JP2001107282A - Method for holding suspendability of cathode starting sheet in electrolytic refining and molding device for cathode starting sheet for implementing the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for holding the suspendability of cathode starting sheets in electrolytic refining which is capable of assuring always the finest suspendability by taking the differences in the processing adequateness of the cathode starting sheets K for electrolytic refining and is capable of providing the cathode sheets K with ruggedness of a plurality of depths without preparing many metal molds and a molding device for the cathode starting sheets for implementing the method. SOLUTION: The method for holding the suspendability consists in changing the depths of the rugged parts alternately formed on the front and rear surfaces of the cathode starting sheets K according to the characters, such as thicknesses and hardnesses, of the cathode starting sheets K and the molding device for the cathode starting sheets for implementing the method is so constituted that piece members 23a, 23b, 23c, 28a, 28b, 28c, 28d and 28e and liners disposed at the upper mold 20 and lower mold 25 are made respectively exchangeable in order to form the ruggedness on the front and rear surfaces of the cathode starting sheets K to be pressed and that the depths of the rugged parts to be formed on the front and rear surfaces of the cathode starting sheets K may be selected by exchanging the piece members and liners disposed at the upper mold 20 and the lower mold 25 with those of prescribed heights.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for maintaining the suspension of a cathode seed plate in electrolytic refining and a molding apparatus for the cathode seed plate for performing the method, and more particularly, to a cathode seed used for electrolytic refining. The present invention relates to a method for maintaining a suspension of a cathode seed plate for vertically immersing a plate in an electrolytic cell, and a molding apparatus for a cathode seed plate for performing the suspension maintenance method.

[0002]

2. Description of the Related Art First, an outline of an electrolytic refining facility will be described (see FIG. 8). The electrolytic cell 30 is a rectangular parallelepiped tank opened upward, and a common conductor 32 (bus bar) is provided on the upper surface of the long side wall 30c. The electrolytic cell 30 is shown in FIG.
As best shown in FIG. 2, a plurality of tanks are installed adjacently in the vertical and horizontal directions, the total number of which is several hundred tanks.
The electrolytic solution in each electrolytic cell 30 includes a plurality (usually, in the case of Cu,
The cathode seed plate (cathode plate) K and the anode eared type (anode plate) A (about 20 to 50 sheets) are immersed alternately in parallel. Each cathode plate K is suspended from a cathode support rod (crossbar) 34. Both ends of the cathode support rod 34 and ears of the anode plate A are connected to the upper surface of one of the left and right electrolytic cell side walls 30c and the other electrolytic cell side wall 3c.
0c are supported by the common conductors 32 provided for the respective conductors.

In the Walker-type current supply system shown in FIG. 7, a total of four electrolytic cells 30 each having two rows and columns are formed as a set so that current flows from all anode plates A to all cathode plates K of each electrolytic cell 30. It is wired to. As a power source for electrolytic refining, a thyristor-type or diode-type semiconductor rectifier is used because it requires a low voltage and a large current, and has a large capacity and can adjust a wide range of voltage according to the conditions of the electrolytic operation. .

Factors hindering the normal operation in such electrolytic refining include generation of resinous crystals and bumps on the cathode surface, curvature of the cathode, bridging by large anode fragments, and the like. The cathode plate K is approximately 1 m × 1 m in length and width and approximately 0.6 to 0.8 mm in width, which makes it very difficult to maintain flatness and easily curve. The anode plates A are arranged in the electrolytic cell 30 at intervals of about 100 mm, and the cathode plate K is immersed in a state in which the cathode plate K is very close to the gap between the anodes A. If the cathode plate K is not suspended vertically in the inside 30, the cathode plate K may come into contact with the anode plate A to cause a short circuit. When a short circuit occurs, the electrolytic current concentrates on the short-circuit portion, so that normal electrolytic refining is hindered. Therefore,
The cathode plate K and the anode plate A are required to be suspended vertically in the electrolytic cell 30 so as not to contact each other. Therefore, conventionally, as shown in FIG. 6, the cathode plate K is pressed by a pressing machine to form irregularities on the front and back surfaces of the cathode plate K, and when the cathode plate K is immersed in the electrolytic cell 30, the cathode plate K is suspended vertically. Ensuring that the suspension could be lowered was performed.

[0005]

However, conventionally, it has been thought that if the surface of the cathode plate K is provided with irregularities on the front and back surfaces, the suspension property is improved. Irrespective of this, the same concavities and convexities were always provided by the same mold and used for electrolytic refining. However, in practice, there was a difference in the suspension from one production lot of the cathode plate K to the other, and it was found that the best suspension could not always be ensured. The reason is that the cathode plate K
It is considered that the processing suitability of the cathode plate K is different depending on the difference in the thickness, the content of the contained impurities and the content ratio thereof. For this reason, it is conceivable to provide irregularities of different sizes according to the characteristics of the cathode plate K, but there is a problem in terms of cost in preparing dies of the required size.

Accordingly, the present invention provides a method of maintaining the suspension of a cathode seed plate in electrolytic refining, which can always ensure the best suspension while taking into account such differences in the processing suitability of the cathode plate K, and its method. It is an object of the present invention to provide an apparatus for molding a cathode seed plate for performing the method.

Another object of the present invention is to provide a cathode seed plate for carrying out a method for maintaining the suspension of a cathode seed plate in electrolytic refining, in which irregularities having a plurality of depths can be provided without preparing a large number of molds. An object is to provide a molding device.

[0008]

In order to solve the above-mentioned problems, the present invention according to claim 1 provides a cathode seed plate for vertically immersing a cathode seed plate used for electrolytic refining in an electrolytic cell. Wherein the depth of the concave and convex portions formed on the front and back surfaces of the cathode seed plate is changed according to characteristics such as the thickness and hardness of the cathode seed plate. To provide a suspension method.

According to a second aspect of the present invention, there is provided a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the first aspect of the present invention. The depth of the unevenness is 2 mm to 4 mm, and one of them is selected depending on characteristics such as the thickness and hardness of the cathode seed plate.

According to a third aspect of the present invention, there is provided a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the first or second aspect. The concavo-convex portion is formed of an inverted U-shaped portion formed in the center of the cathode seed plate, and an approximately U-shaped portion formed continuously in the outward direction so as to surround the U-shaped portion. And a U-shaped portion having a U-shape.

According to a fourth aspect of the present invention, there is provided a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to any one of the first to third aspects. In the apparatus for molding a cathode seed plate, the cathode seed plate is formed by press working, and piece members provided on an upper mold and a lower mold to form irregularities on the front and back surfaces of the cathode seed plate, respectively. The depth of the concave and convex portions formed on the front and back surfaces of the cathode seed plate can be selected by replacing the piece members provided in the upper mold and the lower mold with those having a predetermined thickness. It is characterized by comprising.

According to a fifth aspect of the present invention, there is provided an apparatus for molding a cathode seed plate according to the fourth aspect of the present invention, wherein the lower die and the piece are disposed between the upper die and the piece member. Between the member, has the same shape as the piece member, 0.1 ~
It is characterized in that the depth of the concave and convex portions formed on the front and back surfaces of the cathode seed plate can be adjusted by sandwiching a liner formed to a thickness of 0.4 mm.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the present invention and a molding apparatus for a cathode seed plate for performing the method will be described in detail based on the illustrated preferred embodiments. explain. FIG. 1 is a flowchart of a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the present invention. The method for maintaining the suspension of the cathode seed plate in the electrolytic refining according to the present invention, first, for the manufactured cathode plate K, by inspecting the thickness and the content of the contained impurities and the content ratio thereof for each production lot, Cathode plate K
Confirm the processing suitability (S1).

Here, the concave and convex portions formed on the front and back surfaces of the cathode plate K are, as shown in FIG. 6, an inverted U-shaped inverted portion 41 located at the center of the cathode plate K, It consists of U-shaped portions 41 and 42 which are continuously formed in the outward direction so as to surround the inverted U-shaped portion 41, and have a U-shape.
The convex portions and concave portions are provided alternately and continuously. In the present embodiment, the depth of the inverted U-shaped portion 41 and the U-shaped portions 42 and 43 formed on the front and back surfaces of the cathode plate K is 2 m, respectively.
It is selected at intervals of 0.1 mm between m and 4 mm.

As a result of the workability inspection of the cathode plate K, generally, for example, when the thickness of the cathode plate K is large (about 0.8 mm) or when the hardness is high, the cathode plate K is formed on the front and back surfaces of the cathode plate K. 3mm or more is selected as the depth of
Conversely, when the thickness of the cathode plate K is small (about 0.6 mm) or when the hardness is low, the depth of the unevenness is selected to be 3 mm or less. If the thickness or hardness is average, 3 mm is selected as the depth of the unevenness (S2). However, the processing suitability of the cathode plate K is expressed by a combination of various conditions such as thickness and hardness, and differs for each lot of the cathode plate K. It is necessary to keep.

Then, when the depth of the unevenness is selected, an uneven portion is formed on the front and back surfaces of the cathode plate K based on the selected depth of the unevenness (S3), and is subjected to electrolytic refining (S4).

Next, an apparatus for forming a cathode seed plate for performing the method for maintaining the suspension of the cathode seed plate in electrolytic refining according to the present invention will be described. FIG. 2 is a front view of an embodiment of the apparatus for molding a cathode seed plate according to the present invention. The molding device 10 has a left and right cylindrical columns 13, 13 erected on a pedestal 19, and bridges the upper ends of the left and right columns 13, 13. It is configured. The right and left ends of the columns 13 are formed in a cylindrical shape, and the columns 13, 13 are provided inside the cylinder.
Is mounted so as to be able to ascend and descend by a hydraulic cylinder 15 arranged at the center of the lower side of the beam 11. Moving frame 1
An upper mold 20 for forming irregularities on the cathode plate K is detachably attached to the lower side of the base 7.

On the other hand, a lower mold 25 is removably mounted on a lower mold stand 19a disposed below the upper mold 20, and is arranged at a position facing the upper mold 20. When the moving frame 17 is lowered by the hydraulic cylinder 15, the upper mold 20
The cathode plate K arranged between the lower die 25 and the lower die 25 is pressed to form irregularities on the front and back surfaces.

The upper mold 20 is, as shown in FIG.
Piece members 23a, 23b and 23c for forming irregularities on the surface of the cathode plate K are screwed on screws 24 on a steel seat plate 21 having a length and width substantially equal to the size of the cathode plate K. (See FIG. 5). The piece members 23a, 23b, and 23c are replaceable. The piece member 23a in the present embodiment has a U-shape having a width of about 70 mm,
The b and the piece member 23c have a U-shape with a width of about 50 mm. Note that in FIG. 3, all the screws 24 are not denoted by reference numerals for the sake of simplicity, but the screws 24 are arranged at appropriate places where the piece members 23a, 23b, and 23c do not fall off. A screw hole 24a is formed in the seat plate 21.

Three kinds of piece members 23a, 23b and 23c are prepared such that the heights h from the seat plate 21 when attached to the seat plate 21 are 2 mm, 3 mm and 4 mm, respectively. The processing suitability of the cathode plate K varies depending on the difference in the thickness of the cathode plate K, the content of the contained impurities, the content ratio thereof, and the like, so that unevenness most suitable for the characteristics is formed.

The upper mold 20 and the piece members 23a, 23b,
Between 23c, it has the same shape as the piece members 23a, 23b, 23c, and the thickness thereof is 0.1 mm,
By sandwiching liners (not shown) of 0.2 mm, 0.3 mm, and 0.4 mm, the depth of the uneven portions formed on the front and back surfaces of the cathode plate K can be adjusted in units of 0.1 mm. If a liner is used in combination, irregularities of 0.5 mm to 1.0 mm can be formed at 0.1 mm intervals. SS, preferably SUS, is used as the material of the liner.

Generally, for example, when the thickness of the cathode plate K is large (about 0.8 mm) or when the hardness is high, 3
When the thickness of the cathode plate K is small (about 0.6 mm) or when the hardness is low, the piece members 23a, 23b of less than 3 mm , 23c or a liner. When the thickness or hardness is average, 3 mm piece members 23a, 23b and 23c are used. However, since the processing suitability such as the thickness and hardness of the cathode plate K is different for each production lot of the cathode plate K, the piece members 23a, 23b, 23c suitable for the suitability are different.
And a liner are selected.

The lower mold 25 has the same structure as the upper mold 20. The lower mold 25 is provided with a cathode plate K on a steel seat plate 26 having the same length and width as the cathode plate K. Piece members 28a, 28 for forming irregularities on the front and back surfaces
b, 28c, 28d, and 28e are screwed with screws 24 (see FIG. 4A). And each piece member 28
a, 28b, 28c, 28d, and 28e are also replaceable. Piece members 28a, 28b, 28c,
28d and 28e are the piece members 2 attached to the upper mold 20.
It is shaped to fit into the recess formed by 3a, 23b, 23c. On both sides of the piece member 28e, a ribbon mounting portion 35 in which ribbons 40, 40 for connecting the cathode support rod 34 and the cathode plate K are located is formed. Note that the screw 2 is shown in FIG.
Although reference numerals are not given to all of the four, screws 24 are arranged at appropriate places where the piece members 28a, 28b, 28c, 28d, 28e do not fall off. Seat plate 2
6 is provided with a screw hole (not shown).

Piece members 28a, 28b, 28c, 28
Similarly to the piece members 23a, 23b, and 23c, d and 28e have a height h from the seat plate 26 when attached to the seat plate 26.
Are 2 mm, 3 mm, and 4 mm, respectively. Then, together with the piece members 23a, 23b, and 23c attached to the upper mold 20, a member having a height h is selected as appropriate.

The lower mold 25 and the piece members 28a, 28b,
Piece members 28a, 28b, 28c, 28d, 28, 28c, 28d, 28e
e, and has a thickness of 0.1
mm, 0.2 mm, 0.3 mm, 0.4 mm, by sandwiching a liner (not shown), the depth of the concave and convex portions formed on the front and back surfaces of the cathode plate K can be adjusted in units of 0.1 mm. I have.

Next, the operation of the molding apparatus 10 according to the present invention will be described. First, after confirming the processing suitability of each cathode plate K, the depth of the predetermined inverted U-shaped portion 41 and the U-shaped portions 42 and 43 is determined. The three kinds of piece members 23a, 23b, and 23c whose height h from the seat plate 21 is 2 mm, 3 mm, and 4 mm and the height is 0.1 mm
A liner for adjusting at intervals is selected so as to have a determined depth, and screwed to the screw 24 on the upper mold 20. Similarly, the piece members 28a, 28b, 28c, 28d, 2d corresponding to the selected piece members 23a, 23b, 23c
8e and the liner are attached to the lower mold 25.

Then, the upper mold 20 is attached to the lower side of the moving frame 17, while the lower mold 25 is placed on the lower mold stand 19a. A cathode plate K between the upper mold 20 and the lower mold 25;
Is inserted into the moving frame 1 by the hydraulic cylinder 15.
7 is lowered, and the cathode plate K is pressed. Thereby, a cathode plate K having irregularities of a desired size can be manufactured.

[0028]

According to the method for maintaining the suspension of the cathode seed plate in the electrolytic refining according to the present invention, the depth of the concave and convex portions alternately formed on the front and back surfaces of the cathode seed plate is determined by the thickness and hardness of the cathode seed plate. Therefore, there is an effect that the suspension of the cathode seed plate in the electrolytic refining can always be kept in the best condition.

According to the apparatus for forming a cathode seed plate for carrying out the method for maintaining the suspension of the cathode seed plate in the electrolytic refining according to the present invention, the upper die and the upper mold are used to form irregularities on the front and back surfaces of the cathode seed plate. The piece member and the liner arranged on the lower mold are exchangeable, and the piece and the liner arranged on the upper mold and the lower mold are exchanged for those having a predetermined height. Since it is configured so that the depth of the uneven portion formed on the front and back surfaces can be selected, it is possible to provide unevenness of a plurality of depths without preparing many molds, There is an effect that such cost can be suppressed.

[Brief description of the drawings]

FIG. 1 is a flowchart of a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the present invention.

FIG. 2 is a front view showing an embodiment of an apparatus for forming a cathode seed plate for carrying out a method for maintaining the suspension of a cathode seed plate in electrolytic refining according to the present invention.

FIG. 3A is a plan view showing an upper mold and a piece member;
(B) is a sectional view taken along line AA of (a).

FIG. 4A is a plan view showing a lower mold and a piece member,
(B) is a sectional view taken along line BB of (a).

FIG. 5 is an exploded perspective view showing a relationship between an upper mold and a piece member.

FIG. 6 is a front view showing irregularities formed on the cathode plate.

FIG. 7 is a schematic diagram for explaining a method of supplying power to an electrolytic cell.

FIG. 8 is a perspective view of a power supply unit for an anode plate and a cathode plate in electrolytic refining.

[Explanation of symbols]

 Reference Signs List A Anode plate K Cathode plate 10 Molding device 11 Beam 13 Support 15 Hydraulic cylinder 17 Moving frame 19 Pedestal 19a Lower mold base 20 Upper mold 21 Seat plate 23a Piece member 23b Piece member 23c Piece member 24 Screw 24a Screw hole 25 Lower metal Mold 26 Seat plate 28a Piece member 28b Piece member 28c Piece member 28d Piece member 28e Piece member 34 Cathode support rod 35 Ribbon attachment part 40 Ribbon 41 Inverted U-shaped part 42 Piece member 43 Piece member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akira Ueno 3382-3 Seki, Saganoseki-machi, Sakaseki-cho, Oita Pref. Nippon Mining & Metals Co., Ltd. Saganoseki Smelter & Refinery (72) Inventor Yasukatsu Sasaki Sagaseki, Oita Pref. No. 3382, Seki 3 of the town, Nippon Mining & Metals Co., Ltd. F-term in the Saganoseki Smelter & Refinery (reference) 4K058 BA21 BB03 EB01 EB13 FA08

Claims (5)

[Claims] 1. A method for maintaining the suspension of a cathode seed plate for vertically immersing a cathode seed plate used for electrolytic refining in an electrolytic cell, comprising the steps of: A method for maintaining the suspension of a cathode seed plate in electrolytic refining, wherein the thickness of the cathode seed plate is changed according to characteristics such as the thickness and hardness of the cathode seed plate. 2. The method for maintaining the suspension of a cathode seed plate in electrolytic refining according to claim 1, wherein the depth of the unevenness formed on the front and back surfaces of the cathode seed plate is 2 mm.
A method for maintaining the suspension of a cathode seed plate in electrolytic refining, wherein any one of them is selected according to characteristics such as thickness and hardness of the cathode seed plate. 3. The method for maintaining the suspension of a cathode seed plate in electrolytic refining according to claim 1 or 2, wherein the concave and convex portions formed on the front and back surfaces of the cathode seed plate are formed at the center of the cathode seed plate. And a substantially U-shaped U-shaped portion continuously formed in an outward direction so as to surround the U-shaped portion. A method for maintaining the suspension of a cathode seed plate in electrolytic refining. 4. A cathode seed plate forming apparatus for performing the method for maintaining the suspension of a cathode seed plate in electrolytic refining according to any one of claims 1 to 3, wherein the cathode seed plate is formed by press working. In addition to being molded, the piece members provided on the upper mold and the lower mold to form irregularities on the front and back surfaces of the cathode seed plate are respectively replaceable, and are arranged on the upper mold and the lower mold. The cathode seed is characterized in that it is configured such that the depth of the concave and convex portions formed on the front and back surfaces of the cathode seed plate can be selected by replacing the provided piece member with one having a predetermined thickness. Plate molding equipment. 5. The apparatus for molding a cathode seed plate according to claim 4, wherein the same shape as the piece member is provided between the upper mold and the piece member and between the lower mold and the piece member. Having a thickness of 0.1 to 0.4 mm sandwiched between the liner is configured to be able to adjust the depth of the uneven portion formed on the front and back of the cathode seed plate Characteristic cathode seed plate molding equipment.