JP2001068181A - Memory module conversion connector and information processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To substitutionally use a DIMM in a device using an SIMM by connecting two SIMM connectors and one DIMM. SOLUTION: A DIMM receiving part 11 has grooves 15 having contact part 16 corresponding to the number of signals on both sides, and when a DIMM 40 is inserted, the contact parts 16 come in contact with contact parts 41 installed on both sides of the tip part of the DIMM 40 of the same number as the contact part 16 to be electrically connected, and a signal is transmitted. DIMM guide parts 12 are formed at the opposite ends of the DIMM receiving part 11. SIMM substitutional inserting parts 13, 14 are installed on the opposite sides of the DIMM receiving part 11, have contacts parts 178, 18 corresponding to the number of signals on one side at each tip, and are inserted into grooves 34 of grooves 33, 32 of an SIMM connector to be mounted on a board 50 to transmit a signal. Contact parts 35, 36 of the same number as the contact parts 17 are installed in the grooves 33, 34 of the SIMM connectors 31, 32, and come in contact with contact part 17, 18 of the SIMM substitutional inserting parts 13, 14 to be electrically connected and to transmit a signal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory module conversion connector and an information processing device, and more particularly to a memory module conversion for converting two single in-line memory modules (abbreviated as SIMM) and one dual in-line memory module (abbreviated as DIMM). The present invention relates to a connector and an information processing device equipped with the memory module conversion connector.

[0002]

2. Description of the Related Art As storage means such as a main memory of an information processing apparatus, a memory module which can be easily replaced or added is widely used. The memory module is a relatively small board made so that one side can be inserted and connected to a connector, and has several to several tens of memory chips mounted thereon, and is mounted on a board in an information processing device. Because it can be mounted on the connector, it can be easily attached and detached. By mounting a plurality of memory chips, a data width such as 32 bits or 64 bits is provided, and one to several pieces are set as one set as an access data width of a main memory of each information processing apparatus. Can be easily added or reconfigured in units of the above set.

At present, there are two types of memory modules: a single in-line memory module (SIMM) in which signals connected to a connector are arranged in one row, and a dual in-line memory module (DIMM) in which signals are connected in two rows. DIMMs can handle twice as many signals as SIMMs.
Has twice the data width. The data width and storage capacity of main memory and memory chips are increasing in line with rapid advances in technology, and memory modules with a low unit cost are being made one after another. Users can select appropriate ones from various types of memory modules. You can choose.

[0004] On the other hand, an information processing device that mounts a memory module determines which specification of a memory module to use depending on the situation expected at the time of development. Since it is difficult to make the data width variable in the information processing apparatus, the data width is fixed, and the number of memory chips to be mounted and the capacity of the memory chips are changed so that the memory module can support a memory module having several storage capacities.

[0005]

Recently, DIMMs have been increasing in place of SIMMs, and the tendency is particularly strong in information processing apparatuses that implement a large-capacity main memory. Therefore, many of the newly introduced devices adopt the DIMM, and the SIMM and the DIMM are compared with the conventional SIMM-based device.
There is a problem that the incompatibility between them and the use of relatively expensive memory modules is limited.

Specifically, first, when an information processing apparatus employing a SIMM is purchased and a main memory is added or reconfigured after a lapse of years, the SIMM that meets the specifications is already outdated. If this happens, the production volume and distribution volume will decline, making it difficult to obtain.
There was a problem that I had to purchase an IMM.

Second, when replacing an information processing apparatus,
Even if the data width for the memory of the device is the same, if the information processing device before replacement employs SIMM and the information processing device after replacement employs DIMM, The existing SIMM cannot be reused in the new information processing device after the replacement, and a new expensive DIMM must be purchased when the SIMM is added.

An object of the present invention is to provide a memory module conversion connector for solving the above-mentioned problems.

[0009]

A first memory module conversion connector according to the present invention comprises two SIMM connectors and one SIMM connector.
It has a structure for connecting two DIMMs.

A second memory module conversion connector according to the present invention comprises: a DIMM receiving portion provided with a groove having a plurality of contact portions for inserting a DIMM and transmitting a signal;
It has a DIMM guide portion provided at both ends of the MM receiving portion, and a first SIMM alternative inserting portion and a second SIMM alternative inserting portion which are provided on both sides of the DIMM receiving portion and can be respectively inserted into SIMM connectors.

A third memory module conversion connector according to the present invention comprises: a DIMM receiving portion provided with a groove having a plurality of contact portions for inserting a DIMM and transmitting a signal;
A DIMM guide portion provided at both ends of the MM receiving portion, a first SIMM replacement insertion portion and a second SIMM replacement insertion portion provided at both sides of the DIMM reception portion, each of which can be inserted into a SIMM connector; 1 and a control signal group and an address signal group of the SIMM alternative insertion unit
Means for connecting each of the control signal group and the address signal group of the receiving unit, means for connecting the data signal group of the first SIMM replacement insertion unit to the first data signal group of the DIMM receiving unit, Means for connecting a data signal group of the second SIMM replacement insertion section to a second data signal group of the DIMM receiving section.

According to a fourth aspect of the present invention, there is provided a memory module conversion connector comprising: a DIMM receiving portion provided with a groove having a plurality of contact portions for inserting a DIMM and transmitting a signal;
A DIMM guide portion provided at both ends of the MM receiving portion, a first SIMM replacement insertion portion and a second SIMM replacement insertion portion provided at both sides of the DIMM reception portion, each of which can be inserted into a SIMM connector; 1 and a control signal group and an address signal group of the SIMM alternative insertion unit
Means for connecting to the control signal group and the address signal group of the receiving section, respectively, and the data signal group and the data parity signal group of the first SIMM replacement insertion section to the first data signal group and the first data group of the DIMM receiving section. Means for connecting to each of the data parity signal groups of the first and second groups, and the data signal group and the data parity signal group of the second SIMM substitute insertion section are connected to the second data signal group and the second data parity signal group of the DIMM receiving section. And means for connecting to each of them.

[0013] The first information processing apparatus of the present invention comprises the first information processing apparatus.
, The second memory module conversion connector, the third memory module conversion connector, or the fourth memory module conversion connector.

[0014] The fifth memory module conversion connector of the present invention has a structure capable of connecting one DIMM connector and two SIMMs.

A sixth memory module conversion connector according to the present invention comprises a first SIMM receiving portion and a second SIMM receiving portion provided with grooves each having a plurality of contact portions for inserting a SIMM and transmitting a signal. A SIMM guide section provided at both ends of the first SIMM receiving section and the second SIMM receiving section; and a SIMM guide section provided between the first SIMM receiving section and the second SIMM receiving section. D
An IMM alternative insert.

A seventh memory module conversion connector according to the present invention comprises a first SIMM receiving portion and a second SIMM receiving portion provided with grooves having a plurality of contact portions for inserting a SIMM and transmitting a signal. A SIMM guide section provided at both ends of the first SIMM receiving section and the second SIMM receiving section; and a SIMM guide section provided between the first SIMM receiving section and the second SIMM receiving section. D
An IMM replacement insertion unit, a control signal group and an address signal group of the DIMM replacement insertion unit, a control signal group and an address signal group of the first SIMM receiving unit, and a control signal group and an address signal of the second SIMM receiving unit A first data signal group of the DIMM alternative insert section to a data signal group of the first SIMM receiving section; and a second data section of the DIMM alternative insert section. Means for connecting the signal group to the data signal group of the second SIMM receiving section.

An eighth memory module conversion connector according to the present invention comprises a first SIMM receiving portion and a second SIMM receiving portion provided with grooves having a plurality of contact portions for transmitting a signal by inserting a SIMM. A SIMM guide section provided at both ends of the first SIMM receiving section and the second SIMM receiving section; and a SIMM guide section provided between the first SIMM receiving section and the second SIMM receiving section. D
An IMM replacement insertion unit, a control signal group and an address signal group of the DIMM replacement insertion unit, a control signal group and an address signal group of the first SIMM receiving unit, and a control signal group and an address signal of the second SIMM receiving unit And a first data signal group and a first data parity signal group of the DIMM replacement insertion section are connected to the first S
Means for connecting to the data signal group and the data parity signal group of the IMM receiving unit, respectively, and the second data signal group and the second data parity signal group of the DIMM replacement insertion unit to the data of the second SIMM receiving unit Means for connecting to each of the signal group and the data parity signal group.

According to a ninth memory module conversion connector of the present invention, a first SIMM receiving portion and a second SIMM receiving portion each having a groove having a plurality of contact portions for inserting a SIMM and transmitting a signal. A SIMM guide section provided at both ends of the first SIMM receiving section and the second SIMM receiving section; and a SIMM guide section provided between the first SIMM receiving section and the second SIMM receiving section. D
An IMM replacement insertion unit, a control signal group and an address signal group of the DIMM replacement insertion unit, a control signal group and an address signal group of the first SIMM receiving unit, and a control signal group and an address signal of the second SIMM receiving unit A first data signal group of the DIMM alternative insert section to a data signal group of the first SIMM receiving section; and a second data section of the DIMM alternative insert section. Means for connecting a group of signals to a data signal group of the second SIMM receiving unit, and connecting a part of the group of error correcting code signals of the DIMM substitute inserting unit to the group of error correcting code signals of the first SIMM receiving unit Means for replacing the error correction code signal group of the DIMM substitute insertion section with the second SI
Means for connecting to a part of the error correction code signal group of the MM receiving unit.

The second information processing apparatus of the present invention has the fifth, sixth, seventh, eighth, or ninth memory module conversion connector.

[0020]

Next, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a memory module conversion connector according to a first embodiment of the present invention, and FIG. 2 is a side view of FIG. FIG. 3 is a diagram showing a connection state of the memory module conversion connector according to the first embodiment, and FIG. 4 is a side view of FIG. The memory module conversion connector 10 includes a DIMM receiving portion 11 for receiving the DIMM 40 when the DIMM 40 is inserted, and two DIMMs for inserting the left and right sides of the DIMM 40 when the DIMM 40 is inserted.
It comprises a guide section 12 and a SIMM replacement insertion section 13 and a SIMM replacement insertion section 14 which are parts to be inserted into the SIMM connector instead of the SIMM.

Next, the connection state will be described in detail.
The DIMM receiving portion 11 has a groove 15 having a number of contact portions 16 on both sides according to a signal, and when the DIMM 40 is inserted,
The contact portions 16 are in contact with and electrically connected to the contact portions 41 provided on both sides of the tip portion of the same number of DIMMs so that signals can be transmitted. The DIMM guide portions 12 are formed on both left and right ends of the DIMM receiving portion 11, respectively.
It is provided to facilitate insertion of the IMM. SI
The MM replacement insertion unit 13 and the SIMM replacement insertion unit 14
Number of contact portions 17 and contact portions 18 provided on both sides of the IMM receiving portion 11 according to a signal on one side of each of the tip portions.
Are inserted into the groove 33 of the SIMM connector 31 and the groove 34 of the SIMM connector 32 mounted on the board 50 to transmit signals. Groove 33 of SIMM connector 31
Are provided with the same number of contact portions 35 as the contact portions 17, and similarly, the same number of contact portions 36 as the contact portions 17 are provided in the grooves 34 of the SIMM connector 32, and these contact portions 35 and the contact portions 36 are provided. The contact part 17 of the SIMM replacement insertion part 13 and the SI
The MM substitute insertion section 14 is in contact with and electrically connected to the contact section 18 of the MM replacement insertion section 14 to transmit a signal.

The above and subsequent contact portions are portions corresponding to the pins of the semiconductor chip (hereinafter, also referred to as pins when only a signal transmitting function is indicated), and are made of thin conductors.
Gold plating or tin plating is often applied to keep the contact resistance low. The form of the contact portion may be any other form as long as it has a function of transmitting a signal. SIMM replacement insertion unit 13 and SIMM replacement insertion unit 14
Are the SIMM connectors 31, 3 mounted on the board 50.
In this case, the height should be as low as possible, which is advantageous for mounting. Although not shown, DIM
It is also effective to attach a mechanism for locking the DIMM to or near the DIMM guide portion 12 in order to prevent the M40 from dropping off.

As described above, the SIMM connectors 31, 32
By mounting the memory module conversion connector 10 on the information processing apparatus on which the board 50 on which is mounted is mounted, it is possible to easily replace two SIMMs with one DIMM. Although only two SIMM connectors are mounted on the board 50 in the figure, many SIMM connectors may be mounted on the board 50 when a large-capacity main memory is realized. Accordingly, a large number of memory module conversion connectors 10 can be mounted, but whether to mount the memory module conversion connector 10 may be determined based on the number of DIMMs and SIMMs.

Next, signals of the memory module will be described. A memory module such as a SIMM or a DIMM has signals of a control signal line, an address signal line, and a data signal line for controlling read / write, timing, and the like, and provides a main storage function or the like by using one to several sets as constituent units. . Memory modules used in fields where reliability is required
Some memory modules provided with data parity for detecting data abnormalities or used in fields requiring higher availability include an error correction code (hereinafter abbreviated as ECC). It is known that a parity is provided in a bit unit of a fixed data only when an abnormality of data is detected, and that an ECC is provided when an error is detected and corrected. For example, when 1-bit parity is provided in 8-bit units, 4-bit parity bits are required for 32-bit data, and 8-bit parity is required for double 64-bit data. In the case of an ECC that detects an error and corrects a 1-bit error, an ECC of 7 bits or more is required for 32-bit data including error detection of an ECC added thereto and 1-bit error correction. Similarly, for double data of 64 bits, 8 bits or more, which is 1 bit larger, including ECC, may be used.

Next, connection of signals according to the first embodiment of the present invention will be described. The memory module conversion connector 10 is connected as shown in FIGS. 3 and 4, and the data width on the substrate 50 is 64 bits, the data width of the SIMM is 32 bits, and the data width of the DIMM is 64 bits. Substrate 5
From 0 through the SIMM connectors 31 and 32, the k-bit control signal line c (0 to k-1) and the m-bit address signal line a (0 to m-1) are replaced with the SIMM replacement insertion unit 13 and the SIMM replacement insertion. C (0 to k-1) and a (0
To m−1), and each of the half of the 64-bit data signal line d (0 to 63) and the 8-bit data parity signal line p (0 to 7) d (0 to 31) and p
(0-3) are distributed to the SIMM replacement insertion unit 13, and the other half d (32-63) and p (4-7) are replaced by d (0-31) and p (0-31) of the SIMM replacement insertion unit 13. It is distributed to 3). Here, the data parity signal line is made to correspond to 8 bits of data at a rate of 1 bit, but the correspondence may be other than this. Also, depending on the type of SIMM, there is a case where no data parity is provided, but in this case, it can be considered below that there is no data parity signal line.

FIG. 5 is a diagram showing signal connections of the memory module conversion connector according to the first embodiment. In the memory module conversion connector 10, all of the signal lines of the SIMM replacement insertion section 13 are connected to the DIMM receiving section 11, but since the signal lines of the SIMM replacement insertion section 14 share a control signal line and an address signal line, the data signal Only the line and the data parity signal line are connected to the DIMM receiving unit 11. As for the detailed connection relationship, as shown in FIG. 5, c (0 to k-1) and a (0 to m-1) of the SIMM replacement insertion unit 13 are c (0 to k-1) and a of the DIMM receiving unit 11. (0-m-1), d (0-31) and p of the SIMM replacement insertion unit 13
(0-3) are connected to d (0-31) and p (0-3) of the DIMM receiving unit 11, and d (0-3) of the SIMM replacement insertion unit 14.
(0-31) and p (0-3) are connected to d (32-63) and p (4-7) of the DIMM receiving unit 11, respectively.

As described above, by mounting the memory module conversion connector 10 and one DIMM instead of two SIMMs, the two SIMMs can be replaced with one DIMM.
Can be substituted. In order to enable such a connection, it is necessary that the DIMM has twice or more the number of the SIMMs in the number of data signal lines and the number of the data parity signal lines. However, the DIMM has twice the number of signals as the SIMM. Therefore, it is not a problem in many cases. Although the power supply pin and the ground pin are not shown, the power supply pin and the ground pin are connected between the DIMM receiving section 11 and the SIMM replacement insertion sections 13 and 14.

Next, second and third embodiments of the present invention will be described with reference to the drawings. FIG. 6 is a perspective view of a memory module conversion connector according to the second and third embodiments of the present invention, and FIG. 7 is a side view of FIG. FIG.
FIG. 9 is a diagram for explaining the connection of the memory module conversion connectors according to the second and third embodiments, and FIG. 9 is a side view of FIG. The memory module conversion connector 20 is
A SIMM receiving portion 21 and a SIMM receiving portion 22 for receiving the SIMM when the MM is inserted, and four SIMM guide portions 23 for introducing both the left and right sides of the SIMM when inserting the SIMM; A DIM that is inserted into the DIMM connector instead of the DIMM
And an M alternative insertion unit 24. Note that the memory module conversion connector according to the second embodiment and the memory module conversion connector according to the third embodiment differ only in the connection relationship of signals in the memory module conversion connector 20 as described later. Is the same.

Next, the connection state will be described in detail.
The SIMM receiving portion 21 has a groove 25 having a number of contact portions 27 corresponding to the number of signals, and when the SIMM 61 is inserted, the contact portions 27 make contact with the contact portions 63 provided at the tip portions of the same number of SIMMs. And are electrically connected so that signals can be transmitted. Similarly, the SIMM receiving portion 22 has a groove 26 having a number of contact portions 28 according to the signal, and
When the M62 is inserted, the contact portions 28 have the same number of SIs.
The contact portion 64 provided at the tip of the MM is in contact with and electrically connected to the contact portion 64 so that a signal can be transmitted.
The SIMM guide portions 23 are formed on both left and right ends of the SIMM receiving portions 21 and 22, respectively, and are provided to facilitate insertion of the SIMM.

The DIMM substitute insertion section 24 is provided between the SIMM receiving sections 21 and 22, and has a number of contact sections 29 on both sides of a tip portion thereof in accordance with a signal. The same number of contact portions 72 as the contact portions 29 are provided on both sides of the groove 71 of the DIMM connector 70 mounted on the substrate 80.
When the M substitute insertion section 24 is inserted, the contact section 72 and the contact section 29 come into contact and are electrically connected to transmit a signal.

Each of the above-mentioned contact portions is the same as the contact portion described in the first embodiment of the present invention, and the form of the contact portion may be any other form provided that it has a function of transmitting a signal. Absent. SIMM receiving unit 21 and SIMM receiving unit 22
It is more advantageous to mount the memory module conversion connector 20 as low as possible. Although not shown, SIMM 61 and SIMM 62
It is also effective to attach a SIMM locking mechanism at or near the SIMM guide section 23 to prevent the SIMM from falling off.

As described above, the memory module conversion connector 20 can be easily mounted on the information processing apparatus on which the board 80 on which the DIMM connector 70 is mounted is easily mounted.
One DIMM can be replaced by two SIMMs. Also, the figure shows a state in which only one DIMM connector is mounted on the board 80. However, in order to realize a large-capacity main memory, many DIMM connectors are mounted on the board 80.
0, and many memory module conversion connectors 20 can be mounted. However, whether to mount the memory module conversion connector 20 may be determined based on the number of DIMMs and SIMMs.

Next, connection of signals according to the second and third embodiments of the present invention will be described. The signals of the memory module are as described in the first embodiment. Here, the memory module conversion connector 20 is connected as shown in FIG. 8 and FIG. 9, and the data width on the board 80 is 64 bits, the data width of the SIMM is 32 bits, and the data width of the DIMM is 64 bits. I do.

FIG. 10 is a diagram for explaining signal connection of the memory module conversion connector according to the second embodiment. D
The signal line that the IMM alternative insertion section 24 receives from the substrate 80 is
k-bit control signal line C (0 to k-1), m-bit address signal line a (0 to m-1), 64-bit data signal line d (0 to 63), and 8-bit data The parity signal lines are p (0 to 7), and the signal lines on the two SIMMs 61 and 62 are k-bit control signal lines C (0 to k), respectively.
-1) and an m-bit address signal line a (0 to m-1)
And a 32-bit data signal line d (0 to 31) and a 4-bit data parity signal line p (0 to 3). Although the data parity signal corresponds to 1-bit data parity for 8 bits of data here, any other method may be used. Also, DIMM
Depending on the type, there may be no data parity, but in this case, it may be considered below that there is no data parity signal line.

The DIMM substitute insertion section 24 is inserted into the DIMM connector 70 and connected to the signal lines of the board 80, and these signal lines are connected to the S in the memory module conversion connector 20.
It is distributed to the IMM receiving unit 21 and the SIMM receiving unit 22.
As shown in FIG. 10, the connection relationship between c (0 to k-1) and a (0 to m-1) of the DIMM replacement insertion unit 24 is c (0 to k-1) of the SIMM receiving unit 21 and the SIMM receiving unit 22. ) And a (0-m-1), and the DIMM replacement insertion section 24
D (0-31) and p (0-3) of the SIMM receiving unit 2
1 is connected to d (0 to 31) and p (0 to 3), and DI
D (32 to 63) and p (4 to
7) d (0 to 31) and p (0) of the SIMM receiving unit 22
To 3).

FIG. 11 is a diagram for explaining signal connection of the memory module conversion connector according to the third embodiment. The memory module conversion connector of the third embodiment is the same in appearance as the second embodiment, and differs only in the signal connection inside the memory module conversion connector.
Are used in common with the memory module conversion connector of the second embodiment. The difference is that the memory module conversion connector of the second embodiment supports only data or parity, whereas the memory module conversion connector of the third embodiment supports ECC.

The signal lines received by the DIMM substitute insertion section 24 from the substrate 80 are k-bit control signal lines C (0 to k-1).
, M-bit address signal lines a (0 to m−1), 6
A 4-bit data signal line d (0 to 63) and an 8-bit ECC signal line e (0 to 7) are used. Also, two SIMs
The signal lines on the M61 and M62 sides are respectively a k-bit control signal line C (0 to k-1) and an m-bit address signal line a
(0-m-1) and a 32-bit data signal line d (0-m-1)
31) and a 7-bit ECC signal line e (0 to 6).

The DIMM substitute insertion section 24 is inserted into the DIMM connector 70 and connected to the signal lines of the board 80, and these signal lines are connected to the S in the memory module conversion connector 20.
It is distributed to the IMM receiving unit 21 and the SIMM receiving unit 22.
As for the connection relationship, as shown in FIG. 11, c (0 to k-1) and a (0 to m-1) of the DIMM substitute insertion unit 24 are connected to both the SIMM receiving unit 21 and the SIMM receiving unit 22, and the DI
D (0 to 31) and e (0 to 6) of the MM alternative insertion unit 24
Are d (0-31) and e (0-31) of the SIMM receiving section 21.
6) and d (32 to 32) of the DIMM replacement insertion section 24.
63) and e (7) are d (0 to 3) of the SIMM receiving unit 22.
1) and e (0). The 6 bits of e (1-6) of the SIMM receiving unit 22 are unused.

As described above, in the second and third embodiments, by mounting the memory module conversion connector 20 and two SIMMs instead of DIMMs, one DIMM can be replaced by two SIMMs. .
In the second embodiment, in order to enable such a connection, the number of data signal lines and the number of data parity signal lines need to have a DIMM at least twice that of a SIMM. 2 signal pins
In many cases, this is not a problem. Third
In this embodiment, in order to enable such a connection, there is no problem if both the DIMM and the SIMM adopt ECC. In addition, when the SIMM is based on parity, if the number of twice the number of parity signals of the SIMM is equal to or larger than the number of ECC signals of the DIMM, the parity signal of the SIMM can be used as the ECC signal. . Although the power supply pin and the ground pin are not shown, the SIMM receiving section 21, the SIMM receiving section 22,
The power supply pins and the ground pins are connected to the MM substitute insertion section 24, respectively.

[0040]

According to the memory module conversion connector of the first embodiment of the present invention, a DIMM can be used instead of a DIMM in an information processing apparatus employing a SIMM. This makes it possible to use easily available and inexpensive DIMMs instead of SIMMs.

The memory module conversion connectors according to the second and third embodiments of the present invention allow a data processing device employing a DIMM to use a SIMM instead. As a result, the information processing device employing SIMM
When replacing the information processing device with IMM, SIMM
It can be reused by diverting it to a device in which is replaced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a memory module conversion connector according to a first embodiment.

FIG. 2 is a side view of FIG.

FIG. 3 is a diagram illustrating connection of a memory module conversion connector according to the first embodiment.

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a diagram illustrating connection of signals of a memory module conversion connector according to the first embodiment.

FIG. 6 is a perspective view of a memory module conversion connector according to the second and third embodiments.

FIG. 7 is a side view of FIG. 6;

FIG. 8 is a diagram illustrating connection of a memory module conversion connector according to the second and third embodiments.

FIG. 9 is a side view of FIG.

FIG. 10 is a diagram illustrating connection of signals of a memory module conversion connector according to a second embodiment.

FIG. 11 is a diagram illustrating connection of signals of a memory module conversion connector according to a third embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Memory module conversion connector 11 DIMM receiving part 12 DIMM guide part 13 SIMM substitution insertion part 14 SIMM substitution insertion part 20 Memory module conversion connector 21 SIMM reception part 22 SIMM reception part 23 SIMM guide part 24 DIMM substitution substitution part 31 SIMM connector 32 SIMM Connector 40 DIMM 50 Board 61 SIMM 62 SIMM 70 DIMM Connector 80 Board

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01R 31/06 H01R 31/06 M

Claims (11)

[Claims] 1. Two SIMM connectors and one DIM
A memory module conversion connector characterized by comprising a structure for connecting the M module. 2. A DIMM receiving portion provided with a groove having a plurality of contact portions for inserting a DIMM and transmitting a signal, a DIMM guide portion provided at both ends of the DIMM receiving portion, and the DIMM receiving portion. Provided on both sides of the
A memory module conversion connector, comprising: a first SIMM replacement insertion portion and a second SIMM replacement insertion portion that can be inserted into an MM connector. 3. A DIMM receiving portion provided with a groove having a plurality of contact portions for inserting a DIMM and transmitting a signal, a DIMM guide portion provided at both ends of the DIMM receiving portion, and the DIMM receiving portion. Provided on both sides of the
A first SIMM replacement insertion section and a second SIMM replacement insertion section that can be inserted into the MM connector, wherein a control signal group and an address signal group of the first SIMM replacement insertion section are control signals of the DIMM receiving section. And a data signal group of the second SIMM replacement insertion unit, wherein the data signal group of the first SIMM replacement insertion unit is connected to a first data signal group of the DIMM receiving unit. A memory module conversion connector, wherein a group is connected to a second data signal group of the DIMM receiving unit. 4. A DIMM receiving portion provided with a groove having a plurality of contact portions for transmitting a signal by inserting a DIMM, a DIMM guide portion provided at both ends of the DIMM receiving portion, and the DIMM receiving portion. Provided on both sides of the
A first SIMM replacement insertion section and a second SIMM replacement insertion section that can be inserted into the MM connector, wherein a control signal group and an address signal group of the first SIMM replacement insertion section are control signals of the DIMM receiving section. And the data signal group and the data parity signal group of the first SIMM substitute insertion unit are respectively connected to the first data signal group and the first data parity signal group of the DIMM receiving unit. And the second SIM
A memory module conversion connector, wherein a data signal group and a data parity signal group of the M replacement insertion unit are connected to each of a second data signal group and a second data parity signal group of the DIMM receiving unit. 5. An information processing apparatus having the memory module conversion connector according to claim 1, 2, 3, or 4. 6. One DIMM connector and two SIMs
A memory module conversion connector characterized by having a structure capable of connecting to the M module. 7. A first SIM provided with grooves each having a plurality of contact portions for transmitting a signal by inserting a SIMM.
M receiving part and a second SIMM receiving part, and the first SI
A SIMM guide section provided at both ends of each of the MM receiving section and the second SIMM receiving section;
A memory module conversion connector, comprising: a DIMM substitute insertion portion provided between an MM receiving portion and said second SIMM receiving portion. 8. A first SIM provided with grooves each having a plurality of contact portions for transmitting a signal by inserting a SIMM.
M receiving part and a second SIMM receiving part, and the first SI
A SIMM guide section provided at both ends of each of the MM receiving section and the second SIMM receiving section;
A DIMM replacement insertion portion provided between the MM receiving portion and the second SIMM receiving portion, wherein a control signal group and an address signal group of the DIMM replacement insertion portion are controlled by the control signal of the first SIMM receiving portion. And a control signal group and an address signal group of the second SIMM receiving section, respectively, and a first data signal group of the DIMM substitute inserting section is connected to a data of the first SIMM receiving section. A memory module conversion connector, wherein the connector is connected to a signal group, and a second data signal group of the DIMM substitute insertion section is connected to a data signal group of the second SIMM receiving section. 9. A first SIM provided with grooves each having a plurality of contact portions for transmitting a signal by inserting a SIMM.
M receiving part and a second SIMM receiving part, and the first SI
A SIMM guide section provided at both ends of each of the MM receiving section and the second SIMM receiving section;
A DIMM replacement insertion portion provided between the MM receiving portion and the second SIMM receiving portion, wherein a control signal group and an address signal group of the DIMM replacement insertion portion are controlled by the control signal of the first SIMM receiving portion. Group and an address signal group and a control signal group and an address signal group of the second SIMM receiving unit, respectively, and the first data signal group and the first data parity signal group of the DIMM alternative insertion unit are Connected to each of the data signal group and the data parity signal group of the first SIMM receiving unit,
A memory module conversion connector, wherein a second data signal group and a second data parity signal group of an MM substitute insertion section are connected to a data signal group and a data parity signal group of the second SIMM receiving section, respectively. . 10. A first SI provided with grooves each having a plurality of contact portions for transmitting a signal by inserting a SIMM.
An MM receiver and a second SIMM receiver;
A SIMM guide section provided at both ends of each of an IMM receiving section and the second SIMM receiving section;
A DIMM replacement insertion section provided between the IMM receiving section and the second SIMM receiving section, wherein a control signal group and an address signal group of the DIMM replacement insertion section are controlled by the control signal of the first SIMM receiving section. And a control signal group and an address signal group of the second SIMM receiving section, respectively, and a first data signal group of the DIMM substitute inserting section is connected to a data of the first SIMM receiving section. And a second data signal group of the DIMM alternative insertion section is connected to a data signal group of the second SIMM receiving section, and a part of the error correction code signal group of the DIMM alternative insertion section is connected to the second group. Connecting the error correction code signal group of the first SIMM receiving section to the second SIM
A memory module conversion connector connected to a part of error correction code signal groups of an M receiving section. 11. An information processing apparatus comprising the memory module conversion connector according to claim 6, 7, 8, 9, or 10.