JP2001143988A - Moving body guiding apparatus and aligner using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method of guiding and driving a moving body at a high accuracy. SOLUTION: The apparatus has a first moving body to be a Y-stage 3 and a second moving body to be an X-stage 4 movable in mutually perpendicularly transverse directions on a surface plate 1, such that the Y-stage 3 is guided along a fixed guide 2 fixed onto the surface plate 1 in the transverse direction, the X-stage 4 is guided along the side face of the Y-stage 3 in the transverse direction, and the Y- and X-stages 3, 4 are guided along the surface of the surface plate 1 in the vertical direction. A first actuator composed of a linear motor 50 having a stator 50b fixed to the surface plate 1 drives the Y-stage 3, and a second actuator composed of a linear motor 51 having a stator 51b fixed to the surface plate 1 drives the X-stage 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor exposure apparatus,
The present invention relates to a movement guide device having a moving body that repeats high-speed movement and precision positioning or that performs scanning movement with high precision, which is used in a precision measuring device or a precision processing machine, and an exposure apparatus using the device.

[0002]

2. Description of the Related Art A conventional moving guide device has a fixed surface plate serving as a reference for a moving body, and a stage (here, a Y stage) as a moving body exists on the fixed surface plate. A stage (here, referred to as a Y stage) that moves in the orthogonal direction in the XY plane is mounted thereon.

[0003]

However, in the above-described conventional moving guide device, the Y stage is stacked on the surface plate, and the X stage is further stacked thereon, so that the device becomes vertically high. As shown in FIG. 4, the X stage 4 moves on the Y stage 3.
Moves, a bias of the load acting on the Y stage 3 occurs, and the Y stage 3 is deformed. Therefore, X stage 4
, The static attitude accuracy (pitting) is deteriorated. Assuming that the X and Y stages are rigid,
The dynamic movement of both the X stage and the Y stage has six degrees of freedom. In this configuration, since all six degrees of freedom of each of the X stage and the Y stage are coupled, the posture accuracy is dynamically degraded. Since the position of the center of gravity in the plane of the system changes as the X stage moves, by driving the stage,
Excites vibrations such as pitching and yawing. And the like.

[0004] It is an object of the present invention to provide a moving guide apparatus for guiding and driving a moving body with high accuracy, and to provide a moving guide method for guiding and driving a moving body with high accuracy. Another object of the present invention is to provide an exposure apparatus using such an apparatus or method, and a small device such as a semiconductor or a liquid crystal panel manufactured by the apparatus or method.

[0005]

In order to achieve the above object, the present invention comprises a first moving body and a second moving body which can move on a surface plate in a direction perpendicular to each other. The lateral guidance of the first moving body is performed by a guide fixed on the surface plate, and the lateral guidance of the second moving body is performed on a side surface of the first moving body. In the device, both the first moving body and the second moving body are guided in the vertical direction on the surface of the surface plate, and the driving of the first moving body is performed by one first actuator. The driving of the second moving body is performed by a second actuator provided on the first moving body.

Due to this feature, the present invention does not stack the X stage and the Y stage,
It makes it possible to reduce the height of the device. Even if the X stage moves, no bias in the load occurs on the Y stage, and the static posture accuracy is kept high. The vertical vibration and rolling of the Y stage are not transmitted to the X stage at all. Since there is only one Y stage driving actuator, the cost is reduced. There is an effect.

The present invention is also directed to a first moving body and a second moving body which can move in a lateral direction orthogonal to each other on a surface plate.
The first moving body is guided laterally by a guide fixed on the surface plate, and the second moving body is guided by the second moving body.
In the moving guide device in which the lateral guidance of the moving body is performed on the side surface of the first moving body, the vertical guidance of the first moving body and the second moving body are both performed on the surface of the surface plate. The driving of the first moving body is performed by one first actuator, and the driving of the second moving body is performed by a second actuator provided on the first moving body. In such a case, the same operation as described above can be obtained.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, the first moving body and the second moving body are guided by a static pressure bearing.
The driving of these two moving bodies is performed in a non-contact configuration by using a linear motor. Since the Y stage pitching is transmitted to the X stage only through the gap of the static bearing, the transmitted amount is small. It is possible to dynamically maintain the posture accuracy with high accuracy. Since there is no friction between solids, there is no hiss and the like, and high-precision positioning is enabled. Since no heat is generated from the contact portion, no thermal deformation or the like occurs, and highly accurate positioning can be performed from this surface. Further, there is no generation of dust and no mechanism for collecting dust is required, so that the structure can be simplified easily and the cost can be reduced. Maintenance such as grease up becomes unnecessary. And so on.

Further, the present invention can be applied to an exposure apparatus using the above apparatus or method, and can also be applied to a semiconductor or a liquid crystal panel manufactured by the above apparatus or method.

[0010]

1 to 3 are schematic views of a moving guide device according to an embodiment of the present invention. FIG. 1 is a perspective view, and FIG.
FIG. 3 is a sectional view taken along the line A in FIG. In the movement guide device shown in FIGS. 1 to 3, 1 is a surface plate, and 2 is a surface plate 1.
A fixed guide fixed on the top, 3 is a Y stage as a first moving body, 4 is an X stage as a second moving body, 5
Reference numerals 0 and 51 are linear motors, 50 is a linear motor for driving the Y stage, and 51 is a linear motor for driving the X stage. Numerals 60 to 63 denote static pressure air bearings. Numeral 60 denotes vertical guidance of the Y stage (vertical direction), numeral 61 denotes lateral guidance of the Y stage, numeral 62 denotes vertical guidance of the X stage, and numeral 63 denotes X. Guides are provided for each stage in the horizontal direction. That is, as shown in FIG.
Both the stage 3 and the X stage 4 are guided in the vertical direction on the surface of the surface plate 1 via the respective static pressure air bearings 60 and 62.

The Y stage 3 has guide transporters 31, 31 on both sides continuing straightly in the Y direction, and these two guide transporters 3.
1 and 31, and an X-direction guide 32 extending in the X-direction perpendicular to the two guide carriers.
The lower surfaces of the two guide carriers 31 are supported in a non-contact manner by respective static pressure air bearings 60 interposed between the guide carrier 31 and the surface of the surface plate 1. Static pressure air bearing 61 interposed between inner surface
Are supported in the X direction movably in the Y direction without contact.

The Y stage 3 has a movable member 5 of a linear motor 50 for driving the Y stage on one guide carrier 31.
0a is connected, and is movable along the stator 50b fixed to the outside of the fixed guide 2 in the Y direction while being guided by the surface plate 1 and the fixed guide 2. The X direction guide 32 of the Y stage 3 has a channel shape, and the stator 51b of the X stage driving linear motor 51 is fixed inside.

The X stage 4 has a lower plate portion 41 and both side plate portions 4.
2, 42 and a substrate stage 43,
The X-direction guide 32 of the Y stage 3 passes between the X-direction guides 42, and is brought into non-contact by static pressure air bearings 62, 62 interposed between the outer surface of the X-direction guide 32 and the inner surface of the side plate 42. The lower plate 4 is supported in the Y direction so as to be movable in the X direction.
1 is vertically supported in a non-contact manner by static pressure air bearings 63, 63 provided on the lower surface of the unit 1 and is movable by a linear motor 51 in the X direction.

In the above configuration, the Y stage 3 floats from the surface plate 1 by supplying air to the static pressure air bearing 60, and floats from the fixed guide 2 by supplying air to the static pressure air bearing 61. Further, the X stage 4 rises from the surface plate 1 by supplying air to the static pressure air bearing 62, floats from the Y stage 3 by supplying air to the static pressure air bearing 63, and all are in a non-contact state. . In this state, the Y stage 3 is driven by the linear motor 50 having the stator 50b fixed to the base 1, the X stage 4 is driven by the linear motor 51 having the stator 51b fixed to the Y stage 3, The X stage 4 is positioned at an arbitrary position in the XY plane.

The movement guide device according to this embodiment has the following effects. Since both the Y stage 3 and the X stage 4 are supported by the surface of the surface plate 1, there is no uneven load on the Y stage 3 even when the X stage 4 moves, so that the static posture accuracy can be kept good. . Regarding the coupling of vibration between the Y stage 3 and the X stage 4, of the six degrees of freedom, the vertical direction and the rolling of the Y stage 3 are not transmitted to the X stage 4 at all, and the dynamic posture accuracy is kept good. be able to. Further, since only a very small amount of the rolling of the Y stage 3 is transmitted through the gap of the static pressure air bearing, the dynamic posture accuracy can be kept good. By making the X stage 4 overhang the fixed guide 2 or the Y stage 3 as compared with the conventional example,
The occupied areas of the surface plate 1 and the moving body are substantially matched. The thickness of the moving body in the height direction can be reduced to about 比 べ compared to the conventional example. Since all are non-contact, there is no generation of dust and heat, high precision and easy maintenance. Since the Y stage 3 is driven by only one linear motor, the cost is reduced.

The present invention is not limited by the above embodiment. For example, a static pressure bearing using hydraulic pressure may be used instead of the static pressure air bearing, and the X stage 4 may be the first moving body and the Y stage 3 may be the second moving body.

[0017]

[Embodiment of Device Production Method] Next, an embodiment of a device production method using an exposure apparatus using the above-described movement guide device will be described. FIG. 5 shows a flow of manufacturing small devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Next Step 5
The (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing, bonding).
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 6 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to expose a circuit pattern on the mask onto the wafer by printing. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a highly integrated device at a low cost, which was conventionally difficult to produce.

[0020]

As described above, according to the present invention, the first moving body and the second moving body are vertically guided on the surface of the surface plate, and the first moving body is driven on the surface plate. It is driven by one fixed first actuator, and the second moving body is the first
Driving with the second actuator fixed on the moving body has the following effects.

Since the X stage and the Y stage are not stacked, the height of the apparatus can be reduced.
In addition, by overhanging the X stage and the Y stage, the occupied area can be made substantially the same as that of the related art. Even if the X stage moves, no bias in the load on the Y stage occurs, and the static attitude accuracy can be maintained at high accuracy. Vertical vibration and Y stage rolling are not transmitted to the X stage at all. Since the Y stage pitching is transmitted only to the X stage only through the gap of the static pressure bearing, the transmitted amount is very small, and the posture accuracy can be dynamically maintained with high accuracy. Since there is only one Y stage driving actuator, the cost is reduced. Since there is no friction between solids, there is no hiss and the like, and highly accurate positioning is possible. Since there is no heat generation from the contact portion, no thermal deformation or the like occurs, and highly accurate positioning is possible from this surface. Further, there is no generation of dust and no mechanism for collecting dust is required, so that the structure can be simplified easily and the cost can be reduced. Maintenance such as grease up is unnecessary.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a movement guide device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a view taken in the direction of arrow B in FIG. 1;

FIG. 4 is a side view showing a deformed state of a stage in a conventional movement guide device.

FIG. 5 is a diagram showing an example of a flow in the case of manufacturing a small device using an exposure apparatus provided with a movement guide device according to the present invention.

FIG. 6 is a diagram showing a detailed flow of a wafer process in FIG. 5;

[Explanation of symbols]

1: surface plate, 2: fixed guide, 3: Y stage, 31: guide carrier, 32: X direction guide, 4: X stage, 4
1: lower plate portion, 42: side plate portion, 43: substrate stage, 5
0: linear motor for driving the Y stage, 51: linear motor for driving the X stage, 60, 61: static pressure bearing for guiding the Y stage, 62, 63: focus position measuring means, 9:
Static pressure bearing for X stage guidance.

Claims (5)

[Claims] A first movable body and a second movable body which are respectively movable in a lateral direction orthogonal to each other on a surface plate, wherein the first movable body is guided in a lateral direction by the surface plate; A guide fixed to the upper side of the first moving body, wherein the lateral guidance of the second moving body is performed on a side surface of the first moving body. Both vertical guidance is performed on the surface of the surface plate,
Is driven by one first actuator,
The movement guide device, wherein the second moving body is driven by a second actuator provided on the first moving body. 2. The moving guide according to claim 1, wherein the first moving body and the second moving body are guided by a static pressure bearing, and the two moving bodies are driven by a linear motor. apparatus. 3. A first movable body and a second movable body which are movable in a lateral direction orthogonal to each other on a surface plate, and the first movable body is guided in the lateral direction by the surface plate. A guide fixed to the upper side of the first moving body, wherein the lateral guidance of the second moving body is performed on a side surface of the first moving body. Both the vertical guidance is performed on the surface of the surface plate, the driving of the first moving body is performed by one first actuator, and the driving of the second moving body is provided on the first moving body. A moving guide method performed by the second actuator. 4. An exposure apparatus using one of the movement guide device according to claim 1 and claim 2 and the movement guide method according to claim 3. 5. A small device manufactured by using the exposure apparatus according to claim 4.