JP2001143866A - Method of manufacturing electroluminescent element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electroluminescent element that can form an EL element, particularly an organic EL element in the fine pattern dimension and also provide a method capable of easily manufacturing a color display panel. SOLUTION: In a method of manufacturing an EL element, convex patterns 12 (or, recessed patterns) are formed, which correspondes to an organic EL element 3R and arrangement in the copying substrate (first substrate) 10. The organic EL device 3R is formed on the convex shape pattern (also, in the recessed patterns). The organic EL device 3R of the copying substrate 10 is copied on the substrate (the second substrate) 2. The pattern number of the organic EL element 3R copied on the substrate 2 can be formed by corresponding the convex patterns 12 of copying substrate 10 and form the organic EL device 3R of fine pattern dimension.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electroluminescence (hereinafter, simply referred to as EL) element, and more particularly to a method for manufacturing an EL element which is suitable for miniaturization of an element pattern and suitable for manufacturing a color display panel. About.

[0002]

2. Description of the Related Art Generally, a vacuum evaporation method is used for forming a thin film having a thickness in the order of nm to μm. FIG. 18 is a schematic configuration diagram of a resistance heating type vacuum evaporation apparatus for realizing a vacuum evaporation method. As shown in FIG.
The vacuum evaporation apparatus includes a vacuum container 100 and the vacuum container 10.
And a boat 103 disposed below the inside of the vacuum vessel 100, and a substrate 103 is disposed above the inside of the vacuum vessel 100 so as to face the boat 101. The vacuum vessel 100 is connected to a vacuum exhaust device (not shown), and the inside of the vacuum vessel 100 can be evacuated to a vacuum required for depositing a thin film by the vacuum exhaust device. The boat 101 is formed of a resistor such as tungsten, molybdenum, or the like, and heats and evaporates the evaporating material 102 on the boat 101 by applying a current to cause the boat 101 to generate heat. be able to. As the vapor deposition material 102, a thin film to be vacuum-deposited, such as a powder or a bulk, is used. In the vacuum evaporation method, a thin film having a uniform thickness can be formed over the substrate 103.

Further, a thin film formed on the substrate 103 can be processed into a predetermined shape by a photolithography technique and an etching technique. 19 (A) to 19
(E) is a process sectional view for explaining the etching of the thin film.

First, as shown in FIG. 19A,
A substrate 103 having a thin film 104 formed on its surface is prepared. Next, as shown in FIG. 19B, a photoresist film 105 is formed on the thin film 104. The photoresist film 105 is formed with a uniform thickness by a spin coating method.

Subsequently, a latent image having a predetermined shape is formed on the photoresist film 105 by an exposure process, and as shown in FIG. 19C, an etching mask 105M is formed from the photoresist film 105 by performing a development process. By etching the thin film 104 using the etching mask 105M, the thin film 104 can be patterned as shown in FIG. Etching such as reactive ion etching, ion beam etching, and wet etching can be practically used for the etching. Then, as shown in FIG. 19E, the etching process is completed by selectively removing the etching mask 105M with an organic solvent or the like.

Since a thin film material that can be patterned by the above-described photolithography technique and etching technique needs to have at least water resistance and solvent resistance, an organic material such as an organic EL element is used for photolithography technique and etching. Patterning using technology cannot be performed. Therefore, a vacuum evaporation method is generally used for forming an organic EL element.

FIG. 20 is a schematic configuration diagram of a resistance heating type vacuum evaporation apparatus used for forming an organic EL element.
In the vacuum deposition apparatus shown in FIG. 20, a pattern forming mask 110 is disposed between a boat 101 and a substrate 103 inside a vacuum vessel 100, and vapor-deposited particles obtained by heating and depositing an organic material 111 form the pattern forming mask 110. Opening 110
H adheres to the substrate 103 according to the shape of H, and the opening 11
The organic EL element thin film 112 having a pattern corresponding to the shape of 0H can be formed over the substrate 103.

[0008]

However, in the above-described method of manufacturing an organic EL device using the vacuum evaporation apparatus shown in FIG. 20, no consideration was given to the following points.

The pattern forming mask 110 for forming the thin film 112 of the organic EL element is formed of a metal plate such as stainless steel, and the opening 110H is formed by laser processing or the like. The pattern forming mask 110 needs to have a thickness of, for example, about several hundred μm to increase the mechanical strength so as not to cause a change in shape. There is. In the current laser processing technology, an opening 11 having an opening size of several hundred μm
Only 0H can be formed. Therefore, it has been very difficult to manufacture an organic EL device having a fine pattern on the order of nm to several tens of μm.

Japanese Patent Application Laid-Open No. Hei 10-321372 discloses an organic EL display panel having a plurality of light-emitting portions and a method of manufacturing the same. The organic EL display panel disclosed in this publication includes a substrate, a plurality of first electrodes formed on one surface side of the substrate, and a first electrode exposed from one surface of the substrate so as to expose a part of the first electrode and cover another part. A plurality of electrically insulating barrier ribs formed so as to protrude, a layer of an organic EL medium formed on an exposed portion of the first electrode,
A plurality of second electrodes formed on the layer of the L medium, and a concave portion is formed on a protruding upper portion of the partition. Further, in the method for manufacturing an organic EL display panel disclosed in the publication, in the light emitting layer forming step, a mask having a plurality of openings exposing only a desired portion of the exposed first electrode is formed on the protruding upper part of the partition wall. The organic EL medium is deposited on the first electrode through the opening of the mask, and then the opening is arranged on the first electrode on which the organic EL medium other than the organic EL medium already deposited is not formed. In this manufacturing method, the mask is moved as described above, and the organic EL medium is repeatedly deposited through the openings of the mask.

However, in the organic EL display panel and the manufacturing method disclosed in the above publication,
Since the organic EL medium basically needs to be formed by a vacuum evaporation method, the pattern size of the organic EL medium is about several hundred μm as described above, and it is very difficult to manufacture an organic EL medium having a fine pattern. was difficult.

In the case where an inorganic EL medium is formed instead of an organic EL medium by utilizing the method for manufacturing an organic EL display panel disclosed in the above publication, photolithography and etching techniques may be used. Therefore, it is possible to form an inorganic EL medium with a pattern size on the order of nm to μm. However, since there is no blue inorganic EL medium that can be practically used at present, a color display panel cannot be manufactured using the inorganic EL medium.

The present invention has been made to solve the above problems. Accordingly, an object of the present invention is to provide a method for manufacturing an EL element, which can form an EL element, particularly an organic EL element, with a fine pattern size.

It is a further object of the present invention to provide a method of manufacturing an EL element which can form an EL element with a fine pattern size and can easily manufacture a color display panel.

[0015]

In order to solve the above problems, a first feature of the present invention is to form a convex pattern corresponding to the shape and arrangement of EL elements on a first substrate. A method of manufacturing an EL element, comprising: a step of forming an EL element on a convex pattern of a first substrate; and a step of transferring the EL element of the first substrate onto a second substrate. . Here, the “convex pattern on the first substrate” means a convex pattern directly formed on the surface of the first substrate, a thin film surface formed on the surface of the first substrate, or the surface of another substrate. Is used to mean any of the convex patterns formed on the substrate. Further, the “convex pattern” refers to a convex pattern formed by removing a part of the periphery of the first substrate, and a projection (for example, a thin film) added to a part of the first substrate. It is used to mean any of the convex patterns to be formed. “On the second substrate” includes, similarly to “on the first substrate”, any of the surface of the second substrate, the surface of a thin film formed on the surface of the second substrate, or the surface of another substrate. Used in a meaning.

The EL according to the first aspect of the present invention.
In the element manufacturing method, since the EL element formed on the convex pattern on the first substrate is transferred onto the second substrate, the processing dimensional accuracy of the convex pattern on the first substrate is adjusted. Can be formed on the second substrate. For example, the height of the convex pattern can be equal to or slightly higher than the thickness of the EL element, and the EL element can be formed on the convex pattern. Since the convex pattern itself can be formed in a fine pattern, an EL element having a fine pattern can be formed. further,
Since organic EL elements of each of red, green, and blue in a fine pattern can be transferred onto the second substrate,
A color display panel using the L element can be easily manufactured.

A second feature of the present invention is that an E is provided on a first substrate.
A step of forming a concave pattern corresponding to the shape and arrangement of the L element, a step of forming an EL element in the concave pattern of the first substrate, and transferring the EL element of the first substrate to the second substrate And a method of manufacturing an EL element. Here, the “concave pattern on the second substrate” is a concave pattern directly formed on the surface of the first substrate,
It is used to include both the surface of the thin film formed on the surface of the first substrate and the concave pattern formed on the surface of another substrate. Further, the “concave pattern” is a concave pattern formed by removing a part on the first substrate, and formed by adding a protrusion (for example, a thin film) around a part on the first substrate. It is used to mean any of the concave patterns. “On the second substrate” includes, similarly to “on the first substrate”, any of the surface of the second substrate, the surface of a thin film formed on the surface of the second substrate, or the surface of another substrate. Used in a meaning.

Such an EL according to the second feature of the present invention.
In the element manufacturing method, the EL element formed in the concave pattern on the first substrate is transferred onto the second substrate. Therefore, the EL element is formed according to the processing dimensional accuracy of the concave pattern on the first substrate. The EL element can be formed on the second substrate. The depth of the concave pattern is, for example, equal to or slightly deeper than the thickness of the EL element, so that the EL element can be formed in the concave pattern, and the concave pattern is formed by using, for example, photolithography technology and etching technology. Since it can be formed, the concave pattern itself can be formed with a fine pattern, and as a result, an EL element having a fine pattern can be formed. further,
Since organic EL elements of each of red, green, and blue in a fine pattern can be transferred onto the second substrate,
A color display panel using the L element can be easily manufactured.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1A is a sectional view of an organic EL display panel according to a first embodiment of the present invention, and FIG. 1B is a first embodiment of the present invention. FIG. 2 is an enlarged sectional structural view of an organic EL element forming an organic EL display panel according to the embodiment.

As shown in FIG. 1A, an organic EL display panel 1 includes a substrate 2, a red organic EL element 3R and a green organic EL element 3G disposed on the surface of the substrate 2.
And a blue organic EL element 3B. In the organic EL display panel 1, a plurality of sets of a red organic EL element 3R, a green organic EL element 3G, and a blue organic EL element 3B are regularly arranged in a line or in a matrix. ing.

The substrate 2 is made of, for example, single crystal silicon (Si)
The substrate can be used practically. Note that the substrate 2 corresponds to a specific example of the “second substrate” according to the present invention.

As shown in FIG. 1B, the organic EL element 3
R, 3G, and 3B each include a first electrode 31 disposed on the surface of the substrate 2 and used as a cathode electrode; an electron transport layer 32 on the first electrode 31; , And a second electrode 34 disposed on the hole transport layer 33 and used as an anode electrode. The electron transport layer 32 and the hole transport layer 33 are formed of an organic material. In the first embodiment of the present invention, the first electrode 31, the electron transport layer 32, the hole transport layer 33, and the second The organic EL elements 3R, 3
The definition is made as G or 3B, and the explanation will be made. However, in practice, the organic EL element only needs to include the electron transport layer 32 and the hole transport layer 33. Each of the organic EL elements 3R, 3G, and 3B corresponds to a specific example of the “EL element” according to the present invention.

For the first electrode 31, for example, an aluminum (Al) film can be practically used. The aluminum film can be formed with a thickness of, for example, 100 nm.

For the electron transport layer 32, for example, an aluminum quinolinol complex (Alq ₃ ) film can be practically used. The aluminum quinolinol complex film can be formed with a thickness of, for example, 50 nm.

For the hole transport layer 33, for example, a triphenyldiamine (TPD) film can be practically used.
The triphenyldiamine film can be formed with a thickness of, for example, 80 nm. The hole transport layer 33 includes an aromatic amine (α-NPD) film having a naphthyl substituent, a copper phthalocyanine (CuPc) film, and a starburst amine (M
TDATA) film or the like can be used practically.

For the second electrode 34, for example, an indium tin oxide (ITO) film can be practically used.
The indium tin oxide alloy film can be formed with a thickness of, for example, 100 nm.

The plane pattern size (minimum processing size) of each of the organic EL elements 3R, 3G, 3B is formed to a fine size in the range of several nm to several tens μm by a manufacturing method described later.

Next, the organic EL elements 3R, 3G, 3B
A method for manufacturing the organic EL display panel 1 will be described. 2 to 7 are process sectional views of the organic EL elements 3R, 3G, 3B and the organic EL display panel 1 according to the first embodiment of the present invention.

(1) First, as shown in FIG. 2, a transfer substrate 10 is prepared. As the transfer substrate 10, a single crystal silicon substrate can be practically used. This transfer substrate 1
0 corresponds to a specific example of the “first substrate” according to the present invention.

(2) A photoresist film is formed on the surface of the transfer substrate 10 by a spin coating method, and the photoresist film is sequentially subjected to an exposure process, a development process, a cleaning process, and the like.
An etching mask 11 covering the element formation region and having other regions opened is formed from a photoresist film (see FIG. 3). That is, the etching mask 11 can be formed by a photolithography technique, and is formed according to the shape and arrangement of the EL element.

(3) As shown in FIG. 3, using the etching mask 11, the periphery of the EL element formation region (part) on the surface of the transfer substrate 10 is removed by etching, and the EL element formation region becomes an island region. Such a convex pattern 12 is formed. In the first embodiment of the present invention, highly anisotropic etching such as reactive ion etching, laser beam etching, ion beam etching, and sputter etching is used for etching. In addition, isotropic wet etching can be used for the etching. That is, as long as the surface of the transfer substrate 10 can be chemically or physically removed, various types of etching can be used.

The height (etching depth) of the convex pattern 12 is set between the EL element forming layer formed on the convex pattern 12 and the EL element forming layer formed around the convex pattern 12. To the extent that the EL element can be formed on the convex pattern 12.
For example, the organic EL elements 3R, 3G, and 3B are formed with dimensions equal to or greater than the respective thicknesses. If the height of the convex pattern 12 is about this level, the planar pattern dimension of the convex pattern 12 is on the order of several nm to several tens μm.
It can be easily formed on the order.

The convex pattern 12 corresponds to a specific example of the "convex pattern" according to the present invention. The width of one convex pattern 12 corresponds to the width of one organic EL element 3R, 3G or 3B, and the interval between adjacent convex patterns 12 is the width of almost two organic EL elements. Is equivalent to

(4) After removing the etching mask 11, the EL element forming layer 3 is formed on the entire surface of the transfer substrate 10 as shown in FIG. In the description of this manufacturing method, the description will be made as the EL element forming layer 3 of the red organic EL element 3R, but basically the same manufacturing method is applied to each of the green organic EL element 3G and the blue organic EL element 3B. Therefore, the description is omitted here.

The EL element forming layer 3 is formed on the surface of the transfer substrate 10 in the reverse order so that the layer structure of the organic EL element 3R shown in FIG. 1B is finally obtained. That is, first, the second electrode 34 is formed on the surface of the transfer substrate 10.
Is formed, a hole transport layer 33 is formed on the second electrode 34, an electron transport layer 32 is formed on the hole transport layer 33, and finally, a first electrode is formed on the hole transport layer 32. 31 are formed. The second electrode 34 is formed on the entire surface of the transfer substrate 10 by, for example, a sputtering method. The hole transport layer 33 is the second
Is formed on the entire surface of the electrode 34 by, for example, a vacuum evaporation method. The electron transport layer 32 is formed on the entire surface of the hole transport layer 33 by, for example, a vacuum deposition method. A vacuum evaporation method is used for forming both the hole transport layer 33 and the electron transport layer 32. The mask 110 for pattern formation described in the prior art shown in FIG. 20 is the same as the first embodiment of the present invention. Is unnecessary in the manufacturing method according to the above. The first electrode 31 is an electron transport layer 32
Is formed over the entire surface by, for example, a sputtering method.

From the EL element forming layer 3, the convex pattern 1
2, an organic EL element 3R can be formed on
The organic EL element 3R can be formed with a fine pattern dimension (substantially the same pattern dimension as the planar pattern dimension of the convex pattern 12) corresponding to the planar pattern dimension of the convex pattern 12. Further, the EL element forming layer 3 formed around the convex pattern 12 is formed as an unnecessary organic EL element layer 3R 'as the organic EL element 3R, and the unnecessary organic EL element layer 3R' The organic EL element 3 </ b> R can be selectively formed only on the convex pattern 12. The step between the organic EL element 3R and the unnecessary organic EL element layer 3R ′ is almost certainly separated by the step shape of the convex pattern 12.

(5) Next, the substrate 2 is prepared, and as shown in FIG. 5, the transfer substrate 10 is turned over and the surface of the transfer substrate 10 and the surface of the substrate 2 face each other.

(6) As shown in FIG. 6, the organic EL element 3R of the transfer substrate 10 is brought into close contact with the surface of the substrate 2,
The L element 3R is transferred from the transfer substrate 10 to the surface of the substrate 2. The transfer is performed by applying an appropriate pressure within an appropriate time. At this time, the unnecessary organic EL element layer 3 formed between the convex patterns 12 on the transfer substrate 10
Since the space K is formed at a position on the substrate 2 opposite to R ′, unnecessary organic EL element layers 3R ′ are not transferred onto the substrate 2.

(7) As shown in FIG. 7, by removing the transfer substrate 10 from the surface of the substrate 2, a red organic EL
The substrate 2 to which the element 3R has been transferred is completed. Although not shown, the same process as described above is repeated for each of the green organic EL element 3G and the blue organic EL element 3B, and the transfer substrate 10 is positioned on the substrate 2 so that the organic EL element 3G,
By sequentially transferring 3B onto the substrate 2, the organic EL display panel 1 according to the first embodiment of the present invention can be completed.

As described above, in the method of manufacturing the organic EL elements 3R, 3G, and 3B according to the first embodiment of the present invention, the organic EL elements 3R, 3G,
Convex pattern 1 corresponding to the shape and arrangement of G or 3B
2 and the convex pattern 12 of the transfer substrate 10.
Forming an organic EL element 3R, 3G or 3B thereon; and forming an organic EL element 3R, 3G or 3BE on the transfer substrate 10.
Transferring the organic EL elements 3R and 3R formed on the convex pattern 12 on the transfer substrate 10.
Since the G or 3B is transferred onto the substrate 2, the organic EL elements 3R, 3G or 3B can be formed on the substrate 2 according to the processing dimensional accuracy of the convex pattern 12 on the transfer substrate 10. Since the convex pattern 12 itself can be formed in a fine pattern as described above, the organic EL element 3R, 3G or 3B having a fine pattern can be formed. Furthermore, the organic EL element 3R having a fine pattern,
Since 3G or 3B can be formed, these red, green and blue organic EL elements 3R, 3G or 3
By transferring B onto the substrate 2, the color organic EL display panel 1 can be easily manufactured.

Although the first embodiment of the present invention has been described for a case of three colors, the present invention is not limited to this, and can be applied to a case of only one color. it can.

First Modification FIG. 8 is a sectional view showing a step of transferring an organic EL element and an organic EL display panel according to a first modification of the first embodiment of the present invention. As shown in FIG.
In the method for manufacturing the L element 3R and the organic EL display panel 1, a release layer 15 is previously formed between the surface of the transfer substrate 10 and at least the organic EL element 3R of the EL element forming layer 3, and the transfer substrate is formed in the transfer step. 10, the organic EL element 3R is easily peeled off. In the release layer 15,
For example, a gold (Au) thin film that can easily separate the single crystal silicon of the transfer substrate 10 from the second electrode (ITO) 34 of the EL element formation layer 3 can be used practically. The gold thin film can be formed by, for example, an evaporation method.

Second Modification FIG. 9 is a sectional view showing a step of transferring an organic EL element and an organic EL display panel according to a second modification of the first embodiment of the present invention. As shown in FIG.
The method for manufacturing the L element 3R and the organic EL display panel 1 is based on the method of manufacturing the surface of the substrate 2 (or at least the EL element forming layer 3).
Of the second electrode (the surface of the ITO) 34).
Is formed, the adhesiveness between the organic EL element 3R and the substrate 2 is increased in the transfer step, and the organic EL element 3R is easily peeled off from the transfer substrate 10. Adhesive layer 16
Is practically a composite layer in which a gold thin film is superimposed on a chromium (Cr) thin film, which has not only an adhesive property but also elasticity and can also serve as an electrode material. be able to. The chromium thin film can be formed by, for example, a sputtering method, and the gold thin film can be formed by, for example, an evaporation method as described above.

Third Modification FIG. 10 is a sectional view showing a step of transferring an organic EL element and an organic EL display panel according to a third modification of the first embodiment of the present invention. As shown in FIG. 10, in the method of manufacturing the organic EL element 3R and the organic EL display panel 1, an organic EL element 3R and an organic EL display panel 1
The L element 3R is easily peeled off, and the organic EL element 3R and the substrate 2
Is heated by the heating source 17 so as to enhance the adhesiveness between them. For example, a nichrome wire heater can be practically used as the heating source 17, and the heating source 17 heats the back surface of the transfer substrate 10.

In the method for manufacturing the organic EL element 3R and the organic EL display panel 1 according to the third modification, the organic EL element 3R and the organic EL according to the first or second modification are used. The manufacturing methods of the display panel 1 can be combined.

(Second Embodiment) A second embodiment of the present invention relates to the organic EL elements 3R, 3G, 3B and the organic EL display panel 1 according to the first embodiment of the present invention.
In the manufacturing method, the convex pattern 12 of the transfer substrate 10 is
This is an example in which a concave pattern is used instead of. FIGS. 11 to 17 are sectional views showing steps of the organic EL elements 3R, 3G, 3B and the organic EL display panel 1 according to the second embodiment of the present invention.

(1) First, as shown in FIG. 11, a transfer substrate 20 is prepared. As with the transfer substrate 10 according to the first embodiment of the present invention, for example, a single crystal silicon substrate can be practically used as the transfer substrate 20. The transfer substrate 20 corresponds to a specific example of the “first substrate” according to the present invention.

(2) A photoresist film is formed on the surface of the transfer substrate 20 by a spin coating method, and the photoresist film is sequentially subjected to an exposure process, a development process, a cleaning process, and the like.
An etching mask 21 covering the periphery of the element formation region and having an opening in the EL element formation region is formed from a photoresist film (see FIG. 12). That is, the etching mask 21
Can be formed by a photolithography technique.

(3) As shown in FIG. 12, using an etching mask 21, an EL element forming region (part) on the surface of the transfer substrate 20 is removed by etching, so that the EL element forming region becomes a groove region. A concave pattern 22 is formed. In the second embodiment of the present invention, etching such as reactive ion etching can be used for the etching as in the etching according to the first embodiment of the present invention.

The depth (etching depth) of the concave pattern 22 is, for example, equal to the thickness of each of the organic EL elements 3R, 3G, 3B, similarly to the convex pattern 12 according to the first embodiment of the present invention. Or larger dimensions. If the depth of the concave pattern 22 is this level, the planar pattern dimension of the concave pattern 22 may be several nm.
It can be easily formed on the order of several tens of μm.

The concave pattern 22 corresponds to a specific example of the “concave pattern” according to the present invention.

(4) After removing the etching mask 21, the EL element forming layer 3 is formed on the entire surface of the transfer substrate 20, as shown in FIG. This EL element forming layer 3
Is the same as the layer structure of the EL element forming layer 3 according to the first embodiment of the present invention, and the description is omitted here. Further, in the description of this manufacturing method, similarly to the description of the manufacturing method according to the first embodiment of the present invention, the description will be made as the EL element forming layer 3 of the red organic EL element 3R, and the green organic EL element will be described. 3G, blue organic EL element 3B
The description of each is omitted.

The organic EL element 3R can be formed in the concave pattern 22 from the EL element forming layer 3. The organic EL element 3R has a fine pattern size (substantially concave pattern size) corresponding to the planar pattern size of the concave pattern 22. 2
2 (the same pattern dimension as the two-dimensional pattern dimension). The EL element forming layer 3 formed around the concave pattern 22 is formed as an unnecessary organic EL element layer 3R ′ as the organic EL element 3R, and the unnecessary organic EL element layer 3R ′ is a convex pattern between the concave patterns 22. Since it is formed on the upper side, the organic EL element 3R can be formed only in the concave pattern 22.

(5) As shown in FIG. 14, the transfer substrate 20
Is subjected to a polishing treatment, and the organic E in the concave pattern 22 is polished.
The surface of the L element 3R is exposed. For this polishing treatment, for example, chemical mechanical polishing can be practically used. Unnecessary organic EL element layer 3R 'around the concave pattern 22 is removed by the polishing process.

In the second embodiment of the present invention, while the etching mask 21 is left, the EL
The element forming layer 3 may be formed. in this case,
The depth of the concave pattern 22 can be reduced by an amount corresponding to the film thickness of the etching mask 21.
The upper part of the organic EL element 3R embedded in the substrate can be projected from the surface of the transfer substrate 2 (preferably, only the first electrode 31 is projected), and the etching mask 21 is selectively removed later. Thus, the unnecessary organic EL element layer 3R ′ on the etching mask 21 can also be removed, so that the polishing process can be eliminated.

(6) Next, the substrate 2 is prepared, and the transfer substrate 20 is turned over as shown in FIG.
And the surface of the substrate 2 face each other.

(7) As shown in FIG. 16, the organic EL element 3R of the transfer substrate 20 is brought into close contact with the surface of the substrate 2, and the organic EL element 3R is transferred from the transfer substrate 20 to the surface of the substrate 2. The transfer is performed by applying an appropriate pressure within an appropriate time range.

(8) As shown in FIG. 17, by removing the transfer substrate 20 from the surface of the substrate 2, the red organic E
The substrate 2 to which the L element 3R has been transferred can be completed. Although not shown, the green organic EL element 3
The organic EL display panel 1 according to the second embodiment of the present invention can be completed by forming each of the G and blue organic EL elements 3B.

As described above, in the method for manufacturing the organic EL elements 3R, 3G and 3B according to the second embodiment of the present invention, the organic EL elements 3R, 3G
Concave pattern 2 corresponding to the shape and arrangement of G or 3B
2 and the concave pattern 22 of the transfer substrate 20.
Forming the organic EL element 3R, 3G or 3B therein; and forming the organic EL element 3R, 3G or 3BE on the transfer substrate 20.
Transferring the organic EL elements 3R, 3R and 3R formed in the concave pattern 22 on the transfer substrate 20.
Since the G or 3B is transferred onto the substrate 2, the organic EL elements 3R, 3G or 3B can be formed on the substrate 2 according to the processing dimensional accuracy of the concave pattern 22 on the transfer substrate 20. Since the concave pattern 22 itself can be formed in a fine pattern as described above, the organic EL element 3R, 3G or 3B having a fine pattern can be formed. Furthermore, the organic EL element 3R having a fine pattern,
Since 3G or 3B can be formed, these red, green and blue organic EL elements 3R, 3G or 3
By transferring B onto the substrate 2, the color organic EL display panel 1 can be easily manufactured.

In the manufacturing method according to the second embodiment of the present invention, at least one of the manufacturing methods according to the first to third modifications of the first embodiment of the present invention is used.
Can be combined.

(Other Embodiments) Although the present invention has been described with reference to the plurality of embodiments, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art.

For example, in the manufacturing method according to the first embodiment, the convex pattern 12 is formed directly on the surface of the transfer substrate 10. Forming a film or a silicon oxide film,
A convex pattern may be formed on these films. In the present invention, a convex pattern may be formed on another substrate (for example, a single crystal silicon substrate) bonded on the surface of the transfer substrate 10. Further, in the present invention, for example, a projection made of a polycrystalline silicon film may be attached on the surface of the transfer substrate 10, and the projection may be formed in a convex pattern.

Similarly, in the manufacturing method according to the second embodiment, the concave pattern 2 is directly formed on the surface of the transfer substrate 20.
However, in the present invention, for example, a polycrystalline silicon film or a silicon oxide film may be formed on the surface of the transfer substrate 20, and a concave pattern may be formed on these films. In the present invention, a concave pattern may be formed on another substrate bonded on the surface of the transfer substrate 20. Further, according to the present invention, for example, a projection made of, for example, a polycrystalline silicon film may be attached on the surface of the transfer substrate 20, and a concave pattern surrounded by the projection may be formed.

Further, according to the present invention, the organic EL element 3R, 3G or 3B may be transferred onto the surface of the thin film formed on the surface of the substrate 2. Furthermore, the present invention relates to an organic EL device 3
R, 3G or 3B electron transport layer 32 and hole transport layer 33
Is formed by at least the above-described transfer, and the first electrode 31,
At least one of the second electrodes 34 may be formed by a normal process different from the above-described transfer.

Further, in the present invention, the inorganic EL element selectively formed on any of the concavo-convex patterns on the transfer substrate may be transferred onto the substrate.

As described above, the present invention naturally includes various embodiments and the like not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the appropriate claims.

[0068]

According to the present invention, an EL element is formed on a convex pattern or in a concave pattern using a concave and convex pattern of a first substrate, and the EL element is transferred onto a second substrate. Therefore, it is possible to provide a method for manufacturing an EL element capable of forming an EL element, particularly, an organic EL element with a fine pattern dimension.

Furthermore, according to the present invention, since the red, green and blue EL elements can be formed with a fine pattern size and the EL elements can be arranged on the second substrate,
It is possible to provide a method for manufacturing an EL element that can easily manufacture a color display panel.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of an organic EL display panel according to a first embodiment of the present invention, and FIG. 1B is an organic EL display panel according to the first embodiment of the present invention. FIG. 2 is an enlarged sectional structural view of an EL element.

FIG. 2 is a process sectional view of the organic EL element and the organic EL display panel according to the first embodiment of the present invention.

FIG. 3 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 2;

FIG. 4 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 3;

5 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 4;

FIG. 6 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 5;

FIG. 7 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 6;

FIG. 8 is a process sectional view of a transfer process of an organic EL element and an organic EL display panel according to a first modification of the first embodiment of the present invention.

FIG. 9 is a process cross-sectional view of a transfer process of an organic EL element and an organic EL display panel according to a second modification of the first embodiment of the present invention.

FIG. 10 is a process cross-sectional view of a transfer process of an organic EL element and an organic EL display panel according to a third modification of the first embodiment of the present invention.

FIG. 11 is a process sectional view of an organic EL element and an organic EL display panel according to a second embodiment of the present invention.

FIG. 12 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 11;

FIG. 13 is a process sectional view of the organic EL element and the organic EL display panel, following FIG. 12;

FIG. 14 is a process sectional view of the organic EL element and the organic EL display panel, following FIG. 13;

15 is a process sectional view of the organic EL element and the organic EL display panel, following FIG. 14;

FIG. 16 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 15;

FIG. 17 is a process sectional view of the organic EL element and the organic EL display panel following FIG. 16;

FIG. 18 is a schematic configuration diagram of a vacuum evaporation apparatus for realizing a vacuum evaporation method according to a conventional technique.

FIGS. 19A to 19E are process cross-sectional views for explaining a conventional thin film etching process.

FIG. 20 is a schematic configuration diagram of a vacuum evaporation apparatus used for forming an organic EL element according to a conventional technique.

[Explanation of symbols]

 Reference Signs List 1 organic EL display panel 2 substrate (second substrate) 3 EL element forming layer 3R, 3G, 3B organic EL element 31 first electrode 32 electron transport layer 33 hole transport layer 34 second electrode 10, 20 transfer substrate (First substrate) 11, 21 Etching mask 12 Convex pattern 22 Concave pattern 15 Release layer 16 Adhesive layer 17 Heat source

Claims (2)

[Claims] A step of forming a convex pattern corresponding to the shape and arrangement of the electroluminescent element on the first substrate; and a step of forming an electroluminescent element on the convex pattern of the first substrate. The electroluminescent element of the first substrate is
Transferring onto a substrate as described above. A step of forming a concave pattern corresponding to the shape and arrangement of the electroluminescent element on the first substrate; a step of forming an electroluminescent element in the concave pattern of the first substrate; The electroluminescent element on the first substrate is
Transferring onto a substrate as described above.