JP2001139700A5 - - Google Patents

Download PDF

Info

Publication number
JP2001139700A5
JP2001139700A5 JP2000252322A JP2000252322A JP2001139700A5 JP 2001139700 A5 JP2001139700 A5 JP 2001139700A5 JP 2000252322 A JP2000252322 A JP 2000252322A JP 2000252322 A JP2000252322 A JP 2000252322A JP 2001139700 A5 JP2001139700 A5 JP 2001139700A5
Authority
JP
Japan
Prior art keywords
light
resin
less
absorbing film
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000252322A
Other languages
Japanese (ja)
Other versions
JP2001139700A (en
JP4608750B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000252322A priority Critical patent/JP4608750B2/en
Priority claimed from JP2000252322A external-priority patent/JP4608750B2/en
Publication of JP2001139700A publication Critical patent/JP2001139700A/en
Publication of JP2001139700A5 publication Critical patent/JP2001139700A5/ja
Application granted granted Critical
Publication of JP4608750B2 publication Critical patent/JP4608750B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【特許請求の範囲】
【請求項1】 不飽和ポリエステル樹脂、ビニルエステル樹脂、ビニルウレタン樹脂、あるいはアクリル樹脂から選ばれる1種以上の不飽和樹脂(A)、420nm以上の光の照射によって活性化しない光重合開始剤(B)、熱可塑性樹脂粉末を有効成分とする増粘剤(C)とを必須成分とする光硬化性樹脂コンパウンド(イ)を、420nm未満の光透過率が10%以下の透視性光吸収フィルム(ロ)で被覆してなることを特徴とする光硬化性樹脂コンパウンド。
【請求項2】 光硬化性樹脂コンパウンド(イ)に繊維強化材(E)を有する請求項1記載の光硬化性樹脂コンパウンド。
【請求項3】 熱可塑性樹脂粉末を有効成分とする増粘剤(C)がアクリル系モノマーを重合することによって得られる重合体粉末である請求項1または2記載の光硬化性樹脂コンパウンド。
【請求項4】 熱可塑性樹脂粉末を有効成分とする増粘剤(C)が、平均粒子径0.1μm〜0.5mmの樹脂重合体粉末である請求項1〜3のいずれか一項に記載の光硬化性樹脂コンパウンド。
【請求項5】 熱可塑性樹脂粉末を有効成分とする増粘剤(C)が、重量平均分子量10万以上である請求項1〜4のいずれか一項に記載の光硬化性樹脂コンパウンド。
【請求項6】 420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、紫外線吸収剤(D)を含む熱可塑性フィルムである請求項1記載の光硬化性樹脂コンパウンド。
【請求項7】 420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、熱可塑性フィルムに紫外線吸収剤(D)を含む塗料を塗布したものである請求項1記載の光硬化性樹脂コンパウンド。
【請求項8】 420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、紫外線吸収剤(D)を含む再剥離性粘着剤と熱可塑性フィルムとから構成される請求項1記載の光硬化性樹脂コンパウンド。
【請求項9】 透視性光吸収フィルム(ロ)を付けたまま光硬化性樹脂コンパウンドを賦形した後、透視性光吸収フィルム(ロ)を取り除き、紫外線および/または自然光を照射することによって硬化させることを特徴とする光硬化性樹脂コンパウンドの硬化法。
【請求項10】 透視性光吸収フィルム(ロ)を付けたまま、光硬化性樹脂コンパウンドの一部を重ね合わせ一体化させた後、透視性光吸収フィルム(ロ)を取り除き、紫外線および/または自然光を照射することによって硬化させることを特徴とする硬化法。
[Claims]
1. An unsaturated polyester resin, a vinyl ester resin, a vinyl urethane resin, or one or more unsaturated resins selected from acrylic resins (A), a photopolymerization initiator that is not activated by irradiation with light of 420 nm or more ( B), a photocurable resin compound (A) containing a thickener (C) containing a thermoplastic resin powder as an active ingredient as an essential component, and a transparent light-absorbing film having a light transmittance of less than 420 nm of 10% or less. A photocurable resin compound characterized by being coated with (b).
2. A photocurable resin compound according to claim 1 having the photocurable resin compound (i) fiber reinforcement and (E).
3. The photocurable resin compound according to claim 1 , wherein the thickener (C) containing a thermoplastic resin powder as an active ingredient is a polymer powder obtained by polymerizing an acrylic monomer.
4. thickeners thermoplastic resin powder as an active ingredient (C) is a resin polymer powder having an average particle diameter 0.1μm~0.5mm to any one of claims 1 to 3 The photocurable resin compound as described .
5. The photocurable resin compound according to claim 1 , wherein the thickener (C) containing a thermoplastic resin powder as an active ingredient has a weight average molecular weight of 100,000 or more.
6. 420nm or less of the light transmittance of 10% or less, and see-through light absorbing film (ii) is, light according to claim 1 wherein the thermoplastic film containing an ultraviolet absorber (D) Curable resin compound.
7. A light-absorbing film (b) which has a transmittance of light of 420 nm or less of 10% or less and is transparent, and is obtained by applying a paint containing an ultraviolet absorbent (D) to a thermoplastic film. The photocurable resin compound according to claim 1.
8. A transparent light-absorbing film (b) having a transmittance of light of 420 nm or less of 10% or less and being transparent, comprising a removable adhesive containing an ultraviolet absorbent (D) and a thermoplastic film. The photocurable resin compound according to claim 1, which is constituted.
9. After shaping the photocurable resin compound while attaching the transparent light absorbing film (b), remove the transparent light absorbing film (b) and cure by irradiating ultraviolet light and / or natural light. A method of curing a photo-curable resin compound, characterized in that:
10. A part of the photocurable resin compound is overlapped and integrated with the transparent light-absorbing film (b) attached, and then the transparent light-absorbing film (b) is removed, and ultraviolet and / or ultraviolet light is removed. A curing method characterized by curing by irradiating natural light.

すなわち、本発明は(1)不飽和ポリエステル樹脂、ビニルエステル樹脂、ビニルウレタン樹脂、あるいはアクリル樹脂から選ばれる1種以上の不飽和樹脂(A)、420nm以上の光の照射によって活性化しない光重合開始剤(B)、熱可塑性樹脂粉末を有効成分とする増粘剤(C)とを必須成分とする光硬化性樹脂コンパウンド(イ)を、420nm未満の光透過率が10%以下の透視性光吸収フィルム(ロ)で被覆してなることを特徴とする光硬化性樹脂コンパウンド、好ましくは光硬化性樹脂コンパウンド(イ)に繊維強化材(E)を有すること、好ましくは熱可塑性樹脂粉末を有効成分とする増粘剤(C)がアクリル系モノマーを重合することによって得られる重合体粉末であること、好ましくは熱可塑性樹脂粉末を有効成分とする増粘剤(C)が、平均粒子径0.1μm〜0.5mmの樹脂重合体粉末であること、好ましくは熱可塑性樹脂粉末を有効成分とする増粘剤(C)が、重量平均分子量10万以上であること、好ましくは420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、紫外線吸収剤(D)を含む熱可塑性フィルムであること、好ましくは420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、熱可塑性フィルムに紫外線吸収剤(D)を含む塗料を塗布したものであること、好ましくは420nm以下の光の透過率が10%以下であり、かつ透視可能な光吸収フィルム(ロ)が、紫外線吸収剤(D)を含む再剥離性粘着剤と熱可塑性フィルムとから構成されること、透視性光吸収フィルム(ロ)を付けたまま光硬化性樹脂コンパウンドを賦形した後、透視性光吸収フィルム(ロ)を取り除き、紫外線および/または自然光を照射することによって硬化させることを特徴とする光硬化性樹脂コンパウンドの硬化法、透視性光吸収フィルム(ロ)を付けたまま、光硬化性樹脂コンパウンドの一部を重ね合わせ一体化させた後、透視性光吸収フィルム(ロ)を取り除き、紫外線および/または自然光を照射することによって硬化させることを特徴とする硬化法を提供するものである。次に本発明を詳細に説明する。 That is, the present invention provides (1) one or more unsaturated resins (A) selected from unsaturated polyester resins, vinyl ester resins, vinyl urethane resins, and acrylic resins, and photopolymerization that is not activated by irradiation with light of 420 nm or more. A photocurable resin compound (A) containing an initiator (B), a thickener (C) containing a thermoplastic resin powder as an active ingredient and an essential component, has a transparency of less than 420 nm and a light transmittance of 10% or less. A light-curing resin compound characterized by being coated with a light-absorbing film (b), preferably having a fiber-reinforcing material (E) in the light-curing resin compound (a), preferably a thermoplastic resin powder. The thickener (C) as an active ingredient is a polymer powder obtained by polymerizing an acrylic monomer, preferably a thickener (C) containing a thermoplastic resin powder as an active ingredient, It is a resin polymer powder having an average particle size of 0.1 μm to 0.5 mm, preferably the thickener (C) containing a thermoplastic resin powder as an active ingredient has a weight average molecular weight of 100,000 or more, preferably The transmittance of light having a wavelength of 420 nm or less is 10% or less, and the visible light absorbing film (b) is a thermoplastic film containing an ultraviolet absorbent (D), preferably the transmittance of light having a wavelength of 420 nm or less. Is 10% or less, and the transparent light-absorbing film (b) is a thermoplastic film coated with a paint containing an ultraviolet absorber (D), and preferably has a light transmittance of 420 nm or less. The light-absorbing film (b), which is 10% or less and is transparent, is composed of a removable adhesive containing an ultraviolet absorber (D) and a thermoplastic film, and the transparent light-absorbing film (b) Light curing with After shaping the transparent resin compound, the transparent light absorbing film (b) is removed, and curing is performed by irradiating ultraviolet light and / or natural light. After a part of the photo-curable resin compound is overlapped and integrated with the film (b) attached, the transparent light-absorbing film (b) is removed and cured by irradiating ultraviolet light and / or natural light. And a curing method characterized by the following. Next, the present invention will be described in detail.

420nm以上の光の照射によって活性化しない光重合開始剤(B)とは、好ましくは自然光および/または紫外線領域の光を照射すると、重合反応が進行して常温でも樹脂(A)を硬化するもので、好ましくは光重合開始剤、紫外線硬化剤から選択されるものである。420nm以上の光の照射によって活性化しない光重合開始剤であるかどうかの確認は、次の試験をすることで判断する。即ち、不飽和ポリエステル樹脂、ビニルエステル樹脂、ビニルウレタン樹脂あるいはアクリル樹脂から選ばれる樹脂100重量部に対して、試験したい光重合開始剤を0.5重量部添加し、十分に攪拌混合して溶解させた液状樹脂組成物に、1本の15Wの蛍光灯により30cmの照射距離で光を照射し、この樹脂液が30分以内にまったくゲル化しないことで確認できる。光重合開始剤(B)としては、例えば、ベンゾフェノン、アセトフェノン、または、これらの誘導体を代表例として挙げることができる。市販品としては、イルガキュアー651(チバスペシャリティーケミカル社製品)等が使用できる。樹脂(A)中には使用の際、さらに粘度、粘着性、含浸成形収縮などを調節する添加剤や充填材を、光反応を阻害しない範囲で配合することは差し支えない。

The photopolymerization initiator (B) that is not activated by irradiation with light of 420 nm or more is preferably one that cures the resin (A) even at room temperature, preferably by irradiating natural light and / or light in the ultraviolet region. And preferably selected from photopolymerization initiators and ultraviolet curing agents. Whether or not the photopolymerization initiator is not activated by irradiation with light of 420 nm or more is determined by performing the following test. That is, with respect to 100 parts by weight of a resin selected from an unsaturated polyester resin, a vinyl ester resin, a vinyl urethane resin or an acrylic resin, 0.5 part by weight of a photopolymerization initiator to be tested is added, and sufficiently stirred and mixed to dissolve. The liquid resin composition thus obtained is irradiated with light from a single 15 W fluorescent lamp at an irradiation distance of 30 cm, and it can be confirmed that the resin liquid does not gel at all within 30 minutes. Representative examples of the photopolymerization initiator (B) include benzophenone, acetophenone, and derivatives thereof. As a commercially available product, Irgacure 651 (a product of Ciba Specialty Chemical Co., Ltd.) or the like can be used. When used, the resin (A) may further contain additives and fillers for adjusting the viscosity, tackiness, shrinkage of the impregnation molding, etc. as long as the photoreaction is not hindered.

JP2000252322A 1999-08-31 2000-08-23 Photo-curable resin compound and its curing method Expired - Lifetime JP4608750B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000252322A JP4608750B2 (en) 1999-08-31 2000-08-23 Photo-curable resin compound and its curing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-245172 1999-08-31
JP24517299 1999-08-31
JP2000252322A JP4608750B2 (en) 1999-08-31 2000-08-23 Photo-curable resin compound and its curing method

Publications (3)

Publication Number Publication Date
JP2001139700A JP2001139700A (en) 2001-05-22
JP2001139700A5 true JP2001139700A5 (en) 2007-08-02
JP4608750B2 JP4608750B2 (en) 2011-01-12

Family

ID=26537086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000252322A Expired - Lifetime JP4608750B2 (en) 1999-08-31 2000-08-23 Photo-curable resin compound and its curing method

Country Status (1)

Country Link
JP (1) JP4608750B2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532883B2 (en) * 2003-06-04 2010-08-25 積水化学工業株式会社 Photocurable resin composition, liquid crystal display element sealing agent, liquid crystal display element sealing agent, liquid crystal display element vertical conduction material, and liquid crystal display device
JP2006045404A (en) * 2004-08-06 2006-02-16 Showa Highpolymer Co Ltd Curable resin composition, prepreg and method for producing the same
US20080152921A1 (en) * 2006-12-20 2008-06-26 3M Innovative Properties Company Thermally B-Stageable Composition for Rapid Electronic Device Assembly
EP2113536B1 (en) 2007-02-20 2012-07-04 FUJIFILM Corporation Use of polymer material containing ultraviolet absorbent
JP2009067983A (en) 2007-03-30 2009-04-02 Fujifilm Corp Ultraviolet absorbing agent composition
US8039532B2 (en) 2007-08-16 2011-10-18 Fujifilm Corporation Heterocyclic compound, ultraviolet absorbent and composition containing the same
JP5250289B2 (en) 2008-03-31 2013-07-31 富士フイルム株式会社 UV absorber composition
JP5244437B2 (en) 2008-03-31 2013-07-24 富士フイルム株式会社 UV absorber composition
JP2009270062A (en) 2008-05-09 2009-11-19 Fujifilm Corp Ultraviolet absorbent composition
JP6164997B2 (en) * 2013-09-10 2017-07-19 サンコーテクノ株式会社 Prepreg sheet, method for producing prepreg sheet, and laminate
JP6623612B2 (en) * 2015-08-17 2019-12-25 日立化成株式会社 COMPOSITE-FORMING COMPOSITION, COMPOSITE, AND PROCESS FOR PRODUCING COMPOSITE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186744A (en) * 1987-01-28 1988-08-02 Showa Highpolymer Co Ltd Photocurable fiber-reinforced plastic prepreg sheet
JP2778010B2 (en) * 1989-04-05 1998-07-23 田島ルーフィング株式会社 Bonding tape for waterproof sheet and waterproofing method using it
JPH03106943A (en) * 1989-09-19 1991-05-07 Sekisui Chem Co Ltd Photocurable prepreg sheet
JPH1071661A (en) * 1996-04-24 1998-03-17 Mitsui Petrochem Ind Ltd Execution of waterproof material and waterproof layer
JP3868059B2 (en) * 1997-05-30 2007-01-17 旭化成ケミカルズ株式会社 Waterproofing method using photo-curable prepreg sheet
JP3868060B2 (en) * 1997-06-06 2007-01-17 旭化成ケミカルズ株式会社 Waterproof construction method using photo-curable prepreg sheet
JP3893605B2 (en) * 1997-07-25 2007-03-14 日本ゼオン株式会社 Irradiation curable unsaturated polyester resin composition and method for molding the composition
JP3014993B2 (en) * 1997-11-17 2000-02-28 株式会社ケー・エフ・シー How to repair or reinforce concrete structures

Similar Documents

Publication Publication Date Title
CN102781921B (en) Comprise the composition of Polymerizable ionic liquid mixture and goods and curing
JP2001139700A5 (en)
JP2010521257A (en) Conditioning agent and method for bonding a curable mixture to a high temperature resistant plastic molding containing a filler
CN106010311A (en) Switchable Adhesives
WO2019195763A1 (en) Methods and compositions for photopolymerizable additive manufacturing
WO2016121651A1 (en) Photosensitive composite material, method for producing same, and method for using photosensitive composite material film
Uctasli et al. The degree of conversion of fiber-reinforced composites polymerized using different light-curing sources
Oliveira et al. Shrinkage stress and degree of conversion of a dental composite submitted to different photoactivation protocols
JPS61500974A (en) Photocurable composition containing two curing types of prepolymers
TW202035489A (en) Photocurable resin composition and a method of producing the display device
He et al. Properties of 2, 2‐Bis [p‐(2′‐hydroxy‐3′‐methacryloxy propoxy) phenyl] propane/Isobornyl (Meth) acrylate copolymers
EP0548740B1 (en) Light-currable polymeric adhesive based on methylmethacrylate
JP3524600B2 (en) Curable resin composition and method for producing cured resin
JP4600631B2 (en) Method for producing laminate including active energy ray-curable resin layer
JP6828862B2 (en) A method for producing an adhesive polyaryletherketone resin material and a method for adhering a polyaryletherketone resin material to an adherend.
JPS63183904A (en) Visible light polymerization-curable composition
JPH03288153A (en) Photopolymerizable resin composition and synthetic resin
JP2020509900A (en) Method of molding false nails on artificial nails and natural nails
JP3536879B2 (en) Photopolymerizable composition
JP2002018991A (en) Curable prepreg, method for manufacturing the same and curing method
JPH0465411A (en) Composition polymerizable and curable with visible light
JPH04264178A (en) Photosetting adhesive composition for transparent material
JP4560265B2 (en) Method for producing polyolefin plastic article
JPH0469311A (en) Composition polymerizable and curable with visible light
JP2017031128A (en) Photocurable artificial nail composition