JP2001119247A - Amplification device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a reproduced sound that is closer to the original sound by suppressing mechanical vibrations in amplifier circuits and preventing the unneeded modulation of a signal in an amplification device provided with the two amplifier circuits. SOLUTION: A heat radiating block 1 respectively has areas that are larger than those of the principal planes of two electric circuit substrates 2a and 2b on which the amplifier circuits 20a and 20b are respectively mounted and two mounting planes 1a and 1b which are formed so as to substantially face each other and on which each of the substrates 2a and 2b is mounted and radiates heat generated from the circuits 20a and 20b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, 100 kHz.
The present invention relates to an amplifying device such as an audio amplifier that amplifies a low frequency signal of z or less.

[0002]

2. Description of the Related Art In a conventional audio amplifier, an electric amplifier constituting an amplifier circuit is mounted on a printed circuit board having a thickness of about 1 to 2 mm made of a phenol resin, an epoxy resin, or the like. I was In addition, power devices such as power transistors among electric components generate heat, and a radiator is directly attached to dissipate the heat. In this radiator, aluminum, copper, and the like are generally used as a material for sufficiently radiating heat generated from the power device, and fins are generally provided for increasing a heat radiation area.

[0003]

However, due to vibrations transmitted from components that generate mechanical vibrations such as speakers and transformers, and electromagnetic force generated in each electric component itself,
Each electrical component on the electrical circuit board of the audio amplifier
Mechanical vibration is applied. Also, usually, the electric circuit board is fixed on the chassis at a plurality of places, but since the electric circuit board has a small thickness with respect to its area, it oscillates in a complicated vibration mode and generates undulations and twists, Various stresses are applied to the electric components on the electric circuit board.

As a result, there has been a problem that an audio signal is modulated in an audio amplifier due to a piezoelectric effect due to stress or electromagnetic induction due to vibration of an electric component in an electromagnetic field, thereby deteriorating sound quality. In addition, since the radiator is made of a metal material as described above, the radiator has a high rigidity, but has a unique mechanical vibration characteristic caused by a complicated shape of a fin or the like, and the vibration is hardly attenuated. There is a problem that vibration also deteriorates sound quality.

[0005] In a stereo audio amplifier, except for some inexpensive small-sized amplifiers, two radiators, each having a left channel power transistor and a right channel power transistor, are mounted independently. The mode and the temperature environment are different from each other, resulting in a difference in the electrical characteristics of the left and right channel amplifiers.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems. For example, in an amplifying apparatus having two amplifying circuits, such as a stereo audio amplifier, mechanical vibration in the amplifying circuits is suppressed to eliminate the need for signals. It is an object of the present invention to provide an amplification device that can prevent a proper modulation, make the vibration mode and the temperature environment of the amplification circuit the same on the left and right, and can realize a reproduced sound with high fidelity.

[0007]

An amplifying device according to the present invention has two electric circuit boards each having an amplifying circuit mounted thereon, and has an area larger than the area of the main surface of each electric circuit board. A heat-dissipating block having two mounting surfaces formed substantially opposite to each other and on which the electric circuit boards are mounted, and dissipating heat generated from the amplifier circuit.

In the amplifying apparatus, each of the amplifying circuits includes a power amplifying element and a circuit section other than the power amplifying element and connected to the power amplifying element. The element is mounted on the mounting surface of the heat dissipation block.

Further, in the amplifying apparatus, substantially the entire back surface of the main surface of each of the electric circuit boards is mounted on the mounting surface of the heat radiation block.

Further, in the amplifying device, a concave portion corresponding to a convex surface on a back surface of the main surface of each electric circuit board is formed on each mounting surface of the heat radiation block, and A substantially entire surface of the back surface except for the convex portion is mounted on a mounting surface of the heat radiation block.

[0011] In the above-mentioned amplifying device, a support member may be further provided for contacting and supporting one point of the heat-dissipating block.

Further, in the amplifying apparatus, the support member supports the heat dissipation block at a point on a vertical axis passing through the center of gravity of the heat dissipation block and above the center of gravity.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

<Embodiment> FIG. 1 is a perspective view schematically showing a configuration of an audio amplifier according to an embodiment of the present invention, and FIG. 2 is a side view of the audio amplifier of FIG. FIG. 3 is a circuit diagram showing amplifier circuits 20a and 20b for one channel mounted on the audio amplifier of FIG. 1, and FIG. 4 is a longitudinal sectional view of the audio amplifier of FIG. The audio amplifier of this embodiment has the configuration shown in FIGS.
As shown in FIG. 2, a heat dissipation block 1 is provided, and the heat dissipation block 1 is provided with two amplifier circuits 20a and 20b, respectively.
The two mounting surfaces 1a, 1b each having an area larger than the area of the main surface of each of the electric circuit boards 2a, 2b, formed so as to substantially face each other, and having the electric circuit boards 2a, 2b mounted thereon. And dissipates heat generated from the amplifier circuits 20a and 20b.

1 and 2, the heat dissipating block 1 has, for example, a cylindrical shape, and has two lower mounting surfaces 1a, 1 which are substantially opposed to each other by shaving the lower surface of the cylindrical shape.
b is formed. Each of the mounting surfaces 1a and 1b has at least the area of the main surface of each of the electric circuit boards 2a and 2b and the power transistors Q9 and Q1 in each of the amplifier circuits 20a and 20b.
It has an area equal to or larger than the area including the area of the mounting surface of zero.
Each electric circuit board 2a, 2b having a parallel plate shape has
For example, amplifier circuits 20a and 20b configured by a plurality of electric components 3a and 3b and amplifying an audio signal are formed. Here, the plurality of electric components 3a and 3b are connected to the amplifier circuit 20.
a and 20b are connected by soldering with a predetermined wiring pattern and fixed on the main surfaces of the electric circuit boards 2a and 2b. Each mounting surface 1 of the heat radiation block 1
The back surfaces of the main surfaces of the electric circuit boards 2a and 2b are adhered to a and 1b, and are fixed using, for example, screws 10.

The heat dissipating block 1 and each of the electric circuit boards 2a, 2
Various methods such as fixing with screws, adhesion, and the like can be used as a fixing method with b. In particular, any method can be used as long as the heat radiation block 1 and the electric circuit boards 2a and 2b can be sufficiently adhered and fixed. Not limited. Various materials such as phenolic resin, epoxy resin, metal, and ceramic can be used as the material of the electric circuit boards 2a and 2b, and the material of the heat radiation block 1 includes aluminum, copper, and the like, which have excellent heat radiation characteristics. Various metals and the like can be used.

Heat dissipating block 1 and electric circuit boards 2a, 2
The shape of b is not limited to the above, but is preferably as small as possible in consideration of vibration characteristics. The heat radiation block 1 is preferably provided with fins in consideration of heat radiation characteristics. However, in order to simplify a vibration mode, the heat radiation block 1 may have the shape of the block without fins. Each electric circuit board 2
a and 2b are, for example, single-sided epoxy boards, and the electric components 3a and 3b are preferably surface-mounted components.
In this case, the back surface of the main surface of each of the electric circuit boards 2a and 2b can be flattened, and the electric circuit boards 2a and 2b can be fixed to the heat dissipating block 1 having the flat mounting surfaces 1a and 1b in close contact. In addition, it is preferable that the heat radiation block 1 is subjected to black alumite processing in order to increase heat radiation efficiency and to provide electrical insulation.

FIG. 3 is a circuit diagram of the amplifier circuits 20a and 20b. As shown in FIG. 3, the amplifier circuits 20a and 20b
Are power transistors Q9 and Q1 which are power amplifying elements.
0, a plurality of transistors Q1 to Q10, capacitors and electrolytic capacitors C1 to C9, and resistors R1 to R23.
And a variable resistor VR1.
a, 3b. Here, the power transistor Q
As shown in FIG. 1, the heat radiating surfaces 9 and Q10 are fixed directly and closely to the mounting surfaces 1a and 1b of the heat radiating block 1 using screws 12, for example. Thereby, mainly the power transistors Q9, Q9
The heat generated at 10 is transmitted to the heat radiation block 1 and radiated. On the other hand, in each of the amplifier circuits 20a and 20b, the back surface of the main surface of the electric circuit boards 2a and 2b on which the amplifier circuits except the power transistors Q9 and Q10 are mounted is in close contact with the mounting surfaces 1a and 1b of the heat radiation block 1, for example. It is fixed using screws 10.

In the audio amplifier configured as described above, the main surfaces of the electric circuit boards 2a and 2b and the mounting surface of the power transistors Q9 and Q10 can be fixed to the rigid heat-dissipating block 1. By increasing the rigidity of the circuit boards 2a and 2b, the amplification circuit 2
When the components 0a and 20b perform the amplification operation, the plurality of components 3a and 3
b, electric circuit boards 2a and 2b and power transistor Q
9, the mechanical vibration generated in Q10 can be suppressed, and unnecessary stress applied to the electric components 3a, 3b from the electric circuit boards 2a, 2b can be suppressed. In addition, in the case of the present embodiment, in particular, in the present embodiment, the heat radiation block 1 is made of metal, and the electric circuit boards 2a and 2b are made of glass epoxy by fixing the heat radiation block 1 to the electric circuit boards 2a and 2b as separate members. Therefore, the dissimilar materials are brought into close contact with each other, so that the vibration of the heat radiating block 1 is restrained and the damping characteristics can be improved.
Further, since the electric circuit boards 2a and 2b and the heat radiation block 1 are integrated, even if they vibrate, they vibrate integrally, and the occurrence of relative vibration can be prevented. As a result, mechanical vibrations in the amplifier circuits 20a and 20b are suppressed to prevent unnecessary modulation of the audio signal, and a reproduced sound closer to the original sound can be realized.

In particular, in the present embodiment, the mounting surfaces 1a and 1b of the heat radiation block 1 are formed to face each other, and the mounting surfaces 1a and 1b are provided with left and right channel amplifier circuits 20a and 20b. Circuit boards 2a, 2
b, and the mounting surfaces of the power transistors Q9 and Q10 are mounted so as to face each other via the heat dissipation block 1, so that when the amplifier circuits 20a and 20b operate, one of the electric circuit boards 2a is, for example, as shown in FIG. 2 vibrates in the left direction 21a, the other electric circuit board 2b vibrates in the right direction 21b in FIG. 2, so that these vibrations cancel each other out, and also when they vibrate in the opposite direction. You. Therefore, it is possible to prevent vibration from occurring in the heat dissipation block 1 including the electric circuit boards 2a and 2b and the power transistors Q9 and Q10. Further, the left and right power transistors Q9 and Q10 and the left and right electric circuits can be set to the same temperature environment, and the electric characteristics of the left channel and the right channel can be approximated.
As a result, mechanical vibrations in the amplifier circuits 20a and 20b are suppressed, unnecessary modulation of the audio signals of the left and right channels is prevented, and a reproduced sound closer to the original sound can be realized.

In this embodiment, the electric circuit board 2
Although a and 2b were separately attached to the heat radiation block 1 later, the electric circuit boards 2a and 2b were formed thereon using the mounting surfaces 1a and 1b of the heat radiation block 1 as substrates.
The heat radiating block 1 and each of the electric circuit boards 2a and 2b may be formed as an integral component. In order to restrain the vibration of the heat radiating block 1 by the electric circuit boards 2a, 2b, it is preferable that the size of the heat radiating block 1 is not too large with respect to each of the electric circuit boards 2a, 2b.

Next, a method of supporting the heat dissipation block 1 of the audio amplifier according to the present embodiment will be described. FIG. 4 is a longitudinal sectional view showing a method of supporting the heat radiation block 1.

As shown in FIG. 4, the heat radiation block 1 includes
A cylindrical support hole 5 is formed along the center axis of the heat radiation block 1 from the bottom of the cylinder to the top of the heat radiation block 1 so as to pass through the center of gravity G.
Does not penetrate the upper surface of the cylinder of the heat radiation block 1. The support member 4 is inserted into the support hole 5, and a concave spherical surface is formed on the bottom 1 c located on the upper side of the support hole 5 in the drawing, and the end 4 a of the support member 4 has a curvature greater than that of the concave spherical surface. A convex spherical surface having a small radius is formed, and a pivot bearing in which one point of the concave spherical surface and one point of the convex spherical surface abut at a position above the center of gravity G of the heat radiation block 1 is configured. Here, the support member 4 supports the heat radiation block 1 at one point on a vertical axis passing through the center of gravity G of the heat radiation block 1 and above the center of gravity G.

Various materials can be used as the material of the support member 4. For example, stainless steel can be used in consideration of durability and the like, and in order to improve abrasion resistance. Alternatively, a region including at least the contact portion between the support member 4 and the support hole 5 may be coated with a highly lubricious resin or the like.

The method of supporting the amplifier block by the support member 4 is not particularly limited to the above-described pivot bearing.
(B) a support member having a concave spherical surface at a tip end, using a support member having a minute flat surface portion provided on an end surface of a conical convex portion and a support hole having a flat surface portion contacting the flat surface portion; A ball receiver for supporting a sphere having a small radius of curvature inserted between a support hole having a concave spherical surface at the bottom and (c) fixing an outer ring or an inner ring of a bearing having rolling elements therein to an end of the support hole. And fix the inner ring or outer ring to the tip of the support member,
A bearing receiver which is supported in a contact state by using a gap between the rolling element and the inner ring and the outer ring, (d) a cushioning member receiver using a flexible material which absorbs vibration, for example, a durable absorber α-GEL, etc. Various support methods can be used. Further, the support member 4 may be supported by suspending the heat radiation block 1 instead of being inserted into the support hole 5 from below as described above.

A thread is formed at the other end 4b of the support member 4, and the end 4b is fixed to the chassis 8 using a pair of nuts 4a and 4b.
Terminal 6 is fixed. The terminals 6 are provided at a plurality of positions, for example, six positions, for inputting an audio signal from an external device or outputting an audio signal to an external speaker, and for supplying power to the amplifier circuits 20a and 20b.
Here, the terminal 6 is electrically connected to a predetermined terminal portion in the amplifier circuits 20a and 20b of each of the electric circuit boards 2a and 2b by using the conducting wire 7. The conductor 7 preferably has a diameter as small as possible. However, in consideration of the current value to be transmitted and the like, for example, in the case of power supply and audio signal output, a stranded wire using 40 conductors having a diameter of 0.08 mm is used. In the case of inputting an audio signal, a stranded wire using seven conductors having a diameter of 0.08 mm can be used.

In the audio amplifier configured as described above, since the heat radiation block 1 is supported at one point, that is, in a state where the heat radiation block 1 is in contact with a very small area, the vibration is applied from outside to the support member 4 via the chassis 8. , The transmission of vibration from the support member 4 to the heat radiation block 1 can be reduced. The above-described reduction effect is larger as the weight of the heat radiation block 1 is larger and the contact area of the one-point support is smaller.

Further, since the heat radiating block 1 is supported at one point, the vibration mode of the heat radiating block 1 is also simplified, the natural frequency of the heat radiating block 1 can be increased, and the frequency can be set to be higher than the audible frequency band. If possible, heat dissipation block 1
Of the sound quality due to the resonance of the sound can be prevented. Also,
The primary resonance mode of the heat radiation block 1 supported by the above is
Since the heat radiation block 1 is in a rigid body mode in which it vibrates as a rigid body, unnecessary stress is not applied to the electric components 3a and 3b, and if this resonance frequency can be set to an audible frequency band or less, the effect on sound quality is further reduced. Can be reduced.

The support member 4 supports the heat radiating block 1 at one point on the vertical axis passing through the center of gravity G of the heat radiating block 1 and above the center of gravity G, so that the heat radiating block 1 is moved from its original stationary position. Even in the case of displacement, the own weight of the heat radiation block 1 acts in a direction to suppress the displacement, and the heat radiation block 1 can be always stopped at a stable position.

Further, the electric circuit boards 2a and 2b and the terminals 6
Is connected by the above-described small-diameter conductive wire 7, so that an audio signal or the like is input from the outside or output to the outside via the terminal 7 while suppressing the vibration transmitted from the terminal 7 to the heat radiation block 1. can do.

<Modification> FIG. 5 is a side view of an audio amplifier according to a modification. This modified example is an electric circuit board 1
When the electric circuit boards 12a and 12b are single-sided boards and the electric parts 13a and 13b are all surface-mounted parts, as in the above-described embodiment, the electric circuit boards 12a and 12b have convex parts. Although the back surface of the main surface of the electric circuit board 12b does not have a convex portion, the main parts of the electric circuit boards 12a and 12b are used when a lead part is used as a part of the electric parts 13a and 13b or when a double-sided board is used. A convex portion is formed on the back surface of the surface. In this modified example, in order to keep the electric circuit boards 12a, 12b and the heat dissipation block 11 in close contact with each other avoiding such projections, the heat dissipation block 1 has concave portions D1a, D2a,
D1b and D2b are formed.

As shown in FIG. 5, electric components 13a, 13a
In the case where a lead component is used for b, the electric components 13a, 13b
Lead wires project from the back surface of the main surface of each of the electric circuit boards 12a and 12b, and a convex portion is formed on the back surface of the main surface of each of the electric circuit boards 12a and 12b. Therefore, each of the electric circuit boards 12a and 12b and the heat radiation block 11 are not affected by the protrusion.
Are formed in the heat radiation block 11 so as to correspond to the convex portions. Therefore, each of the electric circuit boards 12a, 12b has a larger area without being affected by the convex portions of the electric circuit boards 12a, 12b.
And the heat radiation block 11 can be brought into close contact with each other, and substantially the same effects as in the above embodiment can be obtained. In addition,
Convex part of each electric circuit board 12a, 12b and heat radiation block 1
A resin or the like may be molded between the first concave portions D1a, D2a, D1b, and D2b to enhance the adhesion between the electric circuit boards 12a and 12b and the heat radiation block 11.

In the above embodiments and modified examples, examples of audio amplifiers have been described. However, the present invention is not limited to this, and can be widely applied to, for example, an amplifier that amplifies a low-frequency signal of about 100 kHz or less. Can be. For example, the present invention can be applied to an electronic stethoscope amplifying device and the like in the field of medical equipment.

[0034]

As described above, according to the present invention, two electric circuit boards each having an amplifier circuit mounted thereon, and each of the electric circuit boards having an area equal to or larger than the area of the main surface of each electric circuit board, are substantially identical to each other. A heat-dissipating block having two mounting surfaces formed so as to face each other and to which the electric circuit boards are mounted, and dissipating heat generated from the amplifier circuit.

Therefore, by mounting the main surface of each electric circuit board on the heat-dissipating block having high rigidity, the rigidity of each electric circuit board can be increased and the vibration of each electric circuit board can be suppressed. Therefore, it is possible to suppress unnecessary stress from being applied to the electric component. Further, by mounting the heat radiating block on each electric circuit board, the vibration of the heat radiating block can be restrained and the damping characteristics can be improved. Further, by integrating each electric circuit board and the heat radiating block, even if they vibrate, they vibrate together, and the occurrence of relative vibration can be prevented. Further, the amplifier circuits of each electric circuit board can be set to the same temperature environment, and the electric characteristics of each channel can be approximated. As a result, mechanical vibration in each amplifier circuit is suppressed, unnecessary modulation of the signal is prevented, and a reproduced sound closer to the original sound can be realized.

Further, the mounting surfaces of the heat radiating blocks are formed to face each other, and the electric circuit boards are mounted on the mounting surfaces so as to face each other. The vibration direction of the electric circuit board and the vibration direction of the other electric circuit board are opposite to each other, and these vibrations cancel each other. Therefore,
Vibration can be prevented from occurring in the heat radiation block provided with each electric circuit board. As a result, unnecessary modulation of the signal amplified by the two amplifier circuits can be prevented by suppressing the mechanical vibration in each amplifier circuit, and a reproduced sound closer to the original sound can be realized.

In the amplifying apparatus, each of the amplifying circuits includes a power amplifying element and a circuit section excluding the power amplifying element and connected to the power amplifying element. The element is mounted on the mounting surface of the heat dissipation block. Therefore, heat generated in the power amplifying element is directly transmitted to the heat radiating block and radiated, so that heat radiating efficiency can be improved. In addition, the power amplifying element is mounted on the heat dissipation block, and each power amplifying element can be set to the same temperature environment, and the electrical characteristics of each channel can be approximated. Mechanical vibrations are also suppressed, thereby preventing unnecessary modulation of signals amplified by the two amplifier circuits and realizing reproduced sound closer to the original sound.

Further, in the amplifying device, substantially the entire back surface of the main surface of each of the electric circuit boards is mounted on the mounting surface of the heat radiation block. Therefore, heat generated in each of the electric circuit boards is directly transmitted to the heat radiating block and radiated, so that heat radiating efficiency can be improved.
Also, since each of the electric circuit boards is mounted on the heat radiating block, the mechanical vibration generated in each of the electric circuit boards is also suppressed, and unnecessary modulation of the signal amplified by the two amplifier circuits is prevented. A close reproduction sound can be realized.

Still further, in the amplifying device, a concave portion corresponding to a convex surface on a back surface of the main surface of each electric circuit board is formed on each mounting surface of the heat radiation block, and a concave surface of the main surface of each electric circuit substrate is formed. Substantially the entire surface of the back surface except for the convex portions is mounted on the mounting surface of the heat radiation block. Therefore, heat generated in each of the electric circuit boards is directly transmitted to the heat radiating block and radiated, so that heat radiating efficiency can be improved. Also, since each of the electric circuit boards is mounted on the heat radiating block, the mechanical vibration generated in each of the electric circuit boards is also suppressed, and unnecessary modulation of the signal amplified by the two amplifier circuits is prevented. A close reproduction sound can be realized.

Further, the amplifying device further includes a support member that abuts and supports one point of the heat dissipation block. Here, the support member preferably supports the heat dissipation block at a point on a vertical axis passing through the center of gravity of the heat dissipation block and above the center of gravity. Therefore, even when the heat dissipating block is displaced from its original stationary position, the weight of the heat dissipating block acts in a direction to suppress the displacement, and the heat dissipating block can be always stopped at a stable position.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a configuration of an audio amplifier according to an embodiment of the present invention.

FIG. 2 is a side view of the audio amplifier of FIG.

FIG. 3 is a circuit diagram showing an amplifier circuit for one channel mounted on the audio amplifier of FIG. 1;

FIG. 4 is a longitudinal sectional view of the audio amplifier of FIG. 1;

FIG. 5 is a side view of an audio amplifier according to a modification.

[Explanation of symbols]

 1, 11: heat dissipating block, 1a, 1b, 11a, 11b: mounting surface, 2a, 2b, 12a, 12b: electric circuit board, 3a, 3b, 13a, 13b: electric component, 4: support member, 4a, 4b ... End of support member, 5: Support hole, 6: Terminal, 7: Conductor, 8: Chassis, 10: Screw, 11a, 11b: Nut, 12: Screw, 20a, 20b: Amplifier circuit, Q9, Q10: Power transistor , G: the center of gravity of the heat radiation block, D1a, D1b, D2a, D2b: recess.

Continued on the front page F-term (reference) 5E322 AA11 AB01 AB07 AB08 EA11 5F036 AA01 BB01 BB08 BC33 5J090 AA02 AA21 AA41 CA02 CA86 CN04 FA07 FA14 FA16 FA20 FN05 GN02 HA08 HA17 HA18 HA19 HA25 HA29 KA02 KA61 QA05A05 MA02 AA21 AA41 CA02 CA86 FA07 FA14 FA16 FA20 GP07 HA08 HA17 HA18 HA19 HA25 HA29 KA02 KA61 KA65 MA02 MA19 QA04 QA05 SA06 TA01 UW07 UW09

Claims (6)

[Claims] 1. An electric circuit board on which an amplifying circuit is mounted, respectively; and an area larger than an area of a main surface of each electric circuit board. Having two mounting surfaces on which the electric circuit board is mounted,
An amplifying device comprising: a heat radiating block that radiates heat generated from the amplifier circuit. 2. Each of the amplifying circuits includes a power amplifying element and a circuit section other than the power amplifying element and connected to the power amplifying element, wherein the power amplifying element is a heat radiation block. 2. The amplifying device according to claim 1, wherein the amplifying device is mounted on a mounting surface. 3. The amplifying device according to claim 1, wherein substantially the entire back surface of the main surface of each of the electric circuit boards is mounted on the mounting surface of the heat radiation block. 4. The mounting surface of the heat radiation block,
A concave portion corresponding to the convex surface of the back surface of the main surface of each electric circuit board is formed, and substantially the entire surface of the main surface of the main surface of each electric circuit board except the convex portion is mounted on the mounting surface of the heat radiation block. The amplification device according to claim 1 or 2, wherein the amplification is performed. 5. The apparatus according to claim 1, further comprising a support member that abuts and supports one point of the heat radiation block.
5. The amplifying device according to any one of claims 4 to 4. 6. The amplifying device according to claim 5, wherein the support member supports the heat dissipation block at a point on a vertical axis passing through the center of gravity of the heat dissipation block and above the center of gravity.