JP2001059159A - Vacuum evaporation equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve safety by inhibiting the adhesion or deposition of by- products to or onto the inside of an exhaust gas pipe and also to thoroughly clean the inside of the pipe at the time of equipment cleaning by filling the pipe with water, or the like, up to a position right short of a reaction furnace body. SOLUTION: In this vacuum evaporation equipment, a metallic compound its introduced together with carrier gas into a reaction furnace 2 via a supply pipe 1, and, while performing suction by means of a vacuum pump 3, a film of the metallic compound is laminated on the surface of a vapor deposition substrate (S) by vacuum evaporation reaction in the reaction furnace 2. In the vacuum evaporation equipment, a descending inclined pipe 8 is used as a pipe for exhausting the waste gas after reaction discharged from the reaction furnace 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum deposition apparatus for forming a high-purity metal compound film or a single metal film on the surface of an object to be deposited by a chemical reaction in a vacuum atmosphere. TECHNICAL FIELD The present invention relates to a vacuum evaporation apparatus capable of suppressing by-products from adhering or accumulating on an inner wall of a pipe for discharging water.

[0002]

2. Description of the Related Art Conventionally, an apparatus for performing vacuum deposition is shown in FIG.
As shown in FIG. 1, the apparatus is configured such that an organic metal or a metal halide as a raw material flows in through a supply pipe 1 together with a carrier gas from the bottom of a reaction furnace 2 in which a substance S to be deposited is placed. The inside of the reaction furnace 2 is evacuated by a vacuum pump 3, and the organic metal or metal halide is gasified by heating a heater 4 in the reaction furnace 2 to perform a vacuum deposition reaction in the reaction furnace 2. An apparatus that completes and deposits a metal compound film or a single metal film on the surface of the object S is generally used.

[0003] This vacuum deposition apparatus, after the reaction, solid,
Alternatively, a liquid by-product or an excess reactant may be generated. Further, the exhaust gas after the reaction was discharged from the upper part of the reaction furnace 2 by an exhaust gas pipe 6 for post-processing by the exhaust gas treatment device 5.

[0004]

However, in the above-mentioned conventional vacuum vapor deposition apparatus, the temperature of the exhaust gas from the organic metal or metal halide used as a raw material when passing through the exhaust gas pipe 6 decreases. There is a problem that the exhaust gas pipe 6 is clogged by solidification or liquefaction inside the pipe 6 for exhaust gas.

[0005] As shown in FIG.
Is arranged so as to hang down from the horizontal arrangement 6a to the vertical arrangement 6b.
The by-product F stayed at the container may fall toward the trap valve 7 and be ignited by the impact.

Incidentally, in order to solve such a problem of the conventional vacuum vapor deposition apparatus, measures have been taken, for example, to provide a heating means around the exhaust gas pipe 6 in order to prevent a temperature drop. However, such means has a large cost burden and has a problem in quality control.

On the other hand, as shown in FIG. 8, when filling the exhaust gas pipe 6 of the vacuum evaporation apparatus with water and washing with water, a combination of the conventional horizontal arrangement 6a and the vertical arrangement 6b of the exhaust pipe 6 is used. In the apparatus composed of the above, water was filled from the lower part of the exhaust gas pipe 6 in the vertical arrangement 6b to clean the inside of the pipe. However, since the inside of the reaction furnace 2 dislikes water, the exhaust gas pipe 6 in a horizontal arrangement 6a protruding horizontally from the side of the reaction furnace 2 is filled with water and washed so that water does not enter from the exhaust gas pipe 6. There was also a problem that the cleaning could not be performed sufficiently.

The present invention has been made to solve such a problem. That is, an object of the present invention is to improve the safety by suppressing the by-products from adhering or accumulating in the exhaust gas pipe, and to fill the pipe with water or the like just before the reactor body of the pipe when cleaning the apparatus. An object of the present invention is to provide a vacuum deposition apparatus capable of sufficiently cleaning the inside.

[0009]

According to the present invention, a metal compound is introduced into a reaction furnace (2) together with a carrier gas through a supply pipe (1), and is sucked by a vacuum pump (3). In a vacuum deposition apparatus for stacking the metal compound film on the surface of the object to be deposited (S) by a vacuum deposition reaction in the reaction furnace (2), the reacted exhaust gas discharged from the reaction furnace (2) is sent to the outside. A vacuum evaporation apparatus is provided, wherein the exhaust pipe is an inclined pipe (8) having a gradient. The inclined pipe (8) is a pipe having a downward slope toward the trap valve (7).

According to the configuration of the present invention, the exhaust gas after the reaction is exhausted through the inclined pipe (8) inclined downward toward the trap valve (7). Since the by-product (F) generated in step (1) tends to slide down toward the trap valve (7) below, the by-product (F) does not adhere or accumulate on the inner wall of the tube. If a certain amount of by-product (F) accumulates in the trap valve (7), it is removed. Further, in the vacuum evaporation apparatus of the present invention, since the exhaust gas pipe is not a combination of the horizontal arrangement and the vertical arrangement as in the conventional apparatus, the by-product (F) may stay and accumulate in the horizontally arranged pipe. In addition, the deposited by-product (F) does not fall in the vertically arranged pipe. The by-product (F) does not explode due to the impact of this drop. Further, when the vacuum evaporation apparatus is washed with water, even if water is filled in the inclined pipe (8) up to just before the furnace body of the reaction furnace (2), this water does not enter the reaction furnace (2). The inside of the inclined pipe (8) can be sufficiently washed with water.

The angle difference (α) between the respective inclination angles of the inclined pipes (8) to be connected is set to be within 50 degrees.
Alternatively, the portion (10) connecting the inclined pipes (8) is connected in a curved manner.

According to this structure, the connecting portion (9) of the inclined pipe (8) has a gradual angle change in which the angle difference (α) between the respective inclination angles is within 50 degrees. The by-product (F) is prevented from colliding with and adhering to and accumulating on the inner wall surface of the pipe (9). In the curved connecting portion (10) of the inclined pipe (8), the by-product (F) is liable to slide on the bent pipe inner wall surface. It prevents adhesion and deposition.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. In the drawings, common members are denoted by the same reference numerals, and duplicate description is omitted.
FIG. 1 shows a vacuum deposition apparatus of the present invention. As shown in this figure, the vacuum evaporation apparatus of the present invention is configured such that an organic metal or a metal halide as a raw material is supplied together with a carrier gas through a supply pipe 1 from the bottom of a reaction furnace 2 in which an object S is placed. It is a device configured to flow in. This reactor 2
The organic metal or metal halide is gasified by heating of a heater 4 provided therein, and a vacuum deposition reaction is completed in the reaction furnace 2 to deposit a metal compound film or a single metal film on the surface of the deposition target S. I do.

The exhaust gas after such a reaction is discharged from the upper part of the reaction furnace 2 by an inclined pipe 8 for exhaust gas in order to post-process the exhaust gas in the exhaust gas treatment device 5. The reason why the inclined pipe 8 of the present invention is arranged to be inclined downward toward the trap valve 7 is that exhaust gas is prevented from solidifying or liquefying and adhering or accumulating as by-products F inside the pipe. That's why. Further, in the present invention, a vertically arranged exhaust gas pipe as in the conventional apparatus is not incorporated in the apparatus to prevent the by-product F staying in the pipe from being ignited by a drop impact.

In FIG. 1, the inclined pipe 8 illustrated as being vertically disposed at the left side of the reaction furnace 2 includes:
The pipes are arranged so as to have a gradient not from the vertical state but from the front side of the illustrated surface to the back surface direction (or the reverse direction). Similarly, each of the inclined pipes 8 illustrated as being disposed in the vertical direction on the right side of the vacuum pump 3 is not in a vertical state, but has a gradient from the front surface of the illustrated surface to the rear surface direction (or the reverse direction). It has been plumbed.

FIG. 2 is a partially enlarged sectional view showing a connecting portion of the inclined pipe. The connecting portions 9 of the inclined pipes 8 are desirably connected so that the angle difference α between the inclination angles of the inclined pipes 8 is within 50 degrees. The reason why the angle difference α is set within 50 degrees is that the by-product F collides with the pipe inner wall surface at the bent connection part 9 of the pipe by making the angle change of the connection part 9 of the inclined pipe 8 gentle. This is for suppressing adhesion and deposition. The angle difference α of the connecting portion 9 is determined by factors such as the arrangement state of each device of the vacuum vapor deposition device, the type of exhaust gas, that is, the type of the compound to be vacuum-deposited, or the flow rate inside the pipe.

FIG. 3 is a partially enlarged sectional view showing another embodiment of the inclined pipe of the present invention. As shown in this figure, the inclination angle of the inclined pipe 8 is set to have a gradient of 10 degrees to 80 degrees downward in the exhaust direction. The inclination angle of the inclined pipe 8 is about 10 degrees to 80 degrees with respect to the horizontal in the exhaust direction.
Any inclination angle up to about degrees may be used. This means that the inclined pipe 8 need not be arranged in a horizontal or vertical arrangement. Although the inclination angle of the inclined pipe 8 is not limited, the inclined pipe 8 is piped so as to have a downward slope in the direction of the trap valve 7, and the by-product F becomes slippery inside the inclined pipe 8, and this by-product F Any angle may be used as long as the angle can suppress adhesion or deposition. The inclination angle of each inclined pipe 8 is determined by various factors such as the arrangement state of each device and the type of exhaust gas.

FIG. 4 is a partially enlarged sectional view showing a state in which the inclined pipe is filled with water for cleaning. When the vacuum evaporation apparatus is washed with water, the inclined pipe 8 of the present invention is no longer distinguished from the conventional horizontal and vertical pipes, and from the bottom of the inclined pipe 8 until just before the furnace body of the reaction furnace 2 that dislikes moisture. Since the water can be filled, the inclined pipe 8 can be sufficiently washed with water.

FIG. 5 is a partially enlarged sectional view showing a state where the connecting portion of the inclined pipe is curved. The part 10 connecting the inclined pipes 8 may be connected in a curved manner.
If a gentle curve is formed in the connecting portion 10 as described above, the by-product F can move smoothly in the pipe, and thus the adhesion and deposition of the by-product F can be suppressed. Note that the curve curvature of the connecting portion 10 is also determined by factors such as the arrangement state of each device of the vacuum vapor deposition device, the type of exhaust gas, and the flow velocity inside the pipe.

In the embodiment of the present invention, a configuration in which an inclined pipe is adopted for a pipe for exhaust gas treatment of a vacuum evaporation apparatus to suppress by-products from adhering or depositing on the inner wall surface will be described. I have. However, the piping is not limited to the above-described vacuum vapor deposition reaction apparatus as long as it is a pipe just before treating the exhaust gas in various plants and is a chemical engineering apparatus to which by-products easily adhere or deposit.

[0021]

As described above, in the vacuum evaporation apparatus according to the present invention, by-products are liable to slide down inside inclined pipes inclined in the exhaust direction. It is possible to suppress the adhesion and deposition of the object. In addition, since the by-products do not stay and accumulate in this way, the by-products do not fall in the pipe and do not explode due to the impact, so that the safety is high.

Further, when the vacuum evaporation apparatus of the present invention is washed with water, the inside of the pipe just before the reactor can be washed with water without damaging the reactor, thereby stabilizing the chemical reaction. It can be performed in a state where it has been done.

Further, the connecting portion of the inclined pipe which is connected so as to have a gentle angle change or curve can suppress the adhesion or accumulation of by-products on the inner wall of the pipe due to collision. There is.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of a vacuum evaporation apparatus having an inclined pipe according to the present invention.

FIG. 2 is a partially enlarged cross-sectional view showing a connection portion of a sloped pipe having a slope.

FIG. 3 is a partially enlarged cross-sectional view showing a state in which a by-product slides down an inclined pipe.

FIG. 4 is a partially enlarged cross-sectional view showing a state in which water is filled in an inclined pipe to be washed.

FIG. 5 is a partially enlarged cross-sectional view showing a state where a connecting portion of the inclined pipe is curved.

FIG. 6 is an overall configuration diagram of a conventional vacuum evaporation apparatus including a combination of horizontal and vertical pipes.

FIG. 7 is a partially enlarged cross-sectional view showing a state in which a conventional by-product accumulates in the middle of a horizontally arranged pipe and drops in a vertically arranged pipe.

FIG. 8 is a partially enlarged cross-sectional view showing a state in which only conventional vertically arranged pipes are filled with water for cleaning.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply piping 2 Reactor 3 Vacuum pump 7 Trap valve 8 Inclined pipe S Deposit to be deposited F By-product

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hiroshi Murata 3-1-1-15 Toyosu, Koto-ku, Tokyo Ishikawajima-Harima Heavy Industries, Ltd.

Claims (4)

[Claims] 1. A metal compound is introduced into a reaction furnace (2) together with a carrier gas through a supply pipe (1), and is vacuum-deposited in the reaction furnace (2) while being sucked by a vacuum pump (3). In a vacuum deposition apparatus for laminating the metal compound film on the surface of the object to be deposited (S) by a reaction, a pipe for exhausting the reacted exhaust gas discharged from the reaction furnace (2) to the outside is a sloped pipe having a gradient. (8) A vacuum deposition apparatus, characterized in that: 2. The vacuum evaporation apparatus according to claim 1, wherein the inclined pipe is a pipe having a downward slope toward the trap valve. 3. The vacuum deposition apparatus according to claim 1, wherein an angle difference (α) between the inclination angles of the inclined pipes (8) to be connected is within 50 degrees. 4. A part (1) for connecting said inclined pipe (8).
The vacuum deposition apparatus according to claim 1, wherein 0) is curved.