. The lying chip component CC does not stagnate as it is. FIG.
Although the chip component CC may lie on the fixed pipe 1 and block the upper end opening of the inner hole 1a other than the state shown by the solid line in (A) and (B), the vertical movement of the movable pipe 2 may occur. Since the chip component CC can be retreated from above the fixed pipe 1 by vibration caused by the vertical movement of the movable pipe 2, there is no interruption in taking the component into the inner hole 1 a of the fixed pipe 1. Of course, the second tapered portion 1b
Is smaller than the length Lc of the chip component CC, the chip component CC enters the first tapered portion 1b in the posture shown by the solid line in FIGS. Not even.

The chip component CC taken into the inner hole 1a of the fixed pipe 1 moves downward in the inner hole 1a by its own weight while keeping its length, and enters the curved passage 5b of the component guide 5. The posture of the chip component CC that has entered the curved passage 5b is changed from vertical to horizontal in the process of moving along the curved passage 5b, and the chip component CC after the posture change enters the horizontal passage 5c. Since the curved passage 5b has a quadrangular cross section, the chip component CC that has entered the curved passage 5b cannot be bent.
In the process of passing through, the posture is corrected so that one side surface faces the lower curved surface. The chip component CC that has entered the lateral passage 5c is conveyed leftward in FIG. 1 by the movable belt 6 that moves intermittently.

In the aforementioned component taking-in structure, the depth D1 is slightly larger than the length Lc of the chip component CC, and the maximum diameter R3 is slightly smaller than the length Lc of the chip component CC. In addition, since the first tapered portion 1b whose minimum diameter matches the inner hole diameter R2 of the fixed pipe 1 is formed at the upper end of the inner hole 1a of the fixed pipe 1, in order to speed up the cycle of taking in parts. Even if the moving speed of the movable pipe 2 is increased, the storage component CC is
a can be promoted by the first tapered portion 1 b, whereby the storage component CC is moved up and down by the vertical movement of the movable pipe 2.
Thus, the parts can be taken into the inner hole 1a with extremely high probability.

The depth D2 is smaller than the length Lc of the chip component CC, the maximum diameter R4 is slightly larger than the length Lc of the chip component CC, and the minimum diameter R3 is smaller than the length Lc of the chip component CC. Since the second tapered portion 1c slightly smaller than the length Lc of the CC is formed at the upper end of the first tapered portion 1b, the fixed pipe 1 is formed as shown by a solid line in FIGS. 6A and 6B. Even when the chip component CC lays on the top and closes the upper end opening of the inner hole 1a, the chip component CC is positively inclined by the second tapered portion 1c and dropped into the first tapered portion 1b. The first tapered portion 1b can be fed into the inner hole 1a in the longitudinal direction. That is, it is possible to reliably prevent the chip components CC lying on the fixed pipe 1 from staying as they are, and to further increase the probability that the storage component CC is taken into the inner hole 1a of the fixed pipe 1.

Further, the height position H of the upper end of the fixed pipe 1
Since P is substantially coincident with the bottom surface of the storage room SC and the rising position of the movable pipe 2 is approximately coincident with the bottom surface of the storage room SC, the moving speed of the movable pipe 2 for accelerating the cycle of taking in parts is increased. However, it is possible to prevent the chip component CC on the movable pipe 2 from being strongly jumped upward and to promote the action of the storage component CC being taken into the inner hole 1 a of the fixed pipe 1, whereby In addition, the probability that the storage component CC is taken into the inner hole 1a of the fixed pipe 1 by the vertical movement of the movable pipe 2 is increased, and the component can be taken into the inner hole 1a extremely well.

In the above-described component take-in structure, a first tapered portion 1b is formed at the upper end of the inner hole 1a of the fixed pipe 1,
An example in which the second tapered portion 1c is formed at the upper end of the first tapered portion 1b has been exemplified. However, as shown in FIG. 7, a roundness 1d is formed at the boundary between the first tapered portion 1b and the second tapered portion 1c.
May be attached. By doing so, FIG.
As shown in (A) and (B), even when the chip component CC lies on the fixed pipe 1 and closes the upper end opening of the inner hole 1a, the second taper is utilized by using the roundness 1d. The part transfer from the portion 1c to the first tapered portion 1b can be performed more smoothly.

Further, in the above-described component taking-in structure, the second tapered portion 1c is formed at the upper end of the first tapered portion 1b of the fixed pipe 1.
However, as shown in FIGS. 8A and 8B, the fixed pipe 1 may be formed by removing the second tapered portion 1c from the upper end of the first tapered portion 1b. At this time, the depth dimension D3 of the first tapered portion 1e is slightly larger than the length dimension Lc of the chip component CC, and the maximum diameter R5 of the first tapered portion 1e is equal to the chip component CC.
Is slightly smaller than the length dimension LC, and the minimum diameter is equal to the inner hole diameter R2 of the fixed pipe 1. If specific numerical values are shown as examples, the reference dimensions of the length dimension Lc, the width dimension Wc, and the height dimension Tc are 1.6 mm, 0.8 mm,
The maximum diameter R5 of the first tapered portion 1e when handling a 0.8 mm chip component CC is about 1.55 mm.
And the minimum diameter R2 is about 1.2 mm.

The fixed pipe 1 shown in FIGS. 8A and 8B
In the case of (1), the tilting operation of the component by the second taper portion 1c as described above cannot be obtained, but the depth dimension D3 is slightly larger than the length dimension Lc of the chip component CC, and
The first tapered portion 1b whose maximum diameter R5 is slightly smaller than the length dimension Lc of the chip component CC and whose minimum diameter matches the inner hole diameter R2 of the fixed pipe 1 is formed in the inner hole 1a of the fixed pipe 1. Since it is formed at the upper end, as described above,
Even if the moving speed of the movable pipe 2 for accelerating the cycle of taking in the parts is increased, the storage parts CC are not fixed pipes 1
The action taken into the inner hole 1a of the first tapered portion 1
b, thereby increasing the probability that the storage component CC is taken into the inner hole 1a of the fixed pipe 1 by the up and down movement of the movable pipe 2, so that the component can be taken into the inner hole 1a extremely well. it can.

Further, in the above-described component take-in structure, a quadrangular prism-shaped chip component CC has been exemplified as an electronic component, but electronic components other than the chip component, for example, electronic components such as an LC filter and a network are handled. The same operation and effect as described above can be obtained when electronic components other than the prismatic shape, for example, cylindrical electronic components are handled.

[0035]

As described in detail above, according to the present invention,
Eliminating concerns about a decrease in the probability of taking in when moving the moving pipe to speed up the cycle of taking in parts, and removing parts into the inner hole of the fixed pipe very well. it can.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.

FIG. 2 is a partially enlarged view of FIG. 1;

FIG. 3 is a perspective view of the chip component shown in FIG. 1;

FIG. 4 is a partially enlarged view of FIG. 2 and a top view thereof;

FIG. 5 is an explanatory diagram of a part taking operation.

FIG. 6 is an explanatory diagram of a part taking operation.

FIG. 7 is a partial longitudinal sectional view showing a modification of the fixed pipe shown in FIG. 1;

8 is a partial longitudinal sectional view showing another modification of the fixed pipe shown in FIG. 1 and a top view thereof.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Fixed pipe, 1a ... Inner hole, 1b ... 1st taper part,
1c: second tapered portion, 2: movable pipe, 3: component storage, 3a: pipe insertion hole, SC: storage room, CC: chip component.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C030 AA01 3F080 AA13 BA04 BC01 BC03 BF05 CA06 5E313 AA03 AA21 CD01 DD02 DD10 DD11 DD19 DD22 DD23 DD42

Claims (5)

[Claims] 1. A storage room having a pipe insertion hole on a bottom surface,
A movable pipe movably disposed in a pipe insertion hole, and a fixed pipe disposed in an inner hole of the movable pipe, and an electronic component of a predetermined shape stored in a bulk state in a storage chamber is moved up and down by the movable pipe. In the component taking-in structure, it is possible to take one by one into the inner hole of the fixed pipe in the length direction by using the electronic component, wherein the upper end of the inner hole of the fixed pipe has a depth larger than the length dimension of the electronic component. The maximum diameter of the first tapered portion is slightly smaller than the length of the electronic component, and the minimum diameter is the inner hole diameter of the fixed pipe. A component take-in structure, 2. An inverted frustoconical second taper having a depth smaller than the length of the electronic component is formed at an upper end of the first taper, and a maximum diameter of the second taper is formed. The component capturing structure according to claim 1, wherein: is slightly larger than a length dimension of the electronic component, and a minimum diameter is slightly smaller than a length dimension of the electronic component. 3. The component take-in structure according to claim 2, wherein a boundary between the first tapered portion and the second tapered portion is rounded. 4. A storage room having a pipe insertion hole on a bottom surface,
A movable pipe movably disposed in a pipe insertion hole, and a fixed pipe disposed in an inner hole of the movable pipe, and an electronic component of a predetermined shape stored in a bulk state in a storage chamber is moved up and down by the movable pipe. In the component taking-in structure capable of taking one by one into the inner hole of the fixed pipe in the length direction by using, the rising position of the movable pipe substantially coincides with the bottom surface of the storage room. A feature for capturing parts. 5. The component take-in structure according to claim 4, wherein a height position of an upper end of the fixed pipe substantially coincides with a bottom surface of the storage chamber.