JP2001124624A - Infrared sensor, sensor device, and method for adjusting infrared sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to write correction data of an infrared sensor (a temperature sensor) in the same sensor by means of an optical signal. SOLUTION: The non-contact temperature sensor 21 is equipped with an infrared detection element 22 and a room temperature detection element 23, and the correction data of the two elements 22, 23 is stored in an EEPROM 28. The sensor 21 has an optical communication means comprising a light transmitting/receiving circuit 29, a light transmitting element 30a, and a light receiving element 30b. The correction data is written in the EEPROM 28 through the optical means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared sensor for detecting infrared rays emitted from an object, a sensor device using the infrared sensor, and a method for adjusting the infrared sensor.

[0002]

2. Description of the Related Art Conventionally, correction of sensitivity and offset of an infrared sensor is often performed by adjusting a resistance value of a circuit by laser trimming of a potentiometer or a thin film resistor when the sensor is shipped.

For example, in the infrared sensor 1 shown in FIG.
The sensitivity of the infrared detecting element 4 such as a thermopile is adjusted by adjusting the resistance value of the adjusting resistor 3 provided in the amplifier circuit 2 to change the amplification degree of the amplifier circuit 2. Further, the offset of the infrared detecting element 4 is adjusted by adjusting the resistance value of the adjustment resistor 5 to change the offset of the amplifier circuit 6. Here, the adjustment resistors 3 and 5 may be potentiometers or laser trimming resistors.

Further, in a non-contact temperature sensor that measures the surface temperature of an object by measuring radiated infrared rays, in addition to the sensitivity and offset of the infrared detecting element, linearity of input / output characteristics, output fluctuation due to fluctuation of ambient temperature, etc. Items also need to be corrected. In recent years, it has become common to use a microprocessor (CPU) for these corrections, and a method of writing correction data in a memory to adjust the sensor output has been adopted.

FIG. 2 is a block diagram showing the structure of a non-contact temperature sensor using such a correction method. In this non-contact temperature sensor 11, the outputs of the infrared detecting element 12 and the room temperature detecting element 13 are amplified by amplifier circuits 14 and 15, and
The data is converted into digital data by a converter 16 and input to a microcomputer (one-chip microcomputer) 17. E
The EPROM 18 stores correction data for the sensitivity, offset, linearity, and temperature characteristics of the infrared detection element 12 and correction data for the sensitivity, offset, and linearity of the room temperature detection element 13. The reading is performed, and the output of the infrared detecting element 12 and the room temperature detecting element 13 is corrected.

As described above, multi-high-order approximation correction is generally used for correction of linearity and correction of temperature characteristics performed using a microcomputer. The correction data stored in the EEPROM 18 is obtained by measuring the outputs of the infrared detecting element 12 and the room temperature detecting element 13 in advance, calculating a correction value by a personal computer or the like, and storing the correction value in the EEPROM 18 via the microcomputer 17. You.

[0007]

As described above, in the method of writing correction data in a memory and correcting the element characteristics by a microcomputer, the temperature sensor 11
It is necessary to electrically connect the microcomputer 17 therein to a writing device such as a personal computer, for example, and it is necessary to draw a cable or a terminal from the temperature sensor 11 to the outside.

However, cables and terminals used for correction are necessary only when the sensor is shipped, and are not required when the sensor is used. For example, when the sensor is used by the user, electrical noise enters from these cables and terminals,
There is a possibility that the sensor may malfunction, or a built-in electronic component may be broken as a path for inducing static electricity.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to enable data such as a correction value of an infrared sensor or the like to be received or transmitted by an optical signal. is there.

[0010]

According to a first aspect of the present invention, there is provided an infrared sensor including an infrared detecting element, a signal processing circuit, and optical communication means for transmitting data to the outside.

Here, the signal processing circuit includes, for example, a microcomputer (CPU) and a memory, and data transmitted from outside through the optical communication means is written and stored in the signal processing circuit. As a memory for writing data, any rewritable memory may be used. For example, an EEPROM can be used. Further, as the infrared detecting element, for example, a thermopile or pyroelectric element can be used.

An infrared sensor according to a second aspect of the invention is characterized in that the infrared detection element and the signal processing circuit in the infrared sensor according to the first aspect are resin-molded.

At this time, in order to enable the optical communication means to transmit data to the outside, the light input / output portion of the optical communication means may be exposed to the outside of the resin mold. May be used for molding.

According to a third aspect of the present invention, in the infrared sensor according to the second aspect, the infrared detecting element is molded using a resin having low thermal conductivity, and a light input / output portion of the optical communication unit is transparent. It is characterized by being molded using optical resin.

As the resin having low thermal conductivity, for example, a resin foam such as foamed polyurethane can be used.
As the translucent resin, a transparent epoxy resin or the like can be used.

According to a fourth aspect of the present invention, in the infrared sensor according to the second aspect, the infrared detecting element is molded using a resin having relatively low thermal conductivity, and the signal processing circuit and the optical communication device are molded. At least a portion of the means that generates a large amount of heat is molded using a translucent resin having a relatively high thermal conductivity, so that the resin having a relatively high thermal conductivity comes into contact with the outside air.

The resin having a relatively low thermal conductivity only needs to have a lower thermal conductivity than a resin having a relatively high thermal conductivity. For example, a resin foam such as foamed polyurethane can be used. Further, the translucent resin having relatively high thermal conductivity may be a resin having relatively high thermal conductivity than a resin having relatively low thermal conductivity. For example, metal powder is dispersed as in an alumina mixed resin. Resin or the like can be used.

According to a fifth aspect of the present invention, there is provided the sensor device according to the first aspect.
An infrared sensor according to claim 1 and a device provided with an optical communication means, so that data communication can be performed between the infrared sensor and the device by communication between the optical communication means of the infrared sensor and the optical communication means of the device. It is characterized by doing.

Typical examples of the device here include a desktop or notebook personal computer, a console type adapter and auxiliary equipment, etc., for inputting various data to the infrared sensor, and for receiving signals from the infrared sensor. Is received and stored or displayed, but is not particularly limited as long as the optical communication means can communicate various data with the infrared sensor.

According to a sixth aspect of the present invention, there is provided a method for adjusting an infrared sensor, comprising: the infrared sensor according to the first aspect; and an arithmetic processing unit having optical communication means, wherein the infrared sensor measures an object to be measured. Is input to the arithmetic processing device by optical communication, a correction value for the sensor characteristic is calculated by the arithmetic processing device, and the correction value is written to the signal processing circuit of the infrared sensor by optical communication. And

[0021]

The infrared sensor according to the first aspect can perform data communication with an external device by optical communication means. Since the optical sensor is provided for transmitting data to and from the outside, the infrared sensor does not require a cable or terminal for transmitting data to and from the outside of the sensor. Therefore, electric noise does not enter from these cables and terminals during use of the sensor, causing malfunction of the infrared sensor and destruction of internal electronic components and the like due to static electricity.

Further, since it is not always necessary to connect to a communication partner with a connector or the like like a cable or a terminal for transmitting an electric signal, when optical communication with the communication partner is performed over a space, the communication for communication is not required. Preparation can be simplified.

In the infrared sensor according to the second aspect, since the infrared detecting element and the signal processing circuit are molded with a resin, the infrared detecting element and the signal processing circuit can be protected by a resin. The impact resistance, water resistance, and moisture resistance of the sensor can be improved.

Furthermore, in the infrared sensor according to the second aspect, since the optical communication means is used, data communication with the outside can be performed without any problem even when the infrared sensor is resin-molded. In other words, in the method of communicating with the outside through the terminal, when resin molding is performed, if the terminal is embedded in the resin mold, data communication cannot be performed after the resin molding, and if the terminal is exposed from the resin mold, it is not possible to communicate with the terminal. Although there is a problem that static electricity flows and noise is picked up, in the infrared sensor according to claim 2,
There is no such problem.

In the infrared sensor according to the third aspect, since the infrared detecting element is molded by using a resin having low thermal conductivity, the heat insulating effect between the infrared detecting element and the outside air is enhanced, and the ambient temperature fluctuation is improved. The stability against is increased. Furthermore, since the light input / output portion of the optical communication means is molded using a translucent resin, it is possible to enhance the environmental resistance such as moisture resistance of the optical communication means without hindering the optical communication.

In the infrared sensor according to the fourth aspect, since the infrared detecting element is molded by using a resin having relatively low thermal conductivity, the heat insulating effect between the infrared detecting element and the outside air is enhanced, and It is possible to enhance the stability of the sensor characteristics with respect to temperature fluctuation. In addition, at least a portion of the signal processing circuit or the optical communication unit that generates a large amount of heat is molded using a translucent resin having a relatively high thermal conductivity so that the resin having a relatively high thermal conductivity contacts the outside air. Therefore, the heat generated from the heat is radiated to the outside air through a resin having relatively high thermal conductivity, and the heat is hardly transmitted to the infrared detecting element, thereby improving the thermal stability of the infrared detecting element.

In the sensor device according to the fifth aspect,
Since the infrared sensor and the device can perform data communication by optical communication means, there is no need to connect the infrared sensor and the device with a cable or the like. For this reason, electrical noise enters from these cables during sensor use, causing malfunction of the infrared sensor,
The internal electronic components and the like are not destroyed by static electricity.

Further, since it is not necessary to connect the infrared sensor to the device with a cable, the cable does not become a hindrance and the infrared sensor becomes easy to handle.

In the method of adjusting an infrared sensor according to a sixth aspect of the present invention, a signal from the infrared sensor that measures an object to be measured is taken into the arithmetic processing device by optical communication, and the arithmetic processing device corrects the sensor characteristics. Calculate the value,
Since the correction value is written to the signal processing circuit of the infrared sensor by optical communication, no cable or terminal is required for writing the correction value to the infrared sensor. Therefore, there is no possibility that noise is picked up from the cable or the terminal, or the inside of the electronic component or the like is damaged due to a passage of static electricity.

[0030]

Embodiments of the present invention will be specifically described below with reference to the drawings. (First Embodiment) FIG. 3 is a block diagram showing a configuration of one embodiment of the present invention. In this embodiment, the infrared sensor of the present invention is configured as a non-contact temperature sensor.
The temperature sensor 21 includes an infrared detecting element 22 such as a thermopile for measuring the amount of radiated infrared rays and a room temperature detecting element 23 such as a thermistor.
Are amplified by the amplifier circuit 24, and the outputs of the room temperature detecting elements 23 are amplified by the amplifier circuit 25 and input to the AD converters 26, respectively. The signal input to the AD converter 26 is converted into digital data by the AD converter 26 and then input to a microcomputer (one-chip microcomputer) 27.

The EEPROM 28 has an infrared detecting element 2
2, correction data of sensitivity, offset, linearity, and temperature characteristics, and correction data of sensitivity, offset, and linearity of the room temperature detecting element 23 are stored. When digital data is input to the microcomputer 27, the microcomputer 27 reads each correction value from the EEPROM 28, performs a correction operation on the outputs of the infrared detection element 22 and the room temperature detection element 23, and uses the corrected operation result as a measured temperature. Output.

In such a temperature sensor 21, each temperature sensor 2 is used in the inspection process and the adjustment process of the production line.
1 must be measured, and the correction data must be written to each temperature sensor 21. In this temperature sensor 21,
Writing of each correction data to the EEPROM 28 is performed through optical communication means. The optical communication means of the temperature sensor 21 includes an optical transmitting / receiving circuit 29, a light emitting element 30a such as a light emitting diode (LED) or a laser diode, and a light receiving element 30b such as a photodiode.

On the other hand, a sensor adjusting device 32 for writing correction data to the temperature sensor 21 is composed of a correction data writing device 35 and optical communication means. The correction data writing device 35 is a personal computer (P
C), the correction data writing device 35 also receives a temperature via an optical communication means including an optical transmitting / receiving circuit 34, a light emitting element 33a such as a light emitting diode (LED) or a laser diode, and a light receiving element 33b such as a photodiode. It transmits and receives data to and from the sensor 21.

The temperature sensor 21 is supplied with electric power from a power supply 36 through a cable. Or,
Power may be supplied by a built-in battery.

In the temperature sensor 21 and the correction data writing device 35 having such a configuration, correction data is written to the EEPROM 28 of the temperature sensor 21 on the manufacturing line as follows. First, infrared rays from a predetermined heat source are measured by the temperature sensor 21. At this time, in order to obtain accurate correction data, several types of heat source temperature and room temperature (ambient temperature) are measured. When the temperature of the predetermined heat source is measured, the outputs of the infrared ray detecting element 22 and the room temperature detecting element 23 which have measured the temperature of each heat source and the room temperature are supplied to the microcomputer 27 via the amplifier circuits 24 and 25 and the AD converter 26.
Is input to The measurement data of the infrared detecting element 22 and the room temperature detecting element 23 stored in the microcomputer 27 are modulated by the optical transmitting and receiving circuit 29 by a predetermined optical communication system, and transmitted from the light emitting element 30a. The optical signal transmitted from the light emitting element 30a is received by the light receiving element 33b of the sensor adjustment device 32 disposed to face the light emitting element 30a, and is demodulated into the original signal by the optical transmitting and receiving circuit 34.
The correction data is sent to the correction data writing device 35.

The correction data writing device 35 corrects the sensitivity, offset, linearity, and temperature characteristics of the infrared detecting element 22 and the sensitivity and offset of the room temperature detecting element 23 based on each measurement data received from the temperature sensor 21. , Linearity correction data is calculated by calculation. Each calculated correction data is modulated by the optical transmission / reception circuit 34 by a predetermined modulation method, and transmitted from the light projecting element 33a. The optical signal transmitted from the light projecting element 33a is transmitted to the light receiving element 3 of the temperature sensor 21 that is arranged to face the light projecting element 33a.
The light is received at 0b, and is demodulated to the original signal by the optical transmission / reception circuit 29, and then stored in the microcomputer 27, and then stored in the EEPROM 28 from the microcomputer 27.

The temperature sensor 21 having the correction data stored in the EEPROM 28 outputs the measured temperature corrected using the correction data as described above.

FIG. 4 is a perspective view showing a specific structure of the temperature sensor 21, and FIG. 5 is a sectional view thereof. The lens holder 40 holding the lens 38 at the tip is accommodated in the tip of a cylindrical case 37, and the lens 38 is exposed from the front opening of the case 37. Sensor unit 39
Is a device in which an infrared detecting element 22 such as a thermopile and a room temperature detecting element 23 such as a thermistor are sealed in a metal package, and is mounted on a substrate 41 in a case 37. The lens 38 and the substrate 41 are kept at a predetermined distance, so that the lens 38 and the infrared detecting element 22
The optical arrangement such as the focal length is maintained between the optical element and the room temperature detecting element 23.

The circuit board 42 is fixed to the back of the board 41, and the amplifiers 24 and 25, the AD converter 26, the microcomputer 27, the EEPROM 2
8. The electronic component 44, the light projecting element 30a, the light receiving element 30b, and the like that constitute the optical transmitting and receiving circuit 29 and the like are mounted. The infrared detecting element 22 and the room temperature detecting element 23 in the sensor section 39 are connected to a circuit board 42 by leads 43. The cable 46 electrically connected to the circuit board 42 is for supplying power to the temperature sensor 21 or outputting a signal from the temperature sensor 21, and is not for writing correction data.

The circuit board 42 on which the electronic components 44, the light projecting element 30a, and the light receiving element 30b are mounted is housed in a case 37, and is sealed with a resin 45 such as epoxy, silicone, or urethane filled in the case 37. Has been stopped. Thereby, the temperature sensor 21 is provided with impact resistance, water resistance, and moisture resistance. However, the interior of the lens holder 40 is a space, and the light emitting element 30a and the light receiving element 30b
Are exposed on the back of the case 37.

In the non-contact temperature sensor 21 having such a configuration, it is not necessary to pull out a cable or a terminal for writing correction data from the temperature sensor 21 to the outside. Noise does not enter, causing malfunction of the temperature sensor 21 and the electronic component 44 is not destroyed by static electricity.

Further, in the temperature sensor 21, the infrared detecting element 2 is generally provided before and after the case 37 is filled with the resin 45.
The offset value, temperature characteristic, and the like change due to a change in the heat conduction characteristics and the heat balance around the device. For this reason, if a method is provided in which a terminal for writing correction data is provided, and after writing the correction data, this terminal is embedded in the resin, there is no risk of picking up noise or invading static electricity. The offset value and the temperature characteristic of the temperature sensor change due to the filling of the resin, and correction data after the change cannot be written to the temperature sensor. On the other hand, in the temperature sensor 21 of the present invention, after filling the resin 45, the correction data of the temperature sensor 21 can be calculated and written, so that the error correction including the heat conduction characteristic and the heat balance change due to the resin filling can be performed. It is possible to realize high accuracy of the non-contact temperature sensor 21.

(Second Embodiment) FIG. 6 is a sectional view showing the structure of a temperature sensor 51 according to another embodiment of the present invention. Since the entire configuration is the same as the configuration in FIG. 3, illustration is omitted. In this temperature sensor, two types of resins are used for the resin for molding. The resin 52 is made of a material having a low thermal conductivity, such as polyurethane foam, and is molded around the sensor unit 39. The other resin 53 is made of a translucent material such as a transparent epoxy resin, and molds the light emitting element 30a and the light receiving element 30b, which are input / output portions of the optical communication means.
In this case, the light emitting and receiving elements 30a and 30b may be bare chips, and may be electrically connected to the circuit board 42 by wire bonding or the like. A window 54 is opened in a part of the case 37 so as to face the light emitting and receiving elements 30a and 30b, and light emitted from the light emitting element 30a
The light-receiving element 30b receives the light incident through the window 54.

If such a configuration is adopted, the sensor unit 3
9 is molded with the resin 52 having a low thermal conductivity, the heat insulating effect with respect to the outside air is enhanced, and the stability against the ambient temperature fluctuation is enhanced. Further, since the light emitting element 30a and the light receiving element 30b are protected by the resin 53 having a light transmitting property, environmental resistance such as moisture resistance can be improved.

(Third Embodiment) FIG. 7 is a sectional view showing the structure of a non-contact temperature sensor 61 according to still another embodiment of the present invention. Also in this embodiment, the overall configuration is the same as the configuration in FIG. Even in this temperature sensor 61, two types of resins are used for the resin for molding. One resin 62 is a resin having a low thermal conductivity such as foamed polyurethane, and molds the vicinity of the sensor unit 39. The other resin 63 is a resin having a high thermal conductivity, such as an alumina mixed resin in which aluminum powder is dispersed in the resin.
0b, which molds an electronic component 44 that consumes a large amount of power and generates a large amount of heat, such as a transistor and a power supply IC that drive the light emitting and receiving elements 30a and 30b. It is exposed.

According to the embodiment having such a configuration, since the sensor section 39 is molded with the resin 62 having a low thermal conductivity, the heat insulating effect between the sensor section 39 and the outside air is enhanced, and the characteristic with respect to the fluctuation of the ambient temperature is improved. Stability can be improved. Further, the light emitting and receiving elements 30a and 30b,
The electronic components 44 that consume a large amount of power and generate a large amount of heat, such as transistors and power supply ICs that drive the a and 30b, are molded with a resin 63 having a high thermal conductivity. Heat is radiated to the outside air through the resin 63 having conductivity. Therefore, heat generated from the electronic component 44 is not easily transmitted to the sensor unit 39, and the thermal stability of the infrared detecting element 22 and the room temperature detecting element 23 in the sensor unit 39 increases.

(Fourth Embodiment) A non-contact temperature sensor using an infrared detecting element such as a thermopile measures the temperature of an object by measuring the amount of infrared radiation radiated from the object. The amount of emitted infrared light varies depending on the emissivity of the object even at the same temperature. Therefore, when the user uses the non-contact temperature sensor, it is necessary to correct the data of the non-contact temperature sensor according to the emissivity for each measured object.

The sensor device 71 of the embodiment shown in FIG.
When the non-contact temperature sensor 21 is used, the user can input measurement basic data such as the infrared emissivity of the object to be measured to the non-contact temperature sensor and output the measurement result. This sensor device 71 includes a non-contact temperature sensor 21 and a hand-held type input / output device 73. Here, the non-contact temperature sensor 21 having the same configuration as that described with reference to FIG. 3 is shown. In this sensor device 71, the temperature sensor 21 is provided with an input / output device 73, but the temperature sensor 21 and the input / output device 73 are provided separately, and are not connected by a cable or the like.

The input / output device 73 includes a microcomputer (one-chip microcomputer) 76 and a memory 7 for storing data.
7, an input operation unit 78 having operation switches, a display device 79 such as a liquid crystal display panel, an optical transmission / reception circuit 75, a light projecting element 74a and a light receiving element 74b. The input / output device 73 is of a console type and is driven by a battery 80.

Thus, the infrared emissivity values of various objects to be measured can be input to the input / output device 73 from the input operation unit 78. The input data is displayed on the display device 79 by the microcomputer 76, and is written and stored in the memory 77. Next, when the type of the measured object is specified from the input operation unit 78, the name of the measured object is displayed on the display device 79, and the infrared emissivity of the measured object is read from the memory 77 to the microcomputer 76. Further, when a data write command is sent from the input operation unit 78, the microcomputer 76 modulates data such as infrared emissivity in the optical transmission / reception circuit 75 and transmits the modulated light signal from the light emitting element 74 a to the temperature sensor 21.

When data is transmitted from the input / output device 73, the temperature sensor 21 receives an optical signal by the light receiving element 30b, demodulates the optical signal by the optical transmission / reception circuit 29, and stores it in the EEPROM 28. Then, the temperature of the measured object is measured using the emissivity.

The temperature measured by the temperature sensor 21 can be output through the cable of the temperature sensor 21, and is transmitted to the input / output device 73 via the optical communication means of the temperature sensor 21 and the optical communication means of the input / output device 73. Feeding, input / output device 7
3 may be displayed on the display device 79.

In addition to the emissivity of the object to be measured, data such as a threshold value for comparison with the measured temperature and various alarm setting values are stored in the EEPROM 28 of the non-contact temperature sensor 21 from the input / output device 73 by optical communication. It can also be done.

Therefore, according to the sensor device 71, data such as the emissivity value can also be written to the EEPROM 28 using the optical communication means for writing correction data to the EEPROM 28 at the time of shipment from the factory.

When the temperature sensor is downsized,
It is difficult for a user to input data such as emissivity to the temperature sensor because an input operation switch, a display unit, and the like cannot be provided in the temperature sensor. Even if the sensor 21 is miniaturized, it becomes possible to input various set values to the temperature sensor 21.

Although the description has been given of the case of the hand-held type input / output device provided with the optical communication means, the input / output device for writing the data such as the emissivity into the temperature sensor is provided to the personal computer by the optical communication. May be connected to an adapter.

[0057]

According to the infrared sensor according to the first aspect, data communication with an external device can be performed by the optical communication means, and there is no need to pull out a cable or a terminal for data transmission with the outside to the outside of the sensor. Therefore, electric noise does not enter from these cables and terminals during use of the sensor, causing malfunction of the infrared sensor and destruction of internal electronic components and the like due to static electricity.

Further, since it is not always necessary to connect to a communication partner with a connector or the like like a cable or a terminal for transmitting an electric signal, when optically communicating with a communication partner across a space, communication is not required. Preparation can be simplified.

According to the infrared sensor of the second aspect,
Since the infrared detection element and the signal processing circuit are resin-molded, the infrared detection element and the signal processing circuit can be protected by the resin, and the shock resistance of the infrared sensor can be improved.
Water resistance and moisture resistance can be improved.

Further, in the infrared sensor according to the second aspect, since the optical communication means is used, data communication with the outside can be performed without any problem even when the infrared sensor is resin-molded.

In the infrared sensor according to the third aspect, since the infrared detecting element is molded using a resin having low thermal conductivity, the effect of insulating the infrared detecting element from the outside air is enhanced, and High stability against temperature fluctuation. Furthermore, since the light input / output portion of the optical communication means is molded using a translucent resin, it is possible to enhance the environmental resistance such as moisture resistance of the optical communication means without hindering the optical communication.

In the infrared sensor according to the fourth aspect, since the infrared detecting element is molded using a resin having relatively low thermal conductivity, the heat insulating effect between the infrared detecting element and the outside air is enhanced. In addition, the stability of the sensor characteristics with respect to the fluctuation of the ambient temperature can be improved. In addition, at least a portion of the signal processing circuit or the optical communication unit that generates a large amount of heat is molded using a translucent resin having a relatively high thermal conductivity so that the resin having a relatively high thermal conductivity contacts the outside air. Therefore, the heat generated from the heat is radiated to the outside air through a resin having relatively high thermal conductivity, and the heat is hardly transmitted to the infrared detecting element, thereby improving the thermal stability of the infrared detecting element.

According to the sensor device of the fifth aspect, since the infrared sensor and the device of the communication partner can perform data communication by the optical communication means, the infrared sensor and the device are connected by a cable or the like. No need to connect. Therefore, electric noise does not enter from these cables during use of the sensor, causing malfunction of the infrared sensor, and destruction of internal electronic components and the like due to static electricity.

Further, since it is not necessary to connect the infrared sensor to the device with a cable, the cable does not become an obstacle and the infrared sensor becomes easy to handle.

According to the method for adjusting an infrared sensor according to the sixth aspect, a cable or a terminal for writing a correction value to the infrared sensor is not required, so that noise is picked up from the cable or the terminal or a path of static electricity is generated. There is no risk of damage to internal electronic components.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing a configuration of a conventional infrared sensor.

FIG. 2 is a block diagram showing a configuration of another conventional non-contact temperature sensor.

FIG. 3 is a block diagram showing a configuration of a non-contact temperature sensor according to one embodiment of the present invention.

FIG. 4 is an external perspective view of the above temperature sensor.

FIG. 5 is a sectional view of the same temperature sensor.

FIG. 6 is a cross-sectional view illustrating a configuration of a non-contact temperature sensor according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a configuration of a non-contact temperature sensor according to still another embodiment of the present invention.

FIG. 8 is a block diagram showing a sensor device using a non-contact temperature sensor according to still another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 21 Non-contact temperature sensor 22 Infrared ray detecting element 23 Room temperature detecting element 27 Microcomputer 28 EEPROM 29 Optical transmitting and receiving circuit 30a Light emitting element 30b Light receiving element 32 Sensor correcting device 33a Light emitting element 33b Light receiving element 34 Optical transmitting and receiving circuit 35 Correction data writing device 39 Sensor part 42 Circuit board 44 Electronic component 45 Resin for sealing 51 Non-contact temperature sensor 52 Resin with low thermal conductivity 53 Translucent resin 61 Non-contact temperature sensor 62 Resin with low thermal conductivity 63 Thermal conductivity High resin 71 sensor device 73 input / output device 74a light emitting element 74b light receiving element 75 light transmitting / receiving circuit 76 microcomputer 78 input operation section 79 display device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H04B 10/22 F term (Reference) 2G065 AB02 AB09 AB28 BA09 BA11 BA12 BA14 BA36 BA37 BC03 BC07 BC09 BC13 BC28 BC33 BC35 BD01 CA12 CA21 DA01 DA05 DA13 DA15 5K002 AA03 AA07 BA13 BA14 BA15 FA03

Claims (6)

[Claims] 1. An infrared sensor comprising an infrared detecting element, a signal processing circuit, and an optical communication unit for transmitting data to the outside. 2. The infrared sensor according to claim 1, wherein the infrared detection element and the signal processing circuit are resin-molded. 3. The method according to claim 1, wherein the infrared detecting element is molded using a resin having low thermal conductivity, and an optical input / output portion of the optical communication unit is molded using a translucent resin.
The infrared sensor according to claim 2. 4. The infrared detecting element is molded by using a resin having a relatively low thermal conductivity, and at least a portion of the signal processing circuit and the optical communication unit which generates a large amount of heat is light-transmitting having a relatively high thermal conductivity. 3. The infrared sensor according to claim 2, wherein the resin is molded using a conductive resin, and the resin having relatively high thermal conductivity comes into contact with the outside air. 5. An infrared sensor according to claim 1, and a device provided with an optical communication means, wherein the communication between the optical communication means of the infrared sensor and the optical communication means of the device causes the infrared sensor to communicate with the device. A sensor device that enables data communication between devices. 6. The infrared sensor according to claim 1, wherein:
An arithmetic processing unit having optical communication means, a signal from the infrared sensor measuring the device under test is taken into the arithmetic processing device by optical communication, and a correction value for the sensor characteristic is calculated by the arithmetic processing device; A method of adjusting an infrared sensor, wherein the correction value is written to the signal processing circuit of the infrared sensor by optical communication.