JP2001068266A - Organic el element, and manufacture thereof - Google Patents

Organic el element, and manufacture thereof

Info

Publication number
JP2001068266A
JP2001068266A JP23674899A JP23674899A JP2001068266A JP 2001068266 A JP2001068266 A JP 2001068266A JP 23674899 A JP23674899 A JP 23674899A JP 23674899 A JP23674899 A JP 23674899A JP 2001068266 A JP2001068266 A JP 2001068266A
Authority
JP
Japan
Prior art keywords
organic
gel
laminated film
adsorbent
uncured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23674899A
Other languages
Japanese (ja)
Inventor
Kazuhide Ota
和秀 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP23674899A priority Critical patent/JP2001068266A/en
Publication of JP2001068266A publication Critical patent/JP2001068266A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/87Arrangements for heating or cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants

Abstract

PROBLEM TO BE SOLVED: To surely block moisture and oxygen in an organic EL element laminate film. SOLUTION: This EL(electroluminescence) element is provided with a transparent substrate 1 (glass plate or the like) with an organic EL laminate film 2 formed, a gel member 3 comprising a gel component 32 (silicone gel or the like) and an adsorbent 31 to coat the EL laminate film 2, and a sealing member 4 joined to the transparent substrate l to seal the EL laminate film 2. The EL laminate layer 2 is coated with an uncured gel composition containing an uncured gel component and the adsorbent 31, the adsorbent 31 in the gel composition is settled in the organic EL element laminate layer 2 side, and then the gel composition is cured to form the gel member 3, so as to manufacture the organic EL element. A sheet-like body preliminarily molded is allowed to be used as the gel member 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、有機エレクトロル
ミネセンス(EL)素子及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescence (EL) device and a method for manufacturing the same.

【0002】[0002]

【従来の技術】有機EL素子の信頼性向上及び長寿命化
を図るためには、有機EL積層膜を構成する発光層や電
極を確実に水分や酸素(以下、「水分等」ともいう。)
から遮断することが重要である。例えば、特開平9−2
04981号公報には、有機EL積層膜を水分等から遮
断するために、有機EL積層膜の背面電極側の外表面を
シリコーンゲルからなるゲル被覆体によって被覆した有
機EL素子が開示されている。また、特開平2−197
071号公報には、有機ポリマーシートに吸湿剤粉末を
分散させた吸湿シートを、ヒートシール性プラスチック
フィルム又はシリコーン樹脂等を用いて有機EL積層膜
に面接着した有機ELパネルが開示されている。ここ
で、ヒートシール性プラスチックフィルム又はシリコー
ン樹脂等からなる面接着層は、水分等が有機EL積層膜
に到達することを妨げるために設けられている。
2. Description of the Related Art In order to improve the reliability and extend the life of an organic EL device, the light emitting layers and electrodes constituting the organic EL laminated film must be surely made of moisture or oxygen (hereinafter also referred to as "moisture").
It is important to block from For example, JP-A-9-2
No. 04981 discloses an organic EL device in which the outer surface of the organic EL laminated film on the back electrode side is covered with a gel coating made of silicone gel in order to shield the organic EL laminated film from moisture and the like. Also, Japanese Patent Application Laid-Open No. 2-197
No. 071 discloses an organic EL panel in which a moisture absorbing sheet in which a moisture absorbing agent powder is dispersed in an organic polymer sheet is surface-bonded to an organic EL laminated film using a heat-sealable plastic film or a silicone resin. Here, the surface adhesive layer made of a heat-sealable plastic film or a silicone resin is provided to prevent moisture and the like from reaching the organic EL laminated film.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記特開平9
−204981号公報に記載の構成においても、シリコ
ーンゲルによる水分等の遮断効果は必ずしも十分なもの
ではない。より長寿命の有機EL素子を得るためには、
ゲルを通過して有機EL積層膜に到達する水分等を更に
低減することが望ましい。また、上記特開平2−197
071号公報に記載の構成によると、吸湿シートと有機
EL積層膜との間が面接着層によって隔てられているた
め、一部の水分等が吸湿シートに捕捉される前に面接着
層に進入し、この面接着層を通過して有機EL積層膜に
到達してしまうという問題がある。
However, Japanese Patent Application Laid-Open No.
Also in the structure described in JP-A-204981, the effect of blocking moisture and the like by the silicone gel is not always sufficient. To obtain a longer life organic EL device,
It is desirable to further reduce moisture and the like that reach the organic EL laminated film through the gel. Further, Japanese Patent Application Laid-Open No. 2-197
According to the configuration described in Japanese Patent Application Laid-Open No. 071, since the moisture absorbing sheet and the organic EL laminated film are separated by the surface adhesive layer, a part of the moisture or the like enters the surface adhesive layer before being captured by the moisture absorbing sheet. However, there is a problem that the organic EL layer reaches the organic EL laminated film through the surface adhesive layer.

【0004】本発明の目的は、水分や酸素から有機EL
積層膜を確実に遮断することができる有機EL素子及び
その製造方法を提供することにある。
An object of the present invention is to remove organic EL from moisture and oxygen.
An object of the present invention is to provide an organic EL device capable of reliably blocking a laminated film and a method for manufacturing the same.

【0005】[0005]

【課題を解決するための手段】前記課題を解決するため
に、本第1発明の有機EL素子は、有機EL積層膜が形
成された透明基板と、吸着剤を内包しており前記有機E
L積層膜を被覆するゲル部材と、前記透明基板に接合さ
れて前記有機EL積層膜を封止する封止部材と、を備え
ることを特徴とする。
In order to solve the above-mentioned problems, an organic EL device according to a first aspect of the present invention includes a transparent substrate on which an organic EL laminated film is formed, an adsorbent, and the organic EL device.
A gel member that covers the L-layer film and a sealing member that is joined to the transparent substrate and seals the organic EL layer film are provided.

【0006】前記「透明基板」としては、ガラス、樹
脂、石英等の透明材料からなる板状物、シート状物、或
いはフィルム状物等を用いることができる。本発明にお
いては、製造時における分割が容易であり、且つ水分等
の遮断性に優れることから、透明基板としてガラス板を
用いることが特に好ましい。
As the "transparent substrate", a plate, sheet, film, or the like made of a transparent material such as glass, resin, and quartz can be used. In the present invention, it is particularly preferable to use a glass plate as the transparent substrate because it is easy to divide at the time of manufacturing and has excellent barrier properties against moisture and the like.

【0007】この透明基板上に、陽極、有機EL膜及び
陰極を積層して「有機EL積層膜」が構成される。有機
EL膜は、発光層のみからなってもよく、発光層に加え
て正孔輸送層及び/又は電子輸送層を有してもよく、更
に正孔注入層及び/又は電子注入層を有してもよい。陽
極、陰極及び有機EL膜を構成する材料としては、それ
ぞれ種々の公知材料を用いることができる。これらの各
層を形成する方法は、真空蒸着法、スピンコート法、キ
ャスト法、スパッタリング法、LB法等の方法から適宜
選択すればよい。
[0007] An "organic EL laminated film" is formed by laminating an anode, an organic EL film and a cathode on this transparent substrate. The organic EL film may consist of only a light emitting layer, may have a hole transport layer and / or an electron transport layer in addition to the light emitting layer, and further has a hole injection layer and / or an electron injection layer. You may. Various known materials can be used for the materials constituting the anode, the cathode, and the organic EL film. A method for forming each of these layers may be appropriately selected from methods such as a vacuum evaporation method, a spin coating method, a casting method, a sputtering method, and an LB method.

【0008】前記「封止部材」としては、ステンレス、
アルミニウム又はその合金等の金属類、ソーダ石灰ガラ
ス、珪酸塩ガラス等のガラス類、アクリル系樹脂、スチ
レン系樹脂等の樹脂類等の一種又は二種以上からなるも
のを使用することができる。金属類からなる封止部材は
放熱性に優れるため好ましい。特に、不活性気体等に比
べて熱伝導性の高いシリコーンゲル等からなるゲル部材
が有機EL積層膜及び封止部材に接触している場合に
は、発光時に有機EL積層膜から発生する熱を、ゲル部
材を介して封止部材から効率よく放散させることができ
る。封止部材の形状は特に限定されず、透明基板との間
に有機EL積層膜及びゲル部材を収容できる形状であれ
ばよい。後述のように、この封止部材の開口部を上にし
てその内側に未硬化ゲル組成物を入れ、その上から透明
基板を被せて接合した後に接合物を上下反転させる製造
方法を適用する場合には、未硬化ゲル組成物を保持可能
なキャップ状の封止部材を用いることが好ましい。
As the “sealing member”, stainless steel,
Metals such as aluminum or an alloy thereof, glasses such as soda-lime glass and silicate glass, and resins composed of one or more of resins such as acrylic resins and styrene resins can be used. A sealing member made of a metal is preferable because of its excellent heat dissipation. In particular, when a gel member made of silicone gel or the like having higher heat conductivity than an inert gas or the like is in contact with the organic EL laminated film and the sealing member, heat generated from the organic EL laminated film during light emission is reduced. It is possible to efficiently radiate from the sealing member via the gel member. The shape of the sealing member is not particularly limited as long as it can accommodate the organic EL laminated film and the gel member between the sealing member and the transparent substrate. As described below, when the uncured gel composition is placed inside the opening with the opening of the sealing member facing upward, and a transparent substrate is covered from above, and then a manufacturing method of inverting the joined product after joining is applied. It is preferable to use a cap-shaped sealing member capable of holding the uncured gel composition.

【0009】この封止部材と透明基板との接合は、エポ
キシ樹脂系接着剤、アクリレート系接着剤、熱硬化性樹
脂、光硬化性樹脂等の接着剤を用いて行うことができ
る。このうち、水分等の透過性の低い硬化物を形成する
ものが好ましい。また、素子への熱ストレス低減と速硬
化性に優れることから、光硬化性樹脂が好ましく用いら
れる。
The bonding between the sealing member and the transparent substrate can be performed using an adhesive such as an epoxy resin-based adhesive, an acrylate-based adhesive, a thermosetting resin, or a photocurable resin. Among them, those that form a cured product having low permeability to moisture and the like are preferable. Further, a photocurable resin is preferably used because it is excellent in the reduction of thermal stress to the element and the rapid curability.

【0010】前記有機EL積層膜を被覆する「ゲル部
材」は、ゲル成分と吸着剤とからなる。このゲル部材の
厚さは、有機EL素子中において、通常5〜2000μ
mであり、20〜200μmとすることが好ましい。こ
のゲル部材は、第2発明のように、予め成形されたシー
ト状体であることが好ましい。有機EL素子の製造時に
おいて、このシート状体を組み付けて有機EL積層膜を
被覆することにより、組付作業性がよく、またゲル部材
を成形する際の熱が有機EL積層膜には加えられないと
いう利点が得られる。
The "gel member" for covering the organic EL laminated film comprises a gel component and an adsorbent. The thickness of this gel member is usually 5 to 2000 μm in the organic EL device.
m, and preferably 20 to 200 μm. This gel member is preferably a sheet-like body formed in advance as in the second invention. At the time of manufacturing the organic EL element, by assembling the sheet-like body and covering the organic EL laminated film, the assembling workability is good, and heat at the time of forming the gel member is applied to the organic EL laminated film. The advantage is that there is no.

【0011】ゲル部材を構成する「ゲル成分」として
は、絶縁性、柔軟性、耐熱耐寒性、熱伝導性、密着性等
に優れることから、第3発明のように、シリコーンゲル
が特に好ましく使用される。このシリコーンゲルの柔軟
性は、JIS K2220(1/4コーン)に規定され
る針入度が、常温において20〜100(より好ましく
は45〜80)、120℃において40〜400(より
好ましくは90〜320)であることが好ましい。上記
範囲よりも針入度が小さい場合には、有機EL積層膜表
面とゲル部材との密着性が不足して水分等が隙間から有
機EL積層膜に到達したり、このゲル部材による応力吸
収性が十分に発揮されない場合がある。
As the "gel component" constituting the gel member, silicone gel is particularly preferably used as in the third invention because it has excellent insulation properties, flexibility, heat and cold resistance, heat conductivity, adhesion and the like. Is done. The flexibility of this silicone gel is such that the penetration specified by JIS K2220 (1/4 cone) is 20 to 100 (more preferably 45 to 80) at room temperature and 40 to 400 (more preferably 90) at 120 ° C. To 320). When the penetration is smaller than the above range, the adhesion between the surface of the organic EL laminated film and the gel member is insufficient, so that moisture or the like reaches the organic EL laminated film from the gap or the stress absorption by the gel member. May not be fully exhibited.

【0012】ゲル部材に内包される「吸着剤」は、水分
等を除去可能なものであって、(1)アルカリ金属酸化
物、アルカリ土類金属酸化物、硫酸塩、金属ハロゲン化
物、過塩素酸塩等の無機化合物、(2)アクリル系又は
メタクリル系の吸水性高分子等の有機物、(3)アルカ
リ金属及びアルカリ土類金属から選択される金属又はそ
れらの合金、(4)活性アルミナ、シリカゲル、ゼオラ
イト等の一般的な吸着剤、などから選択される一種又は
二種以上を使用することができる。水分の除去用には、
水分を物理吸着する一般的な吸着剤よりも、水分を化学
吸着するアルカリ金属酸化物及び/又はアルカリ土類金
属酸化物を吸着剤とすることが好ましい。
The "adsorbent" contained in the gel member is capable of removing moisture and the like. (1) Alkali metal oxide, alkaline earth metal oxide, sulfate, metal halide, perchlorine Inorganic compounds such as acid salts, (2) organic substances such as acrylic or methacrylic water-absorbing polymers, (3) metals selected from alkali metals and alkaline earth metals or alloys thereof, (4) activated alumina, One or more selected from general adsorbents such as silica gel and zeolite can be used. For removing water,
It is preferable to use an alkali metal oxide and / or an alkaline earth metal oxide that chemically adsorbs moisture as an adsorbent, rather than a general adsorbent that physically adsorbs moisture.

【0013】前記「吸着剤」の量は、一般に多いほどゲ
ル部材の吸着性能が高くなる。しかし、吸着剤の内包量
が多すぎると、ゲル部材の成形時において流動性が不足
したり、ゲル部材の柔軟性が不足して有機EL積層膜へ
の密着性が低下したり、このゲル部材による応力吸収性
が十分に発揮されなくなったりする場合がある。このた
め吸着剤の内包量は、ゲル成分に対して5〜64体積%
の範囲とすることが好ましく、10〜50体積%とする
ことがより好ましい。この吸着剤は、ゲル部材の全体に
均一に内包されていてもよく、有機EL積層膜に近い側
の吸着剤密度を高くしてもよい。有機EL積層膜側の吸
着剤密度を高くした場合には、吸着効率とゲル部材の柔
軟性とを両立させやすいので好ましい。吸着剤の形状は
特に限定されないが、表面積が大きく且つ未硬化のゲル
成分への分散性がよいことから、できるだけ細かい粉末
状であることが好ましい。
Generally, the larger the amount of the "adsorbent", the higher the adsorption performance of the gel member. However, if the amount of the adsorbent is too large, the fluidity of the gel member during molding is insufficient, the flexibility of the gel member is insufficient, and the adhesion to the organic EL laminated film is reduced. Stress may not be sufficiently exhibited. Therefore, the encapsulation amount of the adsorbent is 5 to 64% by volume based on the gel component.
And more preferably 10 to 50% by volume. The adsorbent may be uniformly contained in the entire gel member, or the density of the adsorbent on the side closer to the organic EL laminated film may be increased. It is preferable to increase the density of the adsorbent on the organic EL laminated film side, because it is easy to achieve both the adsorption efficiency and the flexibility of the gel member. The shape of the adsorbent is not particularly limited, but is preferably in the form of a powder as fine as possible because of its large surface area and good dispersibility in uncured gel components.

【0014】本発明の有機EL素子は、第4発明のよう
に、未硬化のゲル成分と前記吸着剤とを含有する未硬化
ゲル組成物により前記有機EL積層膜を被覆し、その
後、前記未硬化ゲル組成物中において前記吸着剤を前記
有機EL積層膜側に沈降させ、次いで、前記未硬化のゲ
ル成分を硬化させて前記未硬化ゲル組成物から前記ゲル
部材を形成させることにより好適に製造される。
In the organic EL device of the present invention, as in the fourth invention, the organic EL laminated film is coated with an uncured gel composition containing an uncured gel component and the adsorbent. Preferably, the adsorbent is settled on the organic EL laminated film side in the cured gel composition, and then the uncured gel component is cured to form the gel member from the uncured gel composition. Is done.

【0015】上記未硬化ゲル組成物により有機EL積層
膜を被覆する具体的な操作方法としては、封止部材の
開口部を上にしてその内側に未硬化ゲル組成物を入れ、
その上から有機EL積層膜の形成された透明基板を被せ
て封止部材と透明基板とを接合し、その後、この接合物
を上下反転させて未硬化ゲル組成物を有機EL積層膜側
に移動させる方法、透明基板と封止部材とを接合した
後に、この接合物の一部に設けられた開口部から未硬化
ゲル組成物を注入する方法、等が挙げられる。上記又
はの方法において、未硬化ゲル組成物により有機EL
積層膜を覆った後、この組成物中で吸着剤を有機EL積
層膜側に沈降させてからゲル成分を硬化させることによ
り、有機EL積層膜側における吸着剤密度が透明基板側
に比べて高いゲル部材を形成することができる。
As a specific operation method for coating the organic EL laminated film with the above-mentioned uncured gel composition, the uncured gel composition is put inside the sealing member with the opening thereof facing upward,
The sealing member and the transparent substrate are bonded to each other by covering the transparent substrate on which the organic EL laminated film is formed, and the uncured gel composition is moved upside down to move the uncured gel composition toward the organic EL laminated film. And a method of joining the transparent substrate and the sealing member, and then injecting the uncured gel composition from an opening provided in a part of the joined article. In the above or the above method, the organic EL is prepared by using the uncured gel composition.
After covering the laminated film, the adsorbent is settled on the organic EL laminated film side in this composition, and then the gel component is cured, so that the adsorbent density on the organic EL laminated film side is higher than that on the transparent substrate side. A gel member can be formed.

【0016】[0016]

【発明の実施の形態】以下、実施例により本発明を更に
具体的に説明する。 (実施例1) (1)有機EL素子の構成 実施例1の有機EL素子を図1に示す。有機EL素子
は、透明基板1と、この透明基板1上に形成された有機
EL積層膜2と、有機EL素子2を被覆するゲル部材3
と、接着部5により透明基板1に接合されて有機EL積
層膜2を封止する封止部材4とからなる。有機EL積層
膜2は、厚さ1.1mmのソーダ石灰ガラスからなる透
明基板1の上に、ITOからなる陽極21、有機EL膜
22、及び陰極23を順次積層して構成されている。有
機EL膜22は、陰極23側から順に、LiFからなる
電子注入層、アルミキノリウム錯体からなる電子輸送
層、アルミキノリウム錯体をホストとしキナクリドンを
ドーピングした発光層、TPTE(トリフェニルアミン
の4量体)からなる正孔輸送層、及び銅フタロシアニン
錯体からなる正孔注入層を積層してなる(いずれも図示
せず)。陰極23の主要部は厚さ150nmのアルミニ
ウム合金からなり、その一端は透明基板1上に形成され
たITO膜からなる電極取出線23aに電気的に接続さ
れている。また、ITO電極21の一部は陽極用の電極
取出線21aを形成している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described more specifically by way of examples. Example 1 (1) Configuration of Organic EL Element The organic EL element of Example 1 is shown in FIG. The organic EL device includes a transparent substrate 1, an organic EL laminated film 2 formed on the transparent substrate 1, and a gel member 3 covering the organic EL device 2.
And a sealing member 4 that is bonded to the transparent substrate 1 by the bonding portion 5 and seals the organic EL laminated film 2. The organic EL laminated film 2 is formed by sequentially laminating an anode 21, an organic EL film 22, and a cathode 23 made of ITO on a transparent substrate 1 made of soda-lime glass having a thickness of 1.1 mm. The organic EL film 22 includes an electron injection layer made of LiF, an electron transport layer made of an aluminum quinolium complex, a light emitting layer doped with quinacridone using an aluminum quinolium complex as a host, and a TPTE (4 ) And a hole injection layer made of a copper phthalocyanine complex (both not shown). The main part of the cathode 23 is made of an aluminum alloy having a thickness of 150 nm, and one end thereof is electrically connected to an electrode lead 23 a made of an ITO film formed on the transparent substrate 1. Part of the ITO electrode 21 forms an electrode lead 21a for the anode.

【0017】封止部材4は、厚さ0.4mmのステンレ
ス板からなり、中央部に凹部41を有する皿状にプレス
成形されている。封止部材4の周縁部42は、電気絶縁
性の光硬化性樹脂からなる接着剤を硬化させて形成され
た接着部5によって透明基板1に接合され、これにより
有機EL積層膜2を気密に封止している。封止部材4と
透明基板1との間に形成された封止空間のうち、下方部
分はゲル部材3により満たされている。これにより、有
機EL積層膜2はゲル部材2により完全に覆われてお
り、ゲル部材3の周縁部3aは接着部5と有機EL積層
膜2との間に充填されている。一方、上方部分には気泡
溜まりKが形成されており、この気泡溜まりKには窒素
等の不活性気体が封入されている。
The sealing member 4 is made of a stainless steel plate having a thickness of 0.4 mm, and is press-formed into a dish having a concave portion 41 at the center. The peripheral portion 42 of the sealing member 4 is joined to the transparent substrate 1 by an adhesive portion 5 formed by curing an adhesive made of an electrically insulating photocurable resin, thereby sealing the organic EL laminated film 2 in an airtight manner. It is sealed. The lower part of the sealing space formed between the sealing member 4 and the transparent substrate 1 is filled with the gel member 3. Thereby, the organic EL laminated film 2 is completely covered by the gel member 2, and the peripheral portion 3 a of the gel member 3 is filled between the bonding portion 5 and the organic EL laminated film 2. On the other hand, a bubble reservoir K is formed in the upper portion, and an inert gas such as nitrogen is sealed in the bubble reservoir K.

【0018】ゲル部材3は、酸化バリウム、酸化カルシ
ウム、酸化ストロンチウム及び活性アルミナから選択さ
れる少なくとも一種の粉末からなる吸着剤31を内包
し、そのゲル成分32はシリコーンゲルからなる。有機
EL積層膜2上に形成されたゲル部材3の厚さは平均1
000μmである。ゲル部材3の全体に内包される吸着
剤31の量は、1cm3のゲル成分32に対して0.4
2cm3(30体積%)である。但し、ゲル部材3の図
1における下方部分(即ち有機EL積層膜側)では、上
方部分に比べて吸着剤31の密度が高くなっている。
The gel member 3 contains an adsorbent 31 made of at least one powder selected from barium oxide, calcium oxide, strontium oxide and activated alumina, and the gel component 32 is made of silicone gel. The average thickness of the gel member 3 formed on the organic EL laminated film 2 is 1
000 μm. The amount of the adsorbent 31 contained in the entire gel member 3 is 0.4% per 1 cm 3 of the gel component 32.
2 cm 3 (30% by volume). However, the density of the adsorbent 31 is higher in the lower part of the gel member 3 in FIG. 1 (that is, the organic EL laminated film side) than in the upper part.

【0019】(2)有機EL素子の製造方法 この有機EL素子は、例えば以下の方法により製造する
ことができる。図2(a)に示すように、封止部材4の
開口部を上にして、透明基板1と接合される周縁部42
に未硬化の接着剤5’を配置する。次いで、図2(b)
に示すように、粉末状の吸着剤31を未硬化のゲル成分
32’に分散させた未硬化ゲル組成物3’を、ディスペ
ンサを使用して封止部材4の内側の窪みに注入する。そ
の後、図2(c)に示すように、有機EL積層膜2の形
成された透明基板1を封止部材4に被せ、紫外線照射に
より未硬化の接着剤5’を硬化させて、封止部材4と透
明基板1とを接合する接着部5を形成させる。この接合
物を上下反転させて、未硬化ゲル組成物3’を有機EL
積層膜2側に流動させ、有機EL積層膜2が未硬化ゲル
組成物3’によって完全に覆われた状態でしばらく静置
する。そして、図2(d)に示すように、未硬化ゲル組
成物3’中で吸着剤31が有機EL積層膜2側に沈降し
た後に、例えば100℃のオーブン中に90分間静置す
る。これにより、未硬化のゲル成分32’が加熱硬化し
て、未硬化ゲル組成物3’からゲル部材3が形成され、
図1に示す有機EL素子が得られる。
(2) Method of Manufacturing Organic EL Element This organic EL element can be manufactured, for example, by the following method. As shown in FIG. 2A, a peripheral portion 42 joined to the transparent substrate 1 with the opening of the sealing member 4 facing upward.
The uncured adhesive 5 'is placed on the substrate. Next, FIG.
As shown in (2), an uncured gel composition 3 'in which a powdery adsorbent 31 is dispersed in an uncured gel component 32' is injected into a depression inside the sealing member 4 using a dispenser. After that, as shown in FIG. 2C, the transparent substrate 1 on which the organic EL laminated film 2 is formed is put on the sealing member 4, and the uncured adhesive 5 ′ is cured by irradiating ultraviolet rays. An adhesive portion 5 for joining the transparent substrate 4 to the transparent substrate 1 is formed. The uncured gel composition 3 ′ is turned over by inverting the joined product to form an organic EL.
The organic EL multilayer film 2 is allowed to flow toward the multilayer film 2 and is left standing for a while in a state where the organic EL multilayer film 2 is completely covered with the uncured gel composition 3 ′. Then, as shown in FIG. 2 (d), after the adsorbent 31 has settled on the organic EL laminated film 2 side in the uncured gel composition 3 ′, the adsorbent 31 is left to stand in an oven at 100 ° C. for 90 minutes, for example. As a result, the uncured gel component 32 ′ is cured by heating, and the gel member 3 is formed from the uncured gel composition 3 ′,
The organic EL device shown in FIG. 1 is obtained.

【0020】(3)実施例の効果 実施例1の有機EL素子は、シリコーンゲルからなるゲ
ル成分32中に吸着剤31が固定されたゲル部材3によ
り有機EL積層膜2が完全に被覆されており、しかも吸
着剤31の密度は有機EL積層膜2に近い側(ゲル部材
3の下方部分)が高くなっている。これにより、ゲル部
材3中に侵入した水分等を、少量の吸着剤31により効
率よく除去できる。一方、ゲル部材3の上方部分は、吸
着剤31が少ないので優れた応力吸収性を発揮すること
ができる。
(3) Effects of the Embodiment The organic EL device of the first embodiment has a structure in which the organic EL laminated film 2 is completely covered by the gel member 3 in which the adsorbent 31 is fixed in a gel component 32 made of silicone gel. In addition, the density of the adsorbent 31 is higher on the side closer to the organic EL laminated film 2 (the lower part of the gel member 3). Thereby, water and the like that have entered the gel member 3 can be efficiently removed by the small amount of the adsorbent 31. On the other hand, the upper portion of the gel member 3 can exhibit excellent stress absorption since the amount of the adsorbent 31 is small.

【0021】また、上記製造方法によると、有機EL積
層膜2の上及び周囲に未硬化ゲル組成物3’を流し込ん
だ後に未硬化ゲル組成物3’を硬化させることによりゲ
ル部材3を形成させるので、ゲル部材3と有機EL積層
膜2との密着性がよい。これにより、有機EL積層膜2
を確実に被覆することができるので、この有機EL積層
膜2を水分等から保護する性能に優れる。また、有機E
L積層膜2とゲル部材3との間の熱伝導を高くできるの
で、有機EL積層膜2の発熱を分散する効果が高い。封
止部材4の内部に未硬化ゲル組成物3’を注入する工程
は、例えばこの封止部材に吸着剤を圧縮成形したペレッ
トを固定(貼り付け、圧入等)する場合に比べて自動化
が容易であり、吸着剤をペレット化する工程も不要とな
る。また、注入時には粉末状の吸着剤31はゲル成分3
2’中に分散されているので粉末飛散の問題はなく、ク
リーンルームでの作業にも適している。更に、上記製造
方法によると、未硬化ゲル組成物3’を注入して硬化さ
せることにより、封止空間内に導電性異物(電極の破材
等)をゲル部材3により固定することができる。これに
より、出荷後にこの導電性異物の移動によりショートが
発生することを防止するという効果が得られる。
According to the above-described manufacturing method, the gel member 3 is formed by pouring the uncured gel composition 3 ′ onto and around the organic EL laminated film 2 and then curing the uncured gel composition 3 ′. Therefore, the adhesion between the gel member 3 and the organic EL laminated film 2 is good. Thereby, the organic EL laminated film 2
Can be surely coated, so that the organic EL laminated film 2 is excellent in performance of protection from moisture and the like. Organic E
Since the heat conduction between the L laminated film 2 and the gel member 3 can be increased, the effect of dispersing the heat generated by the organic EL laminated film 2 is high. The step of injecting the uncured gel composition 3 ′ into the sealing member 4 is easier to automate than, for example, fixing (sticking, press-fitting, etc.) a pellet obtained by compression-molding an adsorbent to the sealing member. Therefore, the step of pelletizing the adsorbent becomes unnecessary. Further, at the time of injection, the powdery adsorbent 31 contains the gel component 3
Since it is dispersed in 2 ', there is no problem of powder scattering and it is suitable for work in a clean room. Further, according to the above-described manufacturing method, the conductive foreign matter (such as a broken electrode material) can be fixed by the gel member 3 in the sealed space by injecting and curing the uncured gel composition 3 ′. This provides an effect of preventing a short circuit from occurring due to the movement of the conductive foreign matter after shipment.

【0022】(実施例2)実施例2の有機EL素子を図
3に示す。封止部材4は、厚さ1.1mmのソーダ石灰
ガラスからなるガラス板である。透明基板1と封止部材
4との間に形成される封止空間は、ゲル部材3によって
完全に満たされている。その他の部分の構成は実施例1
と同様である。この有機EL素子は、有機EL積層膜が
形成された透明基板1と封止部材4とを接合した後、接
着部5の一部に設けられた切欠孔51から未硬化ゲル組
成物を注入し、接着剤等から形成される二次封止部材5
2によりこの切欠孔51を二次封止した後に、未硬化ゲ
ル組成物を加熱硬化させてゲル部材3を形成させること
により製造することができる。実施例2の構成及び製造
方法によると、透明基板1と封止部材4との間に形成さ
れる封止空間の全体をゲル部材3で満たし、この封止空
間から気体を除くことができる。
Example 2 FIG. 3 shows an organic EL device of Example 2. The sealing member 4 is a glass plate made of soda-lime glass having a thickness of 1.1 mm. The sealing space formed between the transparent substrate 1 and the sealing member 4 is completely filled with the gel member 3. The configuration of the other parts is the same as in the first embodiment.
Is the same as In this organic EL device, after bonding the transparent substrate 1 on which the organic EL laminated film is formed and the sealing member 4, an uncured gel composition is injected through a cutout hole 51 provided in a part of the bonding portion 5. Sealing member 5 formed of an adhesive or the like
After the notch 51 is secondarily sealed by 2, the uncured gel composition is heated and cured to form the gel member 3. According to the configuration and the manufacturing method of the second embodiment, the entire sealing space formed between the transparent substrate 1 and the sealing member 4 can be filled with the gel member 3, and gas can be removed from the sealing space.

【0023】この実施例2において、接着部に切欠孔を
設ける代わりに、図4に示すように、貫通孔43を有す
る封止部材4を使用し、この貫通孔43から未硬化ゲル
組成物を注入してもよい。この場合には、接着剤5a等
によりガラス製等の封止板44を貫通孔43上に固定し
て、貫通孔43を二次封止すればよい。
In Example 2, a sealing member 4 having a through-hole 43 is used as shown in FIG. May be injected. In this case, the sealing plate 44 made of glass or the like may be fixed on the through hole 43 with the adhesive 5a or the like, and the through hole 43 may be secondarily sealed.

【0024】尚、実施例1及び実施例2の製造方法によ
ると、未硬化ゲル組成物を加熱硬化させる際に有機EL
積層膜も共に加熱されるので、有機EL積層膜の劣化を
防ぐために、比較的低温且つ短時間で硬化するゲル成分
を使用することが好ましい。例えば、150℃で30分
以内、或いは120℃で60分以内に硬化するゲル成分
が好ましく使用される。未硬化ゲル組成物の粘度は20
0〜2500mPa・s(25℃)の範囲とすることが
好ましい。未硬化ゲル組成物の粘度が高すぎると、吸着
剤が沈降し難くなったり、或いは沈降に長時間を要する
ためである。また、実施例1及び実施例2では、未硬化
ゲル組成物により有機EL積層膜を覆った後、この組成
物中で吸着剤を有機EL積層膜側に沈降させてからゲル
成分を硬化させたが、吸着剤が沈降するまで待たずに
(即ち、例えば組成物中に吸着剤をほぼ均一に分散させ
たままで)ゲル成分を硬化させてもよい。これにより、
製造に要する時間を短縮することができる。
According to the production methods of Example 1 and Example 2, when the uncured gel composition is cured by heating, the organic EL
Since the laminated film is also heated, it is preferable to use a gel component that cures at a relatively low temperature and in a short time in order to prevent deterioration of the organic EL laminated film. For example, a gel component which cures at 150 ° C. within 30 minutes or at 120 ° C. within 60 minutes is preferably used. The viscosity of the uncured gel composition is 20
It is preferable to set it in the range of 0 to 2500 mPa · s (25 ° C.). If the viscosity of the uncured gel composition is too high, the adsorbent becomes difficult to settle, or it takes a long time to settle. In Examples 1 and 2, after covering the organic EL laminated film with the uncured gel composition, the adsorbent was settled on the organic EL laminated film side in this composition, and then the gel component was cured. However, the gel component may be cured without waiting for the adsorbent to settle (ie, for example, with the adsorbent substantially uniformly dispersed in the composition). This allows
The time required for manufacturing can be reduced.

【0025】(実施例3)実施例3の有機EL素子を図
5に示す。透明基板1上に形成された有機EL積層膜2
は、予めシート状に成形して有機EL積層膜2上に配置
されたゲル部材3により被覆されている。このゲル部材
3は、実施例1と同じシリコーンゲルからなるゲル成分
32と、実施例1と同じ吸着剤31とからなる。但し、
本実施例においては、ゲル部材3中における吸着剤31
の濃度は、シートの厚み方向に対してほぼ均一である。
ゲル部材3の周縁部3aは、有機EL積層膜2と接着部
5との間に入り込んで透明基板1に面接触している。封
止部材4は、実施例1のような凹部をもたず、単純な皿
状である。その他の部分の構成は実施例1と同様であ
る。
Example 3 FIG. 5 shows an organic EL device of Example 3. Organic EL laminated film 2 formed on transparent substrate 1
Is covered with a gel member 3 previously formed into a sheet shape and arranged on the organic EL laminated film 2. The gel member 3 includes a gel component 32 made of the same silicone gel as in the first embodiment and an adsorbent 31 same as in the first embodiment. However,
In this embodiment, the adsorbent 31 in the gel member 3 is used.
Is substantially uniform in the thickness direction of the sheet.
The peripheral portion 3 a of the gel member 3 enters between the organic EL laminated film 2 and the bonding portion 5 and is in surface contact with the transparent substrate 1. The sealing member 4 has a simple dish shape without the concave portion as in the first embodiment. Other configurations are the same as in the first embodiment.

【0026】この有機EL素子は、例えば以下の方法に
より製造することができる。図6(a)に示すように、
封止部材4の開口部を上にして、透明基板1と接合され
る周縁部42に未硬化の接着剤5’を配置する。次い
で、図6(b)に示すように、予めシート状に成形され
たゲル部材3を、封止部材4の内側上面に載置する。こ
のゲル部材3としては、未硬化のゲル成分と吸着剤粉末
とを混合した未硬化ゲル組成物を、キャスティング法、
直接塗布法等によりシート状とし、これを加熱等により
硬化させて得られたシート状体を用いることができる。
成形されたゲル部材3は、吸着剤の失活等を防止するた
めに、水分等を通さないセパレータの間に挟んで保管さ
れている。このセパレータとしては、アルミニウム箔、
アルミを蒸着した樹脂フィルム等を使用することができ
る。使用時(即ち有機EL素子への組付時)には、ゲル
部材3の一面側のセパレータを剥がし、ゲル部材3自体
の有する粘着性を利用してゲル部材3の一面側を封止部
材4に貼り付けた後、他面側のセパレータを剥がす方法
によれば、封止部材4にゲル部材3を手際よく配置する
ことができる。
This organic EL device can be manufactured, for example, by the following method. As shown in FIG.
With the opening of the sealing member 4 facing upward, the uncured adhesive 5 ′ is arranged on the peripheral edge 42 to be joined to the transparent substrate 1. Next, as shown in FIG. 6B, the gel member 3 formed in a sheet shape in advance is placed on the inner upper surface of the sealing member 4. As the gel member 3, an uncured gel composition obtained by mixing an uncured gel component and an adsorbent powder is prepared by a casting method.
A sheet obtained by forming a sheet by a direct coating method or the like and curing it by heating or the like can be used.
The molded gel member 3 is stored sandwiched between separators that do not allow moisture or the like to pass therethrough in order to prevent deactivation of the adsorbent. Aluminum foil,
A resin film or the like on which aluminum is deposited can be used. At the time of use (that is, at the time of assembling to the organic EL element), the separator on one side of the gel member 3 is peeled off, and one side of the gel member 3 is sealed using the adhesive property of the gel member 3 itself. According to the method of peeling the separator on the other side after sticking to the sealing member 4, the gel member 3 can be arranged on the sealing member 4 efficiently.

【0027】その後、図6(c)に示すように、有機E
L積層膜2の形成された透明基板1を封止部材4に被せ
る。このとき、有機EL積層膜側を上にして配置された
透明基板の上に、ゲル部材を備える封止部材を被せても
よい。本実施例の有機EL素子における(即ち、図5に
示す状態における)有機EL積層膜2と封止部材4の内
側上面との間の距離は1.0mmである。これに対し
て、常態における(即ち、例えば図6(b)に示す状態
における)ゲル部材3の厚みは1.1mmである。この
ような有機EL素子は、封止部材4と透明基板1とを互
いに押しつけてゲル部材3を加圧しながら、紫外線照射
により未硬化の接着剤5’を硬化させて、封止部材4と
透明基板1とを接合する接着部5を形成させることによ
り得られる。このように、接合後における封止部材4の
内側上面と有機EL積層膜2との距離よりも常態ではや
や厚いゲル部材3を使用して、これを加圧しながら透明
基板1と封止部材4接合することにより、ゲル部材3が
有機EL積層膜2及び透明基板1に圧着される。また、
予めシート状に成形されたゲル部材3が有機EL積層膜
2等の凹凸に沿って変形し、その周縁部3aを接着部5
と有機EL積層膜2との間に位置する透明基板1に接触
させて、有機EL積層膜2を一次封止することができ
る。これにより、有機EL積層膜2を水分等から保護す
る効果が高められる。
Thereafter, as shown in FIG.
The transparent substrate 1 on which the L laminated film 2 is formed is put on the sealing member 4. At this time, a sealing member provided with a gel member may be placed on the transparent substrate arranged with the organic EL laminated film side up. The distance between the organic EL laminated film 2 and the inner upper surface of the sealing member 4 in the organic EL element of this embodiment (that is, in the state shown in FIG. 5) is 1.0 mm. On the other hand, the thickness of the gel member 3 in a normal state (that is, in the state shown in FIG. 6B, for example) is 1.1 mm. In such an organic EL element, while the sealing member 4 and the transparent substrate 1 are pressed against each other and the gel member 3 is pressed, the uncured adhesive 5 ′ is cured by irradiating ultraviolet rays to form the sealing member 4 and the transparent member 1. It is obtained by forming an adhesive portion 5 for bonding to the substrate 1. As described above, the gel member 3 which is slightly thicker than the distance between the inner upper surface of the sealing member 4 and the organic EL laminated film 2 after bonding is used, and the transparent substrate 1 and the sealing member 4 are pressed while pressing. By joining, the gel member 3 is pressed against the organic EL laminated film 2 and the transparent substrate 1. Also,
The gel member 3 previously formed into a sheet shape is deformed along the unevenness of the organic EL laminated film 2 and the like, and the peripheral portion 3 a is bonded to the bonding portion 5.
The organic EL laminated film 2 can be primarily sealed by bringing it into contact with the transparent substrate 1 located between the organic EL laminated film 2 and the organic EL laminated film 2. Thereby, the effect of protecting the organic EL laminated film 2 from moisture and the like is enhanced.

【0028】実施例3の構成では、ゲル部材3が有機E
L積層膜2と金属製の封止部材4との双方に広面積で密
着している。従って、ゲル部材3により有機EL積層膜
から発生する熱を分散させて(ヒートスプレッド効果)
有機EL積層膜2の局所的な熱劣化を防止し、またこの
熱を封止部材4から放散させる(ヒートシンク効果)こ
とができる。これにより、有機EL素子の耐久性、輝度
等の性能が向上する。ここで「ヒートスプレッド」と
は、有機EL素子の一部(例えば発光部分)で集中的に
発生した熱を分散させることをいう。この有機EL素子
は、予め成形されたシート状体としてのゲル部材3を有
機EL積層膜2上に配置することにより製造される。従
って、ゲル部材3を成形(硬化)させる際の熱により有
機EL積層膜2がダメージを受けることはないという利
点がある。
In the structure of the third embodiment, the gel member 3 is made of organic E
It is in close contact with both the L laminated film 2 and the metal sealing member 4 over a wide area. Therefore, the heat generated from the organic EL laminated film is dispersed by the gel member 3 (heat spread effect).
Local thermal deterioration of the organic EL laminated film 2 can be prevented, and this heat can be dissipated from the sealing member 4 (heat sink effect). Thereby, performance such as durability and luminance of the organic EL element is improved. Here, “heat spread” refers to dispersing heat intensively generated in a part (for example, a light emitting part) of the organic EL element. This organic EL element is manufactured by arranging a gel member 3 as a sheet-like body formed in advance on the organic EL laminated film 2. Therefore, there is an advantage that the organic EL laminated film 2 is not damaged by the heat when the gel member 3 is formed (cured).

【0029】尚、図7に示すように、透明基板に対向す
る面に凹部41を設けたガラス製の封止部材4を使用し
てもよい。この封止部材4は、ガラス板の中央部に切
削、エッチング、サンドブラスト等により凹部41を形
成して作製することができる。
As shown in FIG. 7, a glass sealing member 4 having a concave portion 41 on the surface facing the transparent substrate may be used. The sealing member 4 can be manufactured by forming a concave portion 41 in the center of a glass plate by cutting, etching, sandblasting, or the like.

【0030】(実施例4)実施例4の有機EL素子を図
8に示す。ゲル部材3は、予め成形されたシート状体で
あって、吸着剤31を内包し有機EL積層膜2側に位置
する第1のゲル部材33(厚さ500μm)と、ゲル成
分32のみからなり封止部材4側に位置する第2のゲル
部材34(厚さ600μm)とからなる。第1のゲル部
材33及び第2のゲル部材34はいずれもシート状であ
り、これらの部材自体が有する粘着性を利用して両部材
を貼り合わせることによりゲル部材3が作製される。
尚、第1のゲル部材33の表面に第2のゲル部材用の未
硬化ゲル部材をキャスティングして硬化させる等の方法
によりゲル部材3を作製してもよい。この実施例4で
は、ゲル部材3の周縁部3aは透明基板1に接触してい
るが、必ずしも接触していなくてもよい。その他の部分
の構成は実施例3と同様である。
Example 4 FIG. 8 shows an organic EL device of Example 4. The gel member 3 is a sheet-like body formed in advance, and includes only a first gel member 33 (500 μm in thickness) including an adsorbent 31 and located on the organic EL laminated film 2 side, and a gel component 32. The second gel member 34 (600 μm in thickness) is located on the sealing member 4 side. The first gel member 33 and the second gel member 34 are both sheet-shaped, and the gel member 3 is manufactured by bonding both members using the adhesiveness of these members themselves.
The gel member 3 may be manufactured by casting an uncured gel member for the second gel member on the surface of the first gel member 33 and curing the gel member. In the fourth embodiment, the peripheral portion 3a of the gel member 3 is in contact with the transparent substrate 1, but is not necessarily required to be in contact. Other configurations are the same as those of the third embodiment.

【0031】このように、一面側の吸湿剤濃度が他面側
よりも高いゲル部材3を、吸着剤濃度の高い側が有機E
L積層膜側となるように配置することにより、有機EL
素子2側においては第1のゲル部材(吸着層)33によ
り高い吸着性能を発揮し、封止部材4側においては第2
のゲル部材(応力吸収層)34により優れた応力吸収性
を得ることができる。また、少量の吸着剤31により有
機EL素子2を水分等から効率よく保護することができ
る。
As described above, the gel member 3 on one side having a higher concentration of the moisture absorbent than the other side is used, and the gel member 3 on the side having the higher adsorbent concentration is the organic E
By arranging it so as to be on the L laminated film side, the organic EL
The first gel member (adsorption layer) 33 exhibits higher adsorption performance on the element 2 side, and the second gel member (adsorption layer) 33 on the sealing member 4 side.
With the gel member (stress absorbing layer) 34 of the above, excellent stress absorbing properties can be obtained. Further, the organic EL element 2 can be efficiently protected from moisture and the like by a small amount of the adsorbent 31.

【0032】尚、図9に示すように、第1のゲル部材3
3と第2のゲル部材34との間に、ガスバリア性、ヒー
トスプレッド性、形状保持性等を高める目的で、厚さ1
8μm程度のアルミニウム等からなる金属箔35を挟ん
でもよい。この金属箔35により、ゲル部材3のガスバ
リア性及びヒートスプレッド性が向上する。また、ゲル
部材3の形状保持性が高まるので組付作業性が向上す
る。また、上記実施例で使用した第2のゲル部材34は
吸着剤を内包しないが、第1のゲル部材に比べて低い濃
度であれば、吸着剤を内包する第2のゲル部材を用いて
もよい。一面側の吸湿剤濃度が他面側よりも高いシート
状のゲル部材を得る他の方法としては、キャスティング
された未硬化ゲル組成物中で吸着剤を沈降させてからゲ
ル成分を硬化させる方法が挙げられる。
As shown in FIG. 9, the first gel member 3
In order to enhance gas barrier properties, heat spread properties, shape retention properties, and the like, a thickness of 1
A metal foil 35 of about 8 μm made of aluminum or the like may be interposed. The metal foil 35 improves the gas barrier property and the heat spread property of the gel member 3. In addition, since the shape retention of the gel member 3 is enhanced, the workability in assembling is improved. Further, the second gel member 34 used in the above embodiment does not include the adsorbent, but if the concentration is lower than that of the first gel member, the second gel member 34 including the adsorbent may be used. Good. As another method of obtaining a sheet-like gel member in which the moisture absorbent concentration on one side is higher than that on the other side, a method in which the adsorbent is allowed to settle in the cast uncured gel composition and then the gel component is cured. No.

【0033】(実施例5)実施例5の有機EL素子を図
10に示す。封止部材4は、アルミダイキャスト又は鍛
造等により作製され、その内側底面(有機EL積層膜
側)には、互いに平行に延びる複数の畝部451からな
るヒートシンク部45が形成されている。各畝部451
の縦断面はV字状であり、これらの畝部451がゲル部
材3と広面積で接触することによりゲル部材3から封止
部材4への熱伝導が効率よく行われる。また、この畝部
451は、ゲル部材3に加えられる応力を分散させる機
能をも有する。一方、封止部材4の外側底面(反有機E
L積層膜側)には、互いに平行に延びる複数の放熱フィ
ン461からなる放熱部46が形成されている。このよ
うな構成とすることにより、ゲル部材3からヒートシン
ク部45に伝えられた熱を、放熱部46から効率よく放
散させることができる。
Example 5 FIG. 10 shows an organic EL device of Example 5. The sealing member 4 is manufactured by aluminum die casting, forging, or the like, and a heat sink portion 45 including a plurality of ridge portions 451 extending parallel to each other is formed on an inner bottom surface (the organic EL laminated film side). Each ridge 451
Has a V-shaped vertical section, and heat conduction from the gel member 3 to the sealing member 4 is efficiently performed by contacting these ridges 451 with the gel member 3 over a wide area. The ridge 451 also has a function of dispersing the stress applied to the gel member 3. On the other hand, the outer bottom surface of the sealing member 4 (anti-organic E
On the L laminated film side), a heat radiating portion 46 including a plurality of heat radiating fins 461 extending in parallel with each other is formed. With this configuration, the heat transmitted from the gel member 3 to the heat sink 45 can be efficiently dissipated from the heat radiator 46.

【0034】[0034]

【発明の効果】本発明の有機EL素子は、吸着剤を内包
したゲル部材により有機EL積層膜を被覆している。従
って、吸着剤を内包しない従来のゲル被覆体により被覆
した場合に比べて、有機EL積層膜を水分等から遮断す
る効果に優れる。また、吸着剤を含まない層を介して吸
湿シートを配置する従来技術等とは異なり、本発明の有
機EL素子では、吸着剤を内包するゲル部材と有機EL
積層膜とが直接接触しているので、ゲル部材に侵入した
水分等が有機EL積層膜に到達する前に、この水分等を
ゲル部材中の吸着剤により確実に除去することができ
る。更に、ゲル部材の有機EL積層膜側における吸着剤
密度を高くすることにより、有機EL積層膜側では高い
吸着性能を有し、封止部材側では優れた応力吸収性を発
揮するゲル部材とすることができる。有機EL積層膜側
の吸着剤密度を高くすることにより、ゲル部材の全体に
吸着剤を均一に分散させた場合に比べて、少量の吸着剤
により有機EL積層膜を水分等から効率よく保護するこ
とができる。本発明の有機EL素子に用いられるゲル部
材は、不活性気体等に比べて熱伝導性が高いことから、
このゲル部材を有機EL素子に直接接触させて配置する
ことにより、有機EL素子を水分等から保護する効果と
ともに、有機EL素子から発生する熱を分散させて局所
的な熱劣化を防止する効果も得られる。
As described above, the organic EL device of the present invention covers the organic EL laminated film with a gel member containing an adsorbent. Therefore, as compared with the case where the organic EL laminated film is covered with the conventional gel covering material which does not include the adsorbent, the effect of shielding the organic EL laminated film from moisture and the like is excellent. Further, unlike the prior art in which a moisture absorbing sheet is disposed via a layer containing no adsorbent, the organic EL device of the present invention includes a gel member containing an adsorbent and an organic EL device.
Since the laminated film is in direct contact with the organic EL laminated film, the moisture and the like that have entered the gel member can be reliably removed by the adsorbent in the gel member before reaching the organic EL laminated film. Further, by increasing the adsorbent density on the organic EL laminated film side of the gel member, the gel member has high adsorption performance on the organic EL laminated film side and exhibits excellent stress absorption on the sealing member side. be able to. By increasing the adsorbent density on the organic EL laminated film side, the organic EL laminated film is efficiently protected from moisture and the like by a small amount of adsorbent, as compared with the case where the adsorbent is uniformly dispersed throughout the gel member. be able to. Since the gel member used in the organic EL device of the present invention has a higher thermal conductivity than an inert gas or the like,
By arranging the gel member in direct contact with the organic EL element, it has an effect of protecting the organic EL element from moisture and the like, and also has an effect of dispersing heat generated from the organic EL element to prevent local thermal deterioration. can get.

【0035】また、不活性「液体」等に吸着剤を分散さ
せたものを用いた場合には、経時によりこの不活性液体
が有機EL積層膜中に侵入して発光性能等に悪影響を及
ぼしたり、不活性液体の流動にともない有機EL積層膜
に対して吸着剤が移動し、その際に吸着剤が有機EL積
層膜を擦って傷つけたりする場合がある。更に、不活性
液体中における吸着剤の存在位置が定まらず、有機EL
素子の設置方向によっては吸着剤が有機EL膜から遠い
側に沈降して所望の吸着性能が得られなくなる。本発明
の有機EL素子では、吸着剤はゲル部材中に固定されて
いるので、上記のような問題が生じることはない。
When an adsorbent is dispersed in an inert "liquid" or the like, the inert liquid penetrates into the organic EL laminated film over time and adversely affects the light emission performance or the like. When the inert liquid flows, the adsorbent moves with respect to the organic EL laminated film, and at that time, the adsorbent may rub the organic EL laminated film and damage the organic EL laminated film. Further, the position of the adsorbent in the inert liquid is not determined, and the organic EL
Depending on the installation direction of the element, the adsorbent sediments to a side far from the organic EL film, and a desired adsorption performance cannot be obtained. In the organic EL device of the present invention, since the adsorbent is fixed in the gel member, the above problem does not occur.

【0036】また、本発明の製造方法によると、液状の
未硬化ゲル組成物で有機EL積層膜を覆った後にこの未
硬化ゲル組成物を硬化させてゲル部材を形成させるの
で、ゲル部材と有機EL積層膜との密着性がよい。これ
により、この有機EL積層膜を水分等から保護する性能
及び有機EL積層膜の発熱を分散する性能に優れた有機
EL素子が得られる。
According to the production method of the present invention, the gel member is formed by covering the organic EL laminated film with the liquid uncured gel composition and then curing the uncured gel composition to form a gel member. Good adhesion to the EL laminated film. As a result, an organic EL element having excellent performance of protecting the organic EL laminated film from moisture and the like and dispersing heat generated by the organic EL laminated film can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例1の有機EL素子を示す縦断面図であ
る。
FIG. 1 is a longitudinal sectional view showing an organic EL device of Example 1.

【図2】実施例1の有機EL素子の製造方法を示す縦断
面図である。
FIG. 2 is a longitudinal sectional view illustrating a method for manufacturing the organic EL element of Example 1.

【図3】実施例2の有機EL素子を示す縦断面図であ
る。
FIG. 3 is a longitudinal sectional view showing an organic EL device of Example 2.

【図4】実施例2の変形例の有機EL素子を示す縦断面
図である。
FIG. 4 is a longitudinal sectional view showing an organic EL element according to a modification of the second embodiment.

【図5】実施例3の有機EL素子を示す縦断面図であ
る。
FIG. 5 is a longitudinal sectional view showing an organic EL device of Example 3.

【図6】実施例3の有機EL素子の製造方法を示す縦断
面図である。
FIG. 6 is a longitudinal sectional view illustrating the method for manufacturing the organic EL element of Example 3.

【図7】実施例3の変形例の有機EL素子を示す縦断面
図である。
FIG. 7 is a longitudinal sectional view showing an organic EL element according to a modification of the third embodiment.

【図8】実施例4の有機EL素子を示す縦断面図であ
る。
FIG. 8 is a longitudinal sectional view showing an organic EL device of Example 4.

【図9】実施例4の変形例の有機EL素子を示す縦断面
図である。
FIG. 9 is a longitudinal sectional view showing an organic EL element according to a modification of the fourth embodiment.

【図10】実施例5の変形例の有機EL素子を示す縦断
面図である。
FIG. 10 is a vertical sectional view showing an organic EL element according to a modification of the fifth embodiment.

【符号の説明】[Explanation of symbols]

1;透明基板、2;有機EL積層膜、3;ゲル部材、3
1;吸着剤、32;ゲル成分、33;第1のゲル部材、
34;第2のゲル部材、35;金属箔、4;封止部材、
5;接着部
1; transparent substrate, 2; organic EL laminated film, 3; gel member, 3
1; adsorbent, 32; gel component, 33; first gel member,
34; second gel member, 35; metal foil, 4; sealing member,
5; adhesive part

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 有機EL積層膜が形成された透明基板
と、吸着剤を内包しており前記有機EL積層膜を被覆す
るゲル部材と、前記透明基板に接合されて前記有機EL
積層膜を封止する封止部材と、を備えることを特徴とす
る有機EL素子。
1. A transparent substrate having an organic EL laminated film formed thereon, a gel member containing an adsorbent and covering the organic EL laminated film, and the organic EL laminated to the transparent substrate.
And a sealing member for sealing the laminated film.
【請求項2】 前記ゲル部材は予め成形されたシート状
体である請求項1記載の有機EL素子。
2. The organic EL device according to claim 1, wherein the gel member is a sheet formed in advance.
【請求項3】 前記ゲル部材を構成するゲル成分はシリ
コーンゲルである請求項1又は2記載の有機EL素子。
3. The organic EL device according to claim 1, wherein the gel component constituting the gel member is a silicone gel.
【請求項4】 請求項1記載の有機EL素子の製造方法
であって、未硬化のゲル成分と前記吸着剤とを含有する
未硬化ゲル組成物により前記有機EL積層膜を被覆し、
その後、前記未硬化ゲル組成物中において前記吸着剤を
前記有機EL積層膜側に沈降させ、次いで、前記未硬化
のゲル成分を硬化させて前記未硬化ゲル組成物から前記
ゲル部材を形成させることを特徴とする有機EL素子の
製造方法。
4. The method for producing an organic EL device according to claim 1, wherein the organic EL laminated film is coated with an uncured gel composition containing an uncured gel component and the adsorbent,
Then, the adsorbent is allowed to settle on the organic EL laminated film side in the uncured gel composition, and then the uncured gel component is cured to form the gel member from the uncured gel composition. A method for producing an organic EL device, comprising:
JP23674899A 1999-08-24 1999-08-24 Organic el element, and manufacture thereof Pending JP2001068266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23674899A JP2001068266A (en) 1999-08-24 1999-08-24 Organic el element, and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23674899A JP2001068266A (en) 1999-08-24 1999-08-24 Organic el element, and manufacture thereof

Publications (1)

Publication Number Publication Date
JP2001068266A true JP2001068266A (en) 2001-03-16

Family

ID=17005213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23674899A Pending JP2001068266A (en) 1999-08-24 1999-08-24 Organic el element, and manufacture thereof

Country Status (1)

Country Link
JP (1) JP2001068266A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179197A (en) * 2001-09-21 2003-06-27 Eastman Kodak Co High humidity sensitive electronic device element
JP2003203763A (en) * 2001-12-28 2003-07-18 Delta Optoelectronics Inc Housing structure with multi-layer sealing layer
US6673436B2 (en) 2000-05-17 2004-01-06 Dynic Corporation Moisture absorbing formed article
WO2006002405A2 (en) * 2004-06-24 2006-01-05 Eastman Kodak Company Oled display having thermally conductive material
US7063902B2 (en) 2003-03-03 2006-06-20 Hitachi, Ltd. Organic electroluminescence display device
JP2006236999A (en) * 2005-02-22 2006-09-07 Lg Electronics Inc Organic el device amd its manufacturing method
US7205718B2 (en) 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive adhesive
WO2008144080A1 (en) * 2007-05-18 2008-11-27 Henkel Ag & Co. Kgaa Organic electronic devices protected by elastomeric laminating adhesive
WO2009139291A1 (en) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 Organic el panel manufacturing method and manufacturing device
WO2009139292A1 (en) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 Organic el light emitting device and process for producing the organic el light emitting device
US7999469B2 (en) * 2008-03-31 2011-08-16 Hitachi Displays, Ltd. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
WO2011108020A1 (en) * 2010-03-01 2011-09-09 パナソニック株式会社 Organic el device and method for manufacturing same
US9698379B2 (en) 2012-01-06 2017-07-04 Lg Chem, Ltd. Encapsulation film
US9780334B2 (en) 2014-03-12 2017-10-03 Panasonic Corporation Organic EL device having a hygroscopic layer
US9799850B2 (en) 2014-03-12 2017-10-24 Panasonic Corporation Organic EL device

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6673436B2 (en) 2000-05-17 2004-01-06 Dynic Corporation Moisture absorbing formed article
JP2003179197A (en) * 2001-09-21 2003-06-27 Eastman Kodak Co High humidity sensitive electronic device element
JP2003203763A (en) * 2001-12-28 2003-07-18 Delta Optoelectronics Inc Housing structure with multi-layer sealing layer
US7063902B2 (en) 2003-03-03 2006-06-20 Hitachi, Ltd. Organic electroluminescence display device
US7205718B2 (en) 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive adhesive
WO2006002405A3 (en) * 2004-06-24 2006-07-20 Eastman Kodak Co Oled display having thermally conductive material
US7205717B2 (en) 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive material
WO2006002405A2 (en) * 2004-06-24 2006-01-05 Eastman Kodak Company Oled display having thermally conductive material
JP2006236999A (en) * 2005-02-22 2006-09-07 Lg Electronics Inc Organic el device amd its manufacturing method
JP4499672B2 (en) * 2005-02-22 2010-07-07 エルジー ディスプレイ カンパニー リミテッド Organic EL device and manufacturing method thereof
US7825583B2 (en) 2005-02-22 2010-11-02 Lg Display Co., Ltd. Organic electroluminescence display and method for manufacturing the same
WO2008144080A1 (en) * 2007-05-18 2008-11-27 Henkel Ag & Co. Kgaa Organic electronic devices protected by elastomeric laminating adhesive
US8858287B2 (en) 2008-03-31 2014-10-14 Japan Display Inc. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
US10326104B2 (en) 2008-03-31 2019-06-18 Samsung Display Co., Ltd. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
US9991466B2 (en) 2008-03-31 2018-06-05 Japan Display Inc. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
US7999469B2 (en) * 2008-03-31 2011-08-16 Hitachi Displays, Ltd. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
US9484551B2 (en) 2008-03-31 2016-11-01 Japan Display Inc. Organic EL display provided with gel-state encapsulant incorporating a desiccant and a high molecular-weight medium
JPWO2009139291A1 (en) * 2008-05-12 2011-09-22 財団法人山形県産業技術振興機構 Manufacturing method and manufacturing apparatus for organic EL light emitting panel
WO2009139292A1 (en) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 Organic el light emitting device and process for producing the organic el light emitting device
US8563112B2 (en) 2008-05-12 2013-10-22 Yamagata Promotional Organization For Industrial Technology Organic EL light-emitting device and method for manufacturing the organic EL light-emitting device
JPWO2009139292A1 (en) * 2008-05-12 2011-09-22 コイズミ照明株式会社 Organic EL light emitting device and method for manufacturing the same
WO2009139291A1 (en) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 Organic el panel manufacturing method and manufacturing device
US8604490B2 (en) 2010-03-01 2013-12-10 Panasonic Corporation Organic light-emitting device and method of manufacturing the same
WO2011108020A1 (en) * 2010-03-01 2011-09-09 パナソニック株式会社 Organic el device and method for manufacturing same
CN102326448A (en) * 2010-03-01 2012-01-18 松下电器产业株式会社 Organic EL device and method for manufacturing same
US9698378B2 (en) 2012-01-06 2017-07-04 Lg Chem, Ltd. Encapsulation film
US9806293B2 (en) 2012-01-06 2017-10-31 Lg Chem, Ltd. Encapsulation film
US10141543B2 (en) 2012-01-06 2018-11-27 Lg Chem, Ltd. Method for manufacturing electronic device
US9698379B2 (en) 2012-01-06 2017-07-04 Lg Chem, Ltd. Encapsulation film
EP2801476B1 (en) * 2012-01-06 2022-03-02 LG Chem, Ltd. Encapsulation film
US9799850B2 (en) 2014-03-12 2017-10-24 Panasonic Corporation Organic EL device
US9780334B2 (en) 2014-03-12 2017-10-03 Panasonic Corporation Organic EL device having a hygroscopic layer

Similar Documents

Publication Publication Date Title
JP2001068266A (en) Organic el element, and manufacture thereof
KR101543888B1 (en) Metal encapsulation with excellent heat emission property, the method for preparing thereof and flexible device packaged by the same
CN104091890B (en) A kind of organic luminescent device, organic light-emitting display device
JP5144041B2 (en) ORGANIC ELECTROLUMINESCENT LIGHT EMITTING DEVICE AND ORGANIC ELECTROLUMINESCENT LIGHTING DEVICE
TWI389271B (en) Package of environmental sensitive element and packaging method using the same
JP4204781B2 (en) Electroluminescent device
US7083866B2 (en) Organic electroluminescent device and method for fabricating same
JP5362948B2 (en) ORGANIC ELECTROLUMINESCENT LIGHT EMITTING DEVICE AND ORGANIC ELECTROLUMINESCENT LIGHTING DEVICE
US6717052B2 (en) Housing structure with multiple sealing layers
WO2016086535A1 (en) Oled packaging structure and packaging method therefor
TWI271833B (en) Packaging structure of display device and method thereof
JP4810587B2 (en) Light emitting display device and manufacturing method thereof
TW200906210A (en) Organic EL panel and method for producing the same
JP2007200845A (en) Organic electroluminescent display
CN204045622U (en) LED packaging
WO2016045250A1 (en) Oled display panel and encapsulating method thereof, and oled display device
WO2005122644A1 (en) Organic semiconductor element
JP2003123966A (en) Sealing and forming method of display element
US8866181B2 (en) Method for producing a component with at least one organic material and component with at least one organic material
US9660222B2 (en) Light-emitting device and method for manufacturing the same
KR20070089845A (en) Organic electroluminescent light source
US8847269B2 (en) Organic light-emitting device
KR100683674B1 (en) An organic electro luminescent device and a method for preparing the same
JP2006210095A (en) Organic el panel
DE102004049955B4 (en) Method for producing an optical component, in particular an OLED