JP2001080110A - Manufacture of exposure device, exposure device and image forming apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device that comprises light emitting elements formed in an array and achieves precise imaging relationship and to provide a method for manufacturing the exposure device wherein the exposure device can be simply and surely produced. SOLUTION: A rear face of a mounting substrate attaching face 5a of a substrate table 5 is preliminarily fixed to a substrate table attaching guide 55 of an assembling jig. A position relationship between a reference face 54 set to be perpendicular to an optical axis Z direction and the substrate table attaching guide 55 is predetermined and a distance L4 from a preliminary center CT' on the substrate table 5 to the reference face 54 is calculated. A rod lens array 3 is grasped by a hand H1 or the like. A distance between the reference face 54 and a preliminary center CT" of a finger of the hand H1 or the like is adjusted to be the distance L4 and the preliminary center CT' on the substrate table 5 and the center of the rod lens array 3 are set to be in conformity with each other in the direction Z (on the axis), and then they are bonded with each other. As a result, it is possible to assure a precise distance L2 from a light emitting point to the center of the rod lens array 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus used as an exposure system for forming a monochrome image and a color image, such as a printer, a facsimile, and a copying machine, and an image forming apparatus equipped with the exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, many image forming apparatuses such as a printer, a facsimile, and a digital copying machine employ an electrophotographic system, including an external computer,
Alternatively, an exposure system using a light source in which light-emitting elements such as light-emitting diodes are arrayed is often used as an exposure system for forming a latent image corresponding to an image signal output from an image reading mechanism on a photoconductor. In order to easily manufacture a quiet image forming apparatus, a small exposure apparatus is preferably used.

Here, the light emitting element is composed of a light emitting diode or the like, which emits diffused light from a certain point or a certain surface. In order to form a latent image on a photoreceptor, It is necessary to form an image of the diffused light emitted from the light emitting element on each minute spot. Therefore, an exposure device is provided with an imaging element array represented by a rod lens array, and a good spot is formed by the imaging element array, thereby increasing the relative positional relationship between the light emitting element and the imaging element to a higher position. I try to be accurate.

For example, FIG. 12 shows an enlarged example of a rod lens array mounted on an exposure device inside an image forming apparatus.

In FIG. 12, from the optical characteristics of the rod lens array, the surfaces S1 and S2 are in an image forming relationship such that if one of them is at the object plane position, one is at the image plane position. Although it may be a certain surface, here, the surface S1 is an object surface and the surface S2 is an image surface for convenience.

The rod lens array 300 has lens surfaces 300a and 300b so as to face each of the object surface S1 and the image surface S2. Then, when the object surface S1 and the image surface S2 face each other with a predetermined surface interval and the optical axis direction center CT of the rod lens array 300 is located at the center of the distance L1, a good equal magnification is established. Form an image. Therefore, the center CT of the rod lens array 300 in the optical axis direction, the object plane S1, and the image plane

[Problems to be solved by the invention]

Ideally, the distance between S2 is L2 = L1 / 2. By the way, regarding the manufacturing process of the exposure apparatus configured as described above, the distance Ll generally has a relatively small variation, while the lens length L of the rod lens array 300 is generally small.
It is well-known to those skilled in the art that the variation in 3 increases.

That is, since there is a difference in the above-mentioned variation tendency between both the distance L1 and the lens length L3, when an exposure apparatus is assembled using the lens surfaces 300a and 300b as a reference in the optical axis direction, each exposure lot is manufactured. Due to the variation in the lens length L3, the actual image plane distance tends to deviate from Ll, or the center of the rod lens array 300 does not coincide with the center of L1 and L2 = L.
There are problems such as the relationship of l / 2 cannot be guaranteed sufficiently. In any case, it is difficult to form a good image of the light beam from the light emitting element. As a result, the yield of the exposure apparatus, and eventually the image forming apparatus main body in which the exposure apparatus is incorporated, is reduced as a finished product.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an exposure apparatus having light emitting elements arranged in an array to achieve a high-precision imaging relationship. It is an object of the present invention to provide an exposure apparatus that performs the above-described steps, and a method of manufacturing the exposure apparatus that easily and reliably manufactures such an exposure apparatus.

Another object of the present invention is to provide an image forming apparatus which realizes high-definition image formation.

[0011]

In order to achieve the above object, according to the present invention, a light source and an imaging element for imaging a light beam emitted from the light source on an image carrier are fixed to the same base. In the manufacturing method of the exposure apparatus, the gist is that the fixed position of the imaging element with respect to the base is positioned with reference to the center of the light beam in the imaging element in the optical axis direction.

A virtual center where the center of the imaging element in the optical axis direction is located when the imaging element is fixed to the base is determined on the base, and the virtual center is determined. , So that the center of the imaging element in the optical axis direction coincides,
The imaging element may be fixed to the base.

Further, the virtual center is set so that a distance from the light source fixed to the base to the center of the imaging element also fixed to the base in the optical axis direction becomes a predetermined value. It may be. Incidentally, the predetermined value can be easily calculated or set in advance so that the light beam emitted from the light source fixed to the base forms a clear image on the image carrier through the imaging element.

Further, a distance from the optical axis direction center of the imaging element temporarily fixed by the manufacturing apparatus to a predetermined reference position;
This is also compared with the distance from the virtual center on the base temporarily fixed by the manufacturing apparatus to the same reference position, and the center of the imaging element in the optical axis direction and the virtual center on the base substantially match. And the imaging element may be fixed to the base.

Further, the light source of the exposure apparatus may have a light-emitting element array including a plurality of light-emitting elements.

In fixing the image forming element to the base, the image forming element is temporarily fixed and held by holding means provided in the manufacturing apparatus, while a predetermined element on the manufacturing apparatus is held. While temporarily fixing the base to the position, while recognizing the distance between the predetermined reference position and the optical axis direction center of the imaging element, and the distance between the reference position and the virtual center on the base,
The imaging device may be fixed to the base by the holding means so that the distances are made to match.

Further, the holding means may hold the imaging element by holding the imaging element.

Further, the holding means may hold the imaging element by sucking the imaging element.

Further, the holding device has a suction port formed in a tapered shape so as to suck and hold the ridge of the imaging element by the suction negative pressure, and the tapered suction port has a cross-section. In the structure, the tapered slope may be formed so as to be substantially symmetric with respect to the central axis of the suction port.

Further, when the base is temporarily fixed by the manufacturing apparatus, the base may be temporarily fixed based on a position where the light source is fixed on the base.

Further, the imaging element may be fixed to the base with an adhesive.

Further, the adhesive may be anaerobic and hard.

Further, the adhesive may have a property of curing when exposed to ultraviolet light or visible light.

The light emitting element array of the exposure apparatus is constituted by a light emitting element chip array in which a plurality of light emitting element chips in which a plurality of light emitting elements are arranged are arranged in the light emitting element arrangement direction, and each light emitting element chip has a threshold voltage or a threshold voltage. A light emitting element chip is formed by arranging a large number of light emitting thyristors capable of electrically controlling a threshold current and connecting neighboring light emitting thyristors to each other by an electric element having a unidirectional voltage or current. The light emitting element rows in the above may share this driving unit, and may scan the light emission of a plurality of light emitting element rows by a two-phase transfer clock.

Alternatively, the light emitting element row may be configured by arraying EL light emitting elements in which the light emitting layer of the light emitting element is made of an organic or inorganic substance.

The light emitting element row is constituted by EL light emitting elements laminated on a transparent base material, and a light beam emitted from each EL light emitting element passes through the transparent base material on which the EL element is laminated. It may be configured to emit light.

[0027] The light emitting element array may be configured such that EL light emitting elements are stacked on a base material, and a light beam emitted from each EL light emitting element is emitted in a direction substantially perpendicular to the stacking direction. Good.

[0028]

Embodiments of the present invention will be described below in detail. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention thereto unless otherwise specified. Absent.

(First Embodiment) An embodiment in which the present invention is applied to a copying machine as an image forming apparatus, an exposure apparatus incorporated in the copying machine, and a method of manufacturing the exposure apparatus will be described with reference to the drawings. This will be described with reference to FIGS.

FIG. 1 schematically shows a schematic configuration of an image forming apparatus (copier) according to the present embodiment.

As shown in FIG. 1, the copying machine 10 is mainly composed of an optical system including a document reading mechanism 20, an exposing device 30, etc., feeding rollers 13, 14, 15 and registration rollers 16a, 16b. And a printing system including a developing unit 18 and a transfer unit 19.

In the actual copying operation, first, the original table 2
4 is read by the reading mechanism 20 and converted into image data. On the other hand, the recording material 80 previously stored in the main body or one of the recording materials 81 drawn from the outside of the main body by the feeding roller 15 is supplied via the feeding rollers 13 and 14 in the main body. Will be fed. When these recording materials reach the positions of the registration rollers 16a and 16b, their leading end positions are detected by a sensor (not shown), and the transfer rollers 19a and 16b are transferred at specific timing by the registration rollers 16a and 16b.
Sent in the direction of. On the other hand, the image carrier 2 pre-charged by the charger 17 is rotating in the direction of the arrow in the figure, and the exposure device 30 performs exposure corresponding to the image data on the rotating image carrier 2. Forms an electrostatic latent image. A developing material (not shown) is applied to the image carrier 2 from the developing device 18 according to the electrostatic latent image. Then, at the same time that the image carrier 2 to which the developing material is applied rotates to the position on the transfer device 19, the recording material 80 also reaches the transfer device 19, and the developing material is transferred onto the recording material 80 by the transfer device 19. Transcribed. As a result, the recording material 80 reaches the fixing devices 22a and 22b through the conveyance path 21, and the transferred developer is fixed on the recording material 80, and is discharged to the tray 23 to complete the image formation.

Next, the exposure device 30 incorporated in the copying machine 10 of the embodiment will be described in detail with reference to FIG.

FIG. 2 is an enlarged plan view showing the exposure device 30 shown in FIG. 1 and the image carrier 2 exposed by the exposure device 30.

As shown in FIG. 2, the exposure apparatus 30 is provided with a light emitting element chip array CH1. On the light-emitting element chip array CH1, a light-emitting element row in which a plurality of light-emitting elements are arranged substantially linearly is provided. The column direction of the light emitting element chip array CH1 is set parallel to the rotation axis of the columnar image carrier 2, and the light emitting element chip array C
Provided between H1 and the image carrier 2 is a rod lens array 3 in which a number of rod lenses are arranged substantially in parallel with the light emitting element rows on the light emitting element chip array CH1. The arrangement of the rod lens array 3 is accurately positioned so that a light beam emitted from the light emitting element array on the light emitting element chip array CH1 is imaged as a minute spot on the surface of the image carrier 2. . In the exposure apparatus 30, the light emitting element chip array CH1 is mounted on the light emitting element chip mounting board 4, and a driver chip DR1 for driving each light emitting element, a limiting resistor (not shown), and the like are provided on the light emitting element chip mounting board 4. It is mounted similarly to the light emitting element chip array CH1. The light emitting element chip mounting substrate 4 is fixed to a rod lens array mounting surface 5b on a substrate base 5 having a heat radiation function by an adhesive or a screw. In addition, rod lens array 3
Are bonded and fixed to the rod lens array mounting surface 5b on the substrate table 5 by an adhesive 90. Then, a cover 6 for preventing light leakage is fixed to the substrate table 5 while being in contact with the rod lens array 3. Further, the rod lens array 3 is accurately positioned at a position where an image is formed as a minute spot on the surface of the image carrier 2 as described above.

The light emitting element chip (light emitting element chip array C) built in the exposure apparatus 30 of the present embodiment is described.
For H1), a self-scanning light-emitting chip having a thyristor structure is used. For example, FIG. 3 shows an equivalent circuit of the light emitting element chip.

In FIG. 3, reference numeral 2001 denotes a shift register unit, and 2002 denotes a light emitting unit. One row of light emitting elements is provided in the light emitting element chip.
Each light-emitting element row in 2 has 128 light-emitting thyristors illustratively. However, the number of the light emitting thyristors may be two or more, and is not limited to the above number. Here, L1001, L1002,... L1128 are light emitting thyristors. Also, R1001, R100
2,... R1128 are load resistances, D1001, D100
2,... D1127 are diodes, T1001, T10
02,... T1128 indicate switch elements each composed of a light emitting thyristor. VGA denotes a power supply line, ΦSA denotes a start pulse line, and DATA denotes a write signal line to a light emitting thyristor of a light emitting element row.

Here, for example, T1001 and T100
The gate terminal of the second switch element is a diode DIOOL.
Are connected to each other via a load resistor R10.
01 and R1002 to the power supply VGA. On the other hand, transfer clock # 1 for the transfer operation,
Φ2 is applied to the respective cathodes of T1001 and T1002, respectively. Incidentally, FIG. 3 shows a circuit diagram of the inside of only one light emitting element chip. However, since the other light emitting element chips have the same configuration, the repeated description is omitted here.

Now, assuming that one of the switching elements T1001 is turned on (ON) at a certain time by the transfer clock Φ1, the gate potential thereof becomes almost zero (0) volt, and this potential becomes the diode D1001.
Affects right through. After a lapse of a certain time, only the rightward element is selectively turned on (turned on) by the transfer clock Φ2 which is 180 ° out of phase with the next transfer clock Φ1, so that the transfer in the rightward direction is performed. It becomes possible. From the start of the ON state by Φ1 to the turn-on of the rightward element by Φ2, T1
001 is addressed, during which D corresponding to the image information is
In response to the ATA clock, the write signal line DATA
, The corresponding light-emitting thyristor L1001 emits light. Here, each light emitting element can be turned off (OFF) depending on a given image signal. Next, after turn-on by Φ2, T1002
Are addressed, L1002 can emit light. By repeating such a transfer operation and ON / OFF of the write signal, a predetermined light-emitting thyristor can emit light according to image data. Incidentally, the description of the driving of the light emitting element chip is also an example of one light emitting element chip, and the same applies to other light emitting element chips. Therefore, since signals other than DATA can be common to each light emitting element chip, the driver section can be common to each light emitting element chip. As a result, the light emitting element chips and the driver chips do not necessarily have to be connected in a 1: 1 correspondence.

Even if the light-emitting elements constituting the light-emitting element chip array CH are replaced with electroluminescent (EL) type light-emitting elements, as in the case of the self-scanning light-emitting chip having a thyristor structure as described above, the present embodiment is also applicable. It can be applied to an exposure apparatus of the form.

FIGS. 4 and 5 show the details of the structure (laminated structure) of the EL element applicable to this embodiment.

That is, FIG. 4 is a plan view of the structure of a light emitting element (part) using an EL element as viewed from the layer stacking direction, and FIG. 5 is a cross sectional view showing a cross section perpendicular to the layer stacking direction. Show. As shown in both figures, the light emitting portion formed by the EL element forms one light emitting portion by the entire substrate 204 including a plurality of stacked bodies. When the light emitting portion of the EL element is used as a light emitting element row, the mounting board 4 and CH1 in FIG.

The structure of the substrate 204 is such that ITO (indium tin oxide) is formed on a transparent substrate 2041 which is transparent to the emission wavelength.
xide) etc., which are also transparent to the emission wavelength and have positive electrodes 2042a, 2042b, 2042c,
(See FIG. 4 and FIG. 5) for each light emitting element. An organic hole transport layer 2043 and an organic electron transport layer 2044 are stacked on part of the positive electrode.
A negative electrode layer 2045 of Mg, Al, etc. on 2044
Are laminated. In some cases, a sealing layer (not shown) may be laminated on the negative electrode layer 2045. Here, the plus electrodes 2042a, 2042b, 2
By applying an optimum voltage between the electrodes 042c and 2042d and the minus electrode 2045, good light emission can be performed, and a desired light amount can be obtained in the direction of the transparent substrate 2041. here,
By changing ITO to a metal film or the like that reflects the emission wavelength, light can be extracted perpendicular to the layer stacking direction. In addition, in FIG. 5, the plus electrode is assumed to be connected to the power supply in parallel. This is a diagram schematically showing that a voltage is applied, and switching may be performed for each electrode. Alternatively, each electrode may be switched. Although the electron transport layer and the hole transport layer have been described as being limited to organic substances, they may be composed of inorganic substances.

Next, the manufacturing process of the exposure apparatus 30 according to the present embodiment will be described with reference to FIGS.

FIGS. 6, 7, and 8 show the mounting process of the rod lens array visually, and FIG. 9 is a flowchart schematically showing the procedure of the mounting process.

The rod lens array 3 used here has the same and optical characteristics as the rod lens array 300 described in FIG.
In FIGS. 6 to 8, reference numerals such as L1 and CT indicating the distance and the center have the same meanings as those used in FIG.

For convenience of explanation, it is assumed that the mounting board 4 on which the light emitting element chips CH1 to CH7 and the driver chips DR1 to DR7 are mounted in another previous step has already been mounted on the board base 5. However, this may be performed before or after the rod lens array 3 is attached (attached).

The step of attaching the rod lens array to the substrate stage in the manufacturing process of the exposure apparatus will be described below with reference to the flowchart of FIG. This series of manufacturing process,
This is performed using a known assembly jig as a manufacturing apparatus.

First, "mounting the board base to the jig based on the board mounting surface" in step A in FIG. 9 is performed by assembling a jig (manufacturing apparatus) by mounting the rear surface of the mounting board mounting surface 5a of the board base 5 to the jig.
(See FIG. 6). in this way,
By attaching the substrate table 5 to the assembly jig, a predetermined reference surface 54 in the optical axis direction (= Z direction in FIGS. 6 to 8; hereinafter referred to as Z direction) of the assembly jig and the rod lens array 3
Of the distance L4 from the temporary center CT 'in the Z-direction to be matched with the center can be easily determined. This is because, if the positional relationship between the board mounting guide 55 and the reference surface 54 is determined in advance, the distance L4 can be easily calculated based on the positional relationship. Incidentally, the reference surface 54 is a plane perpendicular to the optical axis Z direction, and may be, for example, a part of an assembling jig, or a surface of a worktable on which the assembling jig is placed. (See FIG. 7 or FIG. 8). Here, since L2 should be the distance from the light emitting point to the center of the rod lens array 3 in the optical axis direction (see FIG. 12), the mounting board mounting surface on the board base 5 serving as the mounting reference to the assembly jig The distance from 5a to the temporary center CT 'in the Z direction where the center of the rod lens array 3 in the Z direction should be located is larger than L2 by the length α obtained by adding the thickness of the mounting substrate and the thickness of the light emitting element chip. However, since the light emitting element chip is usually manufactured precisely, the length α is also a very accurate numerical value. Therefore,
Regarding the determination of the temporary center CT ′ in the Z direction with high accuracy, the reliability is not impaired.

Next, in the step B of “applying an adhesive to the SLA attaching groove”, the adhesive 90 shown in FIGS.
It is applied to the position c by a dispenser (not shown) on the assembly jig or the like. Further, the adhesive 90 may be a material having properties such as anaerobic curability, and may be a material having anaerobic curability having curability by ultraviolet light or visible light.

Next, the process "hand gripping of the rod lens array" in step C will be described. In this step, FIGS.
The rod lens array 3 is gripped by hands H1, H2, H3,. When the hands Hl, H2, H3,... Grip the rod lens array 3, for example, when the hands Hl are closed, the fingers Hla, Hlb of the hand Hl are closed, and the fingers Hla, Hlb are centered in the Z direction. Is adjusted to coincide with the center in the Z direction of the rod lens array 3. On the other hand, the reference surface 54 and the finger Hl of the hand Hl are adjusted.
By adjusting the distance between the center CT ″ of a and Hlb to the above-described distance L4, the temporary center CT ′ on the substrate table 5 and the center of the rod lens array 3 match in the Z direction. Distance L4 between center of finger in Z direction and reference plane 54
Is the same for fingers of hands other than Hl, H2a and H2b, H3a and H3b... In FIG. 6, and the Z of the rod lens 3 extends over the length in the light emitting element arrangement direction (X direction in FIG. 6). The direction center can be accurately determined.

Next, in the "hand movement" in the step D, the hand H1, H2, H3,... In FIG. 8), the hands H1, H2, and H3 are moved so that the rod lens array 3 is brought into contact with the rod lens array mounting surface 5b on the substrate table 5, and each has a positional relationship shown in FIG.

Next, in the "adhesive curing" of the process E, the anaerobic curing is performed for a predetermined time if the adhesive 90 is cured only by anaerobic curing while keeping the positional relationship of FIG. . In addition, if the adhesive 90 is also provided with curability by ultraviolet light or visible light, the adhesive may be cured by irradiating the adhesive with ultraviolet light or visible light to accelerate the curing and improve the efficiency of the manufacturing process. Can also. Here, as also described in the flowchart of FIG. 9, the rod lens array 3 is held by being held by the hand.

Next, in step F, “hand grip release”, the hands H1, H2, H3 release the rod lens array 3. Finally, the substrate table 5 is removed together with the rod lens array 3 from the assembly jig (substrate table mounting guide 55), and the rod lens array mounting process is completed.

Here, the cover 6 described above may be attached before the substrate table 5 is removed from the jig in the last process. Including the cover attaching step, the assembly of the exposure apparatus 30 is completed.

That is, in the mounting step of the rod lens array 3 in the present embodiment, (1) the substrate table 5 is temporarily fixed to the substrate table mounting guide 55 of the assembling jig on the back surface of the mounting substrate mounting surface 5a; 2) The positional relationship between the reference surface 54 set perpendicular to the optical axis Z direction and the substrate table mounting guide 55 is determined, and the distance L4 from the temporary center CT ′ on the substrate table 5 to the reference surface 54 is determined. Calculating (3) rod lens array 3 by hand Hl or the like
(4) Reference surface 54 and hand H
The distance between the center of the finger CT such as "1" and the center CT "of the finger is adjusted to the distance L4, and the temporary center CT 'on the substrate table 5 and the center of the rod lens array 3 (center of the finger CT") in the Z direction (axis By performing the manufacturing process based on a series of procedures such as bonding the two in the above (1) and (2), the exposure apparatus 3 as a finished product, from the light emitting point to the center of the rod lens array 3, is manufactured. The distance L2 is guaranteed with high accuracy.

As described above with reference to FIG. 12, in the conventional method for attaching the rod lens array to the exposure apparatus, the positional relationship between the rod lens and the light source (light emitting element) in the optical axis direction is recognized. By using the rod lens surface as a reference for determination, the rod lens was attached to the exposure apparatus. For this reason, due to the variation of the rod lens length L3 in each manufacturing lot, the tendency that the actual image plane distance deviates from the distance L1 increases, or the center of the rod lens array does not coincide with the center of the distance L1 and L2. = Ll / 2 is not sufficiently ensured (see FIG. 12), and in any case, it is difficult to form a good image of a light beam from the light emitting element.

In this respect, the exposure apparatus 30 in the present embodiment
According to the manufacturing method of (1), in the rod lens array mounting process, the center of the rod lens array 3 in the optical axis direction is centered on the assembling jig, and its position and the position to be mounted on the substrate table are previously determined. By doing
Even if the length of the rod lens array 3 itself in the optical axis direction varies, the rod lens array 3 can be mounted at a position where a good imaging relationship can be obtained.

Further, by applying the hands H1, H2, H3... In the work of positioning and mounting in the mounting process of the rod lens array, the working efficiency and accuracy are further improved.

Accordingly, the exposure apparatus manufactured by the manufacturing method of the present embodiment can realize the formation of a high-definition latent image. By providing an exposure apparatus capable of forming such a high-definition latent image in the image forming apparatus, it is possible to output a high-quality image.

(Second Embodiment) Next, a second embodiment of the present invention will be described.
Will be described with reference to FIGS. 10 and 11. In the present embodiment, the means for centering the rod lens array, which is the imaging element, in the optical axis direction is different from the first embodiment. On the other hand, the entire exposure apparatus, the image forming apparatus in which the exposure apparatus of the present embodiment is incorporated, the details of the light emitting elements, and the characteristics of the rod lens array are the same as those applied in the first embodiment. Are omitted.

Hereinafter, the rod lens array is attached to (attached to) the above-mentioned substrate table during the manufacturing process of the exposure apparatus.
The steps will be described with reference to the flowchart of FIG.

In FIG. 10, reference numeral CH101 denotes a light-emitting element chip, DR101 denotes a driver chip for driving the light-emitting element chip CH101, 103 denotes a rod lens array, 104 denotes a light-emitting element chip CH101, a driver chip DR101, and a not-shown limiting resistor. Mounting board 105, a board base on which the mounting board 104 is mounted, 154 a reference plane in the optical axis direction (Z direction in FIG. 10; hereinafter, referred to as Z direction) of the assembly jig, and H 101 suction the rod lens array 103. The hands to perform.

The rod lens array 103 is mounted on the substrate table 105.
The procedure of the process of attaching to the first embodiment proceeds according to the flowchart of FIG. 11 similar to the first embodiment.

First, a description will be given of "mounting the substrate table to the jig based on the substrate mounting surface" in step A 'of FIG. This step corresponds to the process of FIG.
This is a step of contacting the board mounting guide of the assembling jig with the back surface of 5a and mounting it with fixing means such as screws (not shown). By attaching the substrate table 105 to the assembling jig in this manner, similarly to the first embodiment, the reference surface 154 of the assembling jig in the Z-axis direction is previously set as shown in FIG.
Of the distance L104 from the center of the rod lens array 103 to the temporary center CT ′ at which the center of the rod lens array 103 should be matched can be determined by precisely determining the positional relationship between the board mounting guide and the Z-direction reference plane 154 of the jig. .

Next, in “Applying an adhesive to the SLA attachment groove” in step B ′, the adhesive 190 shown in FIG. 10 is applied by a dispenser or the like on an assembly jig (not shown). The adhesive 190 may be a material having properties such as anaerobic curability, or may be a material having UV curability in addition to anaerobic curability.

Next, the "hand-adsorption of the rod lens array" of the kneading C will be described. In this step, the rod lens array 103 is attached to the hand H101 provided on the assembly jig in FIG. 10 and having a tapered suction port. Here, the slope (taper slope) of the hand H101
It is manufactured so that the angle between H101a and H101b is exactly symmetric with respect to the center line CT "1-CT" 2 of the hand H101. And the suction port H101 of the hand H101
When air is sucked from C by suction means (not shown) (for example, a vacuum pump or the like), the rod lens array 103
And the gap sp formed by the slopes H101a and H101b
Is under negative pressure. By doing so, the ridge in the Z direction of the rod lens array 103 comes into contact with the slopes H101a, H101b, and the suction of the rod lens array 103 to H101 is completed. Here, since the inclined surfaces H101a and H101b have the above-described positional relationship, the center of the rod lens array 103 in the Z direction and the center CT "1 of the hand H101 are set.
-CT "2 matches.

On the other hand, the distance between the reference surface 154 of the assembling jig and the center CT ″ 1-CT ”2 of the hand H101 in the Z direction is adjusted to the above-described distance L104 in advance.
Temporary center CT 'on substrate stand 105 and rod lens array 1
03 coincides in the Z direction.

Next, the “hand movement” in step C ′ is performed as shown in FIG.
The hand H1 in the Y direction in FIG. 10 keeps the state where the hand H101 in the middle holds the rod lens array 103 by suction.
01 to move the rod lens array 103 to the substrate stage 1
5 is brought into contact with the rod lens array mounting surface 105b on the main lens 05.

Next, in the "adhesive curing" of the step E ', anaerobic curing is performed if the adhesive 190 can be cured only by anaerobic curing. In addition, if the adhesive 190 is also provided with curability by ultraviolet light or visible light, the adhesive is irradiated with ultraviolet light or visible light to promote curing, and the efficiency of the manufacturing process can be further improved. This is the same as in the first embodiment. In the process E ′, the suction state of the rod lens array 103 by the hand H101 is maintained.

Next, in the step F ′ “hand suction release”, the hand H101 releases the rod lens array 103. Finally, the substrate stand 105 is removed together with the rod lens array 103 from the assembly jig, and the rod lens array mounting step is completed.

As described above, in the rod lens array mounting step in this embodiment, similarly to the first embodiment, the rod lens array is centered on the assembly jig in the optical axis direction, and its position and the substrate are set. By locating the position to be attached (attached) to the table in advance, the rod lens array can be placed at a position where a good imaging relationship is established even if the length of the rod lens array itself in the optical axis varies. Assembled.

Therefore, according to the exposure apparatus of the present embodiment, it is possible to form a high-definition latent image, and to provide the image forming apparatus with the exposure apparatus capable of forming a high-definition latent image. Image output becomes possible.

In addition, by using a hand that sucks with the negative pressure of air, even if the assembly process is performed in an environment such as a clean room, the clean and quiet environment in the room is not disturbed.

[0075]

According to the method of manufacturing an exposure apparatus of the present invention,
In the mounting step of the imaging element, the imaging element is centered on the assembly jig in the optical axis direction, and the position to be mounted (attached) to the substrate table is determined in advance. Even if the length of the image element itself in the optical axis direction varies, the image forming element can be assembled at a position where a good image forming relationship can be obtained. Therefore, according to the exposure apparatus of the present invention, a high-definition latent image can be formed. Further, according to the image forming apparatus of the present invention, the exposure apparatus capable of forming the high-definition latent image is built in the image forming apparatus, so that a high-quality image can be output.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an image forming apparatus in which an exposure apparatus according to a first embodiment of the present invention is incorporated.

FIG. 2 is a diagram illustrating a cross section of an exposure apparatus and an image carrier according to the first embodiment of the present invention.

FIG. 3 is an equivalent circuit of an example of a light emitting element chip according to the first embodiment of the present invention.

FIG. 4 is a diagram illustrating the vicinity of a light emitting section of an example of the light emitting element according to the first embodiment of the present invention.

FIG. 5 is a diagram illustrating the vicinity of a light emitting section of an example of the light emitting element according to the first embodiment of the present invention.

FIG. 6 is a perspective view illustrating a part of a rod lens array attaching step according to the first embodiment of the present invention.

FIG. 7 is a diagram illustrating a part of a rod lens array attaching process according to the first embodiment of the present invention.

FIG. 8 is a diagram illustrating a part of a rod lens array attaching process according to the first embodiment of the present invention.

FIG. 9 is a flowchart of a rod lens array attaching process according to the first embodiment of the present invention.

FIG. 10 is a diagram illustrating a part of a rod lens array attaching process according to a second embodiment of the present invention.

FIG. 11 is a flowchart of a rod lens array attaching process according to a second embodiment of the present invention.

FIG. 12 is a diagram illustrating optical characteristics of a rod lens array.

[Explanation of symbols]

S1, S2 Object surface (image surface) 2 Image carrier 3, 103, 300 Rod lens array 3a, 3b, 300a, 300b Lens surface 4, 104 Light emitting element chip mounting substrate 5, 105 Substrate (base) 5a, 105a Mounting substrate mounting surface 5b Rod lens array mounting surface CT Center in the optical axis direction 10 Copy machine 13, 14, 15 Feed roller 16a, 16b Registration roller 17 Charger 18 Developing device 19 Transfer device 20 Document reading mechanism 21 Transport path 22a, 22b Fixing device 23 Tray 24 Document table 54,154 Reference plane 55 Board table mounting guide 80,81 Recording material 90,190 Adhesive CH1, CH2, CH3, CH4, CH5, CH6, C
H7, CH101 Light emitting element chip array 2 Image carrier 3,103 Rod lens array H1, H2, H3, H101 Hand

Claims (19)

[Claims] 1. A method of manufacturing an exposure apparatus, comprising: a light source and an image forming element for forming an image of a light beam emitted from the light source on an image carrier, wherein the light beam in the image forming element is provided. A positioning position of the imaging element with respect to the base with respect to the center in the optical axis direction. 2. An imaginary center on which an optical axis direction center of the imaging element is located when the imaging element is fixed to the base is determined on the base, and the imaginary center is defined as the imaginary center. 2. The method according to claim 1, wherein the imaging element is fixed to the base so that the center of the imaging element in the optical axis direction coincides with the center. 3. The virtual center is set such that a distance from the light source fixed to the base to the center of the imaging element also fixed to the base in the optical axis direction becomes a predetermined value. 3. The method of manufacturing an exposure apparatus according to claim 2, wherein: 4. A distance from an optical axis direction center of an imaging element temporarily fixed by a manufacturing apparatus to a predetermined reference position, and a distance from a virtual center on the base temporarily fixed by the manufacturing apparatus to the same reference position. By comparing with the distance to, the optical axis direction center of the imaging element and the virtual center on the base are positioned so as to substantially coincide with each other, and the imaging element is fixed to the base. 4. The method for manufacturing an exposure apparatus according to claim 2, wherein 5. The method of manufacturing an exposure apparatus according to claim 1, wherein the light source of the exposure apparatus has a light emitting element array including a plurality of light emitting elements. 6. When fixing the image forming element to the base, the image forming element is temporarily fixed and held by holding means provided in the manufacturing apparatus, While temporarily fixing the base to the position, while recognizing the distance between the predetermined reference position and the optical axis direction center of the imaging element and the distance between the reference position and the virtual center on the base, The method according to any one of claims 2 to 5, wherein the holding unit fixes the imaging element to the base so that the distances are matched. 7. The method according to claim 6, wherein said holding means holds the image forming element to maintain the holding state. 8. The method of manufacturing an exposure apparatus according to claim 6, wherein said holding means holds the imaging element by suction. 9. The holding means has a tapered suction port for sucking and holding the ridge of the imaging element by the suction negative pressure, and the tapered suction port has:
9. The method according to claim 8, wherein the tapered slope is formed so as to be substantially symmetrical with respect to the central axis of the suction port. 10. The method according to claim 4, wherein when the base is temporarily fixed by the manufacturing apparatus, the base is temporarily fixed on the basis of a position where the light source is fixed on the base.
10. The method of manufacturing an exposure apparatus according to any one of items 9 to 9. 11. The imaging device according to claim 1, wherein the imaging element is fixed to the base with an adhesive.
6. A method for manufacturing an exposure apparatus according to any one of the above. 12. The method according to claim 11, wherein the adhesive is anaerobic and hard. 13. The method according to claim 11, wherein the adhesive has a property of curing when exposed to ultraviolet light or visible light. 14. An exposure apparatus manufactured by the manufacturing method according to claim 1. Description: 15. The light source comprises a light emitting element chip array in which a plurality of light emitting element chips in which a plurality of light emitting elements are arranged are arranged in the light emitting element arrangement direction, and a threshold voltage or a threshold current is applied to each light emitting element chip. A drive unit is formed by arranging a large number of electrically controllable light-emitting thyristors and connecting the neighboring light-emitting thyristors to each other by an electric element having one-way voltage or current, thereby forming a driving unit. 15. The exposure apparatus according to claim 14, wherein the light emitting element arrays share the driving unit, and scan the light emission of the plurality of light emitting element arrays with a two-phase transfer clock. 16. The light source according to claim 14, wherein the light source is a light-emitting element array in which a light-emitting layer of the light-emitting element is formed by arraying EL light-emitting elements made of organic or inorganic substances.
Exposure apparatus according to the above. 17. The light-emitting element array is formed by laminating EL light-emitting elements on a transparent substrate, and a light beam emitted from each EL light-emitting element passes through the transparent substrate on which the EL elements are laminated. 17. The exposure apparatus according to claim 16, wherein the light is emitted. 18. The light-emitting element array, wherein EL light-emitting elements are stacked on a base material, and a light beam emitted from each EL light-emitting element is emitted in a direction substantially perpendicular to the stacking direction. The exposure apparatus according to claim 16, wherein 19. An electrophotographic image forming apparatus which forms a light beam emitted from a light source by the image forming means and exposes the formed light beam on an image carrier to visualize the image. An exposure apparatus according to any one of claims 14 to 18 is provided as the light source, and the exposure apparatus is arranged such that an arrangement direction of the light emitting element rows is a direction orthogonal to a rotation direction of the image carrier. An image forming apparatus comprising: