JP2001044090A - Semiconductor production facility and maintenance method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance maintenance work efficiency of the entire facility by an arrangement, wherein individual control sections collect the maintenance information item count of respective semiconductor production systems and deliver the count to a main control section where the maintenance timing of the semiconductor production system is set, based on the received maintenance information item count. SOLUTION: Individual control sections 24a, 24b, 24c, 24d, etc., record the number of execution times of a processing program and the record count concerning the cassette of the processing program for respective semiconductor production systems, collect and store the counts concerning maintenance information items and delivers the counts to a main control section 20. The main control section 20 acquires the counts concerning maintenance information items in real time and stores them in a storage section 23. Based on the received counts concerning maintenance information items, the main control section 20 sets the maintenance timing for a plurality of semiconductor production systems.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing facility equipped with a plurality of semiconductor manufacturing apparatuses, and the maintenance status of each semiconductor manufacturing apparatus is controlled so that the operation rate of each semiconductor manufacturing apparatus does not fall below a predetermined value. The present invention relates to a semiconductor manufacturing facility to be managed and a maintenance method for the semiconductor manufacturing facility.

[0002]

2. Description of the Related Art First, a semiconductor manufacturing apparatus for manufacturing a semiconductor device will be described. Semiconductor manufacturing apparatuses include a semiconductor manufacturing apparatus that batch processes a required number of sheets and a single-wafer type semiconductor manufacturing apparatus that processes one or a plurality of sheets. FIG. 6 shows a batch type semiconductor manufacturing apparatus.

A cassette transfer section 2 is provided on the front side inside the housing 1, and a first cassette storage shelf 4 is provided opposite the cassette transfer section 2 with the cassette transfer section 3 interposed therebetween.
A second cassette storage shelf 5 is located above the first cassette storage shelf 4.
Is provided, and a spare cassette storage shelf 13 is provided so as to face the second cassette storage shelf 5. A wafer transfer unit 6 is provided behind the first cassette storage shelf 4, and a boat elevator 7 is provided further behind the wafer transfer unit 6, and the wafer 8 is mounted on the boat elevator 7 in a horizontal posture. A quartz boat 9 loaded in multiple stages is erected.

A reaction furnace 10 is provided behind the second cassette storage shelf 5, and the reaction furnace 10 includes a reaction tube 11 made of quartz.
And a heater unit 12 provided around the reaction tube 11
Consists of The boat elevator 7 loads the boat 9 into and out of the reaction tube 11.

A product wafer to be processed is transported and stored in a state loaded in a cassette 15. The cassette 15 transported from the external transport device is carried into the cassette transfer unit 2 and further transferred by the cassette transport unit 3 to the first cassette storage shelf 4, the second cassette storage shelf 5, and the spare cassette storage shelf 13. Is done.

The cassettes 15 stored in the first cassette storage shelf 4, the second cassette storage shelf 5, and the spare cassette storage shelf 13 are the same as the cassettes (product cassettes 15a) loaded with the above-described product wafers. Another example is a dummy cassette 15b in which dummy wafers are loaded.

The transfer of the wafer 8 by the wafer transfer section 6 is performed between the boat 8 and the boat 9 in the lowered state.

The product wafers 8a to be batch-processed are transferred to the boat 9 by the wafer transfer unit 6 within the uniform heating range of the heater unit 12 or the number of wafers set by a processing program. Dummy wafers 8b are transferred to the upper and lower portions of the boat 9.

The boat 9 loaded with the wafer 8
Is charged into the reaction tube 11 by the boat elevator 7 and required processing such as film formation is performed. After the processing, the boat 9 is pulled out by the boat elevator 7, and the product transfer unit 6 returns the product wafer 8a to the product cassette 15a and the dummy wafer 8b to the dummy cassette 15b. The product cassette 15a is transferred to the cassette transfer section 2 by the cassette transfer section 3, and is unloaded by an external transfer device (not shown).
The dummy cassette 15b is stored in the first cassette storage shelf 4, the second cassette storage shelf 5, and the spare cassette storage shelf 13, and is used repeatedly.

For example, when a film is formed on a wafer,
The reactant adheres and deposits not only on the wafer surface but also on the inner surface of the reaction tube 11, a portion such as a boat, which is in contact with the reaction gas. When the adhered and deposited reactant peels off, it floats in the reaction tube 11 as particles, and a part of the reactant adheres to the wafer and contaminates the wafer. If the wafer is contaminated with particles, the product quality and yield will decrease.
The boat 9 and the reaction tube 11 are subjected to a cleaning process at a predetermined process execution frequency or at a predetermined process execution time. The reaction tube 11 and the like may be washed by flowing a cleaning gas, or the reaction tube 11 and the like may be removed and washed.

The dummy wafer 8b is repeatedly used to form a reactive substance or an oxide film. When the thickness of the film formed on the dummy wafer 8b is increased, a phenomenon such as cracking occurs, and fine dust generated at the time of cracking becomes a contaminant to the wafer. When the number of times reaches, or when the stay time of the dummy wafer 8b in the housing 1 reaches a predetermined time, the dummy cassette 15b for storing the corresponding dummy wafer 8b is transferred via the cassette transfer unit 3 to the housing. Taken out of the body 1,
A new dummy cassette 15b is replenished. The number of times the dummy wafer 8b is used repeatedly and the length of stay in the housing 1 are managed in units of the dummy cassette 15b.

Each semiconductor manufacturing apparatus performs a series of processes such as transporting the cassette 15, transferring a wafer, and forming a film on a wafer according to a processing program. A control unit 16 (described later) of the semiconductor manufacturing apparatus executes the processing program. By recording the number of executions and the history of the processing program cassette, the number of times of use of each dummy cassette 15b and the length of stay in the housing 1 are managed.

With reference to FIGS. 7 and 8, maintenance management of the semiconductor manufacturing apparatus will be described. Maintenance management of the semiconductor manufacturing apparatus is performed by each semiconductor manufacturing apparatus alone.

An operator inputs maintenance information items to the control unit 16 of the semiconductor manufacturing apparatus from the operation unit 17 of each semiconductor manufacturing apparatus. The input maintenance information item is stored in the storage unit 18. The storage unit 18 stores a program necessary for operating the semiconductor manufacturing apparatus, such as the processing program, and also stores history information regarding an operating state obtained based on various sensors of the semiconductor manufacturing apparatus in operation. You. The control unit 16 controls a mechanism driving unit 19 according to a processing program stored in the storage unit 18.

After setting the maintenance information items, the process is started. As the processing proceeds, the control unit 16 determines that the count value corresponding to the maintenance information item, that is, the number of times the dummy cassette 15b has been used, the length of time the dummy cassette 15b has stayed in the housing 1,
The number of process executions, the process execution time, and the like of the product wafer 8a are collected as a count value and counted up. The control unit 16 compares the set value input for each of the maintenance information items with each other, and determines whether the semiconductor manufacturing apparatus has any one of the maintenance information items.
In the case where the condition is satisfied, it is determined that the maintenance time has been met, and the process is prohibited along with a notification operation such as sounding of a buzzer and lighting of a warning lamp. Thereafter, replacement of the used dummy cassette 15b and a new dummy cassette 15b, execution of a maintenance recipe such as cleaning of the reaction tube, and the like, or maintenance operation corresponding to each item is performed.

The items for which maintenance has been performed are initialized, and a new count-up is started.

[0017]

As described above, the maintenance work is required for the semiconductor manufacturing equipment, but the conventional maintenance work is performed for each semiconductor manufacturing equipment, and the maintenance information item is provided for each semiconductor manufacturing equipment. In this method, the operator inputs settings.

For this reason, the input operation of the same maintenance information item must be repeated as many times as the number of the installed semiconductor manufacturing apparatuses, and an input error may occur. Although the semiconductor manufacturing equipment is controlled and managed by the host computer, the maintenance work is performed in units of the semiconductor manufacturing equipment, so that the host computer cannot manage the maintenance work schedule of the entire semiconductor manufacturing equipment. For this reason, the maintenance work of each semiconductor manufacturing apparatus may be duplicated, a waiting time for the maintenance work occurs, and the operation rate of the entire semiconductor manufacturing equipment is reduced.

The present invention has been made in view of the above circumstances, and in a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, a maintenance schedule of each semiconductor manufacturing apparatus is integrated and managed, and maintenance work between the semiconductor manufacturing apparatuses is performed. The purpose of the present invention is to prevent duplication of data, improve the maintenance work efficiency of the entire semiconductor manufacturing equipment, and improve the operation rate of the semiconductor manufacturing equipment.

[0020]

According to the present invention, in a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, a main control section for integrally managing the plurality of semiconductor manufacturing apparatuses and each semiconductor manufacturing apparatus are provided. The individual control unit collects the maintenance information item count values of the subordinate semiconductor manufacturing equipment, and sends them to the main control unit, and the main control unit sends the transmitted maintenance information item counts. The present invention relates to a semiconductor manufacturing facility that controls to set a maintenance time of the plurality of semiconductor manufacturing apparatuses based on a value, and collects maintenance information from each semiconductor manufacturing apparatus in a semiconductor manufacturing facility including a plurality of semiconductor manufacturing apparatuses. The maintenance time of each semiconductor manufacturing apparatus based on the obtained maintenance information. Eliminated to prevent deterioration in the working rate of each of the semiconductor manufacturing device, to improve the utilization rate of the entire semiconductor manufacturing facility.

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 20 denotes a main control unit for integrally controlling semiconductor manufacturing equipment, and a main input unit 21, a main display unit 22, and a storage unit 23 are connected to the main control unit 20. I have. Further, the main control unit 20 is connected to individual control units 24a, 24b, 24c, 24d,... Of the individual semiconductor manufacturing apparatuses, and the individual control units 24a, 24b, 24c, 24d,.
... independently control the mechanism driving units 25a, 25b, 25c, 25d,.

Each semiconductor manufacturing apparatus and individual control unit 24a,
24b, 24c, 24d,... Are the same as those of the semiconductor manufacturing apparatus and the control unit 16 shown in FIGS.

The individual control units 24a, 24b, 24c,
24d,... Are mechanism drive units 25a, 25b, 25c, 25
d,... are individually controlled according to a processing program, and each semiconductor manufacturing apparatus independently processes a wafer.
Mechanism drive units 25a, 25b, 25 for wafer processing
The control of c, 25d,... is the same as the control by the control unit 16 described above.

Further, the main input section 21 is connected to the main control section 20.
Through the individual control units 24a, 24b, 24c, 24
The main control unit 20 can set and input the maintenance information items individually in d,.
, 24c, 24d,..., and the individual control units 24a, 2
4b, 24c, 24d,... Can be rewritten. In addition, the individual control units 24a,
24b, 24c, 24d,...
6b, 26c, 26d,... Can be individually set.

The individual control units 24a, 24b, 24c,
24d,... Record the number of executions of the processing program and the history count value of the processing program regarding the cassette for each semiconductor manufacturing apparatus, and maintain the number of times of use of each dummy cassette 15b, the stay time in the housing 1, and the like. A count value relating to the information item is collected, stored, and sent to the main control unit 20.

The main control unit 20 includes the individual control units 24a,
By sending the count value related to the maintenance information item from 24b, 24c, 24d,..., The count value related to the maintenance information item is acquired in real time and recorded in the storage unit 23. A program for creating a maintenance schedule is input to the storage unit 23, and creates a maintenance schedule for all the semiconductor manufacturing devices based on the maintenance information items for each semiconductor manufacturing device and the count value for the maintenance information items.

With reference to FIG. 2, the maintenance management of the semiconductor manufacturing equipment will be described.

STEP 1: The main control unit 20 calls and acquires maintenance information items for each semiconductor manufacturing apparatus from the individual control units 24a, 24b, 24c, 24d,.

STEP 2: Based on the acquisition of the maintenance information items, the individual control units 24a, 24b, 24c, 24d,.
Is determined whether or not the maintenance information item is set in the. All individual control units 24a, 24b, 24c, 24
If the maintenance setting item is set in d,.
Proceed to P4, and if any one is not set, proceed to STEP3.

STEP 3: The main control unit 20 sets the maintenance information item for the individual control unit 24 in which the maintenance information item is not set. All individual control units 24
When the maintenance setting items are set in a, 24b, 24c, 24d,...
When the setting of the maintenance information items in 24b, 24c, 24d,... Is completed, each semiconductor manufacturing apparatus starts processing the wafer. Collection of the maintenance setting items in the wafer processing process of each semiconductor manufacturing apparatus is performed in the same manner as in the related art (see FIG. 8). The time when each semiconductor manufacturing apparatus starts processing a wafer may be after the completion of STEP 8 described later.

STEP 4: Individual control units 24a, 24
The count value is obtained in real time from b, 24c, 24d,.

STEP 5: A tentative maintenance schedule for each semiconductor manufacturing apparatus is created based on the acquired count value by the maintenance schedule creation program.

STEP 6: It is determined whether or not the maintenance times overlap among the respective semiconductor manufacturing apparatuses in the created temporary maintenance schedule. If it is determined that they do not overlap, the provisional maintenance schedule is set as an execution maintenance schedule, and maintenance management is performed for each semiconductor manufacturing apparatus based on the execution maintenance schedule.

STEP 7: When the maintenance times overlap between the semiconductor manufacturing apparatuses in the created temporary maintenance schedule, an execution maintenance schedule that avoids the overlap is recreated.

The creation of the execution maintenance schedule will be described with reference to FIGS.

FIG. 4 is a temporary maintenance schedule table, and FIG.
Indicates a re-created execution maintenance schedule table.
As shown in FIG. 4 and FIG. 5, the maintenance information items include the number of times the dummy cassette is used, the staying time of the dummy cassette, the number of times the process is executed, the process execution time, the scheduled date of replacement of the dummy cassette, and the scheduled date of boat / reaction tube cleaning There are days. In FIGS. 4 and 5, in the items of the number of times the dummy cassette is used, the stay time of the dummy cassette, the number of times of execution of the process, and the time of execution of the process, the denominator indicates the target value and the numerator indicates the count value.

STEP 21: It is determined whether or not the dummy cassette replacement scheduled dates overlap in the temporary maintenance schedule table. If there is an overlap on the dummy cassette replacement scheduled execution date, the process proceeds to STEP22, and if there is no overlap, the process proceeds to STEP23.

STEP 22: If there is an overlap on the scheduled date of replacement of the dummy cassette, the maintenance time of replacement of the dummy cassette is advanced for the semiconductor manufacturing apparatus which reaches the maintenance time earlier.

STEP 23: It is determined whether or not there is an overlap on the scheduled boat / reaction tube cleaning execution date. If there is an overlap on the boat / reaction tube cleaning scheduled execution date, the process proceeds to STEP 24, and if there is no overlap, the process returns to STEP 21.

STEP 24: If there is an overlap between the scheduled boat / reaction tube cleaning execution dates, the reaction tube cleaning execution maintenance timing is advanced for the semiconductor manufacturing apparatus that reaches the maintenance time soon.

In the schedule table shown in FIG. 4, the scheduled date for replacing the dummy cassette and the scheduled date for executing the boat / reaction tube cleaning for the semiconductor manufacturing apparatuses A and C overlap. When the semiconductor manufacturing apparatus A and the semiconductor manufacturing apparatus C are compared in the maintenance information items regarding the number of times the dummy cassette is used, the stay time of the dummy cassette, the number of times the processing is executed, and the processing execution time, the semiconductor manufacturing apparatus A is earlier in maintenance time. It is determined that the time has arrived, and the scheduled maintenance execution date of the semiconductor manufacturing apparatus A is advanced.

FIG. 5 is a re-created schedule table in which the scheduled date for replacing the dummy cassette and the scheduled date for executing the boat / reaction tube cleaning of the semiconductor manufacturing apparatus A are advanced.
When the creation of the execution maintenance schedule is completed, S shown in FIG.
Proceed to TEP8.

STEP 8: The setting of the maintenance information item is changed for the semiconductor manufacturing apparatus whose maintenance time overlaps based on the re-created execution maintenance schedule.

STEP 9: Individual control units 24a, 24
When b, 24c, 24d,... confirm that the setting of the maintenance information item is completed, the mechanism driving units 25a, 25b, 25c, 2
.. Are controlled to start processing of the wafer. If wafer processing has already been performed, the count values of the maintenance setting items for each semiconductor manufacturing apparatus are collected in real time (see FIG. 8). Whether the count value of the maintenance setting item has reached the target value is determined by each of the individual control units 24a and 24a.
When the target value has been reached, the individual control unit 24 that has reached the target value sends a signal indicating that the maintenance time has arrived to the main control unit 20. The main controller 20 determines which semiconductor manufacturing apparatus has reached the maintenance time.

STEP 10: The main display section 22 displays the semiconductor manufacturing apparatus which has reached the maintenance time, and indicates that the target semiconductor manufacturing apparatus is under maintenance.

STEP11: A maintenance work start command is sent to the individual control units 24a, 24b, 24c, 24d,... Of the corresponding semiconductor manufacturing equipment, and the maintenance work in the corresponding semiconductor manufacturing equipment is started. The corresponding individual control unit 24a,
Until the maintenance completion signal is transmitted from 24b, 24c, 24d,..., The main display section 22 indicates that the target semiconductor manufacturing apparatus is under maintenance. When a maintenance completion signal, for example, a maintenance information item count value initialization signal in FIG. 8 is input from the corresponding individual control unit 24a, 24b, 24c, 24d,...
And the collection of the count value from the semiconductor manufacturing apparatus whose maintenance has been completed is started.

Each time the maintenance work is completed in each semiconductor manufacturing apparatus, the maintenance schedule is created, and it is confirmed whether or not the maintenance times in each semiconductor manufacturing apparatus are overlapped. Such a maintenance schedule is recreated, maintenance information items are reset in each semiconductor manufacturing apparatus, and maintenance management of the entire semiconductor manufacturing equipment is performed.

Thus, the maintenance time is not duplicated for each semiconductor manufacturing apparatus, the waiting time for performing the maintenance is eliminated, and the maximum operation rate of each semiconductor manufacturing apparatus is ensured. As a result, an overall operation rate obtained when each semiconductor manufacturing apparatus is operated at the maximum operation rate can be obtained. Further, even if there is a setting error of the maintenance information item in each semiconductor manufacturing apparatus, the main control unit corrects the setting, so that it is possible to prevent a decrease in the operation rate due to the setting error.

In the above embodiment, the semiconductor manufacturing equipment constituted by a batch type semiconductor manufacturing apparatus has been described. However, the present invention can be applied to a semiconductor manufacturing equipment constituted by a single wafer type semiconductor manufacturing apparatus. Needless to say.

[0051]

As described above, according to the present invention, in a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, a main control unit for integrally managing the plurality of semiconductor manufacturing apparatuses, and Provided with an individual control unit provided, wherein the individual control unit collects the maintenance information item count value of the subordinate semiconductor manufacturing equipment, and sends it to the main control unit,
The main control unit has a configuration for performing control so as to set a maintenance time of the plurality of semiconductor manufacturing apparatuses based on the sent maintenance information item count value, and a maintenance time of the plurality of semiconductor manufacturing apparatuses so that maintenance times do not overlap. Can be managed, the waiting time is reduced when maintenance is performed, and the operation rate of each semiconductor manufacturing apparatus is improved, that is, the operation rate of the semiconductor manufacturing equipment is improved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention.

FIG. 2 is a flowchart of the embodiment.

FIG. 3 is a flow chart for creating a reschedule table in the embodiment.

FIG. 4 is a tentative schedule table created in the embodiment.

FIG. 5 is a reschedule table created in the embodiment.

FIG. 6 is an explanatory view schematically showing a semiconductor manufacturing apparatus.

FIG. 7 is a block diagram of the semiconductor manufacturing apparatus.

FIG. 8 is a flowchart of maintenance management in the semiconductor manufacturing apparatus.

[Explanation of symbols]

 Reference Signs List 1 housing 3 cassette transport unit 4 first cassette storage shelf 5 second cassette storage shelf 6 wafer transfer unit 8 wafer 9 boat 11 reaction tube 15 cassette 20 main control unit 21 main input unit 22 main display unit 23 storage unit 24 individual Control unit 25 Mechanism drive unit 26 Individual operation unit

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[Procedure amendment]

[Submission date] September 9, 1999 (September 9, 1999)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction contents]

STEP 8: Semiconductors whose maintenance time overlaps
Execution maintenance schedule recreated for manufacturing equipment
Make the settings .

Claims (2)

[Claims] 1. A semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, comprising: a main control section for integrally managing the plurality of semiconductor manufacturing apparatuses; and an individual control section provided for each semiconductor manufacturing apparatus. The individual control unit collects the maintenance information item count values of the subordinate semiconductor manufacturing apparatus, and sends the collected information items to the main control unit. The main control unit sends the plurality of semiconductor manufacturing items based on the sent maintenance information item count values. A semiconductor manufacturing facility characterized in that control is performed so as to set the maintenance time of the device. 2. In a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, maintenance information is collected from each semiconductor manufacturing apparatus, and a maintenance time of each semiconductor manufacturing apparatus is set based on the obtained maintenance information. A method for maintaining semiconductor manufacturing equipment, characterized in that: