JP2001093768A - Chip capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip capacitor which can prevent break of a lead terminal and a connector terminal caused by vibration, even if vibration is applied to the main body of a capacitor. SOLUTION: A lead terminal 5 exposed from a sealing member 4 and extended vertically is set, in substantially parallel with a bottom 6f of an insulating plate 6, in a slit 7d of a connector terminal 7 provided along the bottom 6f of an insulating plate 6, and the lead lead terminal 7 is connected to the slit 7d being caught in it, so that there is no bent lead terminal as conventionally, thereby this capacitor can prevent break at the bends of these lead terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type capacitor surface-mounted on a printed circuit board or the like, and more particularly to a vertical chip-type capacitor.

[0002]

2. Description of the Related Art Conventionally, as these vertical chip type capacitors, as disclosed in Japanese Patent Application Laid-Open No. Sho 59-211101, etc., they can be made independent by mounting an insulating plate on a capacitor body, and are surface mounted. There are some that can be used. Since these conventional chip capacitors do not need to be subjected to a molding process involving heating and pressurizing, a vertical chip capacitor can be formed without deteriorating the characteristics of the capacitor element, and has high practicality.

[0003]

However, in these conventional vertical chip capacitors, as shown in FIG. 6, in order to make the capacitor 01 self-supporting, it is necessary to extend along the lower surface (mounting surface) of the insulating plate 02. Reel that is bent and arranged
The contact terminals 03 are flattened by crushing or the like to serve as connection electrodes. Since the thinned flat portions are bent, when the vibration is applied to the capacitor 01, the load becomes a lead. There is a problem that the bent portion of the terminal 03 concentrates on the bent portion, and the bent portion is broken to be inoperable.

The present invention has been made in view of such a problem. Even if vibration is applied to the capacitor body, the chip type capacitor can prevent breakage of the lead terminal and the connection terminal due to the vibration. The purpose is to provide.

[0005]

In order to solve the above-mentioned problems, a chip-type capacitor according to the present invention has a capacitor element housed in a bottomed cylindrical outer case, and seals an open end of the outer case. Sealing with a member, a capacitor body in which a lead terminal led out from the capacitor element penetrates the sealing member, and a connection terminal electrically connected to the lead terminal and connected to a mounting board. An insulating plate having along the lower surface thereof and disposed in contact with a sealing end of the capacitor body, wherein the insulating plate has a lead terminal exposed from the sealing member. At least one insertion hole that can be inserted is provided, and a slit extending in a direction substantially parallel to the lower surface of the insulating plate is provided in the connection terminal, and the lead terminal is fitted in the slit. It is characterized by comprising a.
According to this feature, the vertically extending lead terminal exposed from the sealing member is fitted into the slit of the connection terminal provided along the lower surface of the insulating plate in a direction substantially parallel to the lower surface of the insulating plate, and the lead terminal is inserted. By being connected while being held between the slits, there is no bent portion of the lead terminal as in the related art, and it is possible to prevent breakage of the bent portion of these lead terminals even during vibration.

In the chip-type capacitor according to the present invention, at least a slit portion of the connection terminal where the slit is formed is formed of a metal plate that can be elastically deformed, and a separation width of the slit is larger than a diameter of the lead terminal. Preferably, it is formed to be narrow. With this configuration, the lead terminal is inserted while elastically deforming the slit outward, and the lead terminal is more firmly sandwiched by the elastic repulsive force of the slit, so that the reliability of the connection between the lead terminal and the connection terminal is reduced. Performance can be improved.

In the chip type capacitor according to the present invention, it is preferable that the openings of the slits in the connection terminals of the respective poles are formed at positions facing each other in a direction substantially parallel to the lower surface of the insulating plate. With this configuration, when the lead terminals are inserted into the slits, the insertion directions of the lead terminals of the respective poles are opposite to each other, and the lead terminals can be inserted in a state in which displacement such as rotation of the capacitor body is suppressed. Therefore, the fitting can be easily performed.

In the chip type capacitor according to the present invention, the slit portion is formed by bending and arranging the connection terminal in an inward direction of the insertion hole, and the bent portion of the connection terminal along the inner wall of the insertion hole. Preferably abuts against the inner wall. With this configuration, when the lead terminal is fitted into the slit, the bent portion of the connection terminal bent from the slit is supported by the inner wall of the insertion hole, so that the slit is moved in the fitting direction. Is regulated, so that the fitting can be easily performed.

It is preferable that the chip-type capacitor of the present invention is formed by welding the slit portion and a lead terminal fitted in the slit. In this case, the lead terminal and the connection terminal are more firmly fixed by welding the slit portion and the lead terminal.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment) FIG. 1 is an external perspective view of a chip type capacitor 1 according to an embodiment of the present invention as viewed from below.
Shows cross-sectional views taken along the line II in FIG.

FIG. 1 shows a chip type capacitor 1 of this embodiment.
And a lead body 5 having a lead terminal 5 led out through a sealing member 4 for closing an opening of an aluminum exterior case 3 accommodating a capacitor element 8 therein. 2 and an insulating plate 6 arranged such that the upper surface thereof is in contact with the sealing end surface of the capacitor body 2 from which the lead terminals 5 are led out. The connection terminals 7 formed by insert molding are formed on the surface 6f.

As shown in FIGS. 1 and 2, the capacitor body 2 used in the present embodiment houses a capacitor element 8 inside a bottomed cylindrical aluminum exterior case 3 and seals the open end of the capacitor element. After the member 4 is inserted, the sealing member 4 is locked by caulking the lower part of the outer peripheral side surface of the outer case 3. A lead terminal 5 is provided so as to penetrate the sealing member 4, and its end is connected to a tab 9 led out from the capacitor element 8 by welding.

The capacitor element 8 is formed by winding a separator between an anode foil and a cathode foil made of a valve metal such as aluminum so as to be wound, and is impregnated with an electrolyte or a solid electrolyte. A solid electrolytic capacitor element or the like in which a manganese dioxide layer is formed between an anode foil and a cathode foil made of a valve metal such as aluminum can be used.

As shown in FIG. 1, the insulating plate 6 is made of a resin having a predetermined thickness and an electrical insulating property, and has a substantially rectangular shape when viewed from above.
In addition, a notch 6d is formed at a pair of adjacent corners.

As described above, it is preferable that the shape of the insulating plate 6 in a top view is substantially rectangular because the mounting area of the obtained chip type capacitor 1 on the substrate can be reduced.
The present invention is not limited to this, and may have a polygonal shape in a top view or a circular shape in a top view.
May be appropriately selected.

It is preferable that the notch 6d is formed in the insulating plate 6 because the polarity of the lead terminal 5 can be easily determined visually when the chip type capacitor 1 is mounted on the substrate. It is not necessary to provide.

Further, in this embodiment, as a material of the insulating plate 6, polyphenylene sulfide (PPS) which is a resin having heat resistance and electric insulating property capable of withstanding heating during soldering at the time of mounting is used. The present invention is not limited to this, and may be an inorganic material such as ceramics or glass, or a composite of these materials, and any material having a sufficient insulating property can be used.

As shown in FIG. 2 and FIG.
Penetrating from the contact surface with the capacitor body 2 to the mounting surface 6f,
An insertion hole 6c is formed through which each lead terminal 5 derived from both poles of the capacitor body 2 can be inserted without contact.

On the mounting surface 6f of the insulating plate 6, metal connection terminals 7 which are elastically deformable from the insertion holes 6c to the outer end portions on both sides are formed by insert molding.

These connection terminals 7 are, as shown in FIG.
A connecting portion 7a which is exposed to be flush with the mounting surface 6f and is connected to the substrate at the time of mounting, and is bent upward from one end of the connecting portion 7a so as to contact the inner wall 6e of the insertion hole 6c. It is composed of a formed bent portion 7c and a slit portion 7b formed by bending so as to protrude further into the insertion hole 6c from the tip of the bent portion 7c.

As shown in FIG. 3, a slit 7d, into which the lead terminal 5 can be fitted so that the openings thereof face each other, is formed at the tip of the slit 7b formed in the connection terminal 7 of each pole. It is formed, and the end on the side of the bent portion 7c is supported by the insulating plate 6.

The separation width of the slit 7d is formed to be slightly smaller than the diameter of the lead terminal 5, and
The slit 7d is formed such that the vicinity of the opening is tapered.

As described above, in the present embodiment, the connection terminal 7 is insert-molded on the mounting surface of the insulating plate 6 and the connection terminal 7 is preferably fixed integrally to the insulating plate 6. The present invention is not limited to this.
The connection terminal 7 may be attached after molding.

The bent portion 7c is formed on the inner wall 6 of the insertion hole 6c.
e when the lead terminal 5 is fitted into the slit 7d and the bent portion 7c is
e, it is preferable because the movement of the slit portion 7b in the fitting direction is restricted and the fitting can be easily performed. However, the present invention is not limited to this. 7c may not be in contact with the inner wall 6e.

Further, the end of the slit 7b on the side of the bent portion 7c is supported by the insulating plate 6, and the deformation of the slit 7b is suppressed. Is prevented from being excessively deformed, so that the lead terminal 5 can be easily fitted, and even if an unexpected external force is applied during transportation or the like, the slit portion 7b
However, the present invention is not limited to this. In particular, the slit portion 7b may not be carried by the insulating plate 6.

The slit portion 7b is formed at a height position inside the insertion hole 6c via the bent portion 7c, and even if the tip end of the lead terminal 5 projects from the slit portion 7b, Since the projecting portion is not accommodated in the insertion hole 6c and does not project to the mounting surface 6f of the insulating plate 6,
The chip type capacitor 1 is preferable because it can be stably self-supported, but the present invention is not limited to this, and the slit portion 7b may be formed flush with the mounting surface 6f.

The slits 7d are formed so that the openings thereof face each other. When the lead terminals 5 are fitted, the fitting directions of the lead terminals 5 of the respective poles are opposite to each other. Since the lead terminals 5 can be inserted in a state in which the displacement such as rotation of 2 is suppressed, it is preferable because these can be easily inserted. However, the present invention is not limited to this.
It suffices if the lead terminal 5 can be fitted in a direction substantially parallel to the mounting surface 6f. For example, the chip type capacitor 1 ″ shown in FIG.
, The slit 7 formed in the slit portion 7b ″
The openings d ″ need not face each other.

Further, the separation width of the slit 7d is formed slightly smaller than the diameter of the lead terminal 5, and when the lead terminal 5 is fitted, the slit 7d is elastically deformed outward and resiliently repels. Although it is preferable because the lead terminal 5 is more firmly sandwiched by force, the present invention is not limited to this, and the lead terminal 5 is inserted into the slit 7d.
What is necessary is just to be able to fit in the horizontal direction with respect to the mounting surface 6f, and to hold it.

Further, the vicinity of the opening of the slit 7d is formed so as to expand in a tapered shape, and is preferable because the lead terminal 5 can be easily fitted. However, the present invention is not limited to this, and the slit 7d is not limited thereto. May be formed so that the lead terminal 5 can be fitted therein.

Next, the assembling state of the capacitor main body 2 configured as described above and the insulating plate 6 and the method of connecting the lead terminals 5 and the connection terminals 7 will be described.

First, as shown by the imaginary line in FIG. 3, the lead terminal 5 is inserted through the insertion hole 6c of the insulating plate 6, and the sealing end face of the capacitor body 2 is arranged so as to contact the insulating plate 6.

Next, as shown in FIG. 3, the respective lead terminals 5 are pulled in opposite directions and substantially parallel to the mounting surface 6f, and the slits 7d of the respective slit portions 7a are pulled.
The slit 7d is fitted into the inside so as to elastically deform outward.

As a result, the lead terminal 5 is connected to the slit 7d.
And the lead terminal 5 is connected to the connection terminal 7, and the capacitor body 2 and the insulating plate 6 are integrally fixed.

Finally, a portion of the lead terminal 5 protruding from the mounting surface 6f of the insulating plate 6 is cut so that the mounting surface 6f is flush with the chip terminal 1 so that the chip-type capacitor 1 becomes self-supporting. I do.

In the chip type capacitor 1 of the present embodiment configured as described above, the vertically extending lead terminals 5 exposed from the sealing member 4 are connected to the insertion holes 6 c of the insulating plate 6.
And is fitted along a mounting surface 6f of the insulating plate 6 in a slit 7d formed in the slit portion 7b of the connection terminal 7 in a direction substantially parallel to the mounting surface 6f of the insulating plate 6, and is connected to the lead terminal. By connecting the lead terminals 5 while being sandwiched by the slits 7d, there is no bent portion of the lead terminal 5 as in the related art, and breakage at the bent portion of the lead terminal 5 can be prevented even during vibration.

Further, since the lead terminal 5 is fitted into the slit 7d in a direction substantially parallel to the mounting surface 6f, even if the position of the lead terminal 5 is slightly shifted due to the vibration, the slit 7
In the case of movement inside d, the state in which the lead terminal 5 is always held between the slit portions is maintained, so that resistance to vibration is improved.

Although the embodiments of the present invention have been described with reference to the drawings, the specific configuration is not limited to these embodiments, and even if there are changes and additions without departing from the gist of the present invention. Included in the invention.

For example, in the above embodiment, one insertion hole 6
Although the lead terminals 5 led out from both poles of the capacitor body 2 are inserted through c, the present invention is not limited to this, and as in a chip type capacitor 1 'shown in FIG.
A pair of insertion holes 6c 'may be formed in the insulating plate 6', and the lead terminals 5 may be inserted into each of the holes.

The slit 7b has a slit 7d formed at the tip thereof, but the connection terminal 7 'shown in FIG.
As described above, an insertion hole 7f through which the lead terminal 5 can be inserted may be formed in the slit portion 7b ', and the lead terminal 5 may be fitted into the slit portion 7d' formed in the insertion hole 7f.

[0041]

The present invention has the following effects.

(A) According to the first aspect of the present invention, the vertically extending lead terminals exposed from the sealing member are formed in the slits of the connection terminals provided along the lower surface of the insulating plate, substantially in contact with the lower surface of the insulating plate. Since the lead terminals are fitted in parallel and connected while the lead terminals are sandwiched by the slits, there are no bent portions of the lead terminals as in the conventional case. Can be prevented.

(B) According to the second aspect of the present invention, the lead terminal is fitted while elastically deforming the slit outward, and the lead terminal is more firmly held by the elastic repulsive force of the slit. Reliability at the connection between the terminal and the connection terminal can be improved.

(C) According to the third aspect of the invention, when the lead terminals are inserted into the slits, the insertion directions of the lead terminals of the respective poles are opposite to each other, and the displacement such as rotation of the capacitor body is suppressed. Since the lead terminal can be inserted in the state, the insertion can be easily performed.

(D) According to the invention of claim 4, when the lead terminal is inserted into the slit, the bent portion of the connection terminal bent from the slit is supported by the inner wall of the insertion hole. Since the movement of the slit portion in the fitting direction is restricted, the fitting can be performed easily.

(E) According to the invention of claim 5, the lead terminal and the connection terminal are more firmly fixed by welding the slit portion and the lead terminal.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a chip-type capacitor according to an embodiment of the present invention as viewed from below.

FIG. 2 is a cross-sectional view of the chip type capacitor of FIG. 1 taken along line II.

FIG. 3 is a bottom view of the chip capacitor of FIG. 1;

FIG. 4 is a bottom view showing a modification of the chip-type capacitor of FIG. 1;

FIG. 5 is a bottom view showing a modified example of the chip capacitor of FIG. 1;

FIG. 6 is an external perspective view showing a conventional chip-type capacitor as viewed from below.

[Explanation of symbols]

 1, 1 ', 1 "chip type capacitor 2 capacitor body 3 outer case 4 sealing member 5 lead terminal 6, 6' insulating plate 6c, 6c 'insertion hole 6d notch 6e inner wall 6f mounting surface 7, 7', 7" connection Terminal 7a Connection part 7b, 7b ', 7b "Slit part 7c Bend part 7d, 7d', 7d" Slit 7f Insertion hole 8 Capacitor element 9 Tab

Claims (5)

[Claims] 1. A capacitor element is housed in a bottomed cylindrical outer case, an open end of the outer case is sealed by a sealing member, and a lead terminal led out from the capacitor element seals the sealing member. A capacitor body penetrating therethrough, and a connection terminal electrically connected to the lead terminal, and having a connection terminal to be connected to a mounting board along a lower surface thereof,
An insulating plate arranged in contact with a sealing end of the capacitor body, wherein the insulating plate has at least one insertion hole through which a lead terminal exposed from the sealing member can be inserted. Wherein the connection terminal is provided with a slit extending substantially parallel to the lower surface of the insulating plate, and the lead terminal is fitted into the slit. 2. A method according to claim 1, wherein at least a slit portion of the connection terminal where the slit is formed is formed of an elastically deformable metal plate, and a separation width of the slit is smaller than a diameter of the lead terminal. The chip-type capacitor according to claim 1, wherein 3. The chip-type capacitor according to claim 1, wherein the openings of the slits in the connection terminals of the respective poles are formed at positions facing each other in a direction substantially parallel to the lower surface of the insulating plate. 4. The slit portion is formed by bending a connection terminal in an inward direction of an insertion hole, and a bent portion of the connection terminal along an inner wall of the insertion hole abuts on the inner wall. The chip-type capacitor according to claim 1, further comprising: 5. The chip type capacitor according to claim 1, wherein said slit portion and a lead terminal fitted into said slit are welded.