JP2001069309A - Image sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an image sensor capable of being made high in performance, low in cost and improved in reliability by maintaining the linearity of the array of a waveguide outgoing end in the thickness direction of a light transmission substrate. SOLUTION: In this image sensor 21 of an optical waveguide contracting optical type, a first thermal expansion suppressing member 26 is stuck to one side surface of the thickness direction D2 of the rear end part 32 of a light transmission member 24 having plural waveguide 23. The linear expansion coefficient of the member 26 in an array direction D1 is smaller than that of the member 24 in the direction D1. The bending rigidity of the member 26 in the direction D2 is in such a degree than can maintain linearity with respect to the thickness direction D2 of the array of a waveguide outgoing end 28. The plane degree of an adhering surface 35 with the member 24 of the member 26 is >=0 μ and >=5 μ. Thus, the thermal extension of the part 32 of the member 24 is suppressed and the linearity of the array of the end 28 in the direction D2 is sufficiently maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an image sensor device for converting an optical image into a signal.

[0002]

2. Description of the Related Art A facsimile apparatus is provided with an image sensor device for converting an optical image into a signal in order to optically read an original. 2. Description of the Related Art In recent years, with the spread of home-use facsimile apparatuses and the like, image sensors have been demanded to have higher performance, smaller size, and higher reliability. In response to these demands, the present applicant has proposed, in Japanese Patent Application Laid-Open No. H11-38236, an image sensor device of an optical waveguide reduction optical type, which is one type of image sensor device.

FIG. 5 is an exploded perspective view of the image sensor device 1 disclosed in JP-A-11-38236. The image sensor device 1 shown in FIG. 5 includes a polymer optical waveguide array, which is a light guide member 3 having a plurality of waveguides for transmitting light, and an image sensor 4 including a plurality of conversion elements for converting light into signals. , A microlens array 5 having a plurality of condenser lenses, and a thermal expansion suppressing member 6. The light guide member 3 and the micro lens array 5
A reduction optical system for reducing an optical image is configured.

The light guide member 3 is a substantially flat member. The light guide member 3 is configured by combining a clad substrate having a plurality of grooves and a core member filling each groove. The groove of the clad substrate filled with the core member functions as a waveguide. The clad substrate is made of PMMA (polymethyl methacrylate) resin and is made by an injection molding method. The plurality of waveguides are arranged in the light guide member 3 in a one-dimensional array. A projection 8 is formed at the end of the light guide member 3 on the waveguide emission end side, and the emission ends of all the waveguides are exposed on the end surface of the projection. The emission ends of all the waveguides are arranged in parallel in a predetermined arrangement direction. The arrangement of the exit ends of all the waveguides is similar to the arrangement of the entrance ends of all the waveguides, and the arrangement pitch of the exit ends of the waveguides is smaller than the arrangement pitch of the entrance ends of the waveguides.

The thermal expansion suppressing member 6 is a rectangular tube-shaped member,
The light guide member 3 is fitted to the convex portion 8 in order to suppress the thermal expansion of the convex portion 8 on the waveguide output end side. Thermal expansion suppressing member 6
Has a tapered or irregular shape. The thermal expansion suppressing member 6 is formed of a resin material, for example, a liquid crystal polymer, and has an anisotropic linear expansion coefficient. The linear expansion coefficient of the thermal expansion suppressing member 6 in the arrangement direction 9 is smaller than the linear expansion coefficient of the light guide member 3 in the arrangement direction 9. The linear expansion coefficient of the thermal expansion suppressing member in the direction 10 from the waveguide entrance end side end surface of the light guide member 3 toward the waveguide exit end side is substantially the same as the linear expansion coefficient of the light guide member 3 in the direction 10. .

The image pickup device 4 is bonded to the end face of the projection 8 on the waveguide emission end side of the light guide member 3 in a state where each conversion element is positioned so as to face the emission end of each waveguide. I have. The micro lens array 5 is aligned with each condenser lens so as to face the incident end of each waveguide,
The light guide member 3 is adhered to the end face on the waveguide incident end side.

When the image sensor device 1 shown in FIG. 5 optically reads a document, the document is placed on the light guide substrate 3 while facing the waveguide emission end side end face of the light guide substrate 3 via the microlens array 5. Move relative to The light reflected from the surface of the document is condensed by each condensing lens of the microlens array 5, enters each waveguide from each waveguide entrance end of the light guide member 3, and is transmitted along each waveguide. Then, the light exits from each waveguide exit end and enters each conversion element of the imaging element 4. Since the arrangement of the waveguide exit ends is similar to the arrangement of the waveguide entrance ends and the arrangement pitch is narrow, the reflected light from the surface of the original is transmitted along the waveguide to form the reflected light. The optical image is reduced.

In the optical waveguide reduction optical type image sensor device 1 as shown in FIG. 5, it is not necessary to adjust the reduction optical system after the device is manufactured. The image sensor device 1 of FIG.
Compared with a lens reduction optical type image sensor device having a reduction optical system configured to reduce an optical image using a lens, the configuration of the reduction optical system is simplified and the focal depth of the reduction optical system is increased. Therefore, high performance and low cost can be achieved. Furthermore, the image sensor device 1 of FIG. 5 has a smaller image sensor and an optical system than a contact image sensor device in which an optical image is formed on an image sensor while maintaining an optical image at the same magnification. It is possible.
Further, in the image sensor device 1 of FIG. 5, in order to improve the reliability, the thermal expansion of the convex portion 8 on the waveguide emission end side of the light guide member 3 is suppressed by the thermal expansion suppression obtaining member 6, and the waveguide emission is improved. The pitch deviation between the end and the conversion element of the image sensor 4 is reduced.

In order to make each waveguide exit end face each conversion element in one-to-one correspondence, the light guide member 3 and the imaging element 4 are bonded in a state where they are aligned so that the positional accuracy between them is as high as possible. There is a need to. The arrangement of the conversion elements in the imaging element 4 generally has high linearity in the thickness direction 11 of the light guide member 3. In order to keep the positional accuracy between each waveguide output end and each conversion element high, it is necessary to attach the light guide member 3 in the thickness direction 11 at the end face of the projection 8 of the light guide member 3.
On the other hand, it is necessary that the arrangement of the waveguide emission ends also maintain high linearity. In the image sensor device 1 of FIG. 5, since the thermal expansion suppressing member 6 is formed of a resin material, the thickness of the light guide member 3 when the image pickup element 4 and the light guide member 3 are thermally expanded after the bonding and after the bonding. It becomes difficult to maintain the linearity of the arrangement of the waveguide output ends in the direction 11. For example, the waveguide emission end 14 exposed on the end face 13 of the convex portion 8 of the light guide member 3 is provided when the light guide member 3 is not thermally expanded.
Line up in a straight line. When the light guide member 3 thermally expands, the light guide member 3 is warped, so that the waveguide emission ends 14 are arranged in a curved line as shown in FIG.

If the linearity of the arrangement of the waveguide emission ends with respect to the thickness direction 11 is not maintained, the coupling between the waveguide emission end and the conversion element will be poor, and each conversion element will be accurately connected to each waveguide emission end. It shifts without facing. Therefore, the light guide member 3 in the optical path from the original to the conversion element via the waveguide is provided.
When the light guide member 3 is not thermally expanded, the loss of light when the is thermally expanded is larger than the loss of light in the optical path when the light guide member 3 is not thermally expanded. As a result, when the light guide member 3 is thermally expanded, the image quality of the image obtained as a result of reading the original by the image sensor device 1 is lower than when the light guide member 3 is not thermally expanded. 1 deteriorates the reliability.

The thermal expansion suppressing member 6 of the image sensor device 1 shown in FIG. 5 has a rectangular cylindrical shape and is fitted to the convex portion 8 of the light guide member 3. The accuracy needs to be relatively high. Further, since the inner surface of the thermal expansion suppressing member 6 has a tapered shape or an uneven shape, the manufacturing cost of the thermal expansion suppressing member 6 and the cost related to a device for bonding the thermal expansion suppressing member 6 to the light guide member 3 increase. Cheap. Based on these reasons, the cost of the image sensor device 1 tends to be high.

[0012]

As described above,
In the conventional waveguide-reduced optical image sensor device 1, the thermal expansion suppressing member is formed of a resin material. Therefore, the thermal expansion of the projection 8 on the waveguide output end side of the light guide member 3 can be suppressed, but the thickness direction 1 of the light guide member 3 can be reduced.
Since it is difficult to maintain the linearity of the arrangement of the waveguide emission ends with respect to 1, the reliability of the image sensor device tends to deteriorate. Further, since the thermal expansion suppressing member 6 has a rectangular tube shape, the manufacturing cost of the image sensor device tends to be high.

An object of the present invention is to improve performance, reduce cost,
And an image sensor device capable of improving reliability.

[0014]

SUMMARY OF THE INVENTION The present invention provides a light guide member having a plurality of waveguides for guiding light, a plurality of conversion elements for converting light into a signal, and a waveguide exit of the light guide member. A first thermal expansion suppressing member for suppressing thermal expansion of an end portion on the end side, the emission ends of at least three waveguides are arranged in parallel in a predetermined arrangement direction, and each conversion element The first thermal expansion suppressing member is arranged at a position facing each waveguide emission end in a state where the member has no thermal expansion, and the first thermal expansion suppressing member is orthogonal to the arrangement direction of the waveguide emission end side end of the light guide member. Direction one
The linear thermal expansion coefficient of the first thermal expansion suppressing member in the arrangement direction is smaller than the linear expansion coefficient of the light guide member in the arrangement direction, and the first thermal expansion member in the direction orthogonal to the arrangement direction.
The bending stiffness of the thermal expansion suppressing member is a size that can maintain the linearity of the array of the waveguide emission ends in the orthogonal direction, and the flatness of the bonding surface of the first thermal expansion suppressing member with the light guide member is , 0 μm or more and 5 μm or less.

According to the present invention, the image sensor device comprises:
An optical image is decomposed and transmitted using a plurality of waveguides, and the transmitted optical image is converted into a signal. The first thermal expansion suppressing member has not only a linear expansion coefficient of the first thermal expansion suppressing member in the arrangement direction smaller than that of the light guide member, but also high bending rigidity enough to maintain linearity, and linearity. The flatness of the adhesive surface is high enough to maintain. Since such a first thermal expansion suppressing member is adhered to one side surface of the light guide member in a direction orthogonal to the arrangement direction of the waveguide emission end side end, the heat of the light guide member at the waveguide emission end side end is reduced. The expansion is suppressed, and the linearity of the arrangement of the waveguide emission ends in the direction orthogonal to the arrangement direction is maintained. Further, since the first thermal expansion suppressing member is adhered to one side surface of the light guide member on the side of the waveguide emission end, the first thermal expansion suppressing member can be realized by a plate-like member, and the light guide member and the first thermal expansion suppressing member can be realized. There is no need to increase the precision of bonding with the conventional device. Also, the first thermal expansion suppressing member only needs to increase the flatness of the bonding surface with the light guide member, and does not need to increase the accuracy of other parts. Based on these reasons, the image sensor device of the present invention can reduce the manufacturing cost as compared with the image sensor device of the related art.

[0016] The image sensor device of the present invention further includes a second thermal expansion suppressing member for suppressing thermal expansion of an end portion of the light guide member on the waveguide output end side. The light guide member is adhered to one side surface of the end on the waveguide emission end side, and faces the first thermal expansion suppressing member via the light guide member.

According to the present invention, in the image sensor device, the end of the light guide member on the waveguide emission end side is sandwiched between the first thermal expansion suppressing member and the second thermal expansion suppressing member. This further suppresses the thermal expansion of the light guide member at the waveguide output end side end, so that the linearity of the array of the waveguide output ends is more reliably maintained. Further, since the first and second thermal expansion suppressing members sandwich the waveguide emission end side end of the light guide member,
The portion of the light guide member of the image sensor device on the waveguide emission end side has a sandwich structure that is symmetric with respect to a direction orthogonal to the arrangement direction. As a result, it is possible to prevent the light guide member from being warped due to the heat change at the end of the light guide member on the waveguide output end side.

In the image sensor device according to the present invention, one side of the light guide member on the side of the waveguide exit end to which the first thermal expansion suppressing member is adhered is formed by a method defined by the four side surfaces of the end. The line is a side surface closer to the waveguide among two side surfaces substantially orthogonal to the arrangement direction.

According to the invention, in the image sensor device, the first thermal expansion suppressing member has a normal line substantially orthogonal to the arrangement direction among four side surfaces of the light guide member on the waveguide emission end side. Of the two side surfaces, the surface is bonded to a position closer to the waveguide emission end side in a direction closer to the waveguide. Thereby, in both the case where the image sensor device has only the first thermal expansion suppressing member and the case where the image sensor device has both the first and second thermal expansion suppressing members, the light guide member has the waveguide emission end side. The thermal expansion of the end is further suppressed, and the linearity of the arrangement of the waveguide emission ends in the direction orthogonal to the arrangement direction is more reliably maintained.

The image sensor device according to the present invention is characterized in that an end face of the light guide member on the side of the waveguide emission end is flat.

According to the present invention, in the image sensor device, the end surface of the light guide member on the waveguide emission end side is flat without a concave portion or a convex portion. As a result, the size of the image sensor device of the present invention can be reduced more easily than that of the conventional image sensor device.

In the image sensor device according to the present invention, the linear expansion coefficient of the first thermal expansion suppressing member in the direction from the waveguide entrance end side end surface of the front light guide member to the waveguide exit end side end surface is the light guide member in that direction. Or more.

According to the invention, in the image sensor device, the first thermal expansion suppressing member has a coefficient of linear expansion in the arrangement direction smaller than that of the light guide member, and is orthogonal to the arrangement direction and is incident on the waveguide of the light guide member. The linear expansion coefficient in the direction from the end side end surface to the waveguide emission end side end surface is equal to or greater than that of the light guide member. As a result, the distortion caused by the thermal expansion of the light guide member can escape in the direction from the waveguide entrance end side end face to the waveguide exit end side end face or in the opposite direction.
Therefore, the first thermal expansion suppressing member can reduce the load applied to the light guide member while suppressing the distortion of the light guide member in the arrangement direction due to the thermal expansion of the light guide member.

The image sensor device of the present invention further includes a plurality of light collecting members for collecting light, and each light collecting member is arranged at a position facing the incident end of each of the waveguides. It is characterized by the following.

According to the present invention, in the image sensor device, light condensed by the light condensing member located at a position opposite to the incident end of each waveguide is incident from each of the waveguide incident ends, and each light is guided. The light passes through the wave path, exits from each waveguide output end, and enters each conversion element. As a result, the loss of light from the document at the end of the light guide member on the waveguide incident end side is reduced, and the amount of light incident on each conversion element is increased, so that the reading accuracy of the image sensor device is improved.

[0026]

FIG. 1 is a plan view of an image sensor device 21 according to a first embodiment of the present invention. FIG.
FIG. 2 is an AA enlarged cross-sectional view of the image sensor device 21 of FIG. 1 and 2 will be described together. In FIG. 1, a part of a clad substrate cover 54 described later is notched.

The image sensor device 21 includes a light guide member 24 having a plurality of waveguides 23 for guiding light, a plurality of conversion elements 25 for converting light into signals, and a first thermal expansion suppressing member 26. Include at least. The light that has entered from the incident end 27 of each waveguide 23 travels through each of the waveguides 23 with little attenuation, and exits from the emission end 28 of each of the waveguides 23.
In the light guide member 24, the emission ends 28 of the at least three waveguides 23 are arranged substantially parallel to the predetermined arrangement direction D1. Each conversion element 25 is disposed at a position facing the emission end 28 of each waveguide 23 when the light guide member 24 is not thermally expanded. In the following description, the end 31 and the end face 33 of the light guide member 24 on the waveguide incident end 27 side are referred to as “front end 31” and “front end face 33”, and the light guide member 2
The end 32 and the end face 34 of the No. 3 on the waveguide output end 28 side are referred to as “rear end 32” and “rear end face 34”.

The first thermal expansion suppressing member 26 is
The thermal expansion of the rear end portion 32 is suppressed. The thermal expansion of the rear end portion 32 of the light guide member 24 is caused by the light emission and the waveguide emission end 2.
8 due to the thermal change that occurs. Further, the first thermal expansion suppressing member 26 has a direction perpendicular to the arrangement direction D1 (hereinafter referred to as a “thickness direction”) when the conversion element 25 is bonded to the light guide member 24 and when a thermal change occurs in the waveguide emission end 28. (Referred to as D2) to maintain the linearity of the array of the waveguide exit ends 28 with respect to D2. For this reason, the first thermal expansion suppressing member 26 is bonded to one side surface of the rear end 32 of the light guide member 24 in the thickness direction D2.

The linear expansion coefficient of the first thermal expansion suppressing member 26 in the arrangement direction D1 is determined by the light guide member 2 in the arrangement direction D1.
4 is smaller than the coefficient of linear expansion. The bending stiffness of the first thermal expansion suppressing member 26 in the thickness direction D2 is large enough to maintain the linearity of the arrangement of the waveguide emission ends 28 in the thickness direction D2 on the rear end face 34 of the light guide member 24. I have. The flatness of the adhesive surface 35 of the first thermal expansion suppressing member 26 with the light guide member 24 is such that the rear end face 34 of the light guide member 24 can maintain the linearity of the arrangement of the waveguide emission ends 28 in the thickness direction D2. The size is. In this specification, the “flatness” is based on the specification of JIS B 0621. The first thermal expansion suppressing member 26 is the light guide member 2
4 is adhered to only one side surface of the rear end portion 32.
The bonding surface 35 of the first thermal expansion suppressing member 26 is one side surface of the first thermal expansion suppressing member 26.

As described above, in the image sensor device 21 according to the first embodiment, the first thermal expansion suppressing member 26 is
Not only the linear expansion coefficient of the first thermal expansion suppressing member 26 in the arrangement direction D1 is smaller than that of the light guide member 24, but also the bending rigidity in the thickness direction D2 and the flatness of the bonding surface 35 with the light guide member 24 are reduced by the thickness. Waveguide emission end 2 in direction D2
8 are large enough to maintain the linearity of the eight arrays. Such a first thermal expansion suppressing member 26 serves as the light guide member 24.
Is bonded to one side surface in the thickness direction D2 of the rear end portion 32 of the light guide member 24, so that the thermal expansion of the rear end portion 32 of the light guide member 24 is suppressed, and the linearity of the arrangement of the waveguide emission ends 28 with respect to the thickness direction D2 is improved. Can be maintained.

When the first thermal expansion suppressing member 26 is bonded to only one side in the thickness direction D2 of the rear end portion 32 of the light guide member 24, the first thermal expansion suppressing member 26 can be realized by a plate-shaped member. It is. As a result, the first thermal expansion suppressing member 26 is easier to manufacture and has a lower manufacturing cost than the conventional rectangular thermal expansion suppressing member 6. Further, the first thermal expansion suppressing member 26 only needs to increase the flatness of the bonding surface 35 with the light guide member 24, and it is not necessary to increase the precision of the other portions. More than the expansion suppressing member 6,
It is easier to manufacture and has lower manufacturing costs. Further, since the first thermal expansion suppressing member 26 is only adhered to one side surface of the rear end portion 32 of the light guide member 24, the accuracy of the adhesion between the light guiding member 24 and the first thermal expansion suppressing member 26 can be reduced as in the prior art. Need not be high. Therefore, the first thermal expansion suppressing member 26 can easily perform the bonding process and can reduce the cost related to the bonding device, as compared with the conventional rectangular thermal expansion suppressing member 6. Based on these reasons, the manufacturing cost of the image sensor device 21 of the first embodiment is lower than the manufacturing cost of the image sensor device 1 of the related art.

Preferably, the first thermal expansion suppressing member 26 is a waveguide of the four side surfaces of the rear end portion 32 of the light guide member 26 whose normal line is substantially parallel to the thickness direction D2. 2
Adhered to one side closer to 3. This makes the first
In the image sensor device 21 of the embodiment, the thermal expansion of the rear end portion 32 of the light guide member 24 is suppressed only by using the single first thermal expansion suppressing member 26, and the waveguide in the thickness direction D2 is provided. The linearity of the arrangement of the emission ends 28 can be maintained more reliably.

The image sensor device 2 of the first embodiment
One preferred configuration is as follows. All waveguides 2
The three incident ends 27 are arranged in a predetermined arrangement over the same width as the arrangement direction D1 of the original to be read. The arrangement pattern of the waveguide exit ends 28 is similar to the arrangement pattern of the waveguide entrance ends 27. In the first embodiment, the arrangement pitch PO of the waveguide emission ends 28 is
The pitch is smaller than the arrangement pitch PI of the waveguide incident ends 27. Thereby, the image sensor device 21 of the first embodiment is
This is an optical waveguide reduced optical image sensor device.

[0034] All conversion elements 25 are included in a single image pickup element 41 for converting an optical image into a signal. All conversion elements 2
Reference numerals 5 are arranged in a predetermined arrangement on the surface of an element substrate portion 42 of the imaging element 41. The element substrate portion 42 includes wiring for signal transmission, components for controlling the conversion element, and the like. The imaging element 41 is adhered and fixed to the rear end face 34 of the light guide member 24 in a state where each conversion element 25 is positioned so as to face each waveguide emission end 28. The arrangement pattern and the arrangement pitch PO of the waveguide emission ends 28 in a state where the light guide member 24 has no thermal expansion coincide with the arrangement pattern and the arrangement pitch of the conversion elements 25 in the imaging element 41.

A plurality of conversion elements 25 are arranged on the element substrate portion 42 of the image sensor 41 in a predetermined arrangement.
When the light guide member 24 and the light guide member 24 are bonded, the thickness direction D2
Since the linearity of the arrangement of the waveguide emission ends 28 with respect to the first direction is always maintained by the first thermal expansion suppressing member 26, deterioration of the coupling between the imaging element 41 and the light guide member 24 is prevented. Therefore, light loss in the optical path from the waveguide entrance end 27 to the conversion element 25 via the waveguide 23 is sufficiently reduced in the image sensor device 21 of the first embodiment as compared with the image sensor device 1 of the related art. ing. Therefore, the reliability of the image sensor device 21 of the first embodiment is higher than the reliability of the image sensor device 1 of the related art.

The image sensor device 21 is preferably
It further includes a plurality of lenses 37 that are light collecting members.
Each lens 37 is arranged at a position facing each waveguide input end 27. The optical axis of each lens 37 coincides with the central axis of the incident end 28 of each waveguide 23 and a portion in the vicinity thereof. All the lenses 37 constitute a micro lens array 43 for condensing light. Micro lens array 4
3 is attached to the front end 31 of the light guide member 24 in a state where each lens 37 is positioned so as to face each waveguide entrance end 27. The arrangement pattern and the arrangement pitch PI of the waveguide incident ends 27 are the same as those of the microlens array 4.
3, the arrangement pattern and the arrangement pitch of the lenses 37 coincide with each other. The microlens array 43 and the light guide member 24 constitute a reduction optical system 45 for transmitting an optical image while reducing it. When each lens 37 is provided at a position facing each waveguide incident end 27, light loss at the front end 31 of the light guide member 24 decreases, and each conversion element 2
5, the reading accuracy of the image sensor device 21 is improved.

The original to be read by the image sensor device 21 moves relative to the front end surface 33 of the light guide member 24. An optical image composed of light reflected from a portion of the document that faces the light guide member front end face 33 is reflected on the front end face 33 of the light guide member 24. The reflected light from the original is
And is incident on each waveguide 23 from the incident end 27 facing each lens 37. The light incident on each waveguide 23 travels along each waveguide 23 and
3 exits from the exit end 28. As a result, the light guide member 24
Decomposes an optical image shown on the front end face 33 of the light guide member 24 into bright spots having the same number as the number of the waveguides 23 and distributed in the same array as the array of the waveguide incident ends 27, and is composed of the bright spots. The transmitted optical image is transmitted to the rear end face 34 of the light guide member 23 while being reduced. The light emitted from each waveguide 23 enters each conversion element 25 facing the emission end 28 of each waveguide 23. Each conversion element 25 converts the incident light into a signal,
The signal is output. The signal output from the conversion element 25 is, for example, an electric signal having a level corresponding to the amount of incident light. As a result, the image pickup device 41 is
Thus, the optical image formed on one surface of the element substrate section 42 is converted into a signal corresponding to the optical image.

The image sensor device 2 according to the first embodiment
Reference numeral 1 denotes a waveguide reduced optical image sensor device. As a result, the image sensor device 21 of the first embodiment is smaller than the contact type image sensor device in the imaging device 4.
1 and the optical member can be reduced in size, so that the entire device can be made smaller than a contact image sensor device. In the image sensor device 21 according to the first embodiment, since the pitch shift between the waveguide emission end 28 and the conversion element 25 is suppressed by the first thermal expansion suppressing member 26, the imaging element 41 is downsized. However, the reliability is unlikely to decrease due to the pitch shift.

The bending stiffness of the first thermal expansion suppressing member 26 in the thickness direction D2 depends on the Young's modulus of the material forming the first thermal expansion suppressing member 26 and the thickness and width of the first thermal expansion suppressing member 26. . The material forming the first thermal expansion suppressing member 26 preferably has a Young's modulus of 314 GPa or more. When the first thermal expansion suppressing member 26 made of a material having a Young's modulus of 314 GPa or more is bonded to one side surface of the rear end portion 32 of the light guide member 24 in the thickness direction D2, the waveguide exits in the thickness direction D2. The linearity of the arrangement of the ends 28 is maintained to such an extent that a reduction in the reliability of the image sensor device 21 can be sufficiently prevented.

The flatness of the bonding surface 35 of the first thermal expansion suppressing member 26 is preferably not less than 0 μm and not more than 5 μm. When the first thermal expansion suppressing member 26 formed so that the flatness of the bonding surface 35 is 0 μm or more and 5 μm or less is bonded to one side surface of the rear end 32 of the light guide member 24,
The linearity of the arrangement of the waveguide emission ends 28 with respect to the thickness direction D2 is maintained to such an extent that a reduction in the reliability of the image sensor device 21 can be sufficiently prevented.

The first thermal expansion suppressing member 26 only needs to have a linear expansion coefficient at least in the arrangement direction D1 that is less than the linear expansion coefficient of the light guide member 24 in the arrangement direction D1, and from the front end face 33 of the light guide member 24. The coefficient of linear expansion in a direction D3 toward the rear end face 34 of the light guide member 24 (hereinafter, referred to as an “in / out direction”) is equal to
The coefficient of linear expansion may be less than or greater than 4. It is preferable that the linear thermal expansion coefficient of the first thermal expansion suppressing member 26 has anisotropy, and the linear thermal expansion coefficient of the first thermal expansion suppressing member 26 in the light entry / exit direction D3 of the light guide member 24 is preferably
It is equal to or greater than the linear expansion coefficient of the light guide member 24 in the entrance / exit direction D3. The linear expansion coefficient of the first thermal expansion suppressing member 26 in the arrangement direction D1 is smaller than the linear expansion coefficient of the light guide member 24 in the arrangement direction D1, and the linear expansion coefficient of the first thermal expansion suppressing member 26 If the coefficient of linear expansion of the light member 24 in the entry / exit direction D3 is equal to or greater than the linear expansion coefficient,
The distortion of the light guide member 24 that occurs when the light guide member 24 is suppressed by the thermal expansion suppression member 26 can escape in the entrance / exit direction D3.
As a result, the first thermal expansion suppressing member 26 is
Direction D caused by thermal expansion
1 to suppress the distortion of the light guide member 24, and
And the conversion element 25 can be prevented from being shifted in pitch.

The image sensor device 2 according to the first embodiment
In 1, the first thermal expansion suppressing member 26 can be realized by a flat member. Since the thermal expansion suppressing member 6 of the related art has a rectangular tube shape, it is necessary to provide a convex portion 8 for fitting the thermal expansion suppressing member 6 at the rear end of the light guide member 3. Since the first thermal expansion suppressing member 26 of the first embodiment has a flat plate shape, there is no need to provide a convex portion at the rear end 32 of the light guide member 24,
The rear end face 34 is a flat surface having no concave portion or convex portion. Thereby, the image sensor device 21 according to the first embodiment is
Is easier to miniaturize than the conventional image sensor device 1.

The specific structure of the optical waveguide reduced optical type image sensor 21 in the first embodiment is as follows.

The light guide member 24 is a flat member. The rear end face 34 of the light guide member 24 is a flat surface having no concave portion or convex portion. The waveguide incident end 27 is inside the light guide member 24 and faces the front end face 33. Waveguide exit end 28
Are exposed from the rear end face 34 of the light guide member 24. The first thermal expansion suppressing member 26 is a plate-shaped member. The width of the first thermal expansion suppressing member 26 in the arrangement direction D1 is narrower than the width of the light guide member 24 in the arrangement direction D1, and is equal to or greater than the width in the arrangement direction D1 within the range where all the waveguide emission ends 28 are arranged. The width of the first thermal expansion suppressing member 26 in the entrance / exit direction D3 is smaller than the width of the light guide member 24 in the entrance / exit direction D3. First thermal expansion suppressing member 26
Is bonded to one side surface in the thickness direction D2 of the rear end portion 32 of the light guide member 24 at a position overlapping the portion near the emission end 28 of all the waveguides when viewed from the thickness direction D2.

The light guide member 24 includes a clad substrate 51 and a plurality of core members 52. Both the clad substrate 51 and the core member 52 are formed of a material that can transmit light. The refractive index of the material of the core member 52 is higher than the refractive index of the material of the clad substrate 51. Clad substrate 51
Includes a main body 53 and a lid 54. Clad substrate 51
A plurality of grooves 56 having a fine width are formed on one surface 55 of the main body portion 53. Each core member 52 fills each groove 56 of the clad substrate main body 53. The lid 54 of the clad substrate 51 is provided with a groove 56 of the clad substrate main body 53.
Cover one surface 55 with The optical fiber portion composed of the clad substrate 51 and each core member 52 is
Function as The conditions of the physical properties of the first thermal expansion suppressing member 26 are defined based on the physical properties of the clad substrate 51 and are not related to the physical properties of the core member 52.

The clad substrate main body 53 and the microlens array 43 are integrated, and the portion from the waveguide entrance end 27 to the front end face 33 in the clad substrate main body 53 is formed by each lens 37 in the microlens array 43. , And also serves as a light transmitting section from the waveguide input end 27. For this reason, the cross-sectional shape of the end of the clad substrate body 53 on the waveguide incident end side is substantially trapezoidal, and the front end face of the light guide member 24 that is the end face of the clad substrate main body 53 on the waveguide incident end side. 33 is wider than the rear end surface 34 of the light guide member 24, which is the end surface of the clad substrate main body 53 on the waveguide emission end side. The clad substrate body 53 and the microlens array 43 are integrated and formed by an integral forming method.

The waveguide entrance ends 27 are linearly arranged in parallel in the arrangement direction D1, and the arrangement pitch PO is equal to each other at any two positions in the arrangement of the waveguide entrance ends 27. As a result, all the waveguides 23 are arranged in a one-dimensional array, that is, in the arrangement direction D.
The waveguide 23 is disposed on a plane such that the traveling direction of light in the waveguide 23 is parallel to a reference plane that is parallel to the input and output directions D3. The cross section taken along the line AA in FIG.
3 along the longitudinal direction of the optical path 59. Light path 59
Passes through a single lens 37 and a light guide member 24 to reach a single conversion element 25, and passes through one waveguide 23 in the light guide member 24.

The image sensor device 2 of the first embodiment
An optimal example of each component of 1 is as follows. The first thermal expansion suppressing member 26 is made of black alumina A-
445 (product name). The coefficient of linear expansion of the black alumina A-445 in the arrangement direction D1 is 7.2 × 10 ⁻⁶ / ° C.,
The Young's modulus is 314 GPa. Black alumina A-445
Has a flatness of 5 μm or less. The clad substrate 51 of the light guide member 24 is formed of a molding PMMA resin GH-S (trade name) manufactured by Kuraray Co., Ltd. The refractive index of the PMMA resin GH-S for molding is 1.492.
And the coefficient of linear expansion in the arrangement direction D1 is 60 × 10 ⁻⁶ / ° C.
It is. The core member 52 of the light guide member 24 has a refractive index of 1.
It is formed from 512 ultraviolet curable resins. Conversion element 25
Is realized by a photoelectric conversion element that converts light into an electric signal. The imaging device 41 has a configuration in which a charge-coupled device (CCD) is used for transmitting a signal output from the photoelectric conversion device.
It is realized by a CD array, preferably by TCD1208 (trade name) manufactured by Toshiba Corporation.

FIGS. 3A to 3F are AA end views of members in each step of the manufacturing process of the image sensor device 21 shown in FIG. A preferred manufacturing process of the image sensor device 21 will be described with reference to FIG.

First, as shown in FIG. 3A, an integrally formed body 81 made of the material of the clad substrate main body 53 is formed by an integrated forming method. The integrally formed body 81 is a member in which the microlens array 43 and the clad substrate main body 53 are integrated. One surface 55 of the clad body 53
On the surface of the integrated body 81 corresponding to the above, a fine groove 56 to be the waveguide 23 is formed. The end surface 83 of the integrated body 81 on the waveguide output end side is the rear end surface 3 of the light guide member 24.
It protrudes from a position 84 that should be 4. In the integrally formed body 81, the optical axis of each lens 37 is
Each lens 37 is arranged so as to coincide with the central axis of the portion on the waveguide incident end side.

Next, the integrally formed body 81 is fixed to a flat fixed base 85 having a substrate holding mechanism. The holding mechanism is
For example, it is realized by a mechanism for vacuum-sucking a substrate. Next, the fine grooves 56 on one surface 55 of the integrally formed body 81 are formed.
A liquid core material 87, which is a material of the core member 52, is dropped on a region 86 having the core member 52. The volume of the core material 87 to be dropped is, for example, at least the volume of all the fine grooves 56 or more.

After the dripping of the core material is completed, the surface of the dripped core material 87 is leveled by using a squeegee blade 88 which is a substantially flat jig as shown in FIG. 3B. The squeegee blade 88 keeps its tip in contact with the one surface 55 of the integrally formed body 81 from the position shown by the two-dot chain line, that is, the position near the waveguide emission end side end surface 83 of the integrally formed body 81. It moves in the direction of arrow D4 in FIG. The movement of the squeegee blade 88 is continued until the tip of the squeegee blade 88 reaches the outside of the integrally formed body 81. The tip of the squeegee blade 88 is
From the position closer to the waveguide emission end side end face 83 than the one end 89 of the fine groove 56 to be the waveguide emission end 28 from the position above the one end 89 of the fine groove,
Through the other end 90 in this order. As a result, only the inside of the fine groove 56 is filled with the core material 87, and the excess core material 87 is swept out of the area 86 to be dropped on the one surface 55 of the integrated body 81.

As the core material 87 which is a liquid material, an ultraviolet curable material having a refractive index after curing of about 1.51 and a viscosity in a liquid state before curing of about 500 cps is optimal. The squeegee blade 88
It is optimally realized by a sword-shaped squeegee having an IS hardness of A70 degrees, and the moving speed of the squeegee blade 88 is optimally about 200 mm / sec.
When these three conditions are satisfied, the filling rate of the core material 87 into the fine groove 56 becomes 90%, and the excess core material 87 that protrudes from the fine groove 56 becomes one of the integrated members 81.
The surface 55 is swept out of the region 86 to be dropped. This reliably prevents the surface of the microlens array 43 on the waveguide incident end side and the front end surface 33 of the light guide member from being contaminated by the core material.

After the leveling step of the core material 87 is completed, the integrally formed body 81 filled with the core material 87 is irradiated with ultraviolet rays. This hardens and solidifies the core material 87,
It becomes the core member 52. After the completion of the core member 52, the lid clad material, which is the material of the clad substrate lid 54, is provided on at least the area 86 to be dropped on the one surface 55 of the integrated body 81.
Is applied. The lid cladding material is realized by an ultraviolet curable resin whose refractive index after curing is equal to the refractive index of the cladding substrate main body 53. Next, the applied ultraviolet curable resin is irradiated with ultraviolet light. As a result, as shown in FIG. 3C, the applied clad material for the lid is hardened to form the clad substrate lid 54.

After completion of the clad substrate cover 54, the integrally formed body 81 is cut at a position 84 to be the rear end face 34 of the light guide member, and the protruding portion 91 of the integrally formed body 81 and the clad substrate overlapping the protruding portion 91 are cut off. The lid 54 is removed. The cut surfaces of the integrally formed body 81 and the clad substrate cover 54 are polished. As a result, the waveguide emission end 28 is exposed outside the integrally formed body 81. Through the above steps, the reduction optical system 45 shown in FIG. 3D is completed.

After the reduction optical system 45 is completed, the first thermal expansion suppressing member 26 is positioned so as to overlap the portion of the rear end portion 32 of the light guide member 24 near the exit end of the waveguide as viewed in the thickness direction D2. . After the alignment, as shown in FIG.
The first thermal expansion suppressing member 26 is bonded to a position where one side surface in the thickness direction D2 of the rear end portion 32 of the light guide member 24 is aligned. After the first thermal expansion suppressing member 26 is adhered, the image sensor 41 and the light guide member 24 are aligned so that each conversion element 25 and each waveguide emission end 28 face one to one. After the alignment, as shown in FIG. 3 (F), the imaging element 41 is bonded to the aligned position of the rear end face 34 of the light guide member 24. Through the above steps, the image sensor device 21 is completed.

The method of manufacturing the image sensor device 21 described with reference to FIG. 3 has the following advantages as compared with the sandwich method and the vacuum capillary method used when the conventional image sensor device 1 is manufactured. In the sandwich method and the vacuum capillary method, since two plates having the same thickness as the light guide member are attached, the thickness of the light guide member 3 of the image sensor device 1 according to the prior art is the same as that of the image sensor according to the first embodiment. It is twice as large as the clad substrate body 53 of the light guide member 26 of the device 21. In the manufacturing method of FIG. 3, since the lid portion 54 thinner than the clad substrate main portion 53 is attached to the main portion 53, the thickness of the image sensor device 21 of the first embodiment is the same as that of the conventional image sensor device 1. It becomes thinner than the thickness.

In the sandwich method and the vacuum capillary method, since a vacuum state must be formed for filling the core material, the production is troublesome and the production equipment is also large. In the method for manufacturing an image sensor device described in Japanese Patent Application Laid-Open No. 11-38236, the core material is filled by utilizing the capillary phenomenon, but it is difficult to use such a method. When the manufacturing method described in the first embodiment is used, the core material is filled by the dripping step and the leveling step, so that the manufacturing labor is reduced and the manufacturing apparatus can be simplified.

FIG. 4 is a sectional view of an image sensor device 101 according to a second embodiment of the present invention. The image sensor device 101 according to the second embodiment has a configuration in which a second thermal expansion suppressing member 103 is added to the image sensor device 21 according to the first embodiment. Of the components of the image sensor device 101 according to the second embodiment, those having the same functions as those of the components of the image sensor device 21 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Omitted.

The second thermal expansion suppressing member 103, together with the first thermal expansion suppressing member 26, suppresses the thermal expansion of the rear end portion 32 of the light guide member 24 and arranges all the waveguide emission ends 28 in the thickness direction D2. Maintain the linearity of For this reason, the second thermal expansion suppressing member 103 is connected to one of the rear end portions 32 of the light guide member 24.
Adhered to the side surface and the first through the light guide member 24
It faces the thermal expansion suppressing member 26. That is, the rear end portion 32 of the light guide member 24 has the first thermal expansion suppressing member 26 and the second thermal expansion suppressing member 103 on both sides of one side surface in the thickness direction D2 and one side surface in the opposite direction to the thickness direction D2. Are bonded to each other.

As described above, in the image sensor device 101 according to the second embodiment, the rear end portion 32 of the light guide member 24 is provided.
The first thermal expansion suppressing member 26 and the second thermal expansion suppressing member 10
3 between. Thereby, thermal expansion of the rear end 32 of the light guide member 24 is further suppressed, so that the linearity of the arrangement of the waveguide emission ends 28 in the thickness direction D2 is more reliably maintained.

The first and second thermal expansion suppressing members 26,
103 sandwiches the rear end portion 32 of the light guide member 24, the portion including the rear end portion 32 of the light guide member 24 of the image sensor device 101 of the second embodiment has a thickness direction D2.
Symmetric sandwich structure. Therefore, the occurrence of warpage of the light guide member 24 due to the thermal change of the rear end portion 32 is prevented, so that the deformation of the arrangement of the waveguide emission ends 28 is further prevented, and the waveguide emission end 28 with respect to the thickness direction D2. The linearity of the sequence is more reliably maintained. Thus, the pitch deviation between the waveguide emission end 28 and the conversion element 25 in the image sensor device 101 according to the second embodiment is more reliably prevented. In the image sensor device 101 according to the second embodiment, light loss in the optical path from the waveguide entrance end 27 to the conversion element 25 via the waveguide 23 is further reduced. Therefore, the reliability of the image sensor device 101 according to the second embodiment is further improved than the reliability of the image sensor device 1 according to the related art.

The second thermal expansion suppressing member 103 is
Since the second thermal expansion suppressing member 103 is adhered to one side surface of the rear end portion 32 of the fourth member 4, the second thermal expansion suppressing member 103 can be realized by a flat member. First
Since both the first and second thermal expansion suppressing members 26 and 103 can be realized by plate members, the rear end 32 of the light guide member 24 in the image sensor device 101 of the second embodiment.
There is no need to provide a convex portion on the front end, and the rear end face 34 can be processed into a planar shape. As described in the first embodiment,
If the rear end face 34 of the light guide member 24 is flat, the size of the light guide member 24 can be easily reduced.

Image Sensor Device 1 of Second Embodiment
01, preferably, the rigidity and the adhesiveness are attached to one of the two side surfaces, in which the normal lines in the four side surfaces of the rear end portion 32 of the light guide member 24 are substantially orthogonal to the arrangement direction D1, in the direction close to the waveguide 23. A first thermal expansion suppressing member 26 whose surface flatness is a value sufficient to maintain linearity is bonded, and a second thermal expansion suppressing member 103 is bonded to a side surface farther from the waveguide 23. . In the example of FIG. 4, the clad substrate cover 5 of the light guide member 24 is provided.
The first thermal expansion suppressing member 26 is bonded to the light guide member 2 on the fourth side.
4, the second thermal expansion suppressing member 1
03 is adhered. Accordingly, in the image sensor device 101 according to the second embodiment, the first and second
If the rigidity of at least the first thermal expansion suppressing member 26 of the thermal expansion suppressing members 26 and 103 and the flatness of the bonding surface are sufficient to maintain linearity, the rear end portion 32 of the light guide member 24 will be described. , And the linearity of the arrangement of the waveguide emission ends 28 in the thickness direction D2 can be more reliably maintained.

The second thermal expansion suppressing member 103 preferably has the same configuration as the first thermal expansion suppressing member 26.
That is, the second thermal expansion suppressing member 10 in the arrangement direction D1
3, the light guide member 24 in the arrangement direction D1.
Smaller than the linear expansion coefficient of the second direction in the thickness direction D2.
The bending stiffness of the thermal expansion suppressing member 103 is large enough to maintain the linearity of the arrangement of the waveguide emission ends 28 in the thickness direction D2, and the bonding surface 104 of the second thermal expansion suppressing member 103 with the light guide member. Has sufficient flatness to maintain the linearity. With this, the thermal expansion of the rear end 32 of the light guide member 24 is more reliably suppressed using the first and second flat thermal expansion suppressing members 26 and 103, and the arrangement of the waveguide emission ends 28 is reduced. Linearity is more reliably maintained. Also preferably, the light guide member 2 of the second thermal expansion suppressing member 103 is used.
Similarly to the bonding surface 35 of the first thermal expansion suppressing member 26, the bonding surface 104 with 4 is formed so that the flatness is 0 μm or more and 5 μm or less.

As in the case of the first thermal expansion suppressing member 26, the second thermal expansion suppressing member 103 has at least a linear expansion coefficient in the arrangement direction D1 smaller than the linear expansion coefficient of the light guide member 24 in the arrangement direction D1. The coefficient of linear expansion in the entry / exit direction D3 may be less than or greater than the coefficient of linear expansion of the light guide member 24 in the entry / exit direction D3. Preferably, the linear thermal expansion coefficient of the second thermal expansion suppressing member 103 is anisotropic, and the second thermal expansion suppressing member 10 in the arrangement direction D1.
3 is smaller than the linear expansion coefficient of the light guide member 24 in the arrangement direction D1, and the linear thermal expansion coefficient of the second thermal expansion suppressing member 103 in the light entry / exit direction D3 of the light guide member 24 is equal to the input / output of the light guide member 24. It is equal to or greater than the linear expansion coefficient in the direction D3. When the rear end 32 of the light guide member 24 is sandwiched by the first and second thermal expansion suppressing members 103 having such anisotropic linear expansion coefficient, the first and second thermal expansion suppressing members 103 are provided. Is to suppress the distortion of the light guide member 24 in the arrangement direction D1 due to the thermal expansion of the light guide member 24 without forcing the light guide member 24, and to reduce the pitch between the waveguide emission end 28 and the conversion element 25. Shift can be prevented.

The second thermal expansion suppressing member 103 is actually
It is formed in the same shape as the first thermal expansion suppressing member 103. In this case, the second thermal expansion suppressing member 103 is a portion near one of the emission ends 28 of all the waveguides 23 when viewed from the thickness direction D2 within one side surface of the rear end portion 32 of the light guide member 24 in the direction opposite to the thickness direction D2. Is adhered to the position overlapping with. When the configurations of the first and second thermal expansion suppressing members 26 and 103 are equal to each other, the first
Since the second thermal expansion suppressing members 26 and 103 can be manufactured in exactly the same manufacturing process, the manufacturing cost is reduced. Further, the image sensor device 103 according to the second embodiment
The manufacturing process of the second embodiment is the same as the manufacturing process of the image sensor device of the first embodiment described with reference to FIG.
03 is added.

The image sensor devices 21 and 101 of the first and second embodiments are examples of the image sensor device of the present invention, and can be realized in other various forms as long as the main configurations are the same. . In particular, the detailed configuration of each component is not limited to the above configuration and may be realized by another configuration as long as the same effect is obtained. For example, the first thermal expansion suppressing member 26 may have a shape other than the flat plate shape as long as at least the flatness of the bonding surface 35 is increased. Similarly, the second thermal expansion suppressing member 103 may have a shape other than a flat plate shape as long as at least the flatness of the bonding surface 104 is increased. It is preferable that the first and second thermal expansion suppressing members 26 and 103 have a flat plate shape because the manufacturing cost of the image sensor devices 21 and 101 can be reduced as compared with other shapes.

The image sensor devices 21 and 101 of the first and second embodiments are respectively provided in document reading devices for optically reading a document to be read and creating image data. . The document reader is
It may be used alone as a scanner device, or may be built in a facsimile device or a copier.

A schematic configuration of a document reading apparatus provided with one of the image sensor devices 21 and 101 according to the first and second embodiments is as follows, for example. The document reading device includes image sensor devices 21 and 1
01, a moving mechanism, a light source, and a data storage unit.
The moving mechanism moves at least one of the image sensor device 21 and the document such that the document relatively moves with respect to the front end surface 33 of the light guide member 24 of the image sensor devices 21 and 101. The light source illuminates a reference position facing the front end face 33 of the light guide member 24. The moving direction of the document at the reference position is parallel to the thickness direction D2 and orthogonal to the arrangement direction D1. The reflected light from the object at the reference position arrives at each conversion element 25 of the image sensor 41 of the image sensor devices 21 and 101 via the reduction optical system 45. Each conversion element 25 outputs a signal of a level corresponding to the amount of light received within a predetermined period after the end of the period. The signal from the conversion element 25 is sequentially stored in the data storage unit. A series of processes from the start of light reception to signal output in the conversion element 25 is performed within a period from the time when the leading edge of one document starts passing through the reference position to the time when the end of the document finishes passing through the reference position. , Repeated periodically. The entire signal stored in the data storage unit during the period becomes image data as a result of reading the document. In the image sensor devices 21 and 101 according to the first or second embodiment, the linearity of the waveguide emission end 28 is maintained and the manufacturing cost of the image sensor devices 21 and 101 is reduced. Reading accuracy is improved and manufacturing costs are reduced.

[0071]

As described above, according to the present invention, in the image sensor device, the first thermal expansion suppressing member is adhered to one side in the thickness direction of the light guide member at the end of the waveguide exit end. . The first thermal expansion suppressing member has not only a linear expansion coefficient of the first thermal expansion suppressing member in the arrangement direction smaller than that of the light guide member, but also high bending rigidity so that the linearity is sufficiently maintained.
In addition, the flatness of the bonding surface is high enough to maintain the linearity. As a result, the reliability of the image sensor device of the present invention is improved as compared with the image sensor device of the related art. Further, since the first thermal expansion suppressing member can be realized by a plate-shaped member, the manufacturing cost of the image sensor device of the present invention can be lower than that of the conventional image sensor device.

Further, according to the present invention, the end of the light guide member on the waveguide output end side is sandwiched between the first thermal expansion suppressing member and the second thermal expansion suppressing member. Thereby, the linearity of the arrangement of the waveguide emission ends is more reliably maintained, and the occurrence of warpage of the light guide member at the waveguide emission end side due to a thermal change is prevented. Still further, according to the present invention, the first thermal expansion suppressing member is a waveguide among the four side surfaces whose normal lines are substantially orthogonal to the arrangement direction among the four side surfaces of the light guide member on the waveguide emission end side. Is bonded at a position close to the end face on the waveguide emission end side of the surface in the direction close to. Thereby, the thermal expansion of the end portion of the light guide member on the waveguide emission end side is further suppressed, and the linearity of the arrangement of the waveguide emission ends in the direction orthogonal to the arrangement direction is more reliably maintained.

Further, according to the present invention, the end surface of the light guide member on the waveguide output end side has no concave portion and no convex portion,
It is flat. Thereby, the image sensor device of the present invention can be easily reduced in size. Furthermore, according to the present invention, the first thermal expansion suppressing member has a linear expansion coefficient less than the light guide member in the arrangement direction, and a linear expansion coefficient greater than or equal to the light guide member in the entrance direction. Thereby, the first thermal expansion suppressing member can reduce the load on the light guide member while suppressing the distortion of the light guide member in the arrangement direction due to the thermal expansion of the light guide member. Further, according to the present invention, the light condensing members are arranged at positions facing the incident ends of the respective waveguides. This improves the reading accuracy of the image sensor device.

[Brief description of the drawings]

FIG. 1 is a plan view of an image sensor device 21 according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the image sensor device 21 of FIG.

FIG. 3 is a diagram for explaining a method of manufacturing the image sensor device 21 of FIG.

FIG. 4 is an enlarged sectional view of an image sensor device 101 according to a second embodiment of the present invention.

FIG. 5 is an exploded perspective view of a conventional image sensor device 1.

6 is an enlarged view of an end face 13 of a convex portion 8 of the light guide member 3 of the image sensor device 1 of FIG.

[Explanation of symbols]

 21, 101 Image sensor device 23 Waveguide 24 Light guide member 25 Conversion element 26 First thermal expansion suppressing member 31 Waveguide incident end side (front end) of light guide member 32 Waveguide incident end side of light guide member End surface (front end surface) 33 Waveguide emission end side end portion (rear end portion) of light guide member 34 Waveguide emission end side end surface (rear end surface) of light guide member 35 Adhesion surface of first thermal expansion suppressing member 37 Lens ( (Condensing member) 41 Image sensor 103 Second thermal expansion suppressing member 104 Adhesion surface of second thermal expansion suppressing member

Claims (6)

[Claims] 1. A light guide member having a plurality of waveguides for guiding light, a plurality of conversion elements for converting light into a signal, and a thermal expansion of an end of the light guide member on the waveguide emission end side. And a first thermal expansion suppressing member for suppressing the light emission, wherein the emission ends of at least three waveguides are arranged in parallel to a predetermined arrangement direction. The first thermal expansion suppressing member is disposed at a position facing each of the waveguide emission ends, and the first thermal expansion suppressing member is bonded to one side surface of the end of the light guide member on the waveguide emission end side in a direction orthogonal to the arrangement direction, The linear expansion coefficient of the first thermal expansion suppressing member in the arrangement direction is
The bending stiffness of the first thermal expansion suppressing member in the direction orthogonal to the arrangement direction is smaller than the linear expansion coefficient of the light guide member in the arrangement direction, and can maintain the linearity of the arrangement of the waveguide emission ends in the orthogonal direction. The flatness of the bonding surface of the first thermal expansion suppressing member with the light guide member is:
An image sensor device having a size of 0 μm or more and 5 μm or less. 2. The light guide member further includes a second thermal expansion suppressing member for suppressing a thermal expansion of an end of the light guide member on the waveguide emission end side, wherein the second thermal expansion suppressing member is a waveguide of the light guide member. 2. The image sensor device according to claim 1, wherein the image sensor device is adhered to one side surface of an end portion on an emission end side, and faces the first thermal expansion suppressing member via the light guide member. 3. 3. A side surface of the light guide member on the side of the waveguide emission end to which the first thermal expansion suppressing member is adhered, a normal line in four side surfaces of the end is in the arrangement direction. 3. The image sensor device according to claim 1, wherein, of the two substantially orthogonal side surfaces, the side surface is closer to the waveguide. 4. 4. The image sensor device according to claim 1, wherein an end surface of the light guide member at an end on the waveguide emission end side is a flat surface. 5. The linear expansion coefficient of the first thermal expansion suppressing member in the direction from the waveguide incident end side end surface of the front light guide member to the waveguide output end side end surface is not less than the linear expansion coefficient of the light guide member in the direction. The image sensor device according to claim 1, wherein: 6. The light-emitting device according to claim 1, further comprising a plurality of light-condensing members for condensing light, wherein each light-condensing member is arranged at a position facing an incident end of each of said waveguides. Item 2. The image sensor device according to Item 1.