JP2001113363A - Method and device for joining of terminal - Google Patents
Method and device for joining of terminalInfo
- Publication number
- JP2001113363A JP2001113363A JP29735799A JP29735799A JP2001113363A JP 2001113363 A JP2001113363 A JP 2001113363A JP 29735799 A JP29735799 A JP 29735799A JP 29735799 A JP29735799 A JP 29735799A JP 2001113363 A JP2001113363 A JP 2001113363A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- pair
- electrodes
- terminal
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、一対の端子を互い
に電気的に導通するように接合する端子の接合方法およ
びその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal joining method and an apparatus for joining a pair of terminals so as to be electrically connected to each other.
【０００２】[0002]
【従来の技術】例えば、ＦＥＴなどの電子部品の端子を
基板等に設けられた配線用の端子に接合するために、ヒ
ュージングといわれる接合方法が用いられている。この
接合方法では、図９に示すように、銅の如き金属で形成
される電子部品の端子２の表面にニッケルの層４がメッ
キにより形成され、また、銅の如き材料で形成される配
線用の端子６の表面に、錫または錫を含む半田の層８が
メッキにより形成される。2. Description of the Related Art For example, in order to join terminals of an electronic component such as an FET to wiring terminals provided on a substrate or the like, a joining method called fusing is used. In this bonding method, as shown in FIG. 9, a nickel layer 4 is formed by plating on the surface of a terminal 2 of an electronic component formed of a metal such as copper, and a wiring layer formed of a material such as copper. A layer 8 of tin or a solder containing tin is formed on the surface of the terminal 6 by plating.
【０００３】これらの端子２および６を接合させる際に
は、端子２および６を互いに当接させ、一対の電極でこ
れらの端子２、６を挟持、加圧する。そして、一対の電
極間に電流を通電すると、前記端子２、６に電流が流
れ、そのジュール熱により層８の錫が溶融する。電流の
通電を停止すると、この錫が固化することによって端子
２と６とが互いに接合される。When the terminals 2 and 6 are joined, the terminals 2 and 6 are brought into contact with each other, and the terminals 2 and 6 are sandwiched and pressed by a pair of electrodes. When a current is applied between the pair of electrodes, a current flows through the terminals 2 and 6, and the tin of the layer 8 is melted by the Joule heat. When the current supply is stopped, the terminals 2 and 6 are joined together by solidification of the tin.
【０００４】[0004]
【発明が解決しようとする課題】ところで、前記の従来
技術に係る接合方法では、ニッケルの層４が金属間化合
物を形成しないため、ニッケルの層４が端子２から剥が
れやすく、接合強度が低下してしまうという問題があ
る。また、ニッケルの層４と端子２との間には熱により
ボイドと呼ばれる極小の泡９が形成されるため、端子２
とニッケルの層４との境界面で破壊が起こりやすくな
り、この場合にも接合強度が低下する。In the bonding method according to the prior art, since the nickel layer 4 does not form an intermetallic compound, the nickel layer 4 is easily peeled off from the terminal 2 and the bonding strength is reduced. Problem. Further, since a very small bubble 9 called a void is formed between the nickel layer 4 and the terminal 2 by heat, the terminal 2
Breakage is likely to occur at the interface between the metal and the nickel layer 4, and in this case also, the bonding strength is reduced.
【０００５】本発明は前記の課題を解決すべくなされた
ものであって、接合強度を向上させることが可能な端子
の接合方法およびその装置を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a terminal bonding method and apparatus capable of improving the bonding strength.
【０００６】[0006]
【課題を解決するための手段】前記の目的を達成するた
めに、本発明は、一対の端子を互いに電気的に導通する
ように接合する端子の接合方法において、銅または銅を
含む材料で形成され、錫または錫を含有する半田がメッ
キされた一対の端子を互いに当接させた状態で一対の電
極により挟持、加圧する工程と、前記一対の電極に電流
を通電し、その端子間の抵抗値を測定する工程と、通電
を開始してから、測定された抵抗値が一旦減少した後、
増加を始めて極大値となる近傍の時点で通電を停止する
工程と、を有することを特徴とする。In order to achieve the above object, the present invention relates to a method of joining a pair of terminals so as to be electrically connected to each other, the method comprising the steps of forming a pair of terminals from copper or a material containing copper. A step of sandwiching and applying pressure between a pair of electrodes in a state where a pair of terminals plated with tin or solder containing tin is brought into contact with each other, and applying a current to the pair of electrodes, thereby forming a resistance between the terminals. After the step of measuring the value and starting energization, the measured resistance value once decreases,
Stopping the energization at a point near the time when the increase starts and reaches a local maximum value.
【０００７】また、本発明は、一対の端子を互いに電気
的に導通するように接合する端子の接合装置において、
銅または銅を含む材料で形成され、錫または錫を含有す
る半田がメッキされた一対の端子を互いに当接させた状
態で挟持、加圧する一対の電極と、前記一対の電極に電
流を通電する電流供給源と、前記一対の端子の間の抵抗
値を測定する抵抗測定手段と、通電を開始してから、測
定された抵抗値が一旦減少した後、増加を始めて極大値
となる近傍の時点で通電を停止する電流制御手段と、を
備えることを特徴とする。The present invention also provides a terminal joining apparatus for joining a pair of terminals so as to be electrically connected to each other.
A pair of electrodes formed of a material containing copper or copper and plated with tin or a solder containing tin in a state where the terminals are brought into contact with each other, and a pair of electrodes to be pressed and a current is applied to the pair of electrodes. A current supply source, a resistance measuring means for measuring a resistance value between the pair of terminals, and a point in time when the measured resistance value once decreases and then starts to increase and reaches a local maximum value after the energization is started. And a current control means for stopping the current supply.
【０００８】本発明によれば、通電を開始すると端子間
にジュール熱が発生し、この熱により端子の表面の錫ま
たは錫を含む半田が溶融し、さらに、端子を構成する銅
が溶融する。この場合、発熱当初において、一方の端子
と他方の端子との間の抵抗値が増加する。通電を継続す
ると、端子が軟化し、加圧力による接触面積の増大に伴
って抵抗値が減少する。端子がさらに加熱されると、温
度上昇に伴って再び抵抗値が急激に増大した後、端子の
溶融により接触抵抗が減少し、その気化熱により端子間
の抵抗値が減少し始める。この時点で通電を停止する
と、一方の端子と他方の端子との間に銅と錫との金属間
化合物が形成され、この金属間化合物によりそれぞれの
端子が互いに強固に接続される。なお、抵抗値が極大値
となる前に通電を停止すると、金属間化合物の形成が不
十分で接合強度が低く、また、抵抗値が極大値となった
後に通電を停止すると、金属間化合物の分解が始まり接
合強度が低下する。According to the present invention, when current is started, Joule heat is generated between the terminals, and the heat melts tin or the tin-containing solder on the surface of the terminal, and further melts copper constituting the terminal. In this case, at the beginning of heat generation, the resistance value between one terminal and the other terminal increases. When the energization is continued, the terminals are softened, and the resistance value decreases as the contact area increases due to the pressing force. When the terminals are further heated, the resistance value sharply increases again as the temperature rises, and then the contact resistance decreases due to the melting of the terminals, and the resistance value between the terminals starts to decrease due to the heat of vaporization. When the power supply is stopped at this time, an intermetallic compound of copper and tin is formed between one terminal and the other terminal, and the terminals are firmly connected to each other by the intermetallic compound. If the current is stopped before the resistance value reaches the maximum value, the formation of the intermetallic compound is insufficient and the bonding strength is low, and if the current is stopped after the resistance value reaches the maximum value, the intermetallic compound is stopped. Decomposition starts and the bonding strength decreases.
【０００９】この場合、前記一対の端子がモリブデンを
含む材料により形成され、該一対の電極により前記一対
の端子を挟持、加圧すると、電極が端子に張り付くこと
を防止することができ、好適である。In this case, the pair of terminals is formed of a material containing molybdenum, and when the pair of terminals are sandwiched and pressed by the pair of electrodes, the electrodes can be prevented from sticking to the terminals. is there.
【００１０】[0010]
【発明の実施の形態】本発明に係る端子の接合方法およ
び装置について、好適な実施の形態を挙げ、添付の図面
を参照しながら以下詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a method and an apparatus for joining terminals according to the present invention will be described in detail below with reference to the accompanying drawings.
【００１１】図１において、参照符号１０は、本実施の
形態に係る端子の接合装置によって接合される端子が設
けられたワークを示す。In FIG. 1, reference numeral 10 denotes a work provided with terminals to be joined by the terminal joining apparatus according to the present embodiment.
【００１２】ワーク１０はケーシング１２を有し、該ケ
ーシング１２の一端側には複数のコネクタ１４が設けら
れる。ケーシング１２の内部には電子部品である複数の
リレー１６、ＦＥＴ１８等が配設される。それぞれのリ
レー１６、ＦＥＴ１８は端子２０を有し、それぞれの端
子２０は略鉛直方向に延在する。端子２０は銅または銅
を含む金属材料で形成され、その表面に錫を含有する半
田２２がメッキされている（図２Ａ参照）。端子２０は
配線用の端子２４に電気的に導通するように接合され
る。配線用の端子２４は銅または銅を含む金属材料で形
成され、その表面に錫２６がメッキされている。端子２
４は、例えば、図示しない基板等に立設され、該基板に
設けられた銅箔のパターンによって回路を構成する。The work 10 has a casing 12, and a plurality of connectors 14 are provided at one end of the casing 12. Inside the casing 12, a plurality of relays 16, FETs 18 and the like, which are electronic components, are arranged. Each relay 16 and FET 18 has a terminal 20, and each terminal 20 extends in a substantially vertical direction. The terminal 20 is formed of copper or a metal material containing copper, and the surface thereof is plated with solder 22 containing tin (see FIG. 2A). The terminal 20 is electrically connected to the wiring terminal 24. The wiring terminals 24 are formed of copper or a metal material containing copper, and tin 26 is plated on the surface thereof. Terminal 2
For example, the circuit board 4 is erected on a substrate (not shown) or the like, and forms a circuit by a copper foil pattern provided on the substrate.
【００１３】次に、前記ワーク１０を製造する本実施の
形態に係る端子の接合装置３０について、図３を参照し
て説明する。Next, a terminal joining apparatus 30 according to the present embodiment for manufacturing the work 10 will be described with reference to FIG.
【００１４】この接合装置３０は、ワーク１０を互いに
直交する３方向（Ｘ、Ｙ、Ｚ方向）に変位させる変位機
構３２と、ワーク１０の端子２０、２４を接合させる接
合機構３４と、接合のための電流を供給する電流供給機
構（電流供給源）３６とを備える。The joining apparatus 30 includes a displacement mechanism 32 for displacing the work 10 in three directions (X, Y, Z directions) orthogonal to each other, a joining mechanism 34 for joining the terminals 20 and 24 of the work 10, and a joining mechanism 34. And a current supply mechanism (current supply source) 36 for supplying a current for the operation.
【００１５】変位機構３２は、Ｘ軸方向に延在するＸ軸
ガイド部材３８を有し、Ｘ軸ガイド部材３８にはガイド
ブロック４０が摺動自在に係合する。Ｘ軸ガイド部材３
８の一端部にはモータ４２が設けられ、該モータ４２の
回転軸には、例えば、送りねじ（図示せず）がＸ軸ガイ
ド部材３８の内部に設けられ、該送りねじの回転作用下
にガイドブロック４０がＸ軸方向に変位する。The displacement mechanism 32 has an X-axis guide member 38 extending in the X-axis direction, and a guide block 40 is slidably engaged with the X-axis guide member 38. X-axis guide member 3
A motor 42 is provided at one end of the motor 8, and a feed screw (not shown) is provided on the rotation shaft of the motor 42 inside the X-axis guide member 38, for example. The guide block 40 is displaced in the X-axis direction.
【００１６】ガイドブロック４０の上部にはＹ軸ガイド
部材４４がＹ軸方向に延在して固着され、Ｙ軸ガイド部
材４４にはガイドブロック４６が摺動自在に係合する。
Ｙ軸ガイド部材４４の一端部にはモータ４８が設けら
れ、ガイドブロック４６はモータ４８の駆動作用下にＹ
軸方向に変位する。A Y-axis guide member 44 is fixed to the upper portion of the guide block 40 so as to extend in the Y-axis direction. A guide block 46 is slidably engaged with the Y-axis guide member 44.
A motor 48 is provided at one end of the Y-axis guide member 44, and the guide block 46
Displaces in the axial direction.
【００１７】ガイドブロック４６にはＺ軸方向（鉛直方
向）に延在して支柱５０が立設され、支柱５０にはガイ
ドブロック５２が摺動自在に係合する。支柱５０の上部
にはモータ５４が設けられ、ガイドブロック５２は該モ
ータ５４の駆動作用下にＺ軸方向に変位する。ガイドブ
ロック５２には水平方向に延在してテーブル５６が固着
され、テーブル５６の上部には前記ワーク１０が位置決
めされる治具５８が設けられる。なお、参照符号６０
は、変位機構３２を制御してテーブル５６を変位させる
コントローラである。A column 50 is erected on the guide block 46 so as to extend in the Z-axis direction (vertical direction), and a guide block 52 is slidably engaged with the column 50. A motor 54 is provided on the upper part of the column 50, and the guide block 52 is displaced in the Z-axis direction under the driving action of the motor 54. A table 56 is fixed to the guide block 52 so as to extend in the horizontal direction, and a jig 58 for positioning the work 10 is provided on the table 56. In addition, reference numeral 60
Is a controller that controls the displacement mechanism 32 to displace the table 56.
【００１８】接合機構３４は支柱６２を有し、支柱６２
の上部は前記変位機構３２のテーブル５６の上方に突出
する凸部６４が形成される。凸部６４の下部には支持部
６６が設けられる。支持部６６の下部には一対の電極ホ
ルダ７４ａ、７４ｂが設けられ、電極ホルダ７４ａ、７
４ｂは支持部６６の側部に設けられたシリンダ６８の駆
動作用下に互いに接近、離間する方向に変位する。該電
極ホルダ７４ａ、７４ｂには、図４に示すように、電流
供給機構３６が接続される。なお、電極ホルダ７４ａ、
７４ｂの抵抗値は十分に小さいものとする。電極ホルダ
７４ａ、７４ｂには電圧計７６の端子が接続され、ま
た、一方の電極ホルダ７４ａには電流測定用のコイル７
８を有する電流計８０が接続される。電圧計７６と電流
計８０との出力は抵抗測定部（抵抗測定手段）８２に入
力される。抵抗測定部８２の出力は電流制御部（電流制
御手段）８３を介して前記電流供給機構３６に接続され
る。The joining mechanism 34 has a column 62, and the column 62
Is formed with a projection 64 projecting above the table 56 of the displacement mechanism 32. A support 66 is provided below the protrusion 64. A pair of electrode holders 74a and 74b are provided below the support portion 66, and the electrode holders 74a and 74b are provided.
4b are displaced in directions approaching and separating from each other under the driving action of a cylinder 68 provided on the side of the support portion 66. As shown in FIG. 4, the current supply mechanism 36 is connected to the electrode holders 74a and 74b. Note that the electrode holder 74a,
The resistance value of 74b is assumed to be sufficiently small. A terminal of a voltmeter 76 is connected to the electrode holders 74a and 74b, and a current measuring coil 7 is connected to one of the electrode holders 74a.
An ammeter 80 with 8 is connected. Outputs of the voltmeter 76 and the ammeter 80 are input to a resistance measuring unit (resistance measuring means) 82. The output of the resistance measurement unit 82 is connected to the current supply mechanism 36 via a current control unit (current control unit) 83.
【００１９】電極ホルダ７４ａ、７４ｂには凹部８４
ａ、８４ｂが形成され、凹部８４ａ、８４ｂには電極８
６ａ、８６ｂに形成された凸部８８ａ、８８ｂが係合す
る。電極８６ａ、８６ｂはタングステンとモリブデンと
により形成される。なお、以下の説明において、電極ホ
ルダ７４ａ、７４ｂと電極８６ａ、８６ｂとの接触抵抗
値をＲ1、電極８６ａ、８６ｂの抵抗値をＲ2とする。The electrode holders 74a and 74b have concave portions 84.
a and 84b are formed, and the concave portions 84a and 84b are
The projections 88a, 88b formed on the 6a, 86b are engaged. The electrodes 86a and 86b are formed of tungsten and molybdenum. In the following description, the electrode holder 74a, 74b and the electrode 86a, R 1 the contact resistance value between 86b, electrodes 86a, the resistance of the 86b and R 2.
【００２０】本実施の形態に係る端子の接合装置３０
は、基本的には以上のように構成されるものであり、次
に、前記接合装置３０の使用方法について、本実施の形
態に係る端子の接合方法との関連で、図５に示すフロー
チャートを参照して説明する。The terminal joining device 30 according to the present embodiment.
Is basically configured as described above. Next, the method of using the bonding device 30 will be described with reference to the flowchart shown in FIG. 5 in relation to the terminal bonding method according to the present embodiment. It will be described with reference to FIG.
【００２１】ワーク１０の端子２０と２４とは、ケーシ
ング１２にリレー１６、ＦＥＴ１８等の電子部品を配置
する際に互いに当接させておく（図１参照）。この状態
でワーク１０が変位機構３２の治具５８に載置される
（図３参照）。The terminals 20 and 24 of the work 10 are brought into contact with each other when electronic components such as the relay 16 and the FET 18 are arranged on the casing 12 (see FIG. 1). In this state, the work 10 is placed on the jig 58 of the displacement mechanism 32 (see FIG. 3).
【００２２】変位機構３２が駆動されてテーブル５６が
Ｘ、Ｙ、Ｚ方向に変位し、端子２０、２４が接合機構３
４の電極８６ａと８６ｂとの間に配置される。When the displacement mechanism 32 is driven, the table 56 is displaced in the X, Y, and Z directions, and the terminals 20 and 24 are connected to the joining mechanism 3.
4 between the electrodes 86a and 86b.
【００２３】以上のような準備工程を経て、シリンダ６
８が駆動されると、電極８６ａ、８６ｂが互いに接近し
て端子２０、２４が挟持、加圧される（ステップＳ
１）。After the above-described preparation steps, the cylinder 6
When the electrode 8 is driven, the electrodes 86a and 86b approach each other, and the terminals 20 and 24 are clamped and pressed (Step S).
1).
【００２４】次に、電流供給機構３６を付勢して電極ホ
ルダ７４ａと７４ｂとの間に４０００〜６６００Ａの電
流Ｉを流す（ステップＳ２）。この電流Ｉは、一方の電
極ホルダ７４ａから電極８６ａ、端子２０、２４、電極
８６ｂを介して他方の電極ホルダ７４ｂに通電される。
このとき、電流計８０のコイル７８には電極ホルダ７４
ａに流れる電流Ｉにより誘導起電力が発生し、この起電
力を測定することにより前記電流Ｉを測定することがで
きる。一方、電圧計７６は電極ホルダ７４ａと７４ｂと
の間の電圧Ｖを測定する。電流計８０によって測定され
た電流Ｉと、電圧計７６によって測定された電圧Ｖとは
抵抗測定部８２に入力され、抵抗測定部８２では電極ホ
ルダ７４ａと７４ｂとの間の抵抗値Ｒ0を、Ｒ0＝Ｖ／Ｉ
として求める。Next, a current I of 4000 to 6600 A flows between the electrode holders 74a and 74b by energizing the current supply mechanism 36 (step S2). This current I flows from one electrode holder 74a to the other electrode holder 74b via the electrode 86a, the terminals 20, 24, and the electrode 86b.
At this time, the electrode holder 74 is attached to the coil 78 of the ammeter 80.
The induced electromotive force is generated by the current I flowing through a, and the current I can be measured by measuring the electromotive force. On the other hand, the voltmeter 76 measures the voltage V between the electrode holders 74a and 74b. The current I measured by the ammeter 80 and the voltage V measured by the voltmeter 76 are input to the resistance measuring unit 82, and the resistance measuring unit 82 calculates the resistance R 0 between the electrode holders 74a and 74b, R 0 = V / I
Asking.
【００２５】この抵抗値Ｒ0は、電極ホルダ７４ａ、７
４ｂと電極８６ａ、８６ｂとの接触抵抗値Ｒ1、Ｒ1と、
電極８６ａ、８６ｂの抵抗値Ｒ2、Ｒ2と、電極８６ａ、
８６ｂと端子２０、２４との接触抵抗値Ｒ3、Ｒ3と、端
子２０、２４のそれぞれの抵抗値Ｒ4、Ｒ4と、端子２０
と２４との接触抵抗値Ｒ5とを含む。ここで、電極ホル
ダ７４ａ、７４ｂと電極８６ａ、８６ｂとの接触抵抗値
Ｒ1、Ｒ1と、電極８６ａ、８６ｂの抵抗値Ｒ2、Ｒ2とは
一定値であり、予め測定しておくことができる。そこ
で、前記抵抗値Ｒからこれらの抵抗値Ｒ1、Ｒ2の差を計
算すると、電極８６ａ、８６ｂと端子２０、２４との接
触抵抗値Ｒ3、Ｒ3と、端子２０、２４のそれぞれの抵抗
値Ｒ4、Ｒ4と、端子２０と２４との接触抵抗値Ｒ5との
和が求められる。The resistance value R 0 depends on the electrode holders 74a, 74a
4b and the contact resistance values R 1 , R 1 between the electrodes 86a, 86b;
The resistance values R 2 , R 2 of the electrodes 86a, 86b and the electrodes 86a,
86b and the contact resistance values R 3 and R 3 between the terminals 20 and 24, the respective resistance values R 4 and R 4 of the terminals 20 and 24, and the terminal 20
To include a contact resistance value R 5 and 24. Here, the contact resistance values R 1 and R 1 between the electrode holders 74 a and 74 b and the electrodes 86 a and 86 b and the resistance values R 2 and R 2 of the electrodes 86 a and 86 b are constant values and must be measured in advance. Can be. Therefore, when the difference between these resistance values R 1 and R 2 is calculated from the resistance value R, the contact resistance values R 3 and R 3 between the electrodes 86 a and 86 b and the terminals 20 and 24, and The sum of the resistance values R 4 and R 4 and the contact resistance value R 5 between the terminals 20 and 24 is obtained.
【００２６】図６は、複数のサンプルである端子２０、
２４についてＮｏ．１〜Ｎｏ．８まで番号を付し、それ
ぞれの端子２０、２４に電流Ｉを通電したときの抵抗値
Ｒ0の変化を示すグラフである。FIG. 6 shows a terminal 20, which is a plurality of samples,
No. 24 for No. 24. 1 to No. 8 is a graph showing a change in the resistance value R 0 when a current I is applied to the terminals 20 and 24, respectively, numbered up to 8.
【００２７】端子２０、２４に電流Ｉが通電されると、
通電開始から略３ｍｓまでの間（領域９０ａ）、温度上
昇に伴って金属の抵抗値Ｒ0が増加する。そこで、この
時点での抵抗値Ｒ0の増加を接合完了と誤検出しないよ
うにするために、通電開始から所定時間（例えば、１０
ｍｓ）経過するのを待つ（ステップＳ３）。When a current I is applied to the terminals 20 and 24,
During approximately 3 ms from the start of energization (region 90a), the resistance value R 0 of the metal increases with an increase in temperature. Therefore, in order to prevent the increase in the resistance value R 0 at this point from being erroneously detected as the completion of joining, a predetermined time (for example, 10
ms), and waits for elapse (step S3).
【００２８】次に、所定時間経過した後、抵抗値Ｒ0を
測定し、抵抗値Ｒ0が増加状態にあるか否かを判断する
（ステップＳ４）。ここで、タングステンとモリブデン
とにより形成された電極８６ａ、８６ｂは、銅または銅
を含む材料により形成された端子２０、２４より抵抗が
大きく、電流Ｉが通電されることにより電極８６ａ、８
６ｂにジュール熱が発生する。この熱は電極８６ａ、８
６ｂから端子２０、２４に伝達されて該端子２０、２４
が軟化する。端子２０、２４は電極８６ａ、８６ｂによ
り加圧されているため、端子２０と２４との接触面にお
いて微少な凹凸等により接触面積が限られていたもの
が、端子２０、２４の軟化によって凹凸等がなくなり、
接触面積が増大する。従って、通電開始から所定時間経
過後の領域９０ｂにおける接触抵抗値Ｒ5は減少し、抵
抗値Ｒ0も減少する。Next, after a predetermined time has elapsed, the resistance value R 0 is measured, and it is determined whether or not the resistance value R 0 is in an increasing state (step S4). Here, the electrodes 86a and 86b formed of tungsten and molybdenum have higher resistance than the terminals 20 and 24 formed of copper or a material containing copper, and the electrodes 86a and 86b are formed by the current I flowing.
Joule heat is generated in 6b. This heat is applied to the electrodes 86a, 8a
6b to the terminals 20, 24, which are transmitted to the terminals 20, 24.
Softens. Since the terminals 20 and 24 are pressurized by the electrodes 86a and 86b, the contact area between the terminals 20 and 24 is limited due to minute unevenness or the like. Disappears,
The contact area increases. Therefore, the contact resistance value R 5 in the area 90b after a predetermined time has elapsed from start of energization decreases, the resistance value R 0 is also reduced.
【００２９】一方、端子２０、２４の温度がさらに高く
なると、端子２０、２４の表面にメッキされた錫および
錫を含む半田が溶融する。次いで、端子２０、２４を形
成する銅または銅を含む材料が溶融する。このため、溶
融した銅と錫とが相互拡散し、端子２０と２４との間に
金属間化合物であるＣｕ3Ｓｎの層９４、９６が形成さ
れ、さらに、層９４と９６との間に金属間化合物である
Ｃｕ6Ｓｎ5の層９８が形成される（図２Ｂ参照）。この
金属間化合物は抵抗値が大きく、従って、層９４、９
６、９８が形成されるのに伴って抵抗値Ｒ0が増加する
（領域９０ｃ）。On the other hand, when the temperatures of the terminals 20 and 24 are further increased, tin plated on the surfaces of the terminals 20 and 24 and the solder containing tin melt. Next, copper or a material containing copper that forms the terminals 20 and 24 is melted. As a result, the molten copper and tin diffuse into each other, and Cu 3 Sn layers 94 and 96 which are intermetallic compounds are formed between the terminals 20 and 24. A layer 98 of Cu 6 Sn 5 , which is an intermetallic compound, is formed (see FIG. 2B). This intermetallic compound has a high resistance, and thus the layers 94, 9
With the formation of 6, 98, the resistance value R 0 increases (region 90c).
【００３０】ステップＳ４において抵抗値Ｒ0の増加を
検出すると、次いで、抵抗値Ｒ0が減少したか否かの判
断を行う（ステップＳ５）。When the increase in the resistance value R 0 is detected in step S4, it is then determined whether or not the resistance value R 0 has decreased (step S5).
【００３１】端子２０、２４では、さらなる発熱作用に
よって銅、錫等の金属が溶融し、接触抵抗が減少する。
従って、抵抗値Ｒ0は極大値Ｐを通過して減少し始める
（領域９０ｄ）。ステップＳ５において抵抗値Ｒ0の減
少を検出すると、電流制御部８３は、電流供給機構３６
による電流Ｉの供給を停止させる（ステップＳ６）。こ
のため、発熱が停止して端子２０、２４の温度が低下
し、溶融して形成された金属化合物の層９４、９６、９
８が固化して端子２０と２４とが互いに接合される。こ
の金属間化合物は堅くて強度が高いという特徴を有し、
また、金属間化合物の層９４、９６、９８は銅と錫とが
混合された状態であり、端子２０、２４を構成する材料
である銅と一体的に形成されている。このため、従来技
術のようにメッキによって端子２０、２４に接合されて
いるものとは異なり、層９４、９６、９８が端子２０、
２４から剥がれる懸念が減少する。従って、端子２０と
２４とは強固に接合される。In the terminals 20 and 24, metals such as copper and tin are melted by a further heat generation action, and the contact resistance is reduced.
Therefore, the resistance value R 0 starts to decrease after passing through the maximum value P (region 90d). When detecting the decrease in the resistance value R 0 in step S5, the current control unit 83 sets the current supply mechanism 36
Is stopped (step S6). For this reason, heat generation stops, the temperature of the terminals 20 and 24 decreases, and the metal compound layers 94, 96 and 9 formed by melting.
8 is solidified and the terminals 20 and 24 are joined to each other. This intermetallic compound is characterized by being hard and having high strength,
The layers 94, 96 and 98 of the intermetallic compound are in a state where copper and tin are mixed, and are formed integrally with copper which is a material forming the terminals 20 and 24. For this reason, unlike the prior art in which the terminals 94 and 96 are joined to the terminals 20 and 24 by plating, the layers 94, 96 and 98
There is less concern for peeling off from 24. Therefore, the terminals 20 and 24 are firmly joined.
【００３２】なお、抵抗値Ｒ0が極大値Ｐとなる前に通
電を停止すると、金属間化合物の形成が不十分で接合強
度が低く、また、抵抗値Ｒ0が極大値Ｐとなった後に通
電を停止すると、金属間化合物の分解が始まり接合強度
が低下する。また、この時点で電流Ｉを停止しないと、
端子２０、２４では溶融した銅、錫等の金属がさらに溶
融して端子２０、２４の形状が著しく変形してしまう懸
念がある。これらの理由から、抵抗値Ｒ0が極大値Ｐを
通過して低下し始めた時点で通電を停止する必要があ
る。If the current supply is stopped before the resistance value R 0 reaches the maximum value P, the formation of the intermetallic compound is insufficient and the bonding strength is low, and after the resistance value R 0 reaches the maximum value P, When the energization is stopped, the decomposition of the intermetallic compound starts, and the bonding strength decreases. Also, if the current I is not stopped at this point,
In the terminals 20 and 24, there is a concern that the molten metals such as copper and tin are further melted and the shapes of the terminals 20 and 24 are significantly deformed. For these reasons, it is necessary to stop energization when the resistance value R 0 starts to decrease after passing through the maximum value P.
【００３３】以上のようにして端子２０と２４とが接合
されると、電極ホルダ７４ａと７４ｂとを互いに離間す
る方向に変位させて端子２０、２４から離間し、該端子
２０、２４の挟持、加圧を停止する。なお、電極８６
ａ、８６ｂはモリブデンを含む材料により形成されてお
り、モリブデンは表面が薄く剥がれやすい性質を有して
いるため、電極８６ａ、８６ｂと端子２０、２４とが張
り付いてしまう懸念はない。When the terminals 20 and 24 are joined as described above, the electrode holders 74a and 74b are displaced in a direction away from each other and separated from the terminals 20 and 24. Stop pressurization. The electrode 86
Since a and 86b are formed of a material containing molybdenum, and molybdenum has a property that its surface is thin and easily peeled off, there is no fear that the electrodes 86a and 86b and the terminals 20 and 24 stick to each other.
【００３４】本実施の形態によれば、一対の端子２０と
２４とは金属間化合物の層９４、９６、９８により互い
に接合される。この金属間化合物は堅くて強度が高いと
いう特徴を有し、また、金属間化合物の層９４、９６、
９８は端子２０、２４と一体的に形成されるため、一対
の端子２０、２４は互いに強固に接合され、接合強度を
向上することができる。また、ニッケルの層を含まない
ため、極小の泡が形成されてしまう懸念がない。According to the present embodiment, the pair of terminals 20 and 24 are joined to each other by the intermetallic compound layers 94, 96 and 98. This intermetallic compound is characterized by being rigid and high in strength, and also has layers 94, 96,
Since the 98 is formed integrally with the terminals 20 and 24, the pair of terminals 20 and 24 are firmly joined to each other, and the joining strength can be improved. Further, since no nickel layer is included, there is no concern that extremely small bubbles are formed.
【００３５】図７、図８に、本実施の形態に係る端子の
接合方法によって接合された端子２０、２４の、接合時
の電流Ｉに対する引き剥がし強度の特性曲線を示す。図
７は、端子２０、２４の厚さが１．２ｍｍの２つの試料
ＴＲＹ−１およびＴＲＹ−２における実験結果を示し、
図８は、端子２０、２４の厚さが０．５ｍｍの場合の実
験結果を示す。7 and 8 show characteristic curves of the peel strength of the terminals 20 and 24 joined by the method of joining terminals according to the present embodiment with respect to the current I at the time of joining. FIG. 7 shows experimental results of two samples TRY-1 and TRY-2 in which the thickness of the terminals 20 and 24 is 1.2 mm,
FIG. 8 shows an experimental result when the thickness of the terminals 20 and 24 is 0.5 mm.
【００３６】これらの特性曲線から理解されるように、
接合時の電流Ｉの増加に伴い、引き剥がし強度も増加す
る。また、端子２０、２４の厚さが薄い程、少ない電流
Ｉで所定の引き剥がし強度を得ることができる。As understood from these characteristic curves,
As the current I at the time of joining increases, the peel strength also increases. Further, as the terminals 20 and 24 are thinner, a predetermined peeling strength can be obtained with a smaller current I.
【００３７】[0037]
【発明の効果】本発明に係る端子の接合方法およびその
装置によれば、以下のような効果ならびに利点が得られ
る。According to the method and the apparatus for bonding terminals according to the present invention, the following effects and advantages can be obtained.
【００３８】銅または銅を含む材料で形成され、錫また
は錫を含有する半田がメッキされた一対の端子を電極に
より挟持、加圧し、該一対の電極間に電流を通電して銅
と錫とを溶融させ、端子の抵抗値が一旦低下してから極
大値となる近傍の時点で通電を停止することにより、一
対の端子の間に溶融した銅と錫により金属間化合物の層
が形成される。この金属間化合物は堅くて強度が高いと
いう特徴を有し、また、金属間化合物の層は端子と一体
的に形成されるため、一対の端子は互いに強固に接合さ
れ、接合強度を向上することができる。A pair of terminals formed of copper or a material containing copper and plated with tin or a solder containing tin are sandwiched between electrodes and pressed, and a current is applied between the pair of electrodes to form copper and tin. Is melted, and the current is stopped at a point near the time when the resistance value of the terminal once decreases to a local maximum value, whereby a layer of an intermetallic compound is formed by the molten copper and tin between the pair of terminals. . This intermetallic compound has the feature of being hard and having high strength. Further, since the layer of the intermetallic compound is formed integrally with the terminal, the pair of terminals is strongly bonded to each other to improve the bonding strength. Can be.
【００３９】さらに、ニッケルの層を含まないため、極
小の泡が形成されてしまう懸念がなく、この泡に起因し
て接合強度が低下することもない。Further, since no nickel layer is included, there is no concern that extremely small bubbles are formed, and the bonding strength does not decrease due to the bubbles.
【図１】本発明の実施の形態に係る端子の接合方法によ
って接合されるワークを示す概略斜視図である。FIG. 1 is a schematic perspective view showing a workpiece joined by a terminal joining method according to an embodiment of the present invention.
【図２】本発明の実施の形態に係る接合方法において接
合される端子の一部拡大概略断面図を示し、図２Ａは、
接合される前の端子の図であり、図２Ｂは、接合された
後の端子の図である。FIG. 2 is a partially enlarged schematic cross-sectional view of a terminal to be joined in the joining method according to the embodiment of the present invention, and FIG.
FIG. 2B is a diagram of the terminal before being joined, and FIG. 2B is a diagram of the terminal after being joined.
【図３】本発明の実施の形態に係る端子の接合装置を示
す概略斜視図である。FIG. 3 is a schematic perspective view showing a terminal joining device according to an embodiment of the present invention.
【図４】図３の接合装置に使用される電極および該電極
によって挟持、加圧される端子を示すブロック図であ
る。FIG. 4 is a block diagram illustrating electrodes used in the bonding apparatus of FIG. 3 and terminals that are sandwiched and pressed by the electrodes.
【図５】本発明の実施の形態に係る端子の接合方法を示
すフローチャートである。FIG. 5 is a flowchart showing a method of joining terminals according to an embodiment of the present invention.
【図６】本発明の実施の形態に係る接合方法によって接
合される端子に電流を通電したときの時間に対する抵抗
値の変化を示すグラフである。FIG. 6 is a graph showing a change in resistance value with respect to time when a current is applied to terminals joined by the joining method according to the embodiment of the present invention.
【図７】本発明の実施の形態に係る接合方法によって接
合される端子（１．２ｍｍ厚さ）の電流に対する引き剥
がし強度を示すグラフである。FIG. 7 is a graph showing a peel strength with respect to a current of a terminal (1.2 mm thick) joined by the joining method according to the embodiment of the present invention.
【図８】本発明の実施の形態に係る接合方法によって接
合される端子（０．５ｍｍ厚さ）の電流に対する引き剥
がし強度を示すグラフである。FIG. 8 is a graph showing a peel strength with respect to a current of a terminal (0.5 mm thickness) joined by the joining method according to the embodiment of the present invention.
【図９】従来技術に係る端子の接合方法において接合さ
れる端子の一部拡大概略断面図である。FIG. 9 is a partially enlarged schematic cross-sectional view of a terminal to be joined in a method for joining terminals according to a conventional technique.
１０…ワーク ２０、２４…端子 ２２…半田 ２６…錫 ３０…接合装置 ３６…電流供給機構 ７４ａ、７４ｂ…電極ホルダ ８２…抵抗測定部 ８６ａ、８６ｂ…電極 ９４、９６、９８…
層DESCRIPTION OF SYMBOLS 10 ... Work 20,24 ... Terminal 22 ... Solder 26 ... Tin 30 ... Joining device 36 ... Current supply mechanism 74a, 74b ... Electrode holder 82 ... Resistance measuring part 86a, 86b ... Electrode 94,96,98 ...
layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｒ 43/02 Ｈ０１Ｒ 43/02 Ａ (72)発明者 石橋 正樹 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 (72)発明者 朝野 豊 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 (72)発明者 斉藤 安久 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 (72)発明者 高井 努 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 (72)発明者 金子 大蔵 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 (72)発明者 東 敏行 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 Ｆターム(参考） 5E051 KA01 KA09 KB06 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification FI FI Theme Court ゛ (Reference) H01R 43/02 H01R 43/02 A (72) Inventor Masaki Ishibashi 1-10-1 Shinsayama, Sayama City, Saitama Prefecture Inside Honda Engineering Co., Ltd. (72) Inventor Yutaka Asano 1-10-1 Shinsayama, Sayama City, Saitama Prefecture Inside Honda Engineering Co., Ltd. (72) Yasuhisa Saito 1-10-1, Shinsayama, Sayama City, Saitama Prefecture Honda Engineer Within Ring Co., Ltd. (72) Inventor Tsutomu Takai 1-10-1 Shinsayama, Sayama City, Saitama Prefecture Inside Honda Engineering Co., Ltd. (72) Inventor Okura 1-10-1 Shinzayama, Sayama City, Saitama Prefecture Honda Engineering Stock In-company (72) Inventor Toshiyuki Higashi 1-10-1 Shinsayama, Sayama-shi, Saitama Honda Engineering Co., Ltd. In-house F-term (reference) 5E051 KA01 KA09 KB06
Claims (4)
に接合する端子の接合方法において、 銅または銅を含む材料で形成され、錫または錫を含有す
る半田がメッキされた一対の端子を互いに当接させた状
態で一対の電極により挟持、加圧する工程と、 前記一対の電極に電流を通電し、その端子間の抵抗値を
測定する工程と、 通電を開始してから、測定された抵抗値が一旦減少した
後、増加を始めて極大値となる近傍の時点で通電を停止
する工程と、 を有することを特徴とする端子の接合方法。1. A method for joining a pair of terminals so as to be electrically connected to each other, comprising: forming a pair of terminals made of copper or a material containing copper and plated with tin or solder containing tin; A step of sandwiching and pressing between a pair of electrodes in a state where they are in contact with each other, a step of applying a current to the pair of electrodes, and measuring a resistance value between the terminals; And c. Stopping the energization at a point near the time when the resistance value once decreases and then starts increasing and reaches a local maximum value.
を特徴とする端子の接合方法。2. The method according to claim 1, wherein the pair of electrodes are made of a material containing molybdenum.
に接合する端子の接合装置において、 銅または銅を含む材料で形成され、錫または錫を含有す
る半田がメッキされた一対の端子を互いに当接させた状
態で挟持、加圧する一対の電極と、 前記一対の電極に電流を通電する電流供給源と、 前記一対の端子の間の抵抗値を測定する抵抗測定手段
と、 通電を開始してから、測定された抵抗値が一旦減少した
後、増加を始めて極大値となる近傍の時点で通電を停止
する電流制御手段と、 を備えることを特徴とする端子の接合装置。3. A terminal joining device for joining a pair of terminals so as to be electrically connected to each other, comprising: a pair of terminals formed of copper or a material containing copper and plated with tin or a solder containing tin. A pair of electrodes that are sandwiched and pressed in a state where they are in contact with each other, a current supply source that supplies a current to the pair of electrodes, a resistance measuring unit that measures a resistance value between the pair of terminals, And a current control means for stopping the energization at a point near the time when the measured resistance value once decreases, then starts increasing and reaches a local maximum value.
を特徴とする端子の接合装置。4. The terminal joining device according to claim 3, wherein the pair of electrodes are made of a material containing molybdenum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29735799A JP3698934B2 (en) | 1999-10-19 | 1999-10-19 | Terminal joining method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29735799A JP3698934B2 (en) | 1999-10-19 | 1999-10-19 | Terminal joining method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001113363A true JP2001113363A (en) | 2001-04-24 |
| JP3698934B2 JP3698934B2 (en) | 2005-09-21 |
Family
ID=17845469
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29735799A Expired - Fee Related JP3698934B2 (en) | 1999-10-19 | 1999-10-19 | Terminal joining method and apparatus |
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| Country | Link |
|---|---|
| JP (1) | JP3698934B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911624B2 (en) * | 2002-08-23 | 2005-06-28 | Micron Technology, Inc. | Component installation, removal, and replacement apparatus and method |
-
1999
- 1999-10-19 JP JP29735799A patent/JP3698934B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911624B2 (en) * | 2002-08-23 | 2005-06-28 | Micron Technology, Inc. | Component installation, removal, and replacement apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3698934B2 (en) | 2005-09-21 |
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