JP2001044336A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cover a semiconductor chip with sealing resins by sealing the upper portion of the semiconductor chip mounted on a board with a high- viscosity resin, and sealing the top of the high-viscosity resin layer and the sides of the semiconductor chip with a low-viscosity resin, whose viscosity is lower than that of the high-viscosity resin to thereby maintain the mounting area small. SOLUTION: The upper surface of a semiconductor chip 6 mounted on board 1 is sealed with a high-viscosity resin 12. Furthermore, the upper and side surfaces of the chip 6 are sealed with a low-viscosity resin 13, whose viscosity is lower than that of the resin 12. As a result, the upper surface and corner portions of the chip 6 can be covered with the high-viscosity resin 12, whereby a semiconductor device maintaining configuration can be obtained. Moreover, since both the upper surface of the chip 6 sealed with the high-viscosity resin 12 and its side surfaces can be covered with a thin layer of the low-viscosity resin 13, whereby the upper and side surfaces of the chip 6 can be sealed completely with its mounting area kept to a minimum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip-chip mounting structure of a semiconductor chip, and more specifically, to a semiconductor mounted on a read / write printed board or a head slider supporting suspension mounted inside a magnetic disk drive. The present invention relates to a flip-chip mounting structure of a chip.

2. Description of the Related Art It is required that electronic components used inside a magnetic disk drive do not generate dust which causes a head crash or the like. On the other hand, a magnetic disk device is required to increase a writing frequency for a large storage capacity and a high speed processing, and it is necessary to reduce an inductance and a capacitance of a signal transmission path.
For this purpose, since it is an important requirement to mount the semiconductor device near the magnetic head slider, adoption of flip chip mounting, which can be mounted in a small area, is being studied.

However, if the silicon portion of the semiconductor chip is exposed in the flip chip structure, dust may be generated from the end face of the silicon chip. Therefore, it is indispensable to take measures against dust generation.

[0004]

2. Description of the Related Art With the development of the information society, a magnetic disk device (hereinafter referred to as an HD) as an external storage device of a computer has been developed.
D) has become increasingly important, and its recording density has been significantly improved year by year.

[0005] Furthermore, HDDs are required to have a large capacity in addition to miniaturization from the trend of miniaturization, and this purpose is achieved by reducing the diameter of the magnetic disk medium and improving the areal recording density.

Here, since the areal recording density is composed of the circumferential linear recording density and the radial track density of the magnetic disk medium, it is possible to obtain a high areal recording density by improving both or one of them. it can.

However, it is essential to reduce the flying height of the magnetic head in order to achieve this, and to achieve and maintain this, there must be no generation of dust inside the HDD.

That is, when dust is generated during the operation of the HDD, the dust enters the air bearing portion which keeps the flying height of the magnetic head constant, thereby making the flying posture of the magnetic head unstable and the worst case. In such a case, there is a problem that a so-called head crash which destroys recorded information is caused.

Therefore, as one of the measures, a technique of coating a semiconductor chip mounted near a magnetic head slider with a resin and sealing it in order to prevent dust from being generated from the semiconductor device has been adopted.

As a technique for coating and sealing a semiconductor chip with a resin, there is a technique called a wire bonding method.

In other words, there is a method in which a semiconductor chip is mounted on a substrate surface with the electrode mounting surface facing upward, and the electrodes and the wiring patterns on the substrate surface are connected. Here, it has been common practice to overcoat the sealing resin using a dispense method or a printing method and to solidify the overcoat.

However, since the semiconductor chip needs to be mounted near the magnetic head slider, adoption of a flip chip mounting method instead of the wire bonding mounting method has been studied as a method capable of mounting in a small area.
It is being put to practical use.

For example, when a semiconductor chip is mounted on a printed wiring board by flip-chip bonding, a sealing technique has been disclosed for the purpose of preventing the peeling, cracking, etc. of the sealing resin from occurring (for example, Japanese Patent Application Laid-Open No. HEI 9-110572). 10-199936).

FIG. 3 is a sectional view showing a conventional flip-chip mounting of a semiconductor chip on a flexible printed wiring board. Here, in order to prevent the sealing resin from peeling and cracking when the semiconductor chip is mounted on the flexible printed wiring board, the space between the flexible printed wiring board and the semiconductor chip is sealed with a semiconductor chip fixing resin. In addition, the strength is increased by covering and protecting the semiconductor chip from the upper surface to the side surface with an insulating resin, and at the same time, the flexible printed wiring board is less likely to bend, so that the sealing resin may peel or crack. Will not be done.

At this time, since the insulating resin is made of a resin having a higher viscosity than that of the semiconductor chip fixing resin, the shape retaining property is good and a shape close to the state when supplied is obtained. Worries are resolved.

As a mounting structure of a semiconductor chip, a technique of applying an insulating resin to the side surface of the semiconductor chip has been disclosed (for example, Japanese Patent Application Laid-Open No. H11-40709).

FIG. 4 is a sectional view showing a conventional flip chip mounting structure of a semiconductor chip. That is, an insulating resin is applied to a side surface of a semiconductor chip mounted on a substrate by flip-chip mounting, and a control electrode is provided on a portion of the substrate that does not face the semiconductor chip. Then, a conductive resin is applied so as to cover the periphery of the semiconductor chip and the upper surface of the control electrode, so that the semiconductor device is less likely to malfunction.

By adopting this structure, the semiconductor device is excellent in blocking noise and external radiation, hardly emits and mixes noise on the back surface of the semiconductor device, and is hardly damaged by static electricity even in a semiconductor device having a structure weak to static electricity. The structure can be realized.

[0019]

However, sealing between the flexible printed wiring board and the semiconductor chip with a semiconductor chip fixing resin and further covering the semiconductor chip from the top surface to the side surfaces with an insulating resin is a problem of shape retention. Better
The purpose is to prevent destruction such as peeling or cracking, and in order to perform this coating, the thickness of the insulating resin must be increased, and thus there is a problem that a large mounting area is required.

The flip-chip mounting method aims at making the mounting space smaller than that of the wire bonding mounting method, and does not aim at preventing generation of dust from the semiconductor device.

Therefore, in a method of applying a sealing resin so that corner portions of a semiconductor chip are not exposed when overcoating for preventing generation of dust from a semiconductor device, a mounting area larger than that of the semiconductor device is required. Required.

If the amount of the sealing resin applied is reduced in order to reduce the mounting area, the corners of the semiconductor chip are not completely covered, and a portion that remains exposed remains. There is a concern that it may cause dust.

That is, the viscosity of the sealing resin used in the coating method greatly affects the quality of the covering property of the semiconductor device,
If the viscosity of the resin is low, it can be thinly coated, but the corners of the semiconductor chip cannot be completely covered and a part of it will be exposed. Can be completely covered, but it has been found that the thickness of the sealing resin is increased.

Accordingly, it is an object of the present invention to obtain a semiconductor device in which a mounting area is kept small and a semiconductor chip is completely covered with a sealing resin.

[0025]

As a result of the inventor's intensive studies to solve the problem, the above problem has been solved because the upper surface of a semiconductor chip mounted on a substrate is sealed with a high-viscosity resin. The problem is solved by providing a semiconductor device in which the high-viscosity resin and the side surface of the semiconductor chip are sealed with a low-viscosity resin having a lower viscosity than the high-viscosity resin.

That is, in the semiconductor device of the present invention, first, the upper surface of the semiconductor chip mounted on the substrate is sealed using a high-viscosity resin. By doing so, the upper surface and the corner portion of the semiconductor chip can be covered with the high-viscosity resin, so that the shape can be maintained.

Subsequently, the upper portion of the high-viscosity resin and the side surface of the semiconductor chip are sealed with a point-viscosity resin having a lower viscosity than the high-low viscosity resin.

By doing so, the side surface of the semiconductor chip can be covered with a thin film, so that the top and side surfaces of the semiconductor chip can be completely sealed while the mounting area is kept to a minimum.

Further, the above-mentioned problem is caused by a step of coating the upper surface of a semiconductor chip mounted on a substrate with a high-viscosity resin and a low-viscosity resin having a lower viscosity than the high-viscosity resin by a screen printing method. And a step of heating the low-viscosity resin.

That is, in the method of manufacturing a semiconductor device according to the present invention, the upper surface of the semiconductor chip mounted on the substrate is sealed with a high-viscosity resin, and the upper surface of the semiconductor chip sealed with the high-viscosity resin and the semiconductor chip. The side surfaces are sealed with a low-viscosity resin having a lower viscosity than the high-viscosity resin. By doing so, the upper surface and the corner of the semiconductor chip can be covered with the high-viscosity resin, so that the semiconductor device can be maintained in shape, and the upper surface of the semiconductor chip sealed with the high-viscosity resin and the side surface of the semiconductor chip can be separated. Since the semiconductor device can be covered with a thin film of a low-viscosity resin, a semiconductor device in which the upper surface and side surfaces of the semiconductor chip are completely sealed while the mounting area is kept to a minimum can be obtained.

Further, the above object is to provide a step of placing a high-viscosity resin laminated on a tape and a low-viscosity resin having a lower viscosity than the high-viscosity resin on the upper surface of a semiconductor chip; And a step of heating the semiconductor device.

That is, in the method of manufacturing a semiconductor device according to the present invention, the upper surface of the semiconductor chip mounted on the substrate is sealed with a high-viscosity resin, and the upper surface of the semiconductor chip sealed with the high-viscosity resin and the semiconductor chip. The sides are sealed with a resin having a lower viscosity than the high-viscosity resin. By doing so, the upper surface and the corner of the semiconductor chip can be covered with the high-viscosity resin, so that the semiconductor device can be maintained in shape, and the upper surface of the semiconductor chip sealed with the high-viscosity resin and the side surface of the semiconductor chip can be separated. Since the semiconductor device can be covered with a thin film of a low-viscosity resin, a semiconductor device in which the upper surface and side surfaces of the semiconductor chip are completely sealed while the mounting area is kept to a minimum can be obtained.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.

FIG. 1 is a cross-sectional view showing a method of manufacturing a semiconductor device by a screen printing method according to one embodiment of the present invention. FIG. 2 is a sectional view showing a sealing resin disposed on one surface of one embodiment according to the present invention. It is sectional drawing which shows the manufacturing method of the semiconductor device by a tape. In the figure, 1 is a substrate, 3 is a pump, 6 is a semiconductor chip, 9 is a semiconductor chip fixing resin, 11 is a printing plate, 12 is a high viscosity resin, 13 is a low viscosity resin,
Reference numeral 14 denotes a tape having a sealing resin disposed on one surface, 15 denotes a sealing resin, 16 denotes a bonding head, 17 denotes a heater, and 20 denotes a semiconductor device.

The components shown in the drawings correspond to those shown in FIGS. 3 and 4 showing the conventional example, and are denoted by the same reference numerals.

Example 1 A semiconductor chip 6 was mounted on a substrate 1
The semiconductor chip is fixed with the semiconductor chip fixing resin 9 so as to be electrically connected to the circuit pattern of the substrate 1 via bumps (not shown).

Subsequently, as shown in FIG. 1, a printing plate 11 made of stainless steel and having a thickness of 50 μm was placed such that the height of the lower surface of the printing plate 11 was the same as the upper surface of the semiconductor chip 6. Align using a jig not shown. Then, printing is performed by a normal screen printing method using, for example, the high-viscosity resin 12 of model LP-F8032 manufactured by Dexter. The viscosity of LP-F8032 used here is 10,000 to 100,000 cps at room temperature.

Subsequently, after the same printing plate 11 is similarly positioned, printing is performed by a normal screen printing method using a low-viscosity resin 13 having a lower viscosity than the high-viscosity resin 12 of, for example, Model TB3062C manufactured by ThreeBond. I do. The viscosity of TB3062C used here was 100 to 5,000 at room temperature.
0 cps.

The high-viscosity resin 12 thus formed by the printing method
The low-viscosity resin 13 is cured by holding it at, for example, 150 ° C. for 2 hours using a thermostat.

According to the method of manufacturing a semiconductor device through these steps, the upper surface and the corner portion of the semiconductor chip 6 can be covered with the high-viscosity resin 12 so that the shape can be maintained, and the semiconductor chip cannot be covered with the high-viscosity resin 12. 6
Can be covered with a thin film of the low-viscosity resin 13 having a lower viscosity than the high-viscosity resin 12 together with the upper surface, so that the top and side surfaces of the semiconductor chip 6 are completely sealed while keeping the mounting area to a minimum. It can be.

In this embodiment, the upper surface and the corner portion of the semiconductor chip 6 are covered with the high-viscosity resin 12, and the upper surface of the high-viscosity resin 12 and the semiconductor chip 6 that cannot be covered with the high-viscosity resin 12.
Was coated with a low-viscosity resin 13 having a lower viscosity than the high-viscosity resin, but the upper surface and side surfaces of the semiconductor chip 6 were covered with a low-viscosity resin 13 having a lower viscosity than the high-viscosity resin, and were covered with the low-viscosity resin 13. High-viscosity resin 1 is applied to the upper surface of semiconductor chip 6.
2, the top and side surfaces of the semiconductor chip 6 can be sealed. However, in this method, there is a concern that the sealing of the corner portion of the semiconductor chip becomes insufficient. [Embodiment 2] First, as in Embodiment 1, a semiconductor chip 6 is mounted on a substrate 1 via bumps (not shown).
And is fixed with the semiconductor chip fixing resin 9 so as to conduct with the circuit pattern.

Subsequently, as shown in FIG. 2, a tape 14 having a sealing resin 15 disposed on one side is mounted on the upper surface of the semiconductor chip 6 with the sealing resin 15 facing down,
A bonding head 16 to which a heater 17 positioned by a jig (not shown) is attached is disposed thereon.

It is preferable that the sealing resin 15 used here is, for example, an epoxy resin which is B-staged, and that this is disposed on one side of the tape and used. And heater 1
For example, by heating and pressurizing at 150 ° C. for 2 hours in 7, the viscosity of the sealing resin 15 on the tape 14 arranged on one side is reduced, and flows to the upper surface, the corner portion and the side surface of the semiconductor chip 6, and eventually. To cure.

By adopting a method of manufacturing a semiconductor device through these steps, the upper surface, corner portions and side surfaces of the semiconductor chip 6 can be sealed with the sealing resin 15.

In order to completely seal the upper surface, corner portions and side surfaces of the semiconductor chip 6 while keeping the mounting area to a minimum, as in the first embodiment, the sealing resin disposed on one side of the tape is used. 15 is preferably composed of two layers of a high-viscosity resin 12 and a resin 13 having a lower viscosity than the high-viscosity resin 12.

[0046]

As described above, according to the present invention,
Since the semiconductor device can be a semiconductor device in which the top surface, corner portions, and side surfaces of the semiconductor chip are completely sealed with resin while the mounting area is kept to a minimum, there is an effect of preventing generation of dust from the semiconductor device. Further, the method of manufacturing a semiconductor device according to the present invention facilitates the configuration of an automated assembly line, and thus can reduce the cost.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a method for manufacturing a semiconductor device by a screen printing method according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a method for manufacturing a semiconductor device using a tape having a sealing resin disposed on one side according to one embodiment of the present invention;

FIG. 3 is a cross-sectional view showing a conventional flip-chip mounting of a semiconductor chip on a flexible printed wiring board.

FIG. 4 is a cross-sectional view showing a conventional flip-chip mounting structure of a semiconductor chip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor device electrode 3 Bump 4 Circuit pattern 6 Semiconductor chip 7 Conductive resin 8 Insulating resin 9 Semiconductor chip fixing resin 11 Printing plate 12 High-viscosity resin 13 Low-viscosity resin 14 Tape with sealing resin arranged on one side 15 Resin for sealing 16 Bonding head 17 Heater 20 Semiconductor device

Claims (3)

[Claims] An upper surface of a semiconductor chip mounted on a substrate is sealed with a high-viscosity resin, and the upper surface of the high-viscosity resin and the side surface of the semiconductor chip have a lower viscosity than the high-viscosity resin. A semiconductor device sealed with resin. 2. A method of manufacturing a semiconductor device in which a semiconductor chip mounted on a substrate is sealed with a resin, wherein an upper surface of the semiconductor chip is formed of the high-viscosity resin and a low-viscosity resin having a lower viscosity than the high-viscosity resin. And a step of heating the low-viscosity resin and the high-viscosity resin. 3. A method of manufacturing a semiconductor device for sealing a semiconductor chip mounted on a substrate with a resin, wherein the high-viscosity resin laminated on a tape and a low-viscosity resin having a lower viscosity than the high-viscosity resin are combined with each other. A method of manufacturing a semiconductor device, comprising: a step of placing the chip on an upper surface of a chip; and a step of heating the high-viscosity resin and the low-viscosity resin.