JP2001048639A - Glass-ceramic composition, circuit board using the same and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a glass-ceramic composition excellently matchable with an Ag or Au conductor material as well as provided with good ceramic characteristics and to produce a circuit board using the glass-ceramic composition. SOLUTION: The glass-ceramic composition has a glass to ceramic weight ratio of (40-60):(60-40) and the glass has an Li2O-free composition consisting of, by weight, 40-60% SiO2, 5-9% Al2O3, 1-10% B2O3, 3-5% Na2O+K2O, 3-15% CaO+MgO+ZnO and 15-40% PbO and has 650-780 deg.C softening point. The circuit board contains a laminated substrate 41 obtained by laminating insulating substrates 42a-42d and a conductor circuit formed on the surface of each of the insulating substrates, and the insulating substrates comprise the glass-ceramic composition. A wiring layer 54 and a via hole conductor 56 are disposed in the laminated substrate 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass ceramic composition used for, for example, a circuit board or a chip component, a circuit board using the same, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, glass ceramic substrates have been put into practical use in response to demands for higher performance of ceramic substrates and miniaturization of chip components. The detailed composition, production method and the like are described in JP-B-6-97565 and JP-B-6-69902.

[0003] For example, in Example 1 of Japanese Patent Publication No. 6-97565, the weight ratio of glass to Al ₂ O ₃ is 66:34 (33.5% by weight: 1) as a glass ceramic composition.
7.1% by weight), of which the glass composition is PbO
17.2 wt%, B ₂ O ₃ 4.5 wt%, SiO ₂ 56.
5 wt%, Al ₂ O ₃ 9.1 wt%, CaO 8.6 wt%, Na ₂ O 2.4 wt%, K ₂ O 1.7 wt%,
A glass having a deformation temperature of 590 ° C, a softening point of 660 ° C, and a difference between the softening point and the deformation temperature of 70 ° C is disclosed,
It is described that the tape as a glass-ceramic composite obtained by firing this glass-ceramic composition had excellent dimensional stability.

[0004] Further, in Example 1 of Japanese Patent Publication No. 6-69902, glass 60 is used as a glass ceramic composition.
% By weight and 40% by weight of Al ₂ O ₃ , and the composition of the glass is 50% by weight of SiO _2, 6% by weight of Al ₂ O ₃ , 35% by weight of PbO, 5% by weight of (MgO + CaO + SrO + BaO),
ZnO 1% by weight, B ₂ O ₃ 0.5% by weight, (Li ₂ O + N
a ₂ O + K ₂ O) 0% by weight, (TiO ₂ + ZrO ₂ ) 2.5
By weight, the composition is slurried to form a green sheet, and the substrate obtained by firing is large in resistance strength and thermal conductivity, and excellent in heat resistance and chemical resistance. It is described. Moreover, it is described that a multilayer circuit element as a glass-ceramic composite manufactured by forming an Ag-Pd conductor on a green sheet by screen printing, laminating this, and then firing is excellent in solder wettability and adhesive strength. Have been.

[0005]

However, these glass-ceramic compositions or glass-ceramic composites essentially have conductor paths formed inside or on the surface thereof.
Despite being used as a circuit board,
The matching with various conductor materials has not been sufficiently studied.

Therefore, the present inventor has repeatedly examined this point, and found the following problem. That is, when the softening point of the glass is too high, the conductor material is diffused into the ceramic when performing firing after screen-printing an Ag-based or Au-based conductor circuit on the green sheet, and the insulation resistance and the insulation resistance of the ceramic are reduced. There is a possibility that the electrical characteristics such as the dielectric constant are deteriorated and the performance as designed cannot be obtained. If the softening point of the glass is too low, the Ag-based or Au-based conductor material does not sinter sufficiently, and the adhesion strength between the glass ceramic composite and the conductor circuit may be insufficient. One of the particular problems is the warpage and deformation of the substrate when firing together with the conductor material.
In a substrate having a shape in which a large number of individual pieces of about 10 × 10 mm are arranged on a large plate of about 00 mm, the occurrence of the warpage and distortion is a fatal defect in a solder printing process and a component mounting process after firing the substrate. It became.

The present invention has been made in view of the above problems, and not only has various characteristics of ceramics excellent, but also
It is an object of the present invention to provide a glass ceramic composition having good matching with a g-based or Au-based conductor material, a circuit board using the same, and a method for manufacturing the same.

[0008]

Means for Solving the Problems, Embodiments of the Invention and Effects of the Invention In order to solve the above-mentioned problems, a glass-ceramic composition of the first invention is a glass-ceramic composition, and has a weight ratio of glass to ceramic. Is 40-60: 60-
Is 40, the composition of the _glass, SiO 2: forty to six
0% by weight, Al ₂ O ₃ : 5 to 9% by weight, B ₂ O ₃ : 1 to 10
_{Wt%, Na 2 O + K 2} O: 3~5 wt%, CaO + Mg
O + ZnO: 3 to 15% by weight, PbO: 15 to 40% by weight, not containing Li ₂ O, and having a softening point of 6
The temperature is 50 to 780 ° C.

This glass-ceramic composition preferably has, as physical properties of glass, a difference between a softening point and a yield point of 95 ° C. or more, and a glass transition point of 520 to 620 ° C. The firing of the glass ceramic composition is preferably performed in an oxidizing atmosphere at a firing temperature of 800 to 930 ° C. As the ceramic, it is preferable to use alumina, silica, mullite, magnesia, titania, zirconia, spinel, forsterite, strontium titanate, calcium titanate, or the like alone or in a suitable mixture.

A circuit board according to a second aspect of the present invention is a circuit board, comprising: a laminated board formed by laminating a plurality of insulating boards; a conductor circuit formed on at least a surface of each of the plurality of insulating boards; Wherein the insulating substrate is made of the glass-ceramic composition of the first invention.

The conductor circuit is made of an Ag-based or Au-based conductor, and preferably has an inductance circuit or a capacitance circuit.

According to a third aspect of the present invention, there is provided a method of manufacturing a circuit board, wherein a green sheet comprising the glass-ceramic composition of the first aspect is obtained, and an Ag-based or Au-based conductor layer is formed on at least the surface of the green sheet. And a step of laminating a plurality of green sheets on which the conductor layers are formed, and a step of firing the stacked green sheets at a firing temperature of 800 to 930 ° C. in an oxidizing atmosphere. I do.

As a circuit board using a low-resistance conductor, a circuit board using a Cu conductor is conventionally known. In a circuit board using the Cu conductor, a heat-resistant epoxy resin is used as a board material. The heat-resistant epoxy resin has a large signal transmission loss due to a large dielectric loss in a microwave band, and has a problem that such a resin is not suitable for a substrate used in a microwave band. For this reason, it is required for the microwave band that both the conductor loss and the dielectric loss are small.
The circuit board of the present invention using a g-based or Au-based conductor material is excellent.

In the glass-ceramic composition of the present invention, the weight ratio of glass to ceramic is 40-60: 60-
The reason for setting to 40 is as follows. That is, if the glass content is less than 40 when the total weight of the glass and the ceramic is 100, the amount of the glass component surrounding the ceramic particles is insufficient when the glass ceramic composition is fired to form an insulating substrate. This is because good wettability cannot be formed, the apparent porosity of the substrate does not become zero, and the substrate strength decreases. On the other hand, if the glass content exceeds 60, sufficient bending strength cannot be obtained. The glass-ceramic composition may be composed of only glass and ceramic, or may contain other components. A preferable numerical range is such that the weight ratio of glass to ceramic is 45 to 55:
55-45.

Regarding the components of glass, SiO ₂ is a network former of glass and is a basic composition of glass. However, the content of SiO ₂ is set to 40 to 60% by weight. Tends to be lower than 650 ° C., and if it exceeds 60% by weight, the softening point is 780 ° C.
This is because the strength tends to be higher than this, and sufficient strength cannot be obtained.

With respect to the glass components, Al ₂ O ₃ improves the solubility of the glass or the water resistance of the glass properties. However, if the content of Al ₂ O ₃ is less than 2% by weight, the glass is devitrified during melting. If it exceeds 10% by weight, the softening point becomes too high. Al ₂ O ₃ preferred content is 5 wt% to 9 wt%.

Regarding the components of glass, B ₂ O ₃ plays a role of lowering the softening point as a flux component of glass. However, the content of B ₂ O ₃ is set to 1 to 10% by weight, less than 1% by weight. The softening point tends to increase, and if it exceeds 10% by weight, the glass may flow too much when firing together with an Ag-based or Au-based conductor material, and Ag or Au may diffuse into the insulating substrate. is there.

Regarding the components of the glass, (Na ₂ O + K ₂ O)
Plays a role in lowering the softening point of glass.
₂ O + K ₂ O) of the content was 3-5% by weight of at less than 3% by weight tends to softening point is high, because decreases the insulation resistance of the insulating substrate exceeds 5 wt% .
In addition, as the same alkali metal oxide, Li ₂ O has a similar effect. However, since Li ₂ O has a small ionic radius and easily moves in glass, a circuit is required when firing with an Ag-based or Au-based conductor material. Ag or Au is easily diffused into the substrate. For this reason, in the present invention, L is contained in the glass component.
Does not contain i ₂ O.

Regarding the components of the glass, (CaO + MgO +
ZnO) adjusts the thermal expansion coefficient of the glass and lowers the softening point, and this (CaO + MgO + Zn)
The reason why the content of O) is 3 to 15% by weight is that if it is less than 3% by weight, the above-mentioned role is not sufficiently fulfilled, and if it exceeds 15% by weight, devitrification or vitrification becomes difficult.

Regarding the glass components, PbO plays a role of lowering the softening point of the glass as a flux component of the glass, but the content of PbO is set to 15 to 40% by weight. This is because the points tend to be higher.

Here, B ₂ O ₃ , (Na ₂
O + K ₂ O) and PbO both play a role in lowering the softening point, so it is conceivable to use these components alone to lower the softening point. However, B ₂ O ₃ or (Na ₂
O + K ₂ O) alone, if it is attempted to sufficiently lower the softening point, the amount is too large and another defect (A in the former case) occurs.
It is not suitable because g or Au diffuses into the ceramic, and in the latter case, the insulation resistance decreases. Also, P
Even if bO alone is used to lower the softening point sufficiently,
If PbO is too large, the softening point rises conversely, which is inappropriate. Accordingly, B ₂ O ₃ , (Na ₂ O + K ₂ O), PbO are used so that the softening point is in the range of 650 to 780 ° C.
Need to be appropriately determined within the above numerical range.

In the glass-ceramic composition of the present invention, the softening point was set at 650 to 780 ° C., but the reason why the softening point was limited to this range was that if these physical properties were lower than the lower limit, the softening point was changed to Ag.
When sintering together with Au-based or Au-based conductor material, the ceramic sinters, but the conductor material may not be sufficiently sintered,
If these properties exceed the upper limit, the firing temperature becomes too high and Ag or Au may diffuse into the insulating substrate.

The difference between the softening point and the yield point (also referred to as the deformation temperature) is preferably 95 ° C. or more. The reason is that if this difference is less than 95 ° C., the warpage when firing together with the Ag-based or Au-based conductor material becomes large. Especially this difference is 9
Preferably it is 5 to 120 ° C. For the same reason, the yield point is 555-685 ° C., and the glass transition point is 52
It is preferably in the range of 0 to 620 ° C.

Since the glass-ceramic composition of the present invention contains PbO in the glass component, it is preferable that the firing be performed in an oxidizing atmosphere (for example, in an air atmosphere). This is because when firing in a reducing atmosphere, PbO may be reduced to cause a decrease in insulation resistance. In the case where firing is performed in an oxidizing atmosphere as described above, it is preferable to use an Ag-based or Au-based material that is hardly oxidized as a conductor material. For example, Ag-Pd, A
g-Pt or the like can be used. Further, the organic matter in the green sheet to be fired is evaporated (burned out), and at the same time, the matching property with the conductor material (the sinterability of both the glass ceramic and the conductor material when the conductor material is fired, Ag or Au).
Taking into account the prevention of the diffusion of
The temperature is preferably set to 0 ° C.

[0025]

EXAMPLES [Examples 1 to 5, Comparative Examples 1 to 5] Various components were mixed so as to obtain the glass compositions shown in Table 1, and then melted, solidified and pulverized to obtain glass powder having an average particle size of 3 to 5 μm. I got
Then, this glass powder and α-alumina having an average particle size of 3 μm were mixed at the ratio shown in Table 1, and Examples 1 to 5 and Comparative Example 1 were mixed.
~ 5 glass ceramic compositions were obtained. Next, 10 parts by weight of an acrylic resin as a binder component, 5 parts by weight of dibutyl phthalate as a plasticizer, and an appropriate amount of methyl ethyl ketone as an organic solvent were added to 100 parts by weight of each glass ceramic composition, and mixed and mixed. After that, a green sheet (thickness: 0.3 mm) was produced by a doctor blade method.

The glass transition point, softening point and sagging point were measured by Rigaku Corporation as TG-DTA TA.
Using S300, put the sample powder in a platinum ampoule
50 mg, 10 ° C / mi from room temperature to 1200 ° C
The temperature was raised at n.

[0027]

[Table 1] Various Ceramic Property Tests The obtained green sheets were fired at the firing temperatures shown in Table 2 to form insulating substrates, and the following items were evaluated for the substrates. The results are shown in Table 2.

Apparent porosity: The test was performed according to JIS-C2141 (Testing method for ceramic materials for electrical insulation).

Bending strength: A three-point bending test was performed according to JIS-R1601 (Bending strength test method for fine ceramics).

Young's modulus: This was measured by the ultrasonic pulse method of JIS-R1602.

Dielectric constant, dielectric loss: thickness of substrate is 0.63
After being polished to a thickness of 0.2 mm, the measurement was performed by the dielectric resonator perturbation method.

Withstand voltage: Measured according to JIS-C2110.

Thermal expansion coefficient: Measured according to JIS-R1618.

Thermal conductivity: Measured according to JIS-R1611.

-Simultaneous sinterability test An Ag metallized paste was prepared as follows. That is, for 100 parts by weight of Ag powder having an average particle size of 3 μm,
A glass powder was prepared by adding 2 parts by weight of glass powder having the same composition as the glass in the glass ceramic composition, quantitatively adding ethyl cellulose as an organic binder and butyl carbitol as a solvent, and mixing with a three-roll mill. The obtained paste is vertically 50 × horizontal 50 × thickness 0.3.
(Mm) green sheet 30 × 30 × 20
(Μm) screen printing. This was fired at the firing temperature of each ceramic described in Table 2 to simultaneously sinter the Ag powder and the ceramic, and the warpage of the fired circuit board was measured. The coloring of the substrate at that time was visually evaluated. The results are shown in Table 2. Note that A
At the time of g diffusion, the boundary between the substrate and the conductor was colored yellow.

[0036]

[Table 2] Evaluation Results As is evident from Table 2, the insulating substrate and the circuit board obtained from the glass ceramic composition of Example 1 had good ceramic characteristics, and also exhibited warpage when fired with an Ag-based conductor material. Very little Ag diffusion was observed, and satisfactory characteristics as a green sheet and a circuit board were obtained.

The insulating substrates and circuit boards obtained from the glass-ceramic compositions of Examples 2 and 3 were the same as Example 1 except that the weight ratio of glass to alumina was different. Similarly to the above, all the ceramic characteristics were good, the warpage when sintered with an Ag-based conductor material was extremely small, and no Ag diffusion was observed, and satisfactory characteristics as a green sheet and a circuit board were obtained.

The glass-ceramic compositions of Examples 4 and 5
The obtained insulating substrate and circuit board were compared with those in Example 1.
Therefore, it is almost the same except that the glass composition is different.
As in Example 1, warpage when fired with an Ag-based conductor material was
Very little Ag diffusion was observed. Example
No. 4 is "B" which is a main component for lowering the softening point._TwoO_ThreeAnd K _Two
O + Na_TwoThe total amount of O and PbO "is smaller than in the other embodiments.
Due to the small number, the softening point was high.

The insulating substrate and the circuit board obtained from the glass ceramic composition of Comparative Example 1 were different from those of Example 1 in that
Almost except that the glass composition is different (particularly the point containing Li ₂ O), the glass transition point Tg, the sag point Td, and the softening point Ts are all low and (Ts−Td) is as small as 86 ° C. Similarly, discoloration due to Ag diffusion when sintering together with the Ag-based conductor material was observed, and satisfactory characteristics as a green sheet and a circuit board were not obtained.

The insulating substrate and the circuit board obtained from the glass ceramic composition of Comparative Example 2 were different from those of Example 1 in that
This is almost the same except that the glass composition is different (particularly, the point containing Li ₂ O) and the (Ts−Td) is as small as 92 ° C., but the warpage when fired together with the Ag-based conductor material is large. Discoloration due to diffusion was also observed, and satisfactory characteristics as green sheets and circuit boards were not obtained.

The insulating substrates and circuit boards obtained from the glass-ceramic compositions of Comparative Examples 3 and 4 were almost the same as Example 1 except that the weight ratio of glass to alumina was different. In Comparative Example 3 which was too large, the flexural strength of the ceramic was low, and in Comparative Example 4 where the glass was too small, the apparent porosity was not zero and the sintering was insufficient, and both were not suitable for practical use.

When the insulating substrate obtained from the glass ceramic composition of Example 1 of the present invention was subjected to powder X-ray diffraction, the presence of anorthite was confirmed.

A microwave circuit chip can be prepared by applying an insulating substrate obtained from the glass ceramic composition of the present invention.

Next, a coupler with a built-in low-pass filter as an example of a microwave circuit chip to which the present invention is applied, and an inductance circuit and a capacitance circuit constituting the coupler will be described.

FIG. 1 is a schematic diagram showing a coupler with a built-in low-pass filter used in a mobile phone. As shown in FIG. 1, the low-pass filter built-in coupler 10 is configured by laminating eight insulating substrates 12. Each insulating substrate 12 is one in which necessary circuit elements are formed on the surface of the insulating substrate of the first embodiment. The size of the low-pass filter built-in coupler 10 is 3.2 mm in length, 1.6 mm in width, and 1.3 in height.
mm. It should be noted that FIG. 1 is a schematic diagram, and the vertical scale and the horizontal scale are not the same. Wirings 13 as interlayer conductors for electrically connecting circuit elements of one layer and circuit elements of another layer are provided in six concave portions 11 formed on both side surfaces of the coupler 10 with a built-in low-pass filter.
Is provided.

FIGS. 2A and 2B are diagrams showing a substrate provided with an inductance circuit and a substrate provided with a capacitance circuit among the laminated substrates of the coupler with a built-in low-pass filter shown in FIG. is there.

On the insulating substrate 12a shown in FIG. 2A, inductance circuits 14a and 14b, a via-hole conductor 16 as an interlayer conductor, and a contact region 18 electrically connected to the via-hole conductor 16 are provided. Is formed. 2B, capacitance circuits 20a, 20b and 20c are formed on the insulating substrate 12b, and a capacitance circuit 22 is formed on the insulating substrate 12c.

The inductance circuit 14 shown in FIG.
a and 14b and the contact region 18
The via-hole conductor 16 is electrically connected to the circuit element of the insulating substrate laminated below the insulating substrate 12a. The capacitance circuits 20a, 20 shown in FIG.
A capacitance is formed by the capacitance formed between b and 20c and the capacitance circuit 22.

Next, a method for manufacturing the above-described coupler 10 with a built-in low-pass filter will be described with reference to FIG. FIG.
It is a top view of the ceramic green sheet which takes nine insulating substrates 12c shown in FIG.2 (b). Green sheet 3
A circuit pattern 32 made of silver paste for forming a capacitance circuit is formed on the upper surface of the screen 0 by screen printing. In FIG. 3, a dotted line 34 indicates a cutting line when each insulating substrate is formed. This dotted line 34
Along the through hole 3 for forming the recess 11 shown in FIG.
6 is punched by a punch.

FIG. 2A and FIG.
Eight layers each having a necessary circuit pattern as shown in (b) are laminated, and then silver platinum paste is printed on the inner wall surface of the through hole 36 by a screen printing method. Next, cutting is performed along a dotted line 34 shown in FIG. Next, the green sheet forming the insulating substrate and the silver platinum paste forming the circuit pattern are simultaneously fired. Thus, the coupler with a built-in low-pass filter shown in FIG. 1 is obtained.

FIG. 4 is a partially cutaway sectional view showing a power amplifier to which the present invention is applied. As shown in FIG. 4, the power amplifier 40 is configured by laminating four layers of insulating substrates 42 a to 42 d, and a cavity 44 is provided in the center of the laminated substrate 41. The insulating substrates 42c and 42d in the region of the cavity 44 have a two-layer structure. On the insulating substrate 42b defining the cavity 44, a semiconductor chip 46 on which an integrated circuit is formed is mounted. The step portion 48 surrounding the cavity 44 and the semiconductor chip 46 are electrically connected by bonding wires 50. Fourth-layer insulating substrate 4 as the uppermost layer
A chip component 52 such as a resistor is mounted on 2d. The wiring layer 54 and the via-hole conductor 56 are provided inside the laminated substrate 41.

Next, a method of manufacturing the power amplifier will be described. First, a method of manufacturing a laminated substrate used in the power amplifier will be described.

A green sheet (thickness: 0.15 mm) was prepared in the same manner as in Example 1 described above, and 100 mm × 100 m
Prepare a piece cut to the size of m. In the green sheet of each layer, a necessary circuit pattern is made of Ag and / or Pt.
Is printed in the form of a matrix by screen printing using the paste described above, and through holes for forming the step portions 48 and the cavities 44 are formed in the form of a matrix in the sheets forming the third and fourth layers from the bottom. I do. Next, the green sheets on which the circuit patterns are printed are laminated, and the green sheets and the Ag and / or Pt paste forming the circuits are simultaneously fired. 6 to 8 show the fired large laminated substrate.
Shown in

As shown in FIG. 6, a large laminated substrate 60 is
A large number of power amplifier substrates can be formed from one laminated substrate 60 by cutting along a cutting line 64 indicated by a dotted line, comprising a large number of chip regions 62 extending in the X direction and the Y direction orthogonal to each other.

FIG. 7 is a sectional view taken along line VII-VII shown in FIG. As shown in FIG. 7, the length of the laminated substrate excluding the edge is 63 mm, and the length of one chip region is 7 m.
m. The overall length of the laminated substrate 60 is 75 mm.

FIG. 8 is an enlarged view of the portion S shown in FIG. As shown in FIG. 8, the laminated substrate 60 includes layers La, L
b, Lc and Ld. Each layer is provided with a metallized layer for forming a metal wiring, a pad and the like. Layer L
On the lower surface of a, an AgPt metallized layer is provided, and on the upper surface, an Ag metallized layer is provided. An AgPt metallized layer is provided on the upper surfaces of the layers Lb, Lc, and Ld. A ceramic coat for insulation is formed on the lower surface of the layer La and on the exposed portions of the layers Lb, Lc and Ld so as to cover the metallized layer. As described above, the laminated substrate 60 is obtained by firing a laminate of a plurality of insulating substrates provided with a metallized layer of Ag and / or Pt. When the thickness is within the range, the insulating substrate is physically matched with the conductor layer. Therefore, even if the large-sized laminated substrate 60 is formed as described above, the laminated substrate after firing hardly warps or deforms.

Next, the integrated circuit and the chip parts are mounted,
An electromagnetic shield metal cap (not shown) is attached. Thereafter, cutting is performed along a dotted line 64 shown in FIG. Thereby, many power amplifier components can be obtained from one substrate.

The power amplifier shown in FIG. 4 is smaller than the conventional power amplifier shown in FIG. This is because the conventional power amplifier substrate is composed of the single-layer substrate 410, so that wiring and circuit elements can be provided only on the substrate surface, so that a large area is required. In the laminated substrate to which the present invention is applied, wiring and circuit elements can be provided inside the substrate if necessary, so that a more compact power amplifier than before can be obtained.

As described above, the laminated substrate to which the present invention is applied and which has a metallized layer inside is characterized in that it is not warped or deformed even if it is large. For example, the above 75m
The warpage of the large-sized laminated substrate 60 having four layers of m × 75 mm after firing is 40 μm or less. Therefore, a power amplifier can be manufactured with high production efficiency using such a large-sized laminated substrate. Further, the power amplifier can be downsized.

In the above embodiment, a coupler with a built-in low-pass filter and a power amplifier have been described as circuit configurations to which the present invention is applied. However, the present invention relates to filter circuits such as a low-pass filter and a high-pass filter, and other microwave circuits. It can be applied to

The embodiments of the present invention are not limited to the above-mentioned embodiments at all, and it goes without saying that various forms can be adopted as long as they fall within the technical scope of the present invention.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a low-pass filter built-in coupler used in a mobile phone to which an embodiment of the present invention is applied.

2A and 2B are perspective views showing a laminated substrate of the coupler with a built-in low-pass filter shown in FIG. 1, wherein FIG. 2A shows a substrate provided with an inductance circuit, and FIG. 2B shows a substrate provided with a capacitance circuit; Show.

FIG. 3 is a plan view of a ceramic green sheet for obtaining nine insulating substrates shown in FIG. 2 (b).

FIG. 4 is a partially cutaway sectional view showing a power amplifier to which the present invention is applied.

FIG. 5 is a side view of a conventional power amplifier.

FIG. 6 is a perspective view showing a large laminated substrate to which the present invention is applied.

FIG. 7 is a sectional view taken along line VII-VII shown in FIG. 6;

8 is an enlarged view of a region S shown in FIG.

[Explanation of symbols]

 10 --- Coupler with built-in low-pass filter 12, 12a, 12b, 12c --- Insulating substrate 14a, 14b --- Inductance circuit 20a, 20b, 20c --- Capacitance circuit 22 --- Capacitance circuit 30 --- Green sheet 32 --- Circuit pattern 34 --- Cutting line 40 --- Power amplifier 41 --- Multi-layer board 42a, 42b, 42c, 42d --- Insulating board 54 --- Wiring layer 56 --- Via-hole conductor 60- --- Large laminated substrate 62 ---- Chip area 64 ----- Cutting line

Continued on the front page (72) Inventor Yoshitaka Yoshida 14-18 Takatsuji-cho, Mizuho-ku, Nagoya-shi, Aichi F-term in Japan Special Ceramics Co., Ltd. 4G030 AA07 AA08 AA09 AA16 AA36 AA37 BA12 CA08 GA20 GA25 GA27 PA07 PA22 5E346 AA12 AA15 AA38 BB01 CC18 CC38 CC39 DD02 EE24 EE27 GG08 GG09

Claims (9)

[Claims] 1. A glass-ceramic composition wherein the weight ratio of glass to ceramic is 40-60: 60-4.
0, the composition of the glass, SiO _2: 40 to 60 wt%, Al ₂ O _3: 5~9 wt%, B ₂ O _3: 1~10 _{wt%, Na 2 O + K 2} O: 3~5 A glass-ceramic composition, characterized in that the weight percentage of CaO + MgO + ZnO: 3 to 15% by weight, the content of PbO: 15 to 40% by weight and not containing Li ₂ O, and the softening point of the glass is 650 to 780 ° C. 2. The method according to claim 1, wherein the difference between the softening point and the sag point of the glass is 9
The glass ceramic composition according to claim 1, wherein the temperature is 5 ° C or higher. 3. The glass transition point of said glass is 520-6.
The glass-ceramic composition according to claim 1, wherein the temperature is 20 ° C. 4. 4. The method according to claim 1, wherein the ceramic is alumina, silica,
The glass-ceramic composition according to any one of claims 1 to 3, which is mullite, magnesia, titania, zirconia, spinel, forsterite, strontium titanate, calcium titanate or a mixture thereof. 5. A circuit board, comprising: a laminated substrate formed by laminating a plurality of insulating substrates; and a conductor circuit formed on at least a surface of each of the plurality of insulating substrates. A circuit board comprising the glass ceramic composition according to any one of claims 1 to 4. 6. The circuit board according to claim 5, wherein the conductor circuit is made of an Ag-based or Au-based conductor. 7. In the laminated substrate, a conductor circuit formed on a surface of one insulating substrate is electrically connected to a conductor circuit formed on a surface of a different insulating substrate by an interlayer conductor. 7. The method according to claim 5, wherein
A circuit board according to claim 1. 8. The circuit board according to claim 5, wherein the conductor circuit has an inductance circuit or a capacitance circuit. 9. A method for producing a circuit board, comprising: obtaining a green sheet comprising the glass-ceramic composition according to claim 1; and at least a surface of the green sheet comprising an Ag-based or Au-based sheet. Forming a series of conductive layers, laminating a plurality of green sheets on which the conductive layers are formed, and firing the stacked green sheets at a firing temperature of 800 to 930 ° C. in an oxidizing atmosphere. The manufacturing method of the circuit board provided with.