JP2001102396A5 - - Google Patents
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- Publication number
- JP2001102396A5 JP2001102396A5 JP2000270719A JP2000270719A JP2001102396A5 JP 2001102396 A5 JP2001102396 A5 JP 2001102396A5 JP 2000270719 A JP2000270719 A JP 2000270719A JP 2000270719 A JP2000270719 A JP 2000270719A JP 2001102396 A5 JP2001102396 A5 JP 2001102396A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99810816 | 1999-09-10 | ||
| EP99810816.1 | 1999-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001102396A JP2001102396A (ja) | 2001-04-13 |
| JP2001102396A5 true JP2001102396A5 (bg) | 2007-11-08 |
Family
ID=8243019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000270719A Pending JP2001102396A (ja) | 1999-09-10 | 2000-09-06 | 半導体チップを実装するための方法と装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001102396A (bg) |
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2000
- 2000-09-06 JP JP2000270719A patent/JP2001102396A/ja active Pending