JP2001053473A - Insulating structure of electronics - Google Patents

Abstract

PROBLEM TO BE SOLVED: To insulate a plurality of electronic parts in a small space and improve the cost and workability of the insulating work by separating the electronic parts from each other by the partition plate sections of a resin case and securing the insulating distances of the parts by the partition plate sections. SOLUTION: A box-like resin case 1 is made of an insulating material, such as the polybutylene terephthalate resin, etc., having low thermal conductivity and has partition plate sections 4 provided in the case 1 for separating adjacent electronic parts 3 from each other. The partition plate sections 4 are integrally formed with the case 1 and the electronic parts 3 are respectively inserted into small room-like spaces separated from each other by the partition plate sections 4. In addition, the terminal sections 3-1 of the parts 3 are inserted into hole sections 2-2 connected to the conductive pattern 2-1 of a printed board 2 and electrically connected to the sections 2-2 by soldering, etc. Thus the high- density packaging of the electronic parts 3 is made possible by securing the insulating distances of the parts 3 by the partition plate sections 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating structure of an electronic device, and more particularly to a device capable of maintaining insulation between electronic components when electronic components are mounted at a high density.

[0002]

2. Description of the Related Art Conventionally, when arranging electronic parts, it has been necessary to provide a distance for insulation between the electronic parts and between metal casings in accordance with various safety standards and the like. Whether the electronic components are primary electronic components (primary-primary) up to the main transformer, or primary and secondary electronic components (primary-secondary) of the main transformer, etc. Depending on, the distance to be provided is different, but in the past, it is necessary to take a space between the electronic components, sandwich an insulator between the electronic components, apply a resin adhesive between the electronic components,
Alternatively, a technique of covering all the electronic components with a resin and hardening the resin has been adopted.

FIG. 5 shows a case where an insulator is interposed between electronic components. A plurality of electronic components 3 are mounted on the printed circuit board 2 on which the conductive pattern 2-1 is formed, and a partition plate 11 made of an insulator is arranged between the electronic components 3.

[0004] Since the insulating partition plate 11 is sandwiched between the electronic components 3, the partition plate is displaced as it is.
It is necessary to perform a process such as fixing using an adhesive, which is extremely troublesome.

FIG. 6 shows a case where a resin adhesive is applied between electronic components. A plurality of electronic components 3 are mounted on the printed circuit board 2 on which the conductive pattern 2-1 is formed.
A resin adhesive 12 is interposed therebetween to maintain the insulation between the electronic components 3.

[0006] Since the resin adhesive is applied between the electronic components 3, the amount of the resin adhesive cannot be controlled and workability is poor.

[0007]

SUMMARY OF THE INVENTION In the conventional method,
A large mounting area is required if the electronic components are spaced apart from each other, and if an insulator is interposed, the workability is poor and the cost is high. If a resin adhesive is applied between electronic components, it is difficult to control the amount of the resin adhesive, resulting in poor workability and high cost. In the case where the electronic component is covered with a resin and hardened, it takes time to fill the resin to a fine portion, and there is a problem that workability is poor and cost is increased.

In an apparatus in which a heat-generating power component such as a power supply and a control circuit component coexist, it is difficult to arrange a heat-sensitive component close to the heat-generating component.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems by providing an electronic component with a small space and a good cost and workability, which is suitable for mounting the electronic component on a housing. The purpose is to provide an insulation structure for equipment.

[0010]

The principle structure of the present invention is shown in FIG.
This will be described below. In FIG. 1, 1 is a resin case, 2 is a printed board, 2-1 is a conductive pattern, 3 is an electronic component,
4 is a partition plate part, 5 is a nail | claw.

The above object of the present invention can be achieved by the following electronic device insulation structures (1) and (2).

(1) A resin case 1 having a plurality of electronic components 3 mounted on a substrate 2 and a partition plate portion 4, and a partition plate portion of the resin case 1 is provided between the plurality of electronic components 3. 4, the partition plate 4 secures the insulation distance of the electronic component 3 to enable high-density mounting of the electronic component 3.

(2) In the above (1), the electronic component 3 connected to the conductive material is incorporated, and the partition plate portion 4
By securing the insulation distance of each electronic component 3, the electronic components 3
And high-density mounting is enabled.

Thus, the following effects can be obtained.

[0015] (1) The partition plate of the resin case ensures insulation between a plurality of electronic components mounted on the substrate or between the electronic component and the metal housing. Since the space between components can be reduced to a minimum, extremely high-density mounting can be performed. Also, since the resin case also serves as a fixture for electronic components, the workability of soldering is improved, and since the thermal conductivity of the resin is low, heat received from the outside can be cut off. The components can be arranged and the temperature rise can be suppressed.

(2) The cost can be reduced by using a conductive material such as a sheet metal in place of the substrate.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view showing an embodiment of the present invention, and FIG. 2 is a partially sectional perspective view of the assembly of FIG. In the figure, 1 is a resin case, 2 is a printed board, 3 is an electronic component, 4 is a partition plate, 5 is a nail, and 6 is an outer wall.

The resin case 1 has a box shape, is made of an insulating material such as polybutylene terephthalate resin having low thermal conductivity, and has a partition plate portion for isolating between electronic components 3 adjacent to each other. 4 are provided. The partition plate 4 is formed integrally with the resin case 1, and the electronic components 3 are inserted into the resin case 1 separated into small rooms by the partition plate 4. The terminal portions 3 of these electronic components 3
1 is inserted into a hole 2-2 connected to the conductive pattern 2-1 of the printed circuit board 2, and is electrically connected by soldering or the like.

Although FIGS. 1 and 2 show an example in which one electronic component 3 is arranged in a small room-like area partitioned by the partition plate 4, the present invention is of course limited to this. Instead, a plurality of electronic components can be arranged in one small room-like area.

FIG. 2 is a perspective view, partially in section, assembled in an insulating structure according to the present invention. The electronic component 3 is insulated from the adjacent electronic component by the partition plate 4.

A conductive pattern 2-1 is formed on the printed board 2, and an electronic component 3 is connected to the conductive pattern 2-1. The printed board 2 is provided with a hole 2-2, and the electronic component 3 and the conductive pattern 2-1 are connected by inserting the terminal 3-1 of the electronic component 3 into the hole 2-2.
By soldering this connection portion, the electronic component 3 and the conductive pattern 2-1 are electrically and mechanically connected.

The printed circuit board 2 is formed on the outer wall 6 of the resin case 1.
Is substantially fixed by the claw 5 provided inside the.

Therefore, after the electronic components 3 are mounted on the printed circuit board 2, each of the electronic components 3 is inserted so as to be separated by each partition plate portion 4 of the resin case 1, as shown in FIG.
As shown in the figure, the electronic components 3 are arranged in the resin case 1 isolated in a small room shape, and high-density mounting can be performed while insulating the adjacent electronic components.

Further, the pattern on the printed circuit board 2 can be insulated from the external electronic parts (not shown) or the metal casing (not shown) by the outer wall 6, so that the pattern on the printed circuit board 2 has a shape. The degree of freedom increases.

FIG. 3 shows a second embodiment of the present invention.
FIG. 3 shows a case where a large number of conductive patterns 2-1 are formed on the printed circuit board 2 and a large number of electronic components 3 are mounted.

As in polybutylene terephthalate resin,
A resin case 1 made of a resin having a low thermal conductivity includes:
A large number of partition plates 4 are provided in accordance with the large number of electronic components 3, and a small room-like area for accommodating the electronic components 3 is formed. The resin case 1 shown in FIG.
1 and 2, the lower portion is closed so that heat from the outside is not easily conducted to the internal electronic components.

Supports 21 are fixedly attached to the printed circuit board 2, and the resin case 1 is provided with support portions 26,
26 are formed. The resin case 1 is mounted on the printed circuit board 2 so that the electronic components 3, 3... Then, the hole 22 of the support 21 and the hole 23 of the support 26 are fixed with screws or the like, and the printed circuit board 2 and the resin case 1 are fixed.

Thereafter, the holes 2 formed in the printed circuit board 2 are formed.
5, 25 and holes 24, 24 formed in support 21
The printed circuit board 2 integrated with the resin case 1 can be attached to a supporting portion (not shown) by means of (the corresponding holes are also formed in the supporting portions 26, 26).

As described above, the present invention can be applied to a printed circuit board on which a large number of electronic components are mounted.

FIG. 4 shows a third embodiment of the present invention.
FIG. 4 shows a case where a conductive material 7 is used instead of a printed circuit board on which a conductive pattern is formed. By using a conductive material such as a sheet metal instead of a printed circuit board, cost can be reduced.

Japanese Patent Laying-Open No. 4-352392 discloses a case in which a metal case is divided into two parts by a second circuit board. This is a technology which is completely different from a technology in which a resin case having a partition plate portion is used as in the present invention, and the insulating distance of the electronic component is secured by the partition plate portion.

[0032]

According to the present invention, the following functions and effects can be obtained.

(1) Since the partition plate of the resin case secures insulation between a plurality of electronic components mounted on the substrate or between the electronic device and the metal housing, the electronic device can be manufactured in a very simple and inexpensive manner. Since the space between components can be reduced to a minimum, extremely high-density mounting can be performed. Also, since the resin case also serves as a fixture for electronic components, the workability of soldering is improved, and since the thermal conductivity of the resin is low, heat received from the outside can be cut off. The components can be arranged and the temperature rise can be suppressed.

(2) The cost can be reduced by using a conductive material such as a sheet metal in place of the substrate.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a partial perspective view of the assembly of FIG. 1;

FIG. 3 is a second embodiment of the present invention.

FIG. 4 is a third embodiment of the present invention.

FIG. 5 is a conventional example.

FIG. 6 is another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin case 2 Printed circuit board 3 Electronic component 4 Partition plate part 5 Claw 6 Outer wall 7 Conductive material

Claims (2)

[Claims] A plurality of electronic components mounted on a substrate; and a resin case having a partition plate, wherein the plurality of electronic components are separated by a partition plate of the resin case. An insulating structure for electronic equipment, characterized in that an insulating distance of the electronic component is secured by a part to enable high-density mounting of the electronic component. 2. An electronic component connected to a conductive material,
2. The insulation structure for an electronic device according to claim 1, wherein the partition plate secures an insulation distance between the respective electronic components and enables high-density mounting of the electrical components.