JP2001102769A - Electronic component-mounting structure and cellular telephone - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component-mounting structure having improved assembly property that cannot fall due to shock and vibration, and does not require increase in weight and space, especially mounting structure for a cellular phone, and the cellular telephone. SOLUTION: In speaker-mounting structure for mounting a speaker 10 to a substrate by bringing the terminal of the speaker 10 to a terminal on a substrate 20, a engaging piece 27 that is gear-locked to a gear-lock part 22 of the substrate is provided at a case 3 for accommodating the speaker.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting structure, and more particularly to an electronic component mounting structure for mounting a speaker, a microphone, a vibrator motor and the like on a substrate of a mobile phone, and a mobile phone.

[0002]

2. Description of the Related Art A speaker and a vibrator motor will be described as an example of an electronic component, and a mounting structure to a substrate will be described. FIG. 7 is a perspective view showing a speaker used in a mobile phone or the like. The diaphragm, which is the heart of the speaker 910, is covered by the protector 903 and the outer peripheral portion 904, which are integrated components included in the speaker, and cannot be seen from the outside. Further, the speaker is provided with two spring contacts 905 for electrical conduction. FIG. 8 is a plan view showing a conventional speaker mounting structure for mounting the speaker on a substrate, and FIG.
It is DD sectional drawing in. Referring to FIGS. 8 and 9, locking post 921 is fixed to substrate 920 together with locking post connecting portion 923, and speaker 910 is provided on outer peripheral portion 904 of protector 903, at a locking claw at the end of the locking post. Locked by 922 so as to be pressed from above. FIG. 10 is a plan view showing another speaker mounting structure, and FIG. 11 is a sectional view taken along line EE in FIG. Referring to FIGS. 10 and 11, an elastic body 9 such as silicone rubber is provided inside holding wall 927 fixed to the substrate.
The speaker 910 is press-fitted inside the elastic body 925.

FIGS. 12 to 14 show examples in which a structure in which an electronic component is press-fitted into an elastic body and applied to a vibrator motor of a portable telephone is similar to FIGS. FIG. 12 is a plan view showing a mounting structure in which the vibrator motor 930 is press-fitted into the recess of the elastic body and mounted. FIGS. 13 and 14 are FF in FIG.
It is sectional drawing and GG sectional drawing. 12 to 14, vibrator motor 930 having a weight 931 that generates vibration is attached to holding wall 92 fixed to substrate 920.
Elastic body 925 such as silicone rubber arranged inside 7
It is pushed into the dent and attached. At this time, as shown in FIG. 13, the spring contact 905 comes into contact with a terminal (not shown) provided on the substrate to maintain a conductive state.

According to the structure for mounting a speaker or a vibrator motor on a board shown in FIGS. 8 to 14, it is possible to easily mount the speaker or the vibrator motor on a board or the like.

[0005]

However, FIGS.
When the mounting structure shown in FIG. 14 is employed, when a lateral force such as a drop impact is applied, the locking column 921 or the holding wall 927 may be deformed or damaged, and the speaker 910 or the vibrator motor 930 may come off. Was. Also,
In the press-fitting structure shown in FIGS. 10 to 14, the vertical fixing position of the speaker 910 or the vibrator motor 930 may vary in the assembling work, and the contact load of the spring contact 905 may become unstable.

In order to solve these problems, a mounting structure shown in FIGS. 15 and 16 has been proposed in which the mounting of the electronic components is strengthened. FIG. 15 is a plan view, and FIG. 16 is a sectional view taken along line HH in FIG. Referring to FIGS. 15 and 16, in this electronic component mounting structure, speaker 910 is temporarily fixed to substrate 920 by locking post 921 fixed together with locking post connecting portion 923, and a band-like shape is formed from above protector 903. Pressed down by the fixing part 929. Further, the locking portions 928 provided at both ends of the band-shaped fixing component 929 are engaged with the locking claws 922 provided at the tip of the locking column 921.

According to the mounting structure shown in FIGS. 15 and 16, the mounting strength is certainly improved and the speaker does not come off, but the following problem arises. In other words, it has been found that this structure is inferior to the conventional one in the assembly line such as a cellular phone or the like in terms of speaker alignment and mounting / engaging work, and is a factor inhibiting the speed of the assembly line. did. Further, the fixing part 929 in this structure causes an increase in weight, and further requires a space corresponding to the thickness of the fixing part 929.
For a mobile phone or the like pursuing a reduction in weight and size, it is necessary to minimize the increase in weight and space.

Accordingly, an object of the present invention is to provide an electronic component mounting structure which does not easily fall off due to shock or vibration and which does not require an increase in weight and space and has good assemblability. An object of the present invention is to provide an electronic component mounting structure for mounting a microphone, a vibrator motor, and the like, and a mobile phone.

[0009]

According to a first aspect of the present invention, there is provided a structure for mounting an electronic component on a substrate by bringing a terminal of the electronic component into contact with a terminal provided on the substrate on which the component is mounted. An engagement piece that engages with the engagement portion of the substrate is provided in a case that accommodates the component.

In this structure, the locking piece is provided on the case of the electronic component and engages with the locking portion provided on the substrate, so that the positioning can be easily performed and the assembling property can be improved. it can. Further, since the locking piece is provided on the case of the electronic component, if the locking piece is formed firmly on the case, the attachment to the substrate can be made strong. Further, since the locking piece is formed in the case of the electronic component, the number of components is not increased, and the manufacturing cost can be reduced. In addition, space is not required, and weight reduction is further facilitated. The case of the electronic component may or may not be integrated with the electronic component. When not integrated, it is desirable that the electronic component be held in a housing recess or the like so as to take a fixed position in the case. Further, the locking portion provided on the substrate may be any type as long as it engages with the above-mentioned locking piece. The mobile phone according to claim 10 is
The electronic component is attached to the substrate by bringing the terminal of the electronic component into contact with the terminal provided on the substrate included in the housing of the mobile phone. The electronic component mounting structure according to claim 1 is provided. For this reason, the effect of the electronic component mounting structure of claim 1 can be obtained.

In the electronic component mounting structure according to the present invention, in the above electronic component mounting structure, the locking piece is provided on the board side along the outer surface of the case accommodating the electronic component from the top wall of the electronic component case. Extending.

According to this structure, the locking piece extends from the top wall of the case of the electronic component, so that the electronic component can be securely attached to the substrate so as to cover the ceiling. Further, since the locking portion extends to the substrate side along the outer surface of the case for housing the electronic component, it can be mounted in a small space when viewed in plan.

According to a third aspect of the present invention, in the above-mentioned electronic component mounting structure, the locking portion is provided on a locking column formed on the substrate so as to surround the electronic component housed in the case. .

With this structure, the locking piece does not have to be formed to be elongated, and the length extending from the case is suppressed to improve the handleability, and the size of the material for manufacturing the case including the locking piece is also increased. Can be reduced. Further, since the locking pillar extends from the substrate side, the posture of the electronic component is made parallel to the substrate with a rubber cushion or the like described below between the bottom of the electronic component and the substrate, thereby further increasing the mounting strength. be able to.

According to a fourth aspect of the present invention, in the above-mentioned electronic component mounting structure, the locking piece is formed so as to hold the locking column from outside.

[0016] With the above structure, the locking piece can be easily positioned so as to surround the locking column and the locking piece can be pushed in, so that the assemblability can be improved and the speed in the assembly line can be increased. Further, the locking piece is pushed into the substrate side with the locking portion of the board inside, so that the tip of the locking piece can be bent outward. As a result, it is possible to easily grasp the portion bent outward of the tip of the locking piece and release the engagement with the locking portion.

According to a fifth aspect of the present invention, in the above-mentioned electronic component mounting structure, the case and the locking piece of the electronic component are formed of a metal plate.

Since a metal plate having elasticity is used for the case and the locking piece of the electronic component, it has a sufficient restoring force even if it is thin. Therefore, as the electronic component is pressed against the substrate, the electronic component deforms along the shape of the locking portion provided on the substrate and engages with the locking claw or the like. I do. Therefore, the engagement can be easily performed even at a relatively large pressing distance, and a strong mounting structure can be realized. Further, since the engagement can be performed easily, it is unlikely that the alignment performed once is shifted. As a result, the assembly operation can be performed smoothly, and the speed of the assembly line can be prevented. Also, since the case and the locking piece of this electronic component are made of a metal plate,
Since the thickness is small, it is possible to reduce the electronic component mounting dimensions and the entire device. In addition, since the above-described mounting structure engages the locking piece provided on the case with the locking portion of the board,
Even when used for a long time, it is possible to maintain a firm and stable attachment without shifting. 0.2m above metal plate
It is desirable to have a thickness of not more than m. 0.2mm
A metal plate having the following thickness has sufficient elasticity and can improve assemblability. And conventional 0.7-0.8mm
Substantial reduction in size and weight can be promoted in place of the fixed parts that have been used. On the other hand, if it exceeds 0.2 mm, the rigidity is too high, and it becomes rather difficult to perform the engagement simply. Note that a thin steel plate, a stainless steel plate, a surface-treated thin steel plate, or the like can be used as the metal plate.

In the electronic component mounting structure according to the present invention, at least one of the locking pieces is disposed between the two terminals of the electronic component, and the locking portion is formed of the two terminals provided on the substrate. It is located between and engages with a locking piece disposed between two terminals of the electronic component.

According to this structure, the positioning of the terminals can be performed accurately and easily.
The assemblability of the motor and the like can be improved. In an electronic component such as a motor, the locking piece is sandwiched between the terminals, so that in addition to the above-described effects, a more robust attachment can be realized. The mounting of such a structure is particularly important for a motor that constantly generates vibrations in order to prevent displacement and rattling.

According to a seventh aspect of the present invention, in the above-described electronic component mounting structure, the electronic component is mounted on the substrate at a bottom portion of the electronic component and the electronic component is removed from the substrate when the electronic component is mounted on the substrate. The elastic body further includes an elastic body that is pushed back in a direction away from the elastic body.

In the case of an electronic component that is not so large as compared to the size of the terminal, the electronic component can be stably mounted against an impact or the like only by the elastic force of the terminal. However, it is not sufficient to use only a terminal provided with an elastic means. That is, the terminal is usually provided at the end of the electronic component. However, as the electronic component becomes larger, the elastic terminal side becomes higher and tilts. For this reason, stable mounting cannot be performed, and vibration noise is generated in response to an impact or the like. As a countermeasure against this, if an elastic body such as a cushion is placed between the electronic component and the board as described above, the electronic component can be mounted on the board in a stable posture, so that not only can a strong mounting be ensured, but also the assembly property Can also be improved. As a result, the electronic component can be firmly attached, and it is possible to avoid a situation in which the electronic component emits a vibration sound in response to vibration or impact.

In the electronic component mounting structure according to the present invention, in the electronic component mounting structure, the electronic component is a speaker or a microphone, and the top wall of the case uses a protector for a component included in the speaker or the microphone. .

Therefore, similarly to the electronic component mounting structure according to the first aspect, the effects of reducing the size, weight, and manufacturing cost can be obtained. In addition, in the case of the protector, since the ceiling of the speaker or the microphone is covered, even if the protector and other speaker parts are separated in a state where the electronic components are taken out, a pressing force is applied to the protector in the direction of the board to press the protector. If integrated in a state, stable mounting of electronic components can be ensured. Therefore, steps such as bonding other parts of the speaker to the protector can be omitted.

According to a ninth aspect of the present invention, in the above electronic component mounting structure, the electronic component is a vibrator motor, and the top wall of the case uses a top plate of a vibrator motor case. Also in this case, since the locking pieces provided on the top plate engage with the locking portions of the substrate, a firm attachment is realized. In the case of a motor, since vibration is generated by rotation, there is always a possibility that the mounting position of an electronic component is shifted, so that the structure for pressing the top plate of the case as described above is particularly useful. Therefore, in a vibrator motor in which a weight is added to a motor like a mobile phone, vibration propagates to the entire mobile phone, and thus such a rigid mounting structure ensures that electronic components do not fall off stably for a long time. It can be used.

[0026]

Next, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view showing a state in which a speaker pressing portion is mounted on a speaker in an electronic component mounting structure according to Embodiment 1. In FIG. 1, a protector 3, which is a part of a speaker case, includes a central portion having a hole on an upper surface, an outer peripheral portion 4, a locking piece 27 and a guide piece 29, and is integrally formed of a 0.15 mm thick stainless steel thin plate. It is manufactured by. Locking piece 2
Reference numeral 7 protrudes further outward from the peripheral edge of the disk-shaped sound generating portion of the speaker 10 and is bent toward the substrate. The locking piece 27 has an engagement hole 28 with which a locking claw provided at the tip of the locking column engages. The peripheral portion of the disk-shaped sound generating portion is held by a guide piece 29. The two terminals 5 of the speaker are spring contacts, and are provided at the ends of terminal protruding portions 6 which protrude separately from the disk-shaped sound generating portion. The locking piece 27 of the protector 3 is arranged so as to be sandwiched between the two terminal protrusions.

FIG. 2 is a plan view showing a state where the electronic component is mounted on the substrate. However, the locking struts provided on the substrate side are not shown. FIG. 3 is a sectional view taken along the line AA shown in FIG. 2 and 3, a portion further provided at the tip of the locking piece 27 disposed between the two terminals of the speaker is provided with a detaching piece 31 provided to facilitate removal of the speaker pressing portion. It is. The protector 3, which is a part of the case, covers the entire ceiling of the speaker and applies a planar pressing force to the speaker 10 in the direction of the substrate 20.
In the locking hole 28 opened in the locking piece 27 of the protector 3,
The locking claw 22 at the distal end of the locking column 21 fixed to the substrate 20 is engaged with the locking column connecting portion 23. The holding force of this engagement is maintained by the elasticity of the spring contact and the elasticity of the rubber cushion 25 arranged between the speaker bottom 36 and the locking column connecting portion 23. Note that the speaker 1
The diaphragm 30 and the diaphragm fixing spacer 35 which are the components of No. 0 are covered by the protector 3 and cannot be seen from the outside.

The above-described speaker mounting structure is such that the protector, which is a component integrated with the speaker, which is a speaker case, is enlarged to provide the locking pieces 27 and the guide pieces 29, and to engage the locking posts formed on the substrate. It is engaged with the stop. For this reason, the alignment between the substrate and the speaker can be easily performed. For this reason, assemblability can be improved. Further, since one of the locking pieces 27 is disposed so as to be sandwiched between the two terminals, the positioning is further facilitated and the assembling property is further improved. Further, the engagement of the locking pieces 27 with the engagement portions 22 can be easily performed due to the elastic force of the metal plate, and the assemblability can be improved. Disappears.

Further, since the entire ceiling of the speaker is pressed down to the substrate side in a planar manner and attached to the substrate, the speaker can be firmly attached to the substrate. Therefore, even if the speaker is used for a long period of time, the position of the speaker is not shifted, and no sound is generated due to vibration or shock.
Furthermore, this mounting structure uses original parts and uses a metal plate having a thickness of 0.15 mm, and occupies a small space. Therefore, miniaturization can be promoted and weight increase can be suppressed. . Further, the number of manufacturing steps and manufacturing costs can be reduced.

(Embodiment 2) FIG. 4 is a plan view showing an electronic component, that is, a vibrator motor mounting structure according to Embodiment 2. FIG. FIG. 5 and FIG. 6 are a BB cross-sectional view and a CC cross-sectional view in FIG. 4, respectively. Referring to FIGS. 4 to 6, top plate 33 of the vibrator motor case covers the entire ceiling of the rotary drive unit, which is the main part, presses against substrate 20, and engages engaging hole 28 of locking piece 27 with locking column. 2
1 is engaged with the locking claw 22 at the distal end. The elastic force for stably holding the engagement is determined by the elastic force of the spring contact 5 provided on the vibrator motor 40 and the vibrator motor 4.
It is given by the elastic force of the rubber cushion 25 arranged between the zero and the substrate 20.

The top plate of the vibrator motor case is formed of a stainless steel plate having a thickness of 0.15 mm. The top plate 33 of the vibrator motor case is a part of the vibrator motor case.

In the above configuration, the entire ceiling of the rotary drive section, which is the main part of the vibrator motor 40, is pressed in a planar manner toward the substrate by the top plate of the vibrator motor case and attached, so that a strong attachment is possible.
In addition, since the metal plate is used for the vibrator pressing part, it can be easily engaged with the locking claw even if the locking piece is pushed deeply, and the grip of the locking piece against the side surface of the locking column is improved. Therefore, it is possible to expect an improvement in assemblability as well as a firm attachment. In the vibrator motor, since the weight 50 is eccentrically attached to the rotating shaft, vibration is generated accompanying rotation. For this reason, it is critical that a strong attachment be maintained over a long period of time. The mounting of the vibrator motor case with the planar pressing of the entire ceiling prevents the vibrator motor from being displaced or rattled even when an impact or the like is applied during such long-term use. The vibrator motor case described above has a plate thickness of 0.
Since the thickness of 15 mm is used, it is effective in saving space and weight, and is very effective as a mobile phone.

Although the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. Not limited. The scope of the present invention is shown by the description of the claims, and further includes all modifications within the meaning and scope equivalent to the description of the claims.

[0035]

According to the electronic component mounting structure of the present invention, the engagement is performed by utilizing the elasticity of the metal plate, so that the assemblability is improved, and the electronic component is easily dropped off by impact or long-term vibration. Therefore, the electronic component can be mounted on the substrate without increasing the weight and the space. In particular, a speaker, a microphone, a vibrator motor, and the like can be easily attached to a substrate in a housing of a mobile phone so as not to be displaced or rattled even when vibration or impact is applied for a long period of time.

[Brief description of the drawings]

FIG. 1 shows a speaker mounting structure according to a first embodiment.
It is a perspective view showing the state where a speaker pressing part was attached to a speaker.

FIG. 2 is a plan view of the speaker mounting structure according to the first embodiment.

FIG. 3 is a sectional view taken along line AA in FIG. 2;

FIG. 4 is a plan view of a vibrator motor mounting structure according to a second embodiment.

FIG. 5 is a sectional view taken along line BB in FIG. 4;

6 is a sectional view taken along the line CC in FIG. 4;

FIG. 7 is a perspective view of a speaker with a spring contact.

FIG. 8 is a plan view showing a conventional speaker mounting structure.

FIG. 9 is a sectional view taken along line DD in FIG. 8;

FIG. 10 is a plan view showing another conventional speaker mounting structure.

11 is a sectional view taken along the line EE in FIG. 10;

FIG. 12 is a plan view showing a conventional vibrator motor mounting structure.

13 is a sectional view taken along line FF in FIG.

14 is a sectional view taken along the line GG in FIG.

FIG. 15 is a plan view showing another conventional speaker mounting structure.

16 is a sectional view taken along line HH in FIG.

[Explanation of symbols]

3 Speaker protector, 4 Protector outer periphery, 5
Terminal, 6 terminal protrusion, 10 speaker, 20 substrate, 21 locking column, 22 locking portion (locking claw), 23
Locking column connecting part, 25 rubber cushion, 27 locking piece, 28 locking hole, 29 guide piece, 30 diaphragm, 3
1 Detachment pieces, 33 vibrator motor case top plate, 35 diaphragm fixing spacer, 40 vibrator motor, 50 weight.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H04R 1/02 102 H04R 1/02 107 107 H04B 7/26 VF term (Reference) 4E360 AB42 EA25 ED14 FA02 FA20 GA28 GB26 5D017 AA11 AD32 AE22 BC03 BC15 5K023 AA07 BB03 BB26 BB27 DD06 HH01 HH05 MM25 PP02 QQ02 5K067 AA33 BB02 EE02 KK17

Claims (10)

[Claims] An electronic component mounting structure for mounting the electronic component on the substrate by bringing a terminal of the electronic component into contact with a terminal provided on a substrate on which the component is mounted; An electronic component mounting structure including a locking piece that engages with a locking portion of a substrate. 2. The electronic device according to claim 1, wherein the locking piece extends from the top wall portion of the case of the electronic component to the board side along an outer surface of the case that accommodates the electronic component. Parts mounting structure. 3. The electronic component mounting according to claim 1, wherein the locking portion is provided on a locking column formed on the substrate so as to surround the electronic component housed in the case. Construction. 4. The electronic component mounting structure according to claim 1, wherein the locking piece is formed so as to hold the locking column from outside. 5. The electronic component case and the locking piece,
The electronic component mounting structure according to claim 1, wherein the electronic component mounting structure is formed from a metal plate. 6. At least one of the locking pieces is disposed between two terminals of the electronic component, and the locking portion is located between two terminals provided on the substrate, The electronic component mounting structure according to claim 1, wherein the electronic component mounting structure engages with the locking piece disposed between two terminals of the electronic component. 7. The electronic device according to claim 1, further comprising: an elastic body located at a bottom side of the electronic component and pushing the electronic component away from the substrate when the electronic component is attached to the substrate. An electronic component mounting structure according to any one of claims 1 to 6. 8. The electronic component mounting structure according to claim 1, wherein the electronic component is a speaker or a microphone, and the top wall of the case is a protector for a component included in the speaker or the microphone. . 9. The electronic component mounting structure according to claim 1, wherein the electronic component is a vibrator motor, and the top wall of the case is a top plate of a vibrator motor case. 10. A mobile phone having an electronic component mounting structure in which a terminal of an electronic component is brought into contact with a terminal provided on a substrate included in a housing of a mobile phone, and the electronic component is mounted on the substrate. A mobile phone, wherein in the electronic component mounting structure, a locking piece that engages with a locking portion of the substrate is provided in a case that accommodates the electronic component.