JP2001042313A - Production of substrate for liquid crystal display panel provided with color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production method of a substrate for a liquid crystal display panel provided with color filters capable of preventing color mixture between adjacent color filters without increasing the number of production steps. SOLUTION: A black-colored resin film to become a black matrix 2a is formed on a glass substrate 1 and a resist film is formed on this black-colored resin film. A resist pattern 3a is formed by providing openings at the positions of the resist film for arranging color filters. The black matrix 2a is formed by etching the black-colored resin film masked with the pattern 3a. The color filters 4a, 5a, 6a are formed by an ink jet method in the region partitioned by using the resist film and the black-colored resin film as partitions at the positions specified by the pattern 2a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display panel substrate provided with a color filter used for a color liquid crystal display panel, and more particularly to a liquid crystal display provided with a color filter for preventing color mixture. The present invention relates to a method for manufacturing a panel substrate.

[0002]

2. Description of the Related Art There are various methods for manufacturing a color filter for a liquid crystal display panel. For example, pigment dispersion method,
Printing method, dyeing method, electrodeposition method and ink jet method.
Among them, the ink jet method can form red (R), green (G), and blue (B) color filters at the same time, and thus has advantages such as a small number of steps and a small amount of materials. .

A method of manufacturing a color filter employing an ink jet method is described in, for example, JP-A-8-166507 and JP-A-9-230123.
In the conventional manufacturing method described in JP-A-8-166507, a resist for forming a black matrix has ink repellency. Hereinafter, such a conventional manufacturing method is referred to as a first conventional example. Also, JP-A-9-23
In the conventional manufacturing method described in Japanese Patent No. 0123, the surface of a glass substrate is subjected to an ink-philic treatment, and the surface of a black matrix is subjected to an ink-repellent treatment. Less than,
Such a conventional manufacturing method is referred to as a second conventional example.

FIGS. 14A and 14B are sectional views showing a method of manufacturing a color filter according to a first conventional example in the order of steps.

In the first conventional example, as shown in FIG. 14A, first, a Cr film or a Mo film is formed on a glass substrate 71.
A metal film such as a Ta film is formed. Next, a resist film containing a photosensitive Si compound is formed on the metal film. Thereafter, by exposing and developing the resist film, the resist film is patterned into a predetermined shape, and a resist pattern 73 is formed. Subsequently, the black matrix 72 is formed by etching the metal film using the resist pattern 73 as a mask. Next, the black matrix 72 and the resist pattern 7 are formed by an inkjet method.
The dye-based ink or the pigment-based ink of the R ink 74, the G ink 75, and the B ink 76 is ejected into the area defined by 3.

Thereafter, the solvent in the ink is evaporated by pre-baking the whole. As a result, FIG.
As shown in (b), an R color filter 74a and a G color filter 75 having the same height as the black matrix 72.
The a and B color filters 76a are formed. continue,
The resist pattern 73 is stripped.

According to the first conventional example, since the resist pattern 73 having ink repellency exists at the time of ink ejection, color mixture between adjacent color filters is reduced.

FIGS. 15A and 15B are sectional views showing a method of manufacturing a color filter according to a second conventional example in the order of steps.

In the second conventional example, first, as shown in FIG.
To form Next, a black matrix 82 having a predetermined shape is formed on the ink-philic film 87. Next, after performing the ink-repellent treatment on the entire surface, the ink-repellent portion in the region partitioned by the black matrix 82 is removed,
Only the surface of the black matrix 82 has the ink-repellent processing unit 8
8 remain. Subsequently, a dye-based ink or a pigment-based ink of the R ink 84, the G ink 85, and the B ink 86 is ejected into an area defined by the black matrix 82 by an inkjet method.

Thereafter, the solvent in the ink is evaporated by pre-baking the whole. As a result, FIG.
As shown in (b), an R color filter 84a and a G color filter 85 having the same height as the black matrix 82.
The a and B color filters 86a are formed.

According to the second conventional example, since the surface of the black matrix 82 is subjected to the ink-repellent treatment to form the ink-repellent portion 88, the color mixture between the adjacent color filters is reduced. You.

[0012]

However, according to the above-mentioned first conventional example, the color mixture is reduced as compared with the case where the ink repellent treatment or the like has not been performed. There is a problem that the color mixing is not sufficiently prevented because the height of the partition walls that define the region where the color filter is formed is not sufficient.

Specifically, the thickness of the metal film constituting the black matrix is about 0.1 μm, and the thickness of the resist film constituting the resist pattern is at most about 3 μm. If the thickness of the resist film exceeds 3 μm, exposure failure due to unevenness of the film thickness occurs, so that the metal film cannot be accurately patterned. Therefore, the thickness of the partition is at most about 3.1 μm.

Further, in the second conventional example, it is necessary to remove the ink-repellent portion in the area defined by the black matrix after the entire surface is subjected to the ink-repellent process. is there. Further, since the ink-repellent portion remains on the surface of the black matrix even after the formation of the color filter, when applied to the IPS type liquid crystal display panel, the alignment film provided thereon is repelled. There is a possibility that it will end up.

Furthermore, in the first and second conventional examples, since the ink used as the raw material of the color filter is mainly a water-based dye ink, the range of color selection is narrow.

The present invention has been made in view of the above problems, and has been made in view of the above-mentioned problems, and is a substrate for a liquid crystal display panel provided with a color filter capable of preventing color mixture between adjacent color filters without increasing the number of steps. It is an object of the present invention to provide a method for producing the same.

[0017]

According to the present invention, there is provided a method of manufacturing a substrate for a liquid crystal display panel having a color filter, comprising the steps of: forming a black resin film serving as a black matrix on a transparent substrate; Forming a resist film on the resist film, forming a resist pattern by providing an opening at a position where the color filter of the resist film is provided, and etching the black resin film using the resist pattern as a mask to form a black film. A step of forming a matrix, and a step of forming a color filter by an inkjet method in a region defined by the resist film and the black resin film as a partition at the black matrix position.

In the present invention, before the step of forming the black resin film, the method may further include a step of subjecting the transparent substrate to an ink-philic treatment for facilitating the ink used as a raw material of the color filter.

According to another aspect of the present invention, there is provided a method of manufacturing a substrate for a liquid crystal display panel having a color filter, wherein a thin film transistor is formed on a transparent substrate, and a flattening film covering the thin film transistor is formed on the transparent substrate. A step of forming a black resin film serving as a black matrix on the flattening film, a step of forming a resist film on the black resin film, and forming an opening at a position of the resist film where a color filter is provided. A step of forming a resist pattern by providing, a step of forming a black matrix by etching the black resin film using the resist pattern as a mask, and using the resist film and the black resin film at the black matrix position as partition walls Form color filters by ink-jet method in partitioned areas And having a that step.

In the present invention, the method may further include, before the step of forming the black resin film, a step of subjecting the flattening film to an ink-philic treatment for facilitating the adaptation of the ink used as the raw material of the color filter.

Further, the resist film and / or the black resin film may be subjected to an ink-repellent treatment for facilitating repelling of an ink which is a raw material of the color filter.

Further, the thickness of the black resin film is 1 to 3
It is preferable to use a pigment-based ink as a raw material of the color filter.

In the present invention, when a color filter is formed in an area defined by a black matrix by an ink-jet method, a high partition wall composed of a black matrix and a resist pattern exists. Color mixing is prevented.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a substrate for a liquid crystal display panel having a color filter according to an embodiment of the present invention will be specifically described below with reference to the accompanying drawings. FIG.
2A to 2C are cross-sectional views illustrating a method of manufacturing a liquid crystal display panel substrate having a color filter according to a first embodiment of the present invention in the order of steps, and FIGS. FIG. 1 is a diagram showing a first embodiment of the present invention, and FIG.
FIGS. 3A to 3C are cross-sectional views illustrating steps subsequent to the steps illustrated in FIGS. 3A to 3C in the order of the steps. FIGS. 3A to 3C are views illustrating a first embodiment of the present invention. 2 (a) to (c)
5 is a cross-sectional view showing a next process of the process shown in FIG.

In the first embodiment, a black resin film 2 is first formed on a glass substrate 1 as shown in FIG. The glass substrate 1 has, for example, a thickness of 0.7 or 1.1.
mm non-alkali glass substrate, and the black resin film 2
For example, it is made of a polyimide-based dispersed coloring resin containing a fluorine-based surfactant. In this resin, a red pigment type, a purple pigment type, a blue pigment type, and a yellow pigment type are dispersed. The thickness of the black resin film 2 is, for example, 1 to 3 μm, its optical density (OD value) is, for example, 3 or more, its sheet resistance is, for example, 10 ¹⁰ Ω / □ or more, and its viscosity is, for example, 3 to 10
cP. The addition amount of the fluorine-based surfactant is, for example, 0.1 to 0.5% by weight. As the fluorinated surfactant, for example, FC-430 and F manufactured by Sumitomo 3M Co., Ltd.
C-431 can be used, but is not limited thereto. Further, a silane-based surfactant may be contained instead of the fluorine-based surfactant. The fluorinated surfactant and the silane-based surfactant have ink repellency.

If the thickness of the black resin film 2 is less than 1 μm, the height of the partition walls at the time of forming the color filter is insufficient, and there is a possibility that color mixing may occur. On the other hand, if the film thickness exceeds 3 μm, the uniformity of the film thickness of the resist film formed later may be impaired, and the pattern accuracy may be reduced.

After the black resin film 2 is formed, a positive resist film 3 is formed on the black resin film 2 as shown in FIG. The thickness of the positive resist film 3 is, for example, 3 to 4
μm. The same fluorine-based surfactant or silane-based surfactant as that added to the black resin film 2 is also added to the positive resist film.

Next, as shown in FIG. 1C, the positive resist film 3 is exposed and developed and patterned to form a resist pattern 3a having an opening in a region where a color filter is provided. . As the developer for the positive resist film 3, for example, a tetramethylammonium hydroxide (TMAH) -based alkali developer can be used.

Thereafter, as shown in FIG. 2A, the black resin film 2 is etched using the resist pattern 3a as a mask to form a black matrix 2a.

Subsequently, as shown in FIGS. 2B and 2C, the black matrix 2a is formed by the ink jet method.
And within the area defined by the resist pattern 3a,
The red ink 4, the green ink 5, and the blue ink 6 are ejected. The red ink 4, the green ink 5, and the blue ink 6
For example, it is an acrylic pigment-dispersed ink having a viscosity of 3 to 10 cP.

Next, the solvent in the inks 4 to 6 is evaporated by prebaking the whole. Thus, as shown in FIG. 3A, a red color filter 4a, a green color filter 5a, and a blue color filter 6a having a thickness of, for example, about 1.0 to 1.5 μm are formed. These heights are almost equal to those of the black matrix 2a.

Next, as shown in FIG. 3B, the resist pattern 3a is peeled off.

Then, as shown in FIG. 3C, an alignment film 7 is formed on the entire surface. The alignment film 7 contains, for example, a polyimide-based alignment agent, and has a thickness of, for example, 300 to 600.
Å. For example, an alignment film Sanever series manufactured by Nissan Chemical Co., Ltd. and an Optmer AL series manufactured by JSR Corporation can be used, but the present invention is not limited thereto.

In the first embodiment, the red ink 4, the green ink 5, and the blue ink 6
Is discharged, there is a partition composed of the black matrix 2a and the resist pattern 3a. The height of this partition is, for example, about 4 to 7 μm, which is 30% or more higher than that of the conventional one. Further, the fluorine-based surfactant dispersed in the black matrix 2a and the resist pattern 3a has ink repellency.

Therefore, even if a part of the ink is scattered during the ejection of the ink, the mist does not reach the adjacent color filters. This prevents color mixing.

In order to ensure high ink repellency, the contact angle of the black matrix and the resist pattern with water is preferably 100 ° or more.

Further, in the first embodiment, before forming the black resin film 2 on the glass substrate 1, the glass substrate 1 may be subjected to an ink-philic treatment. For example, hexamethyldisilazane (HMDS) or the like may be applied to the surface of the glass substrate 1, or HMDS vapor may be attached to the surface of the glass substrate 1.

Next, a liquid crystal display panel having the color filter substrate manufactured according to the first embodiment as described above will be described. FIG. 4 shows a TN (twisted n) having a color filter substrate manufactured according to the first embodiment of the present invention.
FIG. 5 is a cross-sectional view showing the structure of an ematic) liquid crystal display panel, and FIG. 5 is a schematic plan view showing the structure of a TN liquid crystal display panel.

In a TN type liquid crystal display panel provided with a color filter substrate manufactured according to the first embodiment of the present invention, a liquid crystal layer 103 is provided between first and second transparent substrates 101 and 102. I have. Hereinafter, the first and second
The liquid crystal layer 103 side of the transparent substrates 101 and 102 inside,
The opposite side is called the outside. The second transparent substrate 102 is shown in FIG.
3 corresponds to the substrate 1. The liquid crystal layer 103 contains, for example, a fluorine compound. For example, a LIXON series manufactured by Chisso Petrochemical Company can be used, but the present invention is not limited to this.

The black matrix 2a, the color filters 4a to 6a and the alignment film 7 are formed on the second transparent substrate 102.
Provided on the inner surface of the. The surface of the alignment film 7 is rubbed using a conductive synthetic fiber such as viscose rayon. Since the liquid crystal display panel is of the TN type, a transparent common electrode 104 is provided between the alignment film 7 and the black matrix 2a and the color filters 4a to 6a. Transparent common electrode 104
Is made of, for example, ITO (Indium-tin-oxide), its film thickness is, for example, 800 to 1500 °, and its sheet resistance is, for example, 20 to 40Ω / □. A polarizing plate 105 is provided on the outer surface of the second transparent substrate 102. The polarizing plate 105 is made of, for example, an iodine-based polarizing film. For example, an NPF series manufactured by Nitto Denko Corporation and a Sumikaran series manufactured by Sumitomo Chemical Co., Ltd. can be used, but the present invention is not limited thereto. FIG. 4 shows only the red color filter 4a as a color filter,
Green color filter 5a and blue color filter 6a
Are formed in other regions (not shown).

On the other hand, on the inner surface of the first transparent substrate 101, a gate electrode 106 is formed in a grid pattern, and a gate insulating film 107 is formed so as to cover the gate electrode 106. The gate insulating film 107 is, for example, a laminated film of a SiO _x film and a SiN _x film, and the total thickness thereof is, for example, 1
2,000 to 2,000Å. A semiconductor layer 108 is formed at a position on the inner surface of the gate insulating film 107 that matches each gate electrode 106, and a drain electrode 109 and a source electrode 110 are formed so as to sandwich the semiconductor layer 108. Gate electrode 106, drain electrode 10
9 and the source electrode 110 are, for example, an Al film, a Mo film, a Cr film, or the like having a thickness of 1000 to 4000 °. The semiconductor layer 108 is, for example, an amorphous silicon layer having a thickness of about 4000 ° and functions as a channel of a field-effect transistor. The pixel electrode 11 connected to the source electrode 110 is formed on the inner surface of the gate insulating film 107.
1 is formed. The pixel electrode 111 is made of, for example, an ITO film having a thickness of 600 to 1200 °.

Then, an alignment film 112 is formed on the pixel electrode 111.
Are formed. The alignment film 112 is similar to the alignment film 7. Note that a passivation film 113 is formed between the alignment film 112 and the semiconductor layer 108, the drain electrode 109, and the source electrode 110. The passivation film 113 has a thickness of, for example, 1000 to 2000 Å.
This is a SiN _x film. On the outer surface of the first transparent substrate 101, a polarizing plate 114 is provided. The polarizing plate 114 is similar to the polarizing plate 105. Further, a transfer (not shown) made of, for example, an epoxy resin containing silver powder is formed at four corners of the sealing material 116 on the inner surface of the first transparent electrode 101. Further, a lead terminal 115 is provided on the outside.

First and second transparent substrates 101 and 102
A seal member 116 surrounding the liquid crystal layer 103 is provided between them. The sealing material 116 is made of, for example, an epoxy-based resin adhesive, and for example, a Struct Bond series manufactured by Mitsui Chemicals, Inc. can be used, but is not limited thereto. Further, as shown in FIG. 5, a hole 116 a for injecting liquid crystal is provided in the sealing material 116, and the hole 116 a is sealed with a sealing agent 118. The sealing agent 118 is, for example, an ultraviolet (UV) curable acrylate-based resin agent. Further, in-plane spacers 117 are dispersed in the liquid crystal layer 103, and peripheral spacers (not shown) are dispersed in the sealant 116. The in-plane spacer (micropearl) 117 is made of, for example, a divinylbenzene-based crosslinked polymer having a diameter of 4.5 to 5.5 μm, and the peripheral spacer (microrod) is made of, for example, a glass fiber having a diameter of 5 to 7 μm. As shown in FIG. 5, a red opening 119R and a green opening 11 are provided in the black matrix 2a.
9G and a blue opening 119R are provided.

In the TN type liquid crystal display panel thus configured, the transparent common electrode 104 and the source electrode 1
An electric field is generated in the thickness direction of the panel between the pixel electrode 111 and the pixel electrode 111, and the electric field controls an image.

Next, the IPS (in plane)
A case where the present invention is applied to a liquid crystal display panel of the (switching) type will be described. FIG. 6 is a sectional view showing the structure of an IPS type liquid crystal display panel having a color filter substrate manufactured according to the first embodiment of the present invention. In the IPS type liquid crystal display panel shown in FIG.
The same components as those of the N-type liquid crystal display panel are denoted by the same reference numerals, and detailed description thereof will be omitted.

On the side of the second transparent substrate 102 of the IPS type liquid crystal display panel provided with the color filter substrate manufactured according to the first embodiment of the present invention, the alignment is performed on the black matrix 2a and the color filters 4a to 6a. Membrane 7
Are formed directly.

On the first transparent substrate 101 side, the gate electrode 1 is formed on the inner surface of the first transparent substrate 101.
6, a transparent common electrode 124 extending in a direction perpendicular to the cross section shown in FIG. 6 is provided. Gate insulating film 10
On 7, a pixel electrode 131 extending in the same direction as the transparent common electrode 124 is provided. The pixel electrode 131 is connected to the source electrode 110 in a region not shown in FIG. Further, on the gate insulating film 107, the semiconductor layer 10
8, a passivation film 133 covering the drain electrode 109, the source electrode 110, and the pixel electrode 131 is formed. Then, the alignment film 1 is formed on the passivation film 133.
12 are provided.

In the IPS mode liquid crystal display panel thus configured, an electric field parallel to the surface of the panel is generated between the transparent common electrode 124 and the pixel electrode 131 connected to the source electrode 110. Controls the image.

In the first embodiment, both the black resin film 2 serving as the black matrix 2a and the resist film 3 serving as the resist pattern 3a contain a surfactant as an ink repellent. Is not limited to this, and the ink repellent agent may not be added. For example, when applied to an IPS liquid crystal display panel,
As shown in FIG. 6, since the alignment film 7 is provided on the black matrix 2a, the alignment film 7 may be repelled by the ink. However, if the black matrix surface is subjected to an ink-philic treatment in order to prevent the alignment film 7 from being repelled by the ink, the ink may flow into the interface with the resist. Therefore, when applied to a TN liquid crystal display panel, it is preferable that both the black resin film and the resist film have been subjected to an ink-repellent treatment.

Further, the side surface of the black matrix may be subjected to an ink-friendly process.

Next, a second embodiment of the present invention will be described. In the second embodiment, a thin film transistor (T
FT) substrate to which the present invention is applied.
The substrate for a liquid crystal display panel manufactured by the embodiment of
On-TFT substrate. FIGS. 7A to 7C are cross-sectional views showing a method of manufacturing a CF-on-TFT substrate according to a second embodiment of the present invention in the order of steps. FIGS.
FIG. 7 is a view showing a second embodiment of the present invention, similarly to FIG.
9A to 9C are cross-sectional views showing steps subsequent to the steps shown in FIGS. 9A to 9C in the order of the steps. FIGS. 9A and 9B are views showing a second embodiment of the present invention. 8 (a) to (c)
FIG. 1 is a cross-sectional view showing the next step after the step shown in FIG.
FIGS. 0 (a) and (b) are views showing a second embodiment of the present invention, and are cross-sectional views showing steps subsequent to the steps shown in FIGS. 9 (a) and (b) in the order of steps. FIGS. 10A and 10B also show a process of manufacturing a CF-on-TFT substrate and then incorporating it into a liquid crystal display panel.

In the second embodiment, as shown in FIG. 7A, first, a gate electrode 16 is formed on a glass substrate 11.
A gate insulating film 17, a semiconductor layer 18, a TFT having a drain electrode 19 and a source electrode 20, a passivation film 23 having an opening on the source electrode 20, and a lead terminal 25 are formed. The glass substrate 11 is, for example, a non-alkali glass substrate having a thickness of 0.7 or 1.1 mm.
Gate electrode 16, drain electrode 19 and source electrode 20
Is, for example, an Al film having a thickness of 1000 to 4000 °, M
o film or Cr film. The semiconductor layer 18 is, for example, an amorphous silicon layer having a thickness of about 4000
Functions as an FT channel. Passivation film 2
3 is, for example, a SiN _x film having a thickness of 1000 to 2000 °.
It is a membrane.

Next, as shown in FIG. 7B, a planarizing film 26 having an opening at the same position as the passivation film 23 is formed on the passivation film 23. The flattening film is made of, for example, a positive photosensitive novolak-based resist having a thickness of 2.5 to 3.5 μm. For example, an Optmer PC series manufactured by JSR Corporation can be used, but the invention is not limited thereto.

Next, a black resin film is formed on the flattening film 26. The black resin film is made of, for example, a polyimide-based dispersed coloring resin containing a fluorine-based surfactant. In this resin, a red pigment type, a purple pigment type, a blue pigment type, and a yellow pigment type are dispersed. The thickness of the black resin film is, for example, 1 to 3 μm, its optical density (OD value) is, for example, 3 or more, its sheet resistance is, for example, 10 ¹⁰ Ω / □ or more, and its viscosity is, for example, 3 to 10 cP. The addition amount of the fluorine-based surfactant is, for example, 0.1 to 0.5% by weight. As the fluorinated surfactant, for example, FC-430 and FC-431 manufactured by Sumitomo 3M can be used. Further, a silane-based surfactant may be contained instead of the fluorine-based surfactant.

After forming the black resin film, a positive resist film is formed on the black resin film. The thickness of the positive resist film is, for example, 3 to 4 μm. The same fluorine-based surfactant or silane-based surfactant as that added to the black resin film is also added to the positive resist film.

Thereafter, by exposing and developing the positive resist film and patterning, a resist pattern 27 having an opening in a region where a color filter is provided is formed as shown in FIG. 7C. As the developer for the positive resist film, for example, a tetramethylammonium hydroxide (TMAH) -based alkali developer can be used. Subsequently, a black matrix 28 and a frame black matrix 28a are formed by etching the black resin film as a resist pattern 27 mask.

Subsequently, as shown in FIGS. 8A and 8B, the black matrix 28 is formed by the ink jet method.
And a red ink 29 in a region defined by the frame black matrix 28a and the resist pattern 27.
Discharges green ink and blue ink. Red ink 2
9. The green ink and the blue ink are, for example, acrylic pigment-dispersed inks having a viscosity of 3 to 10 cP. 8 (a) to 9 (b) show only the area where the red ink is ejected for convenience, the green ink and the blue ink are ejected to an area not shown.

Next, the solvent in the ink such as the red ink 29 is evaporated by prebaking the whole.
Thereby, as shown in FIG. 8C, the red color filter 29 having a thickness of, for example, about 1.0 to 1.5 μm.
a, A green color filter and a blue color filter are formed. These heights are almost the same as those of the black matrix 28 and the frame black matrix 28a. When an opening is formed in the flattening film 26 after the formation of the color filter, there is a risk that the heat treatment during the opening may cause the deterioration of the color filter. Since the opening is formed in the oxide film 26, there is no danger.

Next, as shown in FIG. 9A, the resist pattern 27 is peeled off.

Thereafter, as shown in FIG. 9B, a pixel electrode 31 connected to the source electrode 20 is formed on the black matrix 28, the red color filter 29a, the green color filter and the blue color filter. Pixel electrode 3
1 is formed of, for example, an ITO film having a thickness of 600 to 1200 °. The opening on the source electrode 20 is a contact through hole 43.

Next, as shown in FIG. 10A, an alignment film 32 is formed on the pixel electrode 31. The alignment film 32 contains, for example, a polyimide alignment agent, and has a thickness of, for example, 300 to 600 °. For example, Nissan Chemical's alignment film Sanever series and JSR's Optmer AL series can be used.

Also in the second embodiment, when the red ink 29, the green ink, and the blue ink are ejected by the ink-jet method, the partition wall composed of the black matrix 28 or the frame black matrix 28a and the resist pattern 27 is present. . The height of this partition is, for example, about 4 to 7 μm, which is 30% or more higher than that of the conventional one. The fluorine-based surfactant dispersed in the black matrix 28 or the frame matrix 28a and the resist pattern 27 has ink repellency.

Therefore, also in the second embodiment, even if a part of the ink is scattered during the ejection of the ink, the mist does not reach the adjacent color filters. This prevents color mixing.

The CF on TFT thus manufactured
When the substrate is incorporated in the liquid crystal display panel, after forming the alignment film 32, a sealing material 36 surrounding the black matrix 28 and the frame black matrix 28a is formed on the flattening film 26 as shown in FIG. . Seal material 3
6 is made of, for example, an epoxy resin adhesive, and for example, a Struct Bond series manufactured by Mitsui Chemicals, Inc. can be used. Further, the sealing material 36 is provided with a hole (not shown) for injecting liquid crystal.

Thereafter, as shown in FIG. 10B, the glass substrate 35 having the transparent common electrode 33 and the alignment film 34 formed on one surface thereof is opposed to the transparent common electrode 33 and the alignment film 34 which face the alignment film 32. Then, they are adhered by the seal material 36. The transparent common electrode 33 is made of, for example, ITO (Indium-t
in-oxide), and the film thickness is, for example, 800 to 1
500 °, and the sheet resistance is, for example, 20 to 40Ω /
□. The alignment film 34 contains, for example, a polyimide-based alignment agent, and has a thickness of, for example, 300 to 600 °. For example, Nissan Chemical's alignment film Sanever series and JSR's Optmer AL series can be used. The glass substrate 35 has, for example, a thickness of 0.7 or 1.1.
mm non-alkali glass substrate. The inner surface of the glass substrate 35 may be treated with a silane-based surface treatment agent as a coupling treatment agent. In that case, examples of the silane-based surface treatment agent include AP manufactured by Toray Industries, Inc.
-400 can be used.

Subsequently, liquid crystal is injected into the inside of the hole of the sealing material 36 to form a liquid crystal layer 38. In-plane spacers 37 are dispersed in the liquid crystal layer 38, and the sealing material 3
In 6, peripheral spacers (not shown) are dispersed.
The in-plane spacer (micropearl) 37 has, for example, a diameter of 4.
The peripheral spacer (micro rod) is made of a glass fiber having a diameter of 5 to 7 μm, for example, made of a divinylbenzene-based crosslinked polymer having a diameter of 5 to 5.5 μm. Liquid crystal layer 38
Contains, for example, a fluorine-based compound. For example, LIXON series manufactured by Chisso Petrochemical Co., Ltd. can be used. After injecting the liquid crystal, the holes of the sealing material 36 are sealed with a sealing agent. As the sealing agent, for example, an ultraviolet (UV) curable acrylate-based resin agent can be used.

Thereafter, a polarizing plate is attached to the surfaces of the glass substrates 11 and 35 opposite to the liquid crystal layer 38 to complete the liquid crystal display panel. FIG. 11 is a sectional view showing the structure of a liquid crystal display panel provided with a CF-on TFT substrate manufactured according to the second embodiment of the present invention.
FIG. 4 is a schematic plan view showing a positional relationship between a color filter and a black matrix in a pixel portion of a liquid crystal display panel including a CF-on TFT substrate. FIG. 11 is the same as FIG.
Is a cross-sectional view taken along line AA of FIG.

The CF on T manufactured according to the second embodiment
In a liquid crystal display panel provided with an FT substrate, as shown in FIG. 11, polarizing plates 39 and 40 are attached to the surfaces of both glass substrates 11 and 35 opposite to the liquid crystal layer 38, respectively.

As shown in FIG. 12, the red color filter 29a, the green color filter 42 and the blue color filter 41 are partitioned by the black matrix 28. A contact through hole 43 for connecting the pixel electrode and the source electrode of the TFT is provided for each of the divided color filters.

In the second embodiment, the black matrix 28, the frame black matrix 28a and the resist pattern 27 contain a surfactant as an ink repellent, but the present invention is not limited to this. Absent. When the surface of the black matrix 28 is subjected to an ink-philic treatment in order to prevent the alignment film 32 formed on the black matrix 28 from being repelled by the ink, the ink flows into the interface between the black resin film and the resist. When applied to a CF-on-TFT substrate, it is preferable that both the black resin film and the resist film have been subjected to an ink-repellent treatment.

Further, after forming the flattening film 26 and before forming the black resin film, the flattening film 26 may be subjected to an ink-philic treatment. As in the first embodiment, for example, hexamethyldisilazane (HMDS) or the like may be applied or adhered to the surface of the flattening film 26.

Next, the effect of preventing color mixing according to the embodiment of the present invention will be described in comparison with a conventional example. FIG.
(A) is a schematic diagram showing a liquid crystal display panel substrate manufactured by the first embodiment of the present invention, and (b) is a schematic diagram showing a liquid crystal display panel substrate manufactured by a conventional method.

As shown in FIG. 13A, in the substrate manufactured according to the first embodiment, no color mixture occurs between the green color filter 51, the red color filter 52 and the blue color filter 53 anywhere. However, in the substrate manufactured by the conventional method, as shown in FIG. 13B, color mixture occurs between the green color filter 61 and the red color filter 62, and the color mixture portions 61a and 62a
Was observed. The blue color filter 63 had no color mixture.

[0074]

As described in detail above, according to the present invention,
When a color filter is formed in an area defined by a black matrix by an inkjet method, a high partition wall made of a resist film and a black resin film at a black matrix position is present, so that color mixing between adjacent color filters is performed. Can be prevented. In addition, the effect can be enhanced by performing an ink-repellent treatment on the resist pattern in advance. Furthermore, by performing the ink repellent treatment on the black matrix in advance,
It is possible to improve the spread of the ink serving as the raw material of the color filter. Furthermore, by using a pigment-based ink as a raw material for a color filter, the range of color selection can be expanded.

Further, by performing the ink repellent treatment on the resist pattern and the black matrix in advance, it is possible to prevent the ink from flowing into the interface between the resist film and the black matrix.

[Brief description of the drawings]

FIGS. 1A to 1C are sectional views showing a method for manufacturing a liquid crystal display panel substrate having a color filter according to a first embodiment of the present invention in the order of steps.

FIGS. 2 (a) to 2 (c) are views showing a first embodiment of the present invention, and are cross-sectional views showing steps subsequent to the steps shown in FIGS. 1 (a) to 1 (c) in the order of steps; It is.

FIGS. 3A to 3C are views showing a first embodiment of the present invention, and are cross-sectional views showing the steps subsequent to the steps shown in FIGS. 2A to 2C in the order of steps; It is.

FIG. 4 is a cross-sectional view illustrating a structure of a TN type liquid crystal display panel including a color filter substrate manufactured according to the first embodiment of the present invention.

FIG. 5 is a schematic plan view showing the structure of a TN mode liquid crystal display panel.

FIG. 6 is a cross-sectional view illustrating a structure of an IPS type liquid crystal display panel including a color filter substrate manufactured according to the first embodiment of the present invention.

FIGS. 7A to 7C are cross-sectional views illustrating a method of manufacturing a CF on TFT substrate according to a second embodiment of the present invention in the order of steps.

FIGS. 8A to 8C are views showing a second embodiment of the present invention, and are cross-sectional views showing the steps subsequent to the steps shown in FIGS. 7A to 7C in the order of steps; It is.

FIGS. 9 (a) and 9 (b) are views showing a second embodiment of the present invention, and are cross-sectional views showing steps subsequent to the steps shown in FIGS. 8 (a) to 8 (c) in the order of steps. It is.

FIGS. 10 (a) and (b) are views showing a second embodiment of the present invention, and are cross-sectional views showing steps subsequent to the steps shown in FIGS. 9 (a) and (b) in the order of steps; It is.

FIG. 11 shows a CF manufactured according to the second embodiment of the present invention.
It is sectional drawing which shows the structure of the liquid crystal display panel provided with the ON TFT substrate.

FIG. 12 is a schematic plan view showing a positional relationship between a color filter and a black matrix in a pixel portion of a liquid crystal display panel including a CF-on TFT substrate.

13A is a schematic diagram showing a liquid crystal display panel substrate manufactured according to the first embodiment of the present invention, and FIG. 13B is a schematic diagram showing a liquid crystal display panel substrate manufactured by a conventional method. It is.

14A and 14B are cross-sectional views illustrating a method for manufacturing a color filter according to a first conventional example in the order of steps.

FIGS. 15A and 15B are cross-sectional views illustrating a method of manufacturing a color filter according to a second conventional example in the order of steps.

[Explanation of symbols]

Reference Signs List 1: glass substrate 2: black resin film 2a; black matrix 3: resist film 3a; resist pattern 4: red ink 4a; red color filter 5; green ink 5a; green color filter 6; blue ink 6a; Alignment film 11, 35; glass substrate 16; gate electrode 17; gate insulating film 18; semiconductor layer 19; drain electrode 20; source electrode 23; passivation film 25; extraction terminal 26; flattening film 27; resist pattern 28, 28a; Black matrix 29; Red ink 29a, 52, 62; Red color filter 31; Pixel electrodes 32, 34; Alignment film 33; Transparent common electrode 36; Sealing material 37; Spacer 38; Liquid crystal layer 39, 40; Polarizing plates 41, 53 , 63; blue color filters 42, 51, 61; green Color filters 43; contact through holes 61a, 61b; mixed color portions 71, 81; glass substrates 72, 82; black matrix 73; resist patterns 74, 75, 76, 84, 85, 86; inks 74a, 75a, 76a, 84a; 85a, 86a; color filter 87; ink-philic film 88; ink-repellent processing units 101, 102; transparent substrate 103; liquid crystal layers 104, 124; transparent common electrodes 105, 114; polarizing plate 106; gate electrode 107; A semiconductor layer 109; a drain electrode 110; a source electrode 111, 131; a pixel electrode 112; an alignment film 113, 133; a passivation film 115; a lead terminal 116; a sealing material 116a; a hole 117; a spacer 118; a sealing agent 119R, 119G; 119B; opening

Continuation of front page (72) Inventor Michiaki Sakamoto 5-7-1 Shiba, Minato-ku, Tokyo F-term in NEC Corporation (reference) 2H048 BA64 BB02 BB13 BB14 BB23 BB44 2H091 FA02Y FA35Y FB06 FB08 FC01 FC26 LA15 LA16

Claims (8)

[Claims] A step of forming a black resin film serving as a black matrix on a transparent substrate; a step of forming a resist film on the black resin film; and forming an opening in the resist film at a position where a color filter is provided. A step of forming a resist pattern by providing, a step of forming a black matrix by etching the black resin film using the resist pattern as a mask, and using the resist film and the black resin film at the black matrix position as partition walls Forming a color filter in the partitioned area by an ink-jet method. A method for manufacturing a substrate for a liquid crystal display panel provided with a color filter. 2. The method according to claim 1, further comprising, before the step of forming the black resin film, a step of performing an ink-philic treatment on the transparent substrate so that the ink as a raw material of the color filter can be easily applied. A method for manufacturing a liquid crystal display panel substrate provided with the color filter of the above. 3. A step of forming a thin film transistor on a transparent substrate, a step of forming a flattening film covering the thin film transistor on the transparent substrate, and forming a black resin film serving as a black matrix on the flattening film. A step of forming a resist film on the black resin film, a step of forming a resist pattern by providing an opening in the resist film at a position where a color filter is provided, and the step of forming the resist pattern as a mask using the black Forming a black matrix by etching a resin film, and forming a color filter by an inkjet method in a region defined by the resist film and the black resin film as a partition at the black matrix position. Liquid crystal display panel having a color filter characterized by the following: Of manufacturing substrates for 4. The method according to claim 3, further comprising, before the step of forming the black resin film, a step of subjecting the flattening film to an ink-philic treatment for facilitating the ink used as the raw material of the color filter. A method for manufacturing a substrate for a liquid crystal display panel provided with the color filter described above. 5. The liquid crystal having a color filter according to claim 1, wherein the resist film is subjected to an ink-repellent treatment for facilitating repelling of an ink serving as a material of the color filter. A method for manufacturing a display panel substrate. 6. The black resin film according to claim 1, wherein the black resin film is subjected to an ink-repellent treatment for facilitating repelling of an ink used as a raw material of the color filter. A method for manufacturing a liquid crystal display panel substrate provided with a color filter. 7. The black resin film has a thickness of 1 to 3 μm.
A method for manufacturing a substrate for a liquid crystal display panel having a color filter according to any one of claims 1 to 6. 8. The method for manufacturing a substrate for a liquid crystal display panel having a color filter according to claim 1, wherein a pigment-based ink is used as a raw material of the color filter.