JP2001126868A - Method of manufacturing organic electroluminescence element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic electroluminescence element (hereinafter referred to as EL element) that can prevent degradation and damages to the organic EL element and efficiently manufacture an element having high luminescence and high luminescence efficiency, in the process of manufacturing a organic EL element. SOLUTION: A method of manufacturing an organic EL element comprising forming a stacked body by stacking a pair of electrodes and an organic luminescence layer on a substrate and then a sealed part of the stacked body by adhering a sealed case to the substrate using an ultraviolet ray hardening adhesive, which is characterized in that the method irradiates the ultraviolet rays to the organic luminescence layer after mounting means for preventing an ultraviolet ray irradiation to it previously when the sealed case is adhered to the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic electroluminescence device (hereinafter, abbreviated as "EL"), and more particularly, to a method for manufacturing an organic electroluminescence device.
The present invention relates to a method for manufacturing an organic EL element that prevents damage and deterioration of a light emitting element in a manufacturing process of an L element and has high light emission intensity and light emission efficiency.

[0002]

2. Description of the Related Art The basic structure of an organic EL device is such that an organic light emitting layer (fluorescent dye, low molecular fluorescent polymer, etc.) is interposed between a pair of electrodes. This is expected to be used as various information display elements because it can obtain a high luminance with a low DC current, can obtain a wide viewing angle, and is excellent in heat resistance.

[0003] The manufacturing method of this organic EL element is based on an organic EL device.
Since the element is susceptible to moisture, oxygen, and the like, and the constituent materials are deteriorated, all steps are not exposed to the atmosphere, and are performed in an airtight space in which the moisture, oxygen concentration, and the like are controlled to a very small amount. The outline is as follows.

A lower electrode, an organic layer such as an organic light emitting layer, and a counter electrode are sequentially laminated on a substrate. Then, when the EL element is used, the substrate and the sealing case are joined to cover the organic light-emitting layer and the like with a sealing case in order to prevent deterioration due to moisture in the air and the like. To form An adhesive is used to join the two, and an ultraviolet curable adhesive or a thermosetting adhesive is generally used. But,
It is said that it is preferable to use an ultraviolet-curing adhesive having a relatively low temperature in the bonding step, because the material constituting the organic EL element deteriorates and deteriorates when its temperature exceeds its glass transition temperature.

As described above, an organic EL device is manufactured under a strictly controlled environment in order to prevent deterioration and damage of the device.

However, the present inventors have strictly studied the manufacturing process of the organic EL device, and as a result, even if the organic EL device is manufactured under the strictly controlled environment as described above, the light emitting device is damaged by some factor. It has been discovered that devices having abnormal light emission due to deterioration may be manufactured. This means
This is a serious problem that impairs the quality of the manufactured organic EL device and lowers the manufacturing efficiency.

Therefore, it is inevitable to develop a new method for manufacturing an organic EL device which does not cause such damage or deterioration.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. In the manufacturing process of an organic EL device, deterioration and damage of the organic EL device are prevented, and emission intensity and emission efficiency are reduced. Organic EL that can efficiently manufacture expensive devices
An object is to provide a method for manufacturing an element.

[0009]

SUMMARY OF THE INVENTION The present invention has investigated the causes of the damage, deterioration, etc. of the device by the conventional method of manufacturing an organic EL device, and has found that the sealing case and the substrate are bonded by ultraviolet curing. That part of the ultraviolet light used for bonding with the agent is caused by irradiating the organic light emitting layer;
In the case of bonding by irradiating ultraviolet rays from the light source side, it was found that the ultraviolet rays mainly reflected on the substrate on the opposite side, particularly on the lower surface of the substrate, and the reflected light reached the light emitting layer. The present invention has been completed based on the discovery of such a new problem, and the outline thereof is as follows.

[1] A pair of electrodes and at least an organic light-emitting layer are laminated on a substrate to form a laminated portion, and then a sealing case is bonded to the substrate using an ultraviolet-curable adhesive. In the method of manufacturing an organic electroluminescence element for forming a sealing portion of the laminate by the above, after the sealing case is bonded to the substrate, a means for preventing irradiation of the organic light emitting layer with ultraviolet rays is performed in advance, A method for manufacturing an organic electroluminescence device, comprising irradiating ultraviolet light. [2] The organic electroluminescence according to the above [1], wherein the means for preventing irradiation of the organic light emitting layer with ultraviolet rays is means for preventing transmission or reflection of ultraviolet rays on the substrate and / or the sealing case surface. Device manufacturing method. [3] The means for preventing the irradiation of the organic light emitting layer with ultraviolet rays is at least one of the substrate surface and the sealing case surface, and the substrate surface or the sealing surface of the pair of electrodes on the side where the transparent electrode is located. The method for producing an organic electroluminescence device according to the above [1], wherein the organic electroluminescence device is an ultraviolet absorbing layer provided on the surface of the stopper case. [4] A transparent electrode, at least an organic light emitting layer, and a metal electrode are sequentially laminated on a substrate to form a laminate portion, and then a sealing case is bonded to the substrate using an ultraviolet curing adhesive. In the method of manufacturing an organic electroluminescence element for forming a sealing portion of the laminate, a method for preventing reflection of ultraviolet rays on the substrate surface is performed before joining the sealing case to the substrate. A method of manufacturing an organic electroluminescent device, which comprises irradiating ultraviolet rays from the substrate side toward the substrate. [5] The method for producing an organic electroluminescent device according to [4], wherein the means for preventing reflection of ultraviolet light on the substrate surface is an ultraviolet absorbing layer provided on the lower surface of the substrate. [6] The method for producing an organic electroluminescence device according to [4], wherein the means for preventing reflection of ultraviolet light on the substrate surface is an ultraviolet absorbing layer covering a surface of a work table for performing a sealing operation. [7] The method for producing an organic electroluminescence device according to the above [5] or [6], wherein the ultraviolet absorbing layer is a layer containing carbon.

[0011]

Embodiments of the present invention will be described below. The present invention forms a laminate portion by laminating a pair of electrodes and at least an organic light emitting layer on a substrate,
Then, the sealing case is joined to the substrate in a method of manufacturing an organic EL device in which a sealing portion of the laminate is formed by joining the sealing case to the substrate using an ultraviolet curable adhesive. At this time, a method for producing an organic EL element is provided, in which a means for preventing irradiation of the organic light-emitting layer with ultraviolet rays is applied in advance, and then ultraviolet rays are irradiated.

In the present invention, there are various modes of the means for preventing irradiation of the organic light emitting layer with ultraviolet rays. For example, means for preventing transmission or reflection of ultraviolet rays on the substrate and / or the sealing case is preferable. It can be mentioned as an embodiment.

Means for preventing the transmission or reflection of ultraviolet light on the substrate or the sealing case may be applied to either the substrate or the sealing case, but the manufacturing method is simplified and the cost is reduced. Therefore, it is preferable to apply the method to one of the substrate and the sealing case. The choice of which to apply is organic EL
It differs depending on the element configuration of the element and the ultraviolet irradiation position.

This will be described below. In general, an element configuration of an organic EL element includes a method of extracting light emission from the substrate side by using a lower electrode on a substrate as a transparent electrode and a counter electrode as a metal electrode (hereinafter referred to as “substrate side extraction”).
), And the positions of the above electrodes are reversed so that the lower electrode is a metal electrode, the opposite electrode is a transparent electrode, and the sealing case is formed.
There is a method of extracting light emission from the case side (hereinafter, abbreviated as "case side extraction"). Regarding the ultraviolet irradiation position, a method of irradiating ultraviolet rays from the substrate side (substrate side irradiation)
And a method of irradiating ultraviolet rays from the sealing case side (case side irradiation).

In the case of taking out the substrate side / irradiating the case side, since the metal electrode is provided on the case side, the object can be achieved by providing a means for preventing reflection of ultraviolet rays on the substrate surface. . In addition, in taking out the substrate side / irradiating the substrate side, means for preventing transmission of ultraviolet rays through the substrate may be provided. On the other hand, at the time of case side take-out / case side irradiation, means for preventing transmission of ultraviolet rays at the sealing case surface is provided. At the case side take-out / substrate side irradiation, the sealing case surface is provided. Means for preventing the irradiation of ultraviolet rays in the above.

That is, as means for preventing irradiation of the organic light emitting layer with ultraviolet rays, at least one of the substrate surface or the sealing case surface and the substrate surface on the side of the pair of electrodes where the transparent electrode is located. Alternatively, means for preventing transmission or reflection of ultraviolet rays, such as providing an ultraviolet ray absorbing layer on the surface of the sealing case, may be provided.

As means for preventing transmission or reflection of ultraviolet rays on the substrate or the sealing case in the present invention, (1) a method of providing an ultraviolet absorbing layer on the surface of the substrate or the sealing case, (2)
There are a method of making the material of the substrate and the sealing case itself UV-absorbing, (3) and a method of improving a manufacturing apparatus such as a sealing work table. The present invention can achieve the object by any of these methods.

The method for providing an ultraviolet absorbing layer on a substrate or a sealing case will be specifically described below. The ultraviolet absorbing layer used in one embodiment of the means for preventing irradiation of the organic light emitting layer with ultraviolet light according to the present invention has an ultraviolet light, that is, a light transmittance or reflectance of light having a wavelength of 400 nm or less of 30% or less, further 20% or less, It is particularly preferable that the content is 10% or less. This is because the effect of preventing deterioration and damage of the organic EL element is not remarkably recognized as long as the substance has a transmittance or reflectance of ultraviolet rays exceeding 30%. Such UV absorbing materials include:
Use black or ultraviolet absorbing compounds. In particular,
Various black paints, black tapes,
Examples of ultraviolet absorbing compounds such as a mixture of carbon include organic compounds such as salicylic acid compounds, benzophenone compounds, benzotriazole compounds, triazine compounds, and cyanoacrylate compounds, and inorganic inorganic oxides. Is mentioned.

The preferred salicylic acid compounds include phenyl salicylate and pt-butyl salicylate.
And p-octylphenyl salicylate.

Preferred benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, and 2-hydroxy-benzophenone.
4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, bis [2-methoxy-4-hydroxy-5-benzoylphenylmethane] and the like.

Preferred benzotriazole-based compounds include 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-5-tert-butylphenyl) benzotriazole-
, 2- (2'-hydroxy-3 ', 5'-ditert
-Butylphenyl) benzotriazole, 2- (2'-
Hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2 ′
-Hydroxy-3 ', 5'-ditert-butylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-ditert-amylphenyl)
Benzotriazole, 2- [2-hydroxy-3,5-
Di (1,1-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- [2-hydroxy-3-dimethylbenzyl-5- (1,1,3,3-tetramethylbutyl) phenyl] -2H- Benzotriazole, isooctyl-3- [3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl] propionate, methyl-3- [3-tert-butyl-5 -(2H-benzotriazol-2-yl)-
4-hydroxyphenyl] propionate and polyethylene glycol 300.

Further, preferred cyanoacrylate compounds include 2-ethylhexyl-2-cyano-3,
Examples thereof include 3′-diphenyl acrylate and 2-ethyl-2-cyano-3,3′-diphenyl acrylate.

Preferred triazine compounds include 2- [4-[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl]-
4,6-bis (2,4-dimethylphenyl) -1,3
5-triazine or 2- [4-[(2-hydroxy-3-
Tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine and the like.

Further, preferred inorganic oxides include titania, zinc oxide, zirconia, silica, and alumina.

The ultraviolet absorbing layer absorbs ultraviolet light and transmits visible light, for example, a wavelength of 400.
Light transmittance of 50% or more in the region of ~ 800 nm;
Further, it is preferably 70% or more, particularly preferably 80% or more.

When the ultraviolet absorbing layer also absorbs visible light, it is necessary to remove the ultraviolet absorbing layer after the end of the manufacturing process.

On the other hand, means for providing an ultraviolet absorbing layer include a method of forming a film of an ultraviolet absorbing substance (compound) by a vacuum evaporation method, a sputtering method, or the like, and a method of dispersing the ultraviolet absorbing substance itself or fine particles thereof into a resin binder. After that, it may be a method of sticking as a film or a sheet-like thin film. In this case, the thickness of the layer is not limited, and is usually used in the range of several mm to several μm.

In the above, the case (1) of the ultraviolet absorbing layer has been described. In the case (2) of making the material such as the substrate itself ultraviolet absorbing, the ultraviolet absorbing glass containing the ultraviolet absorbing substance (compound) or the like may be used. May be used for a substrate or the like. The method (3) will be described later.

Next, in a second aspect of the present invention, a transparent electrode, at least an organic luminescent layer and a metal electrode are sequentially laminated on a substrate to form a laminate portion, and then the sealing case is formed of an ultraviolet curable type. In a method of manufacturing an organic electroluminescent device in which a sealing portion of the laminate is formed by bonding to the substrate by using an adhesive, when the sealing case is bonded to the substrate, reflection of ultraviolet rays on the substrate surface in advance is performed. A method for manufacturing an organic electroluminescent device, comprising irradiating ultraviolet rays from the side of the sealing case toward the substrate after taking measures to prevent the occurrence.

This method corresponds to the above-mentioned case of "unloading on the substrate side / irradiating on the case side", and is a more specific development thereof. That is, in the conventional method for manufacturing an organic EL device in this case, after forming a laminated body portion such as an organic light emitting layer on the substrate, the sealing case and the substrate are joined.
A part of the ultraviolet light irradiated from the sealing case side is complicatedly refracted or reflected when passing through the side of the sealing case, causing reflection of the ultraviolet light on the substrate surface, especially on the lower surface of the substrate. ,
This is a method found as a result of investigating that it causes damage and deterioration of the organic EL element. Therefore, by providing a means for preventing the reflection of ultraviolet rays on the substrate surface, damage and deterioration of the organic EL element in the manufacturing process can be prevented.

The means for preventing the reflection of ultraviolet rays on the substrate surface used in the present invention is not particularly limited, and examples thereof include the following method. A method in which an ultraviolet absorbing layer is provided on the lower surface of the substrate. A method in which an ultraviolet absorbing layer is provided on the surface of a working table for sealing.

Suppressing reflection of ultraviolet in the lower surface of the substrate by providing an ultraviolet absorbing layer on the lower surface of the substrate with the case of [0032], it is possible to cut off most of the reflected ultraviolet rays reaching the light-emitting layer. This is as described above.

In the case of (1), a method of providing an ultraviolet absorbing layer on the surface of the work table also
Reflection of ultraviolet light on the lower surface of the substrate can be prevented. In this case, it is necessary that both adhere to each other to the extent that ultraviolet light can be prevented from diffusing between the surface of the worktable and the lower surface of the substrate,
Therefore, the ultraviolet absorbing layer on the surface of the worktable is required to be smooth. This method is advantageous in that it is not necessary to remove the ultraviolet absorbing layer after the manufacturing process is completed, even if a layer of any material is used, as compared with the case where the ultraviolet absorbing layer is provided on the substrate itself.

It is needless to say that the method combining the above and the method has a great effect of reliably preventing the organic EL element from being damaged.

Next, one embodiment of a method for manufacturing an organic EL device of the present invention will be described with reference to FIGS. FIG.
FIG. 2 is a schematic vertical sectional view of an organic EL element according to one embodiment of the manufacturing method of the present invention, and FIG. 2 is a schematic vertical sectional view of a layered portion of the organic EL element in FIG.

First, in the method for manufacturing an organic EL device of the present invention, a substrate 1 is used, and a laminate portion 5 is formed on the substrate. The substrate 1 is usually made of transparent glass or a transparent resin such as polyethylene terephthalate or polyethylene naphthalate. A transparent conductive material such as ITO, tin oxide, indium oxide, or IXO (In-Zn-O) is applied to one surface of the substrate 1 by vacuum evaporation or sputtering, and the visible light transmittance is 50% or more, preferably 80% or more. To form a lower electrode (transparent electrode) 2 having a thickness of about 10 to 500 nm.

Next, a hole injection / transport layer 3a is formed on the lower electrode 2. The hole injecting / transporting material has a large hole transfer, an ionization energy between the anode and the light emitting layer material, a good film-forming property, and is substantially transparent at least in a fluorescent wavelength region of the light emitting layer material. Used. Specifically, a phthalocyanine such as copper phthalocyanine or a tetraphenyldiamine derivative is used as a single layer or a stacked layer. Representative examples of the tetraphenyldiamine derivative include N, N'-bis (3-methylphenyl-N, N'-
Diphenyl (1,1′-biphenyl) -4,4′-diamine (hereinafter abbreviated as “TPD”),
It is not limited to the above example. The hole injecting and transporting layer 3a using these compounds is formed mainly on the transparent electrode 2 by vapor deposition, but dispersed in a resin such as polyester or polycarbonate and coated by a method such as spin coating. It is also possible to form by carrying out. The thickness of the hole injection transport layer 3a is usually 1 nm to 1 μm.
It is.

Next, an organic light emitting layer 3b is formed on the hole injection transport layer 3a. The phosphor used for the organic light emitting layer 3b is
Any phosphor that has fluorescence in the visible region and can be formed by an appropriate method can be used. For example, a benzoxazole-based fluorescent whitening agent, a stilbenzene-based compound, an oxadiazol derivative, 8-hydroxyquinoline or a derivative thereof, specifically 8-quinolinol lithium, tris (8-quinolinol) aluminum , 4,4'-bis (2,2'-diphenylvinyl) biphenyl (hereinafter, referred to as
"DPVBi"). The organic light emitting layer 3b is formed by a vacuum evaporation method, a cumulative film method, or a method of dispersing in a resin binder and coating by a method such as spin coating. Organic light emitting layer 3b
Is usually 0.01 to 0.1 μm.

Next, an electron injection / transport layer 3c is formed on the organic light emitting layer 3b. As the material used for the electron injection / transport layer 3c, a material having a high electron mobility, a large work function, and a good film-forming property is suitable.
Derivatives, 8-hydroxyquinoline or a metal complex of a derivative thereof, and the like. The electron injecting and transporting layer 3c is formed by a vacuum deposition method, a cumulative film method, or a method of dispersing in a resin binder and coating by a method such as spin coating. The thickness of the electron injection / transport layer 3c is usually 1 nm to 1 μm.

Next, as the last step of forming the laminate portion 5,
The counter electrode 4 is formed on the electron injection transport layer 3c. The counter electrode 4 is made of a material having a low work function to effectively perform electron injection, and is composed of Li, Na, Mg, Ca, Al, Ag, and I.
A single metal element such as n, Sn, Zn, Zr, or an alloy thereof is used. The counter electrode 4 is deposited by a resistance heating method under a degree of vacuum of 10 ⁻³ Pa or less. This film forming method may be a sputtering method, an electron beam method, or a vapor deposition method. The resulting film thickness is usually 0.0
It is about 5 to 1 μm.

In the above description, an example of the element structure of the laminate portion 5 including the lower electrode 2, the hole injection / transport layer 3a, the organic light emitting layer 3b, the electron injection / transport layer 3c, and the counter electrode 4 has been described.
The device configuration is not limited to this, and one or both of the hole injection transport layer and the electron injection transport layer may be two types of layers,
In addition, there is an element configuration example in which the organic light emitting layer is provided with the functions of a hole injection transport layer and an electron injection transport layer, and the organic layer is a single layer. Of course, each layer is 2
It may be composed of more than one kind of material.

In the above description, the lower electrode is a transparent electrode,
This is the case of taking out the substrate side using the counter electrode as the metal electrode. In the case of taking out the case side, the layers can be stacked in the reverse order, and the lower electrode and the counter electrode can be manufactured in reverse order.

After the laminate portion 5 is formed on the substrate 1 as described above, the sealing case 6 is joined to the substrate 1. The sealing case 6 is usually formed of glass, metal, ceramics, a low-moisture permeable polymer material or the like. In the present invention, glass is preferable in terms of light transmittance and sealing effect. For example, the sealing case 6 has a rectangular upper surface and a sealing case side surface extending vertically downward from the entire periphery of the upper surface.

First, the upper surface of the substrate 1 (the side where the laminated body is located)
Then, an ultraviolet curable adhesive 7 is applied according to the side shape of the sealing case 6. The UV-curable adhesive is not particularly limited, and a commercially available one can be used as it is.

Subsequently, a sealing step is performed, and the ultraviolet absorbing layer 8 is formed on the lower surface of the substrate 1 (the surface opposite to the side where the laminated body portion is present) in advance.
Is provided. Next, the sealing case 6 is placed on the ultraviolet curing adhesive 7 on the upper surface of the substrate 1 and placed on a work table (not shown).

Next, ultraviolet light is irradiated from above the side surface of the sealing case 6 toward the substrate 1 by an ultraviolet light irradiator (not shown). UV irradiation is usually 1 to 10,000 mW / c
It may be performed for about ² to 60 seconds at m ² .

Finally, if necessary, the ultraviolet absorbing layer 8
Is removed. Thereby, the manufacture of the organic EL element is completed. The above operations are all performed in a vacuum or an inert gas atmosphere.

[0048]

EXAMPLES The present invention will be described in further detail with reference to Examples. [Embodiment 1: Substrate Side Extraction / Case Side Irradiation] An embodiment in the case of "substrate side extraction / case side irradiation" will be described with reference to FIG. 25mm x 75mm x 1.1mm
100 nm thick ITO film 1 on a glass substrate 11
2 was formed by an evaporation method. 400 to 6 of this substrate 11
The light transmittance in the wavelength region of 00 nm was about 80%.
This substrate was subjected to ultrasonic cleaning in isopropyl alcohol and then in pure water for 5 minutes, and further to UV ozone cleaning for 10 minutes.

Next, this substrate 11 was fixed to a substrate holder of a vapor deposition apparatus (manufactured by Nippon Vacuum Co., Ltd.), 200 mg of TPD was placed in a molybdenum resistance heating boat, and another molybdenum resistance heating boat was placed. After 200 mg of DPVBi was put into the reactor, the pressure in the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa. Then TPD
The entrance boat was heated to 215 to 220 ° C., and a hole transport layer (not shown) having a film thickness of 60 nm at a deposition rate of 0.1 to 0.3 nm / s (not shown. Was formed. Next, the boat containing DPVBi is
By heating to 40 ° C., a 40 nm-thick light emitting layer was formed at a deposition rate of 0.1 to 0.3 nm / s.

This was taken out of the vacuum chamber, and a stainless steel mask was placed on the light emitting layer and fixed again to the substrate holder. Next, tris (8-quinolinol) aluminum (hereinafter referred to as "Alq
₃ "), 1 g of magnesium ribbon in another board, and 500 mg of silver wire in a tungsten basket, and these boats were mounted in a vacuum chamber.

The pressure in the vacuum chamber was reduced to 1 × 10 ⁻⁴ Pa, and Alq
_{The three-} boat is heated to 270 ° C. and the deposition rate is 0.1 to
An electron transport layer having a thickness of 20 nm was formed at 0.3 nm / s. Further, at the same time as depositing silver on the electron transporting layer at a deposition rate of 0.1 nm / s, magnesium is deposited on the adhesive layer at a deposition rate of 1.4 nm / s, and is made of a mixed metal of magnesium and silver. The counter electrode 14 having a thickness of 150 nm was formed.

The laminate portion 15 produced as described above
Was sealed by the following method. First, a glass cap-type sealing case (counterbore board manufactured by Howa Sangyo Co., Ltd.) 16 was prepared. This sealing case has an inner size of 13 mm x 13 mm x
It has one 0.5 mm recess, and its outer dimension is 17 mm x 1
It is 7 mm x 1.1 mm. An inlet 19 for injecting an inert liquid is provided at the bottom of the concave portion of the sealing case 16. Next, the substrate 11 on which the laminate portion is formed and the sealing case 16 are bonded with an ultraviolet-curable adhesive (three-layer) so that the laminate portion 15 to be sealed is accommodated in the recess. Bonding was performed using T8-3025) 17 manufactured by Bond. In this state, on a work table (not shown) whose surface is covered with a black ultraviolet absorbing layer with an acrylic resin mat black (manufactured by Nitoms), the sealing case 16 is turned up and the substrate 11 is turned down. The substrate 11 was placed so that the substrate 11 was in close contact with the surface of the worktable. Next, an ultraviolet irradiator (HOYA
(UL-200M manufactured by SCHOTT) and irradiated with ultraviolet rays 10 through an optical fiber. In this case, irradiation was performed so that the tip of the optical fiber was perpendicular to the sealing case 16 at a distance of 1 cm, and traced the sealing portion on the side surface of the sealing case 16. UV intensity is φ6m at 1cm distance
m, 1750 mW / cm ² , and the irradiation time was 30 seconds. Therefore, the irradiation amount is about 5000 mJ. The adhesive was cured by this ultraviolet irradiation.

Further, an inert liquid [Perfluoropolyether (Demnum S-20, manufactured by Daikin Industries, Ltd.) was vacuum-degassed from the inlet 19 of the sealing case 16 to give a dissolved oxygen concentration of 0.05 ppm. (With a water content of 5 ppm)] and filled into the space formed by the concave portion of the sealing case 16 and the substrate 11. Next, the above-mentioned ultraviolet curing adhesive was applied to the injection port 19, and 15 mm × 15 mm ×
A glass substrate (not shown) of 0.7 mm was attached, and ultraviolet rays were irradiated by the ultraviolet ray irradiator.

[Embodiment 2: Substrate side removal / substrate side irradiation] An embodiment in the case of "substrate side removal / substrate side irradiation" will be described with reference to FIG. The substrate 21 is placed on a workbench (not shown) on which the ultraviolet absorbing layer is not provided, with the sealing case 26 facing down, and is placed on the surface of the substrate 21 (the side opposite to the laminate portion 25). Sealing black vinyl tape 28
An organic EL device was manufactured in the same manner as in Example 1 except that the device was stuck on a portion other than the seal surface of the sheet 26 and that the ultraviolet irradiation 20 was performed from the substrate 21 side.

[Embodiment 3: Case-side take-out / case-side irradiation] Referring to FIG.
Example of “Surface side irradiation” will be described. The laminated body 35 is formed in the reverse order of the first embodiment, that is, a mixed metal of magnesium and silver, Alq ₃ , DPVBi, TPD, and ITO are formed in this order, and the substrate 31 is placed below and the sealing case 36 is placed above. Then, the organic EL device was manufactured in the same manner as in Example 1 except that a black vinyl tape 38 was stuck on the surface of the sealing case 36.

[Embodiment 4: Case side take-out / substrate side irradiation] An embodiment in the case of "case side take-out / substrate side irradiation" will be described with reference to FIG. An organic EL device was manufactured in the same manner as in Example 3, except that the irradiation of ultraviolet rays 40 was performed from the substrate 41 side.

[Embodiment 5: Substrate-side extraction / case-side irradiation] Another embodiment in the case of "substrate-side extraction / case-side irradiation" will be described with reference to FIG. In addition to the ultraviolet absorbing layer 58 (1) on the lower surface of the substrate 51, a black vinyl tape 58 is formed on the side of the sealing case 56 other than the seal surface.
After applying (2), ultraviolet irradiation 50 was performed.

[Effects of Examples 1 to 5] In the manufacturing methods of Examples 1 to 5, the organic light emitting layer is not deteriorated or damaged by ultraviolet irradiation during the manufacturing process, and the light emission intensity and the light emission efficiency are reduced. Was not found. In addition, it was confirmed that the method of Example 5 did not diffuse the irradiated ultraviolet light, and that irradiation of the organic light emitting layer with the ultraviolet light could be completely prevented.

[0059]

According to the manufacturing process of the organic EL device according to the method of the present invention, deterioration and damage of the organic EL device during the manufacturing process are prevented, and a device having high luminous intensity and luminous efficiency is efficiently manufactured. Can be.

[Brief description of the drawings]

FIG. 1 is a conceptual vertical sectional view of an organic EL device according to one embodiment of a method for manufacturing an organic EL device of the present invention.

FIG. 2 is a conceptual diagram of a vertical cross section of a laminated body portion of FIG.

FIG. 3 shows a first embodiment of a method for manufacturing an organic EL device of the present invention.
FIG. 3 is a schematic vertical sectional view of the organic EL element according to the first embodiment.

FIG. 4 shows a second embodiment of the method for producing an organic EL device of the present invention.
FIG. 3 is a schematic vertical sectional view of the organic EL element according to the first embodiment.

FIG. 5 shows a third embodiment of the method for producing an organic EL device of the present invention.
FIG. 3 is a schematic vertical sectional view of the organic EL element according to the first embodiment.

FIG. 6 shows a fourth embodiment of the method for producing an organic EL device of the present invention.
FIG. 3 is a schematic vertical sectional view of the organic EL element according to the first embodiment.

FIG. 7 shows a fifth embodiment of the method for producing an organic EL device of the present invention.
FIG. 3 is a schematic vertical sectional view of the organic EL element according to the first embodiment.

[Brief description of reference numerals]

1, 11, 21, 31, 41, 51: Substrate 2, 12, 22, 32, 42, 52: Lower electrode 3, 13, 23, 33, 43, 53: Organic light emitting region 3a: Electron injection transport layer 3b: Organic light emitting layer 3c: hole injecting and transporting layer 4, 14, 24, 34, 44, 54: counter electrode 5, 15, 25, 35, 45, 55: laminate portion 6, 16, 26, 36, 46, 56 : Sealing case 7, 17, 27, 37, 47, 57: UV curable adhesive 8, 28, 38, 48, 58: UV absorbing layer 19, 29, 39, 49, 59: Sealing case Injection port 10, 20, 30, 40, 50: UV light from UV irradiator

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3K007 AB02 AB03 AB18 BB00 BB01 CA01 CA05 CB01 DA00 DB03 EB00 FA00 FA01 FA02

Claims (7)

[Claims] 1. A laminate part is formed by laminating a pair of electrodes and at least an organic light emitting layer on a substrate, and then a sealing case is formed.
In a method for manufacturing an organic electroluminescence element, wherein a sealing portion of the laminate is formed by bonding a substrate to the substrate using an ultraviolet curable adhesive, a sealing case is provided.
A method for manufacturing an organic electroluminescence device, comprising: before bonding an organic light-emitting layer to a substrate; 2. The organic electroluminescent device according to claim 1, wherein the means for preventing irradiation of the organic light emitting layer with ultraviolet light is means for preventing transmission or reflection of ultraviolet light on the substrate and / or the sealing case surface. A method for manufacturing a luminescence element. 3. A means for preventing irradiation of the organic light-emitting layer with ultraviolet light is at least one of the substrate surface and the sealing case surface, and the substrate surface on the side of the pair of electrodes on which the transparent electrode is located. 2. The method for manufacturing an organic electroluminescent device according to claim 1, wherein said device is an ultraviolet absorbing layer provided on a surface of a sealing case. 4. A laminate portion is formed by sequentially laminating a transparent electrode, at least an organic light-emitting layer and a metal electrode on a substrate, and then a sealing case is bonded to the substrate using an ultraviolet-curing adhesive. In the method of manufacturing an organic electroluminescence device for forming a sealing portion of the laminate, a method for preventing reflection of ultraviolet light on the substrate surface is performed before joining the sealing case to the substrate. A method of manufacturing an organic electroluminescence device, comprising irradiating ultraviolet rays from a stop case side toward a substrate. 5. The method for manufacturing an organic electroluminescence device according to claim 4, wherein the means for preventing reflection of ultraviolet light on the substrate surface is an ultraviolet absorbing layer provided on the lower surface of the substrate. 6. The method for manufacturing an organic electroluminescent device according to claim 4, wherein the means for preventing the reflection of ultraviolet light on the substrate surface is an ultraviolet absorbing layer covering a surface of a work table for performing a sealing operation. 7. The method for producing an organic electroluminescence device according to claim 5, wherein the ultraviolet absorbing layer is a layer containing carbon.