JP2001144226A - Electronic component module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component module that is superb in its manufacturing workability. SOLUTION: A molding substrate 8 comprises a plurality of conductive plates 32 embedded in a synthetic resin encapsulating section 31, and bosses 35 are integrated in the encapsulating section 31 via hinges 34. In this constitution, lead terminals 47 are inserted into through holes 42 and are soldered to the conductive plates 32 from the bottom side in a solder cell. Then, the bosses 35 are bent toward the bottom side from the hinges 34, and are fastened in an equipment room 5 by tightening screws 36 into the bosses 35. As the bosses 35 are prevented from interfering in the solder cell when the molding substrate 8 is carried into the solder cell, the molding substrate 8 can be easily soldered, thus causing the manufacturing workability to be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component module having an electronic component mounted on a molded substrate and a method of manufacturing the electronic component module.

[0002]

SUMMARY OF THE INVENTION The present applicant forms a molded substrate based on sealing a conductive plate with a resin sealing portion, and leads the lead of an electronic component into a through hole of the molded substrate from above. We applied to insert the terminal and solder it to the conductive plate from below. In the case of this configuration, if the electronic component cover exists on the upper surface of the sealing portion, the electronic component cover becomes an obstacle when the lead terminal is inserted into the through hole from above. Also, if there is a mounting portion such as a boss on the lower surface of the sealing portion,
When the molded substrate is flowed into the solder bath and the lead terminals are soldered from below, the mounting portion interferes with the solder bath, for example, so that the manufacturing workability is reduced in any case.

[0003] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component module and an electronic component module manufacturing method which are excellent in manufacturing workability.

[0004]

According to a first aspect of the present invention, there is provided an electronic component module comprising: a molded substrate formed by sealing a conductive plate with a resin sealing portion; A through hole that penetrates the conductive plate, an electronic component mounted on one surface of the molded substrate, and a lead terminal inserted into the through hole and soldered to the conductive plate; integrated with the sealing portion via a hinge And a mounting portion for mounting the molded substrate, wherein the mounting portion is bent about the hinge toward the non-mounting surface side of the electronic component. According to the above means, after the lead terminal of the electronic component is inserted into the through hole and soldered to the conductive plate from the non-mounting surface side of the electronic component, the mounting portion can be bent to the non-mounting surface side. For this reason, for example, when the molded substrate is flowed into the solder bath and the lead terminals are soldered, the mounting portion is prevented from interfering with the solder bath, so that manufacturing workability is improved. In addition, since it is not necessary to separately attach the mounting portion to the sealing portion, an increase in the number of components can be suppressed.

According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component module according to the first aspect, wherein a lead terminal of the electronic component is inserted into a through-hole of the molded substrate, and the counterpart of the electronic component is removed. It is characterized in that, after soldering to the conductive plate from the mounting surface side, the mounting portion is bent toward the non-mounting surface side of the electronic component. According to the above means, for example, when the molded substrate flows into the solder bath, the mounting portion is prevented from interfering with the solder bath, so that manufacturing workability is improved.

According to a third aspect of the present invention, there is provided an electronic component module comprising: a molded substrate formed by sealing a conductive plate with a resin sealing portion;
A through hole provided in the molded substrate and penetrating the sealing portion and the conductive plate, and an electronic component mounted on one surface of the molded substrate and having a lead terminal inserted into the through hole and soldered to the conductive plate And an electronic component cover integrally provided on the sealing portion via a hinge, wherein the electronic component cover is bent toward the mounting surface side of the electronic component around the hinge. Have. According to the above means, after the lead terminal of the electronic component is inserted into the through hole, the electronic component cover can be bent toward the mounting surface of the electronic component. For this reason, since the lead terminal insertion work can be performed without disturbing the electronic component cover,
Manufacturing workability is improved. Moreover, since it is not necessary to separately attach the electronic component cover to the sealing portion, an increase in the number of components can be suppressed.

According to a fourth aspect of the present invention, there is provided a method of manufacturing an electronic component module according to the third aspect, wherein a lead terminal of the electronic component is inserted into a through hole of the molded substrate, and then the electronic component cover is inserted. Is bent toward the mounting surface side of the electronic component. According to the above means, the work of inserting the lead terminal can be performed without being obstructed by the electronic component cover, so that the manufacturing workability is improved.

According to a fifth aspect of the present invention, there is provided an electronic component module comprising: a molded substrate formed by sealing a conductive plate with a resin sealing portion;
A through hole provided in the molded substrate and penetrating the sealing portion and the conductive plate, and an electronic component mounted on one surface of the molded substrate and having a lead terminal inserted into the through hole and soldered to the conductive plate And a heat radiation member provided on the anti-mounting surface of the electronic component of the molded substrate, and a wind direction member provided integrally with the sealing portion via a hinge and guiding cooling air to the heat radiation member, It is characterized in that the wind direction member is bent around the hinge toward the side opposite to the mounting surface of the electronic component. According to the above means, after the lead terminal of the electronic component is inserted into the through hole and soldered to the conductive plate from the non-mounting surface side of the electronic component, the wind direction member can be bent to the non-mounting surface side. For this reason, for example, when the molded substrate is flowed into the solder bath and the lead terminals are soldered, the wind direction member is prevented from interfering with the solder bath, so that the manufacturing workability is improved. In addition, since it is not necessary to separately attach the wind direction member to the sealing portion, an increase in the number of components can be suppressed.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an electronic component module according to the fifth aspect, wherein a lead terminal of the electronic component is inserted into a through-hole of the molded board, and the electronic component module is turned on. It is characterized in that after being soldered to the conductive plate from the mounting surface side, the wind direction member is bent toward the non-mounting surface side of the electronic component. According to the above means, for example, when the molded substrate flows into the solder bath, the wind direction member is prevented from interfering with the solder bath, so that the manufacturing workability is improved.

According to a seventh aspect of the present invention, there is provided an electronic component module comprising: a molded substrate formed by sealing a conductive plate with a resin sealing portion;
A through hole provided in the molded substrate and penetrating the sealing portion and the conductive plate, and an electronic component mounted on one surface of the molded substrate and having a lead terminal inserted into the through hole and soldered to the conductive plate And an external connection portion provided integrally with the conductive plate and protruding outside the sealing portion, wherein the external connection portion is bent toward the non-mounting surface side of the electronic component. are doing. According to the above means, after the lead terminals of the electronic component are inserted into the through holes and soldered to the conductive plate from the non-mounting surface side of the electronic component, the external connection portion can be bent to the non-mounting surface side. For this reason, for example, when the molded substrate is flowed into the solder bath and the lead terminals are soldered, the external connection portion is prevented from interfering with the solder bath, so that manufacturing workability is improved. In addition, since it is not necessary to separately connect the external connection portion to the predetermined conductive plate, an increase in the number of components can be suppressed.

According to an eighth aspect of the present invention, there is provided a method of manufacturing an electronic component module according to the seventh aspect, wherein a lead terminal of the electronic component is inserted into a through-hole of the molded substrate, and the electronic component module has a counter electrode. It is characterized in that after soldering to the conductive plate from the mounting surface side, the external connection portion is bent toward the non-mounting surface side of the electronic component. According to the above means, for example, when the molded substrate flows into the solder bath, the external connection portion is prevented from interfering with the solder bath, so that the manufacturing workability is improved.

[0012]

FIG. 1 shows a first embodiment of the present invention.
7 will be described with reference to FIG. First, in FIG.
The cabinet 1 has a rectangular box shape with an open front surface, and a cooking chamber 2 is formed in the cabinet 1. A door 3 is rotatably mounted at a front end of the cooking chamber 2, and a front opening of the cooking chamber 2 is opened and closed based on a rotation operation of the door 3.

An operation panel 4 is fixed to the front end of the cabinet 1 on the right side of the cooking chamber 2. A machine room 5 is located in the cabinet 1 behind the operation panel 4.
(See FIG. 1A). The machine room 5 is adjacent to the right side of the cooking room 2, and a magnetron 6 (see FIG. 5) is disposed in the machine room 5.

As shown in FIG. 1A, a magnetron drive circuit module 7 corresponding to an electronic component module is provided in the machine room 5. The magnetron drive circuit module 7 has a magnetron drive circuit 9 mounted on a molded substrate 8. A drive power is supplied to the magnetron 6 from a commercial AC power supply 10 (see FIG. 5) through the magnetron drive circuit 9. Hereinafter, the magnetron drive circuit 9 and the molded substrate 8 will be described in detail.

<Regarding the Magnetron Drive Circuit 9> Both terminals of the commercial AC power supply 10 are connected to both input terminals of the rectifier circuit 11, as shown in FIG. This rectifier circuit 1
Reference numeral 1 denotes a bridge connection of four rectifier diodes 12, and a noise prevention capacitor 13 is connected between both input terminals of the rectifier circuit 11. The rectifier circuit 11
Is connected to one terminal of a choke coil 14, and the other terminal of the choke coil 14 is connected to one terminal of a resonance capacitor 15.

The other terminal of the resonance capacitor 15 has an IG
The collector terminal of BT16 is connected and IGBT1
6, a flywheel diode 17 is connected between the collector terminal and the emitter terminal. These IGBTs
The IGBT 16 has an emitter terminal connected to the output terminal (−) of the rectifier circuit 11, and a smoothing capacitor 19 connected between both output terminals of the rectifier circuit 11. Have been.

The primary coil 21 of the step-up transformer 20 is connected between both terminals of the resonance capacitor 15. The step-up transformer 20 is configured by winding a primary coil 21, a secondary coil 23, and a heater coil 24 around a bobbin 22 (see FIG. 1A) made of synthetic resin. Constitutes a resonance circuit 25 together with the resonance capacitor 15.

As shown in FIG. 5, a high voltage circuit 26 is connected to both terminals of the secondary coil 23. The high voltage circuit 26 includes a high voltage diode 27 connected between both terminals of the secondary coil 23, a high voltage capacitor 28 interposed between an anode terminal of the high voltage diode 27 and one terminal of the secondary coil 23, A high-voltage resistor 29 connected between both terminals of the capacitor 28; a cathode terminal of the high-voltage diode 27 is grounded to the bottom plate 30 (see FIG. 1A) of the cabinet 1; Are the cathode terminal of the high voltage diode 27 and the bottom plate 30.
Is connected between. Each rectifier diode 12,
The IGBT 16, the flywheel diode 17, and the high-voltage diode 27 correspond to internal electronic components, and are composed of semiconductor bare chips.

Both terminals of the heater coil 24 are connected to both cathode terminals of the magnetron 6, as shown in FIG. The cathode of the magnetron 6 also serves as a heater, and the anode terminal of the magnetron 6 is grounded to the bottom plate 30 of the cabinet 1. The noise prevention capacitor 13, the choke coil 14, the resonance capacitor 15,
The smoothing capacitor 19, the step-up transformer 20, the high-voltage capacitor 28, and the high-voltage resistor 29 correspond to electronic components.

<Regarding Molded Substrate 8> As shown in FIG. 3, the molded substrate 8 is formed by embedding a plurality of elongated conductive plates 32 in a rectangular plate-shaped sealing portion 31. Part 3
1 is formed based on injecting an epoxy resin into a mold (not shown). In addition, a plurality of conductive plates 3
Reference numeral 2 denotes a circuit pattern of FIG. 5 for electrically connecting the rectifier circuit 11 to the high-voltage resistor 29, and is formed by pressing a copper plate.

As shown in FIG. 1B, thin hinges 34 are integrally formed at the four corners of the sealing portion 31 at the front and rear surfaces. A cylindrical boss 35 corresponding to the mounting portion is integrally formed. On the inner peripheral surface of each of these bosses 35, as shown in FIG.
Screws 36 are tightened from below through the bottom plate 30 of the cabinet 1, and the molded substrate 8 is fixed to the upper surface of the bottom plate 30 by the fastening force of the four screws 36.

Each set of hinges 34 and bosses 35 is shown in FIG.
As shown in FIG. 2A, the boss 35 is formed in a horizontal state parallel to the sealing portion 31, and each boss 35 is formed as shown in FIG. Later hinge 34
Is made vertical based on bending downward. In this vertical state, each boss 35 is urged upward by the elastic restoring force of the hinge 34, and is held in a state of being in close contact with the lower surface of the sealing portion 31.

As shown in FIG. 1A, an insulating barrier 37 is integrally formed on the upper surface of the sealing portion 31. The insulating barrier 37 has a flat plate shape extending in the front-rear direction, and divides the upper surface of the sealing portion 31 into a high pressure region 38 in the left half and a low pressure region 39 in the right half.

The bobbin 22 of the step-up transformer 20 has two through holes (not shown), and a screw 40 is inserted into each through hole from above. Also, the sealing portion 31
Has two screw holes 41 formed in the high-pressure area 38, and the step-up transformer 20 tightens the lower end of each screw 40 into the screw hole 41 so that the high-pressure It is fixed in the area 38.

As shown in FIG. 3, a plurality of through-holes 42 are formed in the molded substrate 8, and on the upper surface of the sealing portion 31, as shown in FIG. And a frusto-conical projection 43 is integrally formed. As shown in FIG. 4, each of these through holes 42 includes a terminal hole 44 formed in the conductive plate 32, a tapered hole 45 penetrating the upper half of the sealing portion 31, and a lower half portion of the sealing portion 31. And a plurality of lead terminals 47 of the step-up transformer 20 are inserted into the plurality of through-holes 42 from above (only one is shown). Based on the soldering of the lead terminals 47 to the periphery of the plurality of terminal holes 44, the conductive plate 32 (the circuit pattern 3
3) is electrically connected.

As shown in FIG. 1A, a noise prevention capacitor 13, a choke coil 14, a resonance capacitor 15, and a smoothing capacitor 19 are mounted on the upper surface of the sealing portion 31 as shown in FIG. The high voltage capacitor 28 and the high voltage resistor 29 are mounted in the high voltage region 38 (the mounting state of the choke coil 14, the high voltage capacitor 28 and the high voltage resistor 29 is omitted in the drawing). The plurality of lead terminals 47 of the noise prevention capacitor 13 to the high voltage resistor 29 are inserted into the plurality of through holes 42 from above, and the noise prevention capacitor 13 to the high voltage resistor 29 are connected to the plurality of lead terminals 4.
7 is electrically connected to the circuit pattern 33 based on soldering to the periphery of the plurality of terminal holes 44.

As shown in FIG.
The rectifier diode 12, the IGBT 16, the flywheel diode 17, and the high voltage diode 27 are embedded. These four rectifier diodes 12 to high-voltage diodes 27 are mounted on the upper surface of the conductive plate 32, as shown in FIG. 4 as a representative of the IGBT 16, and are based on wire bonding to the conductive plate 32. It is electrically connected to the circuit pattern 33 inside the sealing portion 31.

As shown in FIG. 1A, a predetermined ground plate 48 is formed integrally with the predetermined conductive plate 32 so as to be bent downward. The ground connection portion 48 corresponds to an external connection portion protruding outside the sealing portion 31, and is grounded by being screwed to the bottom plate 30 of the cabinet 1. As shown in FIG. 5, a ground terminal 48 connects the cathode terminal of the high-voltage diode 27 to the bottom plate 3.
0 is grounded.

As shown in FIG. 1A, a thin hinge 49 extending in the front-rear direction is integrally formed on the right side surface of the sealing portion 31. The hinge 49 has a plate-like shape extending in the front-rear direction. The electronic component cover 50 is integrally formed. The hinge 49 and the electronic component cover 50 are formed in a horizontal state parallel to the sealing portion 31 similarly to the boss 35 and the like. It is in a vertical state based on bending upward.

A plurality of screws 51 are fastened to the right side of the sealing portion 31 from the right through the electronic component cover 50. These screws 51 connect the electronic component cover 50 to the molded substrate 8.
The electronic component cover 50 covers the high-voltage components such as the step-up transformer 20 from the right side based on the fact that the electronic component cover 50 is held in the vertical state. Prevents touching parts.

A heat radiating member 52 is screwed to the lower surface of the sealing portion 31. The heat dissipating member 52 is formed by extruding aluminum, and includes a flat base 53 closely contacting the lower surface of the sealing portion 31 and a plurality of heat dissipating fins 54 extending in the left-right direction, as shown in FIG. are doing. The magnetron drive circuit module 7 is configured as described above.

In the machine room 5, a cooling fan device (not shown) is located on the left side of the magnetron drive circuit module 7.
Are arranged. In this cooling fan device, a fan is connected to a rotation shaft of a fan motor. When the fan rotates based on the driving of the fan motor, cooling air is discharged from the fan toward the heat radiation member 52 on the right side.

A control circuit board (not shown) composed of a printed wiring board is provided in the machine room 5, and a control device (not shown) is mounted on the control circuit board. This control device has a microcomputer, a gate drive circuit and the like, and changes the voltage and current generated in the primary coil 21 of the step-up transformer 20 based on switching control of the IGBT 16 to control the heating output of the magnetron 6. I do.

Next, a method for manufacturing and mounting the magnetron drive circuit module 7 will be described. (1) The four rectifier diodes 12, IGBT 16, flywheel diode 17, and high-voltage diode 27 are mounted on the upper surface of the conductive plate 32 and wire-bonded. In this state, a plurality of conductive plates 32 are connected to a plurality of connecting bars (not shown).
And is connected to a single plate through the first plate, and this single plate is referred to as a frame plate.

(2) The frame plate is positioned and stored in the molding die based on being sandwiched between a movable die and a fixed die (both not shown). Then, the molded substrate 8 is molded based on the injection of the epoxy resin into the molding die, and the molded substrate 8 is removed from the molding die. In this state, the hinges 34, the bosses 35, the hinges 49, and the electronic component cover 50 of each set are in a state horizontal to the molded substrate 8.

(3) The molded substrate 8 is set in a press device (not shown), and the frame plate is pressed. Then, the plurality of connecting bars are cut at once, and the frame plate is separated into the plurality of conductive plates 32.

(4) Noise prevention capacitor 13, choke coil 14, resonance capacitor 15, smoothing capacitor 1
9. The plurality of lead terminals 47 of the high voltage capacitor 28 and the high voltage resistor 29 are inserted into the plurality of through holes 42 of the molded board 8. At the same time, the plurality of lead terminals 47 of the step-up transformer 20 are inserted into the plurality of through holes 42, and the step-up transformer 20
Is screwed to the molding substrate 8.

(5) The molded substrate 8 is caused to flow in a solder bath (not shown), and a plurality of lead terminals 47 are soldered at once from the lower surface side of the molded substrate 8 to the peripheral edge of the terminal hole 44 in the solder bath.
Then, the molded substrate 8 is removed from the solder bath, and the predetermined conductive plate 32 is bent downward so that the ground connection portion 48 is formed.
To form

(6) The hinge 49 of the electronic component cover 50 is bent upward, and the electronic component cover 50 stands upright. Then, the sealing portion 31 is passed through the electronic component cover 50.
Then, a plurality of screws 51 are tightened to fix the electronic component cover 50 in an upright state.

(7) The hinge 34 of each boss 35 is bent downward, and each boss 35 is turned upside down. Then, the molded substrate 8 is stored in the machine room 5 of the cabinet 1, and screws 36 are inserted into the respective bosses 35 through the bottom plate 30 of the cabinet 1.
To fix the molded substrate 8 in the machine room 5.

According to the first embodiment, the circuit pattern 3
3 was composed of a plurality of conductive plates 32. For this reason, the conductive plate 32, which is thicker and narrower than the copper foil pattern, can be used, so that the magnetron drive circuit module 7 is downsized. In addition, since the current loop is reduced, noise is reduced.

Since the internal electronic components such as the IGBT 16 are embedded in the sealing portion 31 and wire-bonded to the conductive plate 32 in the sealing portion 31, the electrical connection portion such as the IGBT 16 is formed inside the sealing portion 31. Buried in Moreover, the lead terminals 47 of the external electronic components such as the step-up transformer 20 were soldered to the conductive plate 32 in the through holes 42 of the molded board 8. For this reason, the electrical connection portion such as the step-up transformer 20
2, the electrical reliability is generally improved.

The lead terminals 4 of the step-up transformer 20 and the like
7 is inserted into the through-hole 42 and soldered to the conductive plate 32 from below, and then the boss 35 is bent downward from the hinge 34, so that when the molded substrate 8 flows into the solder tank, the boss 35 is inserted into the solder tank. Interference is prevented. Therefore, the molded substrate 8
Therefore, the work of loading the magnetron drive circuit module 7 is improved. In addition, since it is not necessary to separately attach the boss 35 to the molded substrate 8, an increase in the number of components can be suppressed.

The lead terminals 4 of the step-up transformer 20 and the like
Since the electronic component cover 50 is bent upward from the hinge 49 after inserting the electronic component 7 into the through hole 42, the step-up transformer 20 and the like interfere with the electronic component cover 50 when the lead terminal 47 is inserted into the through hole 42. Is prevented. Therefore, the work of inserting the lead terminal 47 into the through hole 42 is simplified, and the workability of manufacturing the magnetron drive circuit module 7 is also improved from this point. Moreover, since it is not necessary to separately attach the electronic component cover 50 to the molded substrate 8,
An increase in the number of parts can be suppressed.

The lead terminals 4 of the step-up transformer 20 and the like
7 was inserted into the through hole 42 and soldered to the conductive plate 32 from below, and then the ground connection portion 48 was bent downward.
When the molded substrate 8 is put into the solder bath, the ground connection 4
8 is prevented from interfering with the solder bath. For this reason, the work of putting the molded substrate 8 into the solder tank is further simplified, and the workability of manufacturing the magnetron drive circuit module 7 is further improved. Moreover, the ground connection portion 48 is connected to the conductive plate 32.
Since there is no need to separately connect the components, an increase in the number of components can be suppressed.

Further, since the projection 43 is formed integrally with the peripheral portion of the through hole 42 in the sealing portion 31, the creeping insulation distance between the lead terminals 47 is increased. For this reason, since the linear separation distance between them can be shortened, the magnetron drive circuit module 7 can be further reduced in size. Moreover, even if water or the like is dropped on the upper surface of the sealing portion 31, it is difficult for the water to collect between the lead terminals 47, so that the occurrence of tracking is prevented.

The high voltage side of the magnetron drive circuit 9 in the sealing portion 31 (the side of the step-up transformer 20 and the high voltage circuit 26)
Since the insulating barrier 37 is formed integrally between the low voltage side (the rectifier circuit 11 and the inverter circuit 18 side), the creepage insulation distance between them becomes longer. For this reason, the linear separation distance between the two can be reduced, so that the magnetron drive circuit module 7
Are further miniaturized. Moreover, the magnetron drive circuit 9
Along the right side of the cabinet 1 (the machine room 5). For this reason, the linear separation distance between the two can be reduced, and the magnetron drive circuit module 7 can be further reduced in size in this respect.

A heat radiating member 52 was mounted on the sealing portion 31. For this reason, the heat generated in the magnetron drive circuit 9 is released through the heat dissipation member 52, so that the heat dissipation of the magnetron drive circuit 9 is improved.

Next, a second embodiment of the present invention will be described with reference to FIG. Thin hinges 55 extending in the left-right direction are integrally formed on both front and rear sides of the sealing portion 31 (only one hinge 55 is shown), and each hinge 55 has a plate-shaped wind direction member 56 extending in the left-right direction. It is formed integrally. The hinge 55 and the wind direction member 56 of each set are formed in a horizontal state parallel to the sealing portion 31 like the hinge 34 and the boss 35.
1 is formed vertically by bending the hinge 55 downward after molding.

The wind direction members 56 are provided on both front and rear sides of the sealing portion 31.
, A plurality of screws 57 are tightened. These screws 57 hold the wind direction member 56 in a vertical state, and the cooling air discharged from the cooling fan device is guided to the heat radiating member 52 by both vertical wind direction members 56.

Next, a method for manufacturing and mounting the magnetron drive circuit module 7 will be described. (1) An internal electronic component such as the IGBT 16 is mounted on the upper surface of the frame plate and wire-bonded. Then, the frame plate is housed in a mold and the molded substrate 8 is formed based on the injection of the epoxy resin, and the frame plate is separated into a plurality of conductive plates 32.

(2) A plurality of lead terminals 47 of an electronic component such as the resonance capacitor 15 are connected to a plurality of through holes 42 of the molded substrate 8.
Insert inside. At the same time, the plurality of lead terminals 47 of the step-up transformer 20 are inserted into the plurality of through holes 42, and the step-up transformer 20 is screwed to the molded board 8. Then, after the plurality of lead terminals 47 are soldered to the periphery of the terminal hole 44 in the solder bath, the ground connection portion 48 is formed based on bending a predetermined conductive plate 32 downward.

(3) The hinge 49 of the electronic component cover 50 is bent upward, and the electronic component cover 50 is screwed to the sealing portion 31. At the same time, the hinge 55 of each wind direction member 56 is bent downward, and each wind direction member 56 is screwed to the sealing portion 31. Thereafter, the hinge 34 of each boss 35 is bent downward, and each boss 35 is screwed to the bottom plate 30 of the machine room 5.

According to the second embodiment, the sealing member 31 is provided with the wind direction member 56. Therefore, the cooling air is efficiently supplied from the cooling fan device to the heat radiating member 52, so that the heat radiation of the magnetron drive circuit 9 is further improved.

The lead terminals 4 of the step-up transformer 20 and the like
7 was inserted into the through hole 42 and soldered to the conductive plate 32 from the lower surface side, and then the wind direction member 56 was bent to the lower surface side.
When flowing the molded substrate 8 into the solder bath, the wind direction member 56 is prevented from interfering with the solder bath. Therefore, the work of putting the molded substrate 8 into the solder tank is simplified, and the workability of manufacturing the magnetron drive circuit module 7 is improved. In addition, since it is not necessary to separately attach the wind direction member 56 to the sealing portion 31, an increase in the number of components can be suppressed.

In the second embodiment, the cooling fan device is provided to the left of the magnetron drive circuit module 7. However, the present invention is not limited to this. A cooling fan device may be provided either forward or backward. In particular, when the cooling fan device is provided in front of or behind the magnetron drive circuit module 7, the radiating fins 54 of the radiating member 52 extend in the front-rear direction, and the wind direction members 56 may be formed integrally.

Next, a third embodiment of the present invention will be described with reference to FIG. A bent portion 57 is formed on a predetermined plurality of conductive plates 32 (only one is shown). Each of these bent parts 5
Reference numeral 7 denotes a lower surface exposed outside the sealing portion 31.
The internal electronic components such as the GBT 16 are mounted on the upper surface of the bent portion 57, and an insulating plate 58 made of silicon rubber is interposed between the lower surface of the sealing portion 31 and the base 53 of the heat radiating member 52.

According to the third embodiment, the internal electronic components such as the IGBT 16 are mounted on the upper surface of the bent portion 57. For this reason, the heat generated in the internal electronic components is efficiently transmitted to the heat radiating member 52 through the bent portion 57, so that the heat radiation of the internal electronic components in the magnetron drive circuit 9 is particularly improved.

In the third embodiment, the bent portion 5
7 is exposed to the outside of the sealing portion 31, but is not limited to this. For example, an aluminum heat transfer member is brought into contact with the lower surface of the bent portion 57 to seal the lower surface of the heat transfer member. It may be exposed outside the stop portion 31.

In the first to third embodiments, the inverter circuit 18 is connected to one IGBT 16 and one IGBT 16.
The resonance circuit 25 is composed of one resonance capacitor 15 and the primary coil 21 of the step-up transformer 20. However, the present invention is not limited to this. For example, the fourth embodiment of the present invention Figure 1 showing
0, the inverter circuit 18 is connected to two IGBTs 16
And the two resonance capacitors 25 and the primary coil 21 of the step-up transformer 20.

In the first to fourth embodiments, the plurality of conductive plates 32 are formed by pressing a copper plate. However, the present invention is not limited to this. For example, the copper plate may be etched. A plurality of conductive plates 32 may be formed based on the above. In the first to fourth embodiments, the electronic component cover 50 is bent upward after the soldering of the lead terminals 47. However, the present invention is not limited to this. Immediately after insertion, the molded board 8 may be bent upward and screwed to the sealing portion 31, and the molded substrate 8 may be flown into the solder bath with the electronic component cover 50 folded.

In the first to fourth embodiments, the plurality of lead terminals 47 are soldered to the peripheral portions of the plurality of terminal holes 44 in the solder bath. However, the present invention is not limited to this. A plurality of lead terminals 47 are connected to a plurality of terminal holes 4.
After soldering individually to the periphery of No. 4, a plurality of bosses 35,
Ground connection part 48, electronic component cover 50, wind direction member 56
May be bent. In the case of this configuration, the work of inserting the lead terminals 47 and the work of soldering can be performed without being obstructed by the electronic component cover 50, the boss 35, and the like, so that the manufacturing workability is improved.

In the first to fourth embodiments, the present invention is applied to the magnetron drive circuit module 7 for driving the magnetron 6 of the microwave oven. However, the present invention is not limited to this. The present invention may be applied to a coil drive circuit module for driving a heating coil, a motor drive circuit module for rotationally driving a main motor of a washing machine, and the like.

[0064]

As is apparent from the above description, the electronic component module and the method for manufacturing the electronic component module according to the present invention have the following effects. According to the first and second aspects of the present invention, after the lead terminal of the electronic component is inserted into the through hole and soldered to the conductive plate from the non-mounting surface side of the electronic component, the mounting portion is folded to the non-mounting surface side. Can be bent. For this reason,
Since the mounting part is prevented from obstructing soldering,
Manufacturing workability is improved. According to the third and fourth aspects, after the lead terminal of the electronic component is inserted into the through hole, the electronic component cover can be bent toward the mounting surface of the electronic component. For this reason, the electronic component cover is prevented from hindering the work of inserting the lead terminal, and the workability in manufacturing is improved.

According to the fifth and sixth aspects of the present invention, after the lead terminals of the electronic component are inserted into the through holes and soldered to the conductive plate from the side opposite to the mounting surface of the electronic component, the wind direction member is removed from the mounting surface. Can be folded to the side. For this reason, the wind direction member is prevented from hindering the soldering, so that the manufacturing workability is improved. According to the measures of claims 7 and 8,
After the lead terminals of the electronic component are inserted into the through holes and soldered to the conductive plate from the side opposite to the mounting surface of the electronic component, the external connection portion can be bent toward the side opposite to the mounting surface. For this reason, the external connection portion is prevented from hindering the soldering, and the workability in manufacturing is improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention (a is a front view showing a magnetron drive circuit module, and b is a bottom view).

FIG. 2 (a) is a side view showing the boss in a non-bent state,
(B) is a side view showing the boss in a bent state.

FIG. 3 is a perspective view showing a molded substrate.

FIG. 4 is a longitudinal sectional side view of a molded substrate showing a connection state of electronic components.

FIG. 5 is a diagram showing an electrical connection state of the magnetron drive circuit;

FIG. 6 is a perspective view showing a protrusion of a sealing portion.

FIG. 7 is a perspective view showing the appearance of a microwave oven.

FIG. 8 is a view showing a second embodiment of the present invention (a is a front view showing a magnetron driving circuit module, b is a bottom view, and c is a cross-sectional view along X-ray).

FIG. 9 is a view corresponding to FIG. 4, showing a third embodiment of the present invention.

FIG. 10 is a view corresponding to FIG. 5, showing a fourth embodiment of the present invention;

[Explanation of symbols]

7 is a magnetron drive circuit module (electronic component module), 8 is a molded board, 13 is a noise prevention capacitor (electronic component), 14 is a choke coil (electronic component), 15 is a resonance capacitor (electronic component), and 19 is a smoothing capacitor ( Electronic components), 20 is a step-up transformer (electronic components), 28
Is a high-voltage capacitor (electronic component), 29 is a high-voltage resistor (electronic component), 31 is a sealing portion, 32 is a conductive plate, 34 is a hinge,
35 is a boss (mounting portion), 42 is a through hole, 47 is a lead terminal, 48 is a ground connection portion (external connection portion), 49 is a hinge, 50 is an electronic component cover, 52 is a heat dissipation member, 55 hinge, and 56 is a wind direction. The members are shown.

Claims (8)

[Claims] A molded substrate formed by sealing a conductive plate with a resin sealing portion; a through hole provided in the molded substrate, penetrating the sealing portion and the conductive plate; An electronic component mounted on one surface and having a lead terminal inserted into the through hole and soldered to the conductive plate; and an attachment provided integrally with the sealing portion via a hinge to attach the molded substrate. An electronic component module, wherein the mounting portion is bent toward the non-mounting surface side of the electronic component around the hinge. 2. The method for manufacturing an electronic component module according to claim 1, wherein the lead terminals of the electronic component are inserted into the through holes of the molded substrate and soldered to the conductive plate from the side opposite to the mounting surface of the electronic component. And a method of manufacturing an electronic component module, wherein the mounting portion is bent to the side opposite to the mounting surface of the electronic component. 3. A molded substrate obtained by sealing a conductive plate with a resin sealing portion; a through hole provided in the molded substrate, penetrating the sealing portion and the conductive plate; An electronic component mounted on one surface and having lead terminals inserted into the through holes and soldered to the conductive plate; and an electronic component cover integrally provided on the sealing portion via a hinge, An electronic component module, wherein the electronic component cover is bent toward the mounting surface side of the electronic component around the hinge. 4. The method of manufacturing an electronic component module according to claim 3, wherein the electronic component cover is bent toward the mounting surface of the electronic component after inserting the lead terminal of the electronic component into the through hole of the molded substrate. A method for manufacturing an electronic component module, comprising: 5. A molded substrate formed by sealing a conductive plate with a resin sealing portion; a through hole provided in the molded substrate, penetrating the sealing portion and the conductive plate; An electronic component mounted on one surface and having lead terminals inserted into the through holes and soldered to the conductive plate; a heat dissipating member provided on the mounting surface of the molded substrate opposite to the electronic component; A wind direction member provided integrally with the stop portion via a hinge and guiding cooling air to the heat dissipation member, wherein the wind direction member is bent around the hinge toward the non-mounting surface side of the electronic component. An electronic component module. 6. A method for manufacturing an electronic component module according to claim 5, wherein the lead terminals of the electronic component are inserted into the through holes of the molded substrate and soldered to the conductive plate from the side opposite to the mounting surface of the electronic component. A method for manufacturing an electronic component module, comprising: bending a wind direction member to a side opposite to a mounting surface of an electronic component. 7. A molded substrate formed by sealing a conductive plate with a resin sealing portion; a through hole provided in the molded substrate, penetrating the sealing portion and the conductive plate; An electronic component mounted on one surface and having a lead terminal inserted into the through hole and soldered to the conductive plate; and an external connection portion provided integrally with the conductive plate and protruding outside the sealing portion. The electronic component module, wherein the external connection portion is bent toward a side opposite to the mounting surface of the electronic component. 8. The method for manufacturing an electronic component module according to claim 7, wherein the lead terminals of the electronic component are inserted into the through holes of the molded substrate and soldered to the conductive plate from the side opposite to the mounting surface of the electronic component. And a method of manufacturing an electronic component module, wherein the external connection portion is bent toward a side opposite to the mounting surface of the electronic component.