JP2001063044A - Ink jet head and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized high density ink jet head. SOLUTION: Grooves are provided to at least one of first and second substrates 3, 7 and these substrates are bonded to form liquid chambers 2 by the grooves and active elements 12 generating a pressure change in the liquid chambers 2 are formed to the first substrate 3. Ink is supplied to the liquid chambers 2 through the through-holes 11 provided to the second substrate 7, and the ink in the liquid chambers 2 is pressurized by driving the active elements 12 to be emitted from the nozzles 6 provided to the single ends of the liquid chambers 2. Two ink jet head units 13, 14 thus formed are provided in opposed relationship so that the second substrates 7 become inside. The ink supply member 8 for supplying ink to the respective liquid chambers 2 of a pair of the ink jet head units 13, 14 are provided to the central part of an ink jet head formed of two ink jet head units to be bonded to the second substrates 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet print head and a method of manufacturing the same, and more particularly, to a small and high-density ink jet head having a simple structure and easy manufacture, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In an ink jet recording apparatus and a method for manufacturing the same described in Japanese Patent Application Laid-Open No. 7-156392, a compact ink jet head capable of independently driving two channels is realized by providing recording heads on both sides of a substrate member. are doing. JP-A-9-66604
In the ink-jet head and the ink-jet recording apparatus described in Japanese Patent Application Laid-Open Publication No. H11-209, a substrate having an energy element for ink jetting is provided on both sides of a plate member to realize a compact ink-jet head which can be driven independently for two channels. The ink jet recording head described in Japanese Patent Application Laid-Open No. 9-314831 has a structure in which an ink supply groove is formed in the center of two rows of heads, thereby simplifying the manufacturing process. In the ink jet recording head described in JP-A-5-24190, a separation wall for guiding ink is formed inside each liquid chamber in the center of two rows of heads, thereby realizing ink supply with less entrainment of bubbles. .

[0003]

In the on-demand type ink jet recording technique, a diaphragm is provided on a part of a wall of a liquid chamber filled with ink, and the diaphragm is displaced by a piezoelectric actuator or the like to change the volume of the liquid chamber. Or a method of ejecting ink by increasing the pressure to eject ink, or a method of providing a heating element that generates heat by energization in the liquid chamber, and increasing the pressure in the liquid chamber by bubbles generated by the heat generated by the heating element, and ejecting ink. Is widely known. In recent years, speeding up and high image quality of ink jet printers have been progressing, and accordingly, miniaturization and high density of recording heads have become a major issue.

As a solution to this problem, first, a method of miniaturizing individual elements such as a nozzle, a liquid chamber, and a diaphragm constituting a recording head and arranging them at a high density can be considered. Not only is there a limit in increasing the density, but it is difficult to manufacture with a high yield. Alternatively,
JP-A-7-156392 and JP-A-9-66604
As disclosed in Japanese Unexamined Patent Publication, there is a method of realizing high-density recording by disposing two nozzle rows and shifting each nozzle row by a half pitch. According to this method, a high-density head can be realized relatively easily. However, the recording heads disclosed in JP-A-7-156392 and JP-A-9-66604 have a configuration in which liquid chambers are provided on both sides of a substrate provided with an active element for generating ink ejection energy. Therefore, it is possible to put different inks in the two liquid chambers and drive them independently, but there is a problem that the ink supply system becomes complicated when the same ink is put in both the liquid chambers. .

[0005] As a method of improving such a disadvantage, Japanese Patent Application Laid-Open No. 9-314831 and Japanese Patent Application Laid-Open No. 5-241 are disclosed.
As disclosed in Japanese Patent Publication No. 90, there is a configuration in which a substrate provided with active elements is disposed outside and a liquid chamber is interposed. By doing so, the ink supply system is united into one,
A simple configuration can be realized. However, the method described in Japanese Patent Application Laid-Open No. 9-314831 is not suitable for reducing the cost because the liquid chamber having a complicated shape is entirely formed of a piezoelectric material. In addition, Japanese Patent Application Laid-Open No. 5-241
The method disclosed in Japanese Patent Application Publication No. 90-90 has a manufacturing defect that the ink supply jig must be three-dimensionally joined to the print head.

An object of the present invention is to improve the above-mentioned disadvantages and to provide a compact and high-density ink jet head.

It is an object of the present invention to provide an ink jet head unit comprising two substrates each having a first substrate provided with an active element and a second substrate laminated on the first substrate to form a flow path. The ink supply member for supplying ink is located at the center of both units, and has a simple configuration in which ink is supplied through through holes provided in both second substrates, thereby providing a small, high-density head that is easy to manufacture. It is to realize.

Another object of the present invention is to provide a material for an ink supply member for satisfactorily joining the ink supply member and the ink jet head unit.

It is an object of the present invention to provide a material structure of each layer of the ink supply member for satisfactorily joining the ink supply member having the laminated structure to the ink jet head unit.

It is an object of the present invention to provide a shape of an ink supply member for satisfactorily joining the ink supply member to an ink jet head unit.

An object of the present invention is to prevent the ink jet head unit from being damaged by heat even when the ink supply member is joined to the ink jet head unit using a high-temperature curing type adhesive.

It is an object of the present invention to realize good joining between an ink supply member and an ink jet head unit by a relatively easy method.

An object of the present invention is to improve the positioning accuracy of the ink jet head unit and the ink supply member, and to facilitate the fixing of the ink jet head unit to the carriage.

An object of the present invention is to secure a good positioning accuracy between the ink jet head unit and the ink supply member.

It is an object of the present invention to secure the dimensional accuracy of the ink jet head unit and the positioning accuracy of the ink supply member.

A further object of the present invention is to realize the formation of the ink supply member and the good connection between the ink supply member and the ink jet head unit.

[0017]

According to a first aspect of the present invention, a first substrate and a second substrate having at least one groove are joined to form a flow path by the groove, and the flow path is formed in the flow path. An active element that causes a pressure change is formed in the first substrate, ink is supplied into the flow path through a through hole provided in the second substrate, and the inside of the flow path is driven by driving the active element. And a pair of inkjet head units that pressurize the ink and discharge the ink from one end of the flow path with the second substrate inside, and a pair of ink jet head units. Is provided at the center of two ink-jet head units forming the ink-jet head, and is joined to each of the second substrates.

According to a second aspect of the present invention, in the first aspect of the present invention, the ink supply member is formed of a high heat conductive material.

According to a third aspect of the present invention, in the first aspect of the invention, the ink supply member has a laminated structure of at least three layers, and the outer layer is formed of a high thermal conductive material and the inner layer is formed of a low thermal conductive material. It is characterized by.

According to a fourth aspect of the present invention, in the third aspect of the present invention, at least a portion of the ink supply member formed of a high heat conductive material has a small heat capacity shape.

According to a fifth aspect of the present invention, in the third aspect of the present invention, a low thermal conductive material layer is formed on the interface between the second substrate and the ink supply member.

According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, the heat-reaction type is applied to the joint of the ink supply member with the second substrate or the joint of the second substrate with the ink supply member. The ink supply member and the second
After the substrate is positioned and brought into contact, a part of the ink supply member is heated so that the ink supply member and the second
Are bonded to each other.

According to a seventh aspect of the present invention, in the first to fifth aspects, when the ink supply member and the second substrate are overlapped, at least a part of the ink supply member is attached to the ink supply member by the second substrate. A protruding portion that protrudes outside the substrate, and a mark is provided on at least a part of the protruding portion.

According to an eighth aspect of the present invention, in the seventh aspect of the present invention, the ink supply member and the second substrate are positioned using the mark of the ink supply member.

According to a ninth aspect of the present invention, in the first to fifth aspects, the first substrate and the second substrate are made of silicon, glass, or ceramics.

In a tenth aspect of the present invention, in the first to fifth or ninth aspects, at least a surface layer of the ink supply member is made of a metal having a low coefficient of thermal expansion.

[0027]

FIG. 1 is a cross-sectional view showing an example of a basic configuration of a piezo-on-demand type ink jet head unit used in the embodiment of the present invention. In the illustrated system, a first substrate 3 and a second substrate 3 are used. The pressurized liquid chamber 2,
An ink jet head unit including the main components of the liquid chamber of the ink jet head, such as the fluid resistance flow path 4 and the nozzle communication path 9, is formed. The second substrate 7 is provided with a through-hole as a common ink flow path 11, and the upper surface of the second substrate 7 is provided with an ink supply member 8. The liquid enters the common ink flow path 11 from 10 and is filled in the respective pressurized liquid chambers 2 through the fluid resistance flow paths 4 of the respective liquid chambers. The vibrating plate 1 is formed on a part of the first substrate 3. The vibrating plate 1 is deformed by driving the piezoelectric element 12, the pressure inside the pressurized liquid chamber 2 is increased, and the vibrating plate 1 is provided on the nozzle plate 5. The ink is ejected from the nozzle 6 that has been ejected.

FIG. 2 is a sectional view showing an example of the basic structure of an ink jet head according to the present invention. In the head shown in FIG. 2, the second substrate of the first ink jet head unit 13 and the second ink jet head unit 14 is used. 7
The ink supply member 8 is joined to both sides. Since the ink supply member 8 and the ink jet head unit can be joined on each surface in this manner, it is necessary to join the ink supply member 8 with an ink sealing property by a simple method such as providing an adhesive layer on one of the surfaces and crimping. Can be. The ink supply member 8 has a flat tube structure that is open facing two inkjet head units.
Such a shape can be integrally manufactured by, for example, a resin molding technique or a metal casting technique.

FIG. 3 is a view showing an example of forming the ink supply member 8. As shown, the plates 15 (15 ₁ , 15 ₂ ) and 16 having the holes 15a, 15b and the groove 16a are laminated. Can also be made by For example, the ink supply member 8 can be easily formed by laminating the metal plates 15 and 16 having holes and grooves formed by etching or the like.

FIG. 4 is a perspective view showing an example of the ink supply member 8 formed by laminating as described above. As a material for forming the ink supply member 8, glass, ceramics,
Various materials such as resin and metal can be used. However, if a material having high thermal conductivity such as metal is used, as shown in FIG. After laminating and superimposing on the inkjet head units 13 and 14 as shown in FIG. 5, only the portions (regions A in FIG. 5) where the ink supply member 8 protrudes from the inkjet head units 13 and 14 are heated. The adhesive can be cured to complete the bonding. When glued in this way,
Thermal damage to the inkjet head units 13 and 14, such as thermal deformation, can be reduced as compared with a normal method of heating the whole.

As described above, in the case of joining by local heating, it is desirable that the temperature of the joint rises quickly and that heat is not transmitted to portions other than the joint. For example, the ink supply member 8
But in the case of the layer structure shown in FIG. 3, the outer of the ink supply port forming plate 15 a (15 _1, 15 ₂₎ and a material having a large thermal conductivity such as a metal, inside of the ink inflow channel forming plate By using 16 as a material having low thermal conductivity such as a resin, heat can be quickly transmitted to the joint. Further, heat conduction can be favorably performed by reducing the thickness of the ink supply port forming plate 15 and the ink inflow path forming plate 16 or reducing the heat capacity by eliminating extra regions. Further, for example, as shown in FIG. 6, when a heat insulating member 18 such as a resin is provided at a joint of the ink jet head units 13 and 14 with the ink supply member 8, transmission from the ink supply member 8 to the ink jet head units 13 and 14 is performed. Since it is difficult to heat, even when an adhesive that cures at a relatively high temperature is used, thermal damage to the inkjet head unit can be prevented.

As described above, in order to join the ink supply member 8 to the ink jet head unit by local heating of the ink supply member 8, an overhang portion is provided so that at least a part of the surface of the ink supply member is exposed to the outside. good. As shown in FIG. 5, if the ink supply member 8 projects outside the ink jet head unit in three directions (arrows C, D, and E directions) excluding the ink ejection direction side indicated by the arrow B, heating can be performed. It is possible to widen a selection range regarding a heating method such as a place, and if the overhang portion is made of a highly rigid material, it can be used for fixing the head to the carriage.

By providing a mark 15c such as a hole or a groove on the overhang as shown in FIG. 7, it can be used for positioning the ink jet head unit with the ink supply member and positioning the head with the carriage. As shown in FIG. 8, when positioning is performed using the mark 15c provided on the overhanging portion, the mark is not hidden when superimposed. Inspection becomes easy. FIG.
As shown in (1), when positioning is performed at the edge of the ink jet head unit indicated by the dashed-dotted line F with the mark 15c of the overhanging portion of the ink supply member 8, the outer shape accuracy of the ink jet head unit is important. In order to obtain a head with excellent shape accuracy, materials such as glass and
A simple method is to use ceramics and silicon to join individual substrates that have been subjected to groove processing and drilling, and then cut out individual heads with a dicing saw in the final stage.
According to this method, an inkjet head unit having an outer shape accuracy of several microns can be obtained relatively easily. When such an ink jet head unit is used, highly accurate positioning can be performed using the edge of the ink jet head unit as shown in FIG.

Incidentally, since the ink jet head units 13 and 14 and the ink supply member 8 are joined under heating conditions, it is basically preferable that both are made of the same material in consideration of thermal deformation. However, considering the conditions such as thermal conductivity, workability, and cost required for the ink supply member 8, as described above, when the inkjet head unit is made of glass, ceramics, or silicon, at least the surface layer of the ink supply member 8 is formed. Is preferably a low thermal expansion metal such as Kovar. Since it is a metal material, its thermal conductivity is large,
Further, sufficiently high-precision processing by etching or the like is possible.
In the case where the ink supply member has a rigid structure, the ink supply member can be used as a mounting portion for fixing the head of the projecting portion of the ink supply member to the carriage.

(Embodiment 1) FIG. 2 shows a first embodiment of the present invention.
It will be described based on. First, the diaphragm 1 of the first substrate 3
Is to form a thermal oxide film on a Si (110) wafer, pattern the resist in accordance with the shape of the diaphragm 1, open the resist, and then etch the Si using a hydrofluoric acid-based etching solution or a KOH aqueous solution. Formed. The thickness of the diaphragm 1 was about 7 [μm] and the width was 130 [μm]. First, the lead S in the piezoelectric element
Zirconia as an intermediate layer for preventing diffusion into i was formed to a thickness of 1 [μm] by a sputtering method. A platinum electrode having a thickness of 5 [μm] was formed on the intermediate layer by a screen printing method.
Furthermore, the calcined powder of the piezoelectric material mainly composed of PZT was paste-processed, screen-printed to a thickness of 20 [μm], and fired in the air at a temperature of 900 to 1100 ° C. A silver electrode was patterned on the fired piezoelectric body to form a piezoelectric element 12.

As the second substrate 7, a Si (100) wafer is used, and grooves corresponding to the pressurized liquid chamber 2, the fluid resistance flow path 4, and the common ink flow path 11 are formed by etching similarly to the first substrate 3. Formed. Next, a dry film resist (DFR) having a thickness of about 20 [μm] is laminated on the groove forming surface of the second substrate 7, and a chrome mask having a pattern corresponding to the groove shape formed on the second substrate 7 is formed. Exposure was carried out by using, and developed to pattern the DFR. This second substrate 7
And the first substrate 3 were accurately positioned, the two groove surfaces were aligned, and joined by thermocompression bonding under a temperature environment of about 180 ° C.
The Si wafer thus laminated was divided into chips by a dicing saw. The nozzle plate 5 was formed by an electroforming method, DFR was laminated on the joining surface, and after patterning, the DFR was joined by thermocompression bonding to the nozzle plate joining surface of the inkjet head unit which was chipped.

As shown in FIG. 3, the ink supply member 8 has a thickness of 1 [mm] formed by molding and firing ceramics.
Ink supply port forming plate 15 formed by etching a Kovar having a thickness of 50 μm.
To form a three-layer structure. The connection between the ink supply port forming plate 15 and the ink inflow path forming plate 16 was performed using a thermo-flexible polyimide adhesive having excellent ink resistance. The ink supply member 8 includes ink jet head units 13 and 14.
The width is narrower than that of the ink jet head unit, and it is formed to protrude only on the side opposite to the nozzle with respect to the inkjet head unit.

At the joint of the laminated ink supply member 8 with the first ink jet head unit 13, a polyethylene ionomer film as a heat-reactive adhesive was punched to form an ink supply hole, and then laminated. As shown in A), the overhanging portion (region G) of the ink supply member 8 is set at 180 ° C. with the first inkjet head unit 13 overlapped and the joining portion sandwiched therebetween.
For about 10 seconds to perform bonding.

Subsequently, an adhesive layer is similarly formed on the side of the second ink jet head unit 14 of the ink supply member 8, and the nozzle surfaces of the first ink jet head unit 13 and the second ink jet head unit 14 and FIG.
The two ink jet head units are positioned using the side surface indicated by the arrow H in (B), and the protrusion of the ink supply member 8 is heated to join the second ink jet head unit 14 and the ink supply member 8. Was.

Since the first head unit 13 and the second head unit 14 are cut into a high-precision shape by a dicing saw, the nozzle positions of both heads are shifted by half the nozzle pitch. With such a method, an ink jet head having a recording density of 300 dpi, which is twice the nozzle density, could be easily realized in a relatively short time.

As a comparative example of the present embodiment, when the ink supply port forming plate 15 on the surface layer of the ink supply member 8 was made of stainless steel having the same thickness instead of Kovar, poor bonding occurred at the interface with the ceramics. Thus, when the ink inflow path forming plate 16 was also made of stainless steel of the same material as the ink supply port forming plate 15, the above-described bonding at the interface was successfully performed, but when the ink supply member 8 was bonded to the inkjet head unit. The bonding time required about 30 seconds, and the manufacturing efficiency was reduced.

(Embodiment 2) FIG. 10 is a view for explaining a second embodiment of the present invention. First, the vibration plate 1 of the first substrate 3 is formed by forming a thermally oxidized film on a Si (110) wafer. Was formed, the resist was patterned in accordance with the shape of the diaphragm 1, the resist was opened, and then Si was etched using a hydrofluoric acid-based etching solution or a KOH aqueous solution. The thickness of the diaphragm 1 was about 7 [μm] and the width was 130 [μm]. As the electrode substrate 19, Pyrex glass having a thickness of 1 [mm] was used, and the electrode substrate 19 was etched using a resist pattern having an opening only at a portion where a gap was formed, thereby forming a groove-shaped step on the substrate. The groove width of the glass was about 140 [μm] and the depth was about 0.5 [μm].

Next, a thickness of 0.
An Ni thin film having a thickness of 1 μm and a width of 120 μm was provided as the electrode 20. Further, an SiO ₂ layer having a thickness of 0.1 [μm] was formed as a protective film 21 on the electrode 20 by a sputtering method. The electrode substrate 19 and the first substrate 3 on which the vibration plate 1 is provided are accurately positioned with respect to the position of the electrode 20 and the position of the vibration plate 1 and are joined by anodic bonding. μm]
Gap was formed.

The second substrate 7 is made of Si as in the first embodiment.
Grooves corresponding to the pressurized liquid chamber 2, the fluid resistance flow path 4, and the common ink flow path 11 were formed on the (100) wafer by etching. The second substrate 7 has a thickness of about 2
A dry film resist (DFR) of 0 [μm] was laminated, patterned by the same process as in Example 1, and thermocompression bonded to the first substrate 3. The thus-formed three-layer wafer was cut by a dicing saw to divide it into individual inkjet head units.

The nozzle plate 5 is formed by an electroforming method.
After the FR was laminated on the bonding surface and patterned, it was bonded to the nozzle plate bonding surface of the inkjet head unit by thermocompression bonding. Thereafter, a polyimide layer as a heat insulating member 18 was formed on the surface of the second substrate 7 at the joint with the ink supply member 8. As a method of forming the heat insulating member 18, a polyethylene ionomer film having a thickness of 30 [μm] is laminated on a polyimide film having a thickness of 100 [μm], and then a hole is formed by punching, and a second layer is formed using the polyethylene ionomer as an adhesive layer. A method of thermocompression bonding to the surface of the substrate 7 was used.

As shown in FIG. 11, the ink supply member 8 has a thickness 1 in which a through groove is formed at the center by blasting.
[mm] glass ink inflow path forming plate 16
The ink supply port forming plate 15 (15 ₁ , 15 ₂ ) formed by etching of [μm] Kovar had a three-layer structure. The ink supply member 8 was wider than the ink jet head unit, and had such a size that the ink supply member 8 protruded outward when joined to the ink jet head unit. In the ink supply port forming plate 15, ink outflow / inflow holes 15a and 15b, alignment marks 15c, and lightening holes 15d were formed. Alignment mark 15c
Is provided on the overhanging portion of the ink supply member 8 when the ink supply member 8 is overlapped with the ink jet head unit, and can be positioned with respect to the ink jet head unit at a ridge line of its outer shape. Further, the lightening hole 15d is provided in the dead space of the ink supply port forming plate 15, thereby reducing the heat capacity of the ink supply port forming plate 15 and improving the bondability with the ink flow path forming plate 16. The ink supply port forming plate 15 and the ink inflow path forming plate 16 were joined by a heat-flexible polyimide adhesive having excellent ink resistance to form the ink supply member 8. Next, a thermo-flexible polyimide was applied to the joint of the ink supply member 8 with the ink jet head unit, and was heated and dried to form a film.

The ink supply member 8 and the ink-jet head unit prepared as described above are positioned and overlapped using the alignment mark 15c provided on the ink supply port forming plate 15 and the outer ridge of the ink-jet head unit. 280 ° C overhang of member 8
For about 15 seconds to perform bonding. In this embodiment,
The bonding of the ink supply member 8 to the inkjet head unit was performed using an adhesive that cured at a relatively high temperature, but a polyimide film as a heat insulating member 18 was interposed at the interface between the two, and a lightening hole 15d and the like were used. By reducing the heat capacity and shortening the heating time by providing the ink jet head unit, it is possible to form a desired high-resolution head without damaging the DFR and the like used for joining the ink jet head units, and obtain good ejection characteristics. did it.

[0048]

According to the ink jet head of the first aspect, the first substrate provided with the active elements and the flow path are formed by being laminated on the first substrate. An ink supply member for supplying ink to two inkjet head units formed of a second substrate that is located at the center of the two inkjet head units;
Since the configuration is such that ink is supplied through the through holes provided in both the second substrates, it is possible to realize a small and high-density head with a simple configuration that is easy to manufacture.

(Operation and Effect Corresponding to Claim 2) Claim 2
According to the inkjet head described above, since the ink supply member is formed of a high heat conductive material, the ink supply member can be joined to the ink head unit by utilizing the heat conduction of the ink supply member.

(Function and Effect Corresponding to Claim 3) Claim 3
According to the inkjet head described above, the ink supply member has at least a three-layer structure, and the outer layer has a high heat conductive material,
Since the inner layer is formed of a low heat conductive material, heat can be efficiently and quickly conducted.

(Operation and Effect Corresponding to Claim 4) Claim 4
According to the inkjet head described above, at least the portion formed of the high heat conductive material is reduced in heat capacity, so that the heat transfer speed can be improved.

(Operation and Effect Corresponding to Claim 5) Claim 5
According to the ink jet head described above, since the low heat transfer material layer is formed at the bonding interface between the second substrate and the ink supply member of the ink jet head unit, the heat at the time of bonding is less likely to be transmitted to the ink jet head unit side. Even when a high-temperature curing type adhesive is used, there is no damage to the inkjet head unit.

(Operation and Effect Corresponding to Claim 6) Claim 6
According to the method for manufacturing an ink jet head described above, when the ink supply member is joined to the ink jet head unit, the heating is performed by a local heating method in which only one end of the ink supply member is heated. Since the portion is not heated, damage to the element due to heat can be avoided.

(Operation and Effect Corresponding to Claim 7) Claim 7
According to the method for manufacturing an inkjet head described above, at least a part of the ink supply member is provided with an overhanging portion that projects outside the second substrate, and a mark is provided on at least a part of the overhanging portion. It can be used for heating during joining and for fixing the head to the carriage. In addition, positioning of the inkjet head units can be easily performed.

(Operation and Effect Corresponding to Claim 8) Claim 8
According to the inkjet head manufacturing method described above, since the ink supply member and the second substrate are positioned using the mark of the ink supply member, good positioning accuracy can be obtained relatively easily.

(Function and Effect Corresponding to Claim 9) Claim 9
According to the ink jet head described above, since the first substrate and the second substrate are made of silicon, glass, and ceramics, the ink jet head unit can be cut into a high-precision dimensional shape with a dicing saw, and the outer ridge of the ink jet head unit is used. Thus, highly accurate positioning of the ink jet head unit and the ink supply member can be relatively easily performed.

According to the ink jet head of the tenth aspect, at least the surface layer of the ink supply member is made of a metal having a low coefficient of thermal expansion. In the case where is made of silicon, glass, or ceramics, bonding between the ink jet head unit and the ink supply member can be realized without causing a bonding failure or the like.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a basic configuration of a piezo-on-demand type inkjet head.

FIG. 2 is a cross-sectional view illustrating an example of a basic configuration of an inkjet head according to the present invention.

FIG. 3 is a diagram illustrating a creation example of an ink supply member.

FIG. 4 is a perspective view showing an example of an ink supply member formed by lamination.

FIG. 5 is a perspective view in which two inkjet head units are overlapped.

FIG. 6 is a cross-sectional view illustrating an example in which a heat insulating member such as a resin is provided at a joint between the inkjet head unit and the ink supply member.

FIG. 7 is a perspective view showing an example in which a marking such as a hole or a groove is provided on an overhang portion.

FIG. 8 is a diagram for explaining an example of a case where alignment is performed using a mark provided on an overhang portion.

FIG. 9 is a diagram for explaining an example of performing thermal bonding between an ink jet head unit and an ink supply member.

FIG. 10 is a sectional configuration diagram for explaining a second embodiment of the present invention.

FIG. 11 is a view for explaining another example of the ink supply member.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Vibration plate, 2 ... Pressurized liquid chamber, 3 ... First substrate, 4 ... Fluid resistance flow path, 5 ... Nozzle plate, 6 ... Nozzle, 7 ... Second substrate, 8 ... Ink supply member, 9 ... Nozzle communication path, 10: ink inflow path, 11: common ink flow path, 12: piezoelectric element,
13: first inkjet head unit, 14: second inkjet head unit, 15 (15 ₁ , 1
5 ₂ ): ink supply port forming plate, 16: ink inflow path forming plate, 17: heat-reactive adhesive, 18: heat insulating member, 19: electrode substrate, 20: electrode, 21: protective film.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C056 EA23 FA04 FA07 FA10 HA05 HA08 HA15 HA16 HA17 HA22 KB40 2C057 AF34 AF93 AG15 AG39 AG44 AG52 AG54 AG55 AG68 AG99 AN01 AP02 AP13 AP14 AP22 AP25 AP26 AP27 AP31 AP34 AP38 AP52 AP56 AP57 AP77 AQ01 AQ02 AQ10 BA03 BA14 BA15

Claims (10)

[Claims] A first substrate provided with a groove on at least one side thereof and a second substrate joined to each other to form a flow path by the groove, and the active element for causing a pressure change in the flow path is formed by the active element; Ink is supplied into the flow path through a through-hole formed in the first substrate and provided in the second substrate, and the ink in the flow path is pressurized by driving the active element to thereby form one end of the flow path. An ink supply unit for supplying ink to the flow path of each of the pair of inkjet head units, the inkjet head unit comprising: An ink jet head, which is located at the center of two ink jet head units to be formed and is joined to each of the second substrates. 2. The ink jet head according to claim 1, wherein said ink supply member is formed of a high heat conductive material. 3. The ink jet head according to claim 1, wherein the ink supply member has a laminated structure of at least three layers, wherein an outer layer is formed of a high heat conductive material and an inner layer is formed of a low heat conductive material. . 4. The ink jet head according to claim 3, wherein at least a portion of said ink supply member formed of a high heat conductive material has a small heat capacity shape. 5. The ink jet head according to claim 3, wherein a low heat conductive material layer is formed on the second substrate at a bonding interface with the ink supply member. 6. The method for manufacturing an ink jet head according to claim 1, wherein the ink supply member is joined to a second substrate or the ink on the second substrate. A thermal reaction type adhesive layer is provided at a joint with the supply member, and after the ink supply member and the second substrate are positioned and brought into contact with each other, a part of the ink supply member is heated to thereby supply the ink. A method for manufacturing an ink jet head, comprising joining a member and the second substrate. 7. The method for manufacturing an ink-jet head according to claim 1, wherein when the ink supply member and the second substrate are overlapped, at least the ink supply member is provided with the ink supply member. A method for manufacturing an ink jet head, comprising: providing an overhanging portion in which a part of an ink supply member extends outside the second substrate; and providing a mark on at least a part of the overhanging portion. 8. Using a mark of the ink supply member,
The method according to claim 7, wherein the ink supply member and the second substrate are positioned. 9. The ink jet head according to claim 1, wherein the first substrate and the second substrate are made of silicon, glass, or ceramics. 10. The ink supply member according to claim 1, wherein at least a surface layer of the ink supply member is made of a metal having a low coefficient of thermal expansion.
10. The inkjet head according to any one of claims 5 to 9.