JP2001038770A - In-mold coating molding method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] After injecting paint between the surface of a resin molded product molded in a mold and the cavity surface of the mold, the paint is cured in the mold to form a coating film on the surface. The present invention provides an in-mold coating molding method which is excellent in productivity and can be used to manufacture an integrally molded article with high precision. SOLUTION: After injecting a thermosetting paint between a surface of a resin molded product molded in molds 51 and 52 and a surface of a mold cavity 53, the paint is cured in the molds 51 and 52,
This is an in-mold coating molding method for producing an integrated molded product in which a coating film is in close contact with the surface of a resin molded product. The paint is injected in a state where the surface temperature of the resin molded product is higher than the curing temperature of the paint and the mold temperature on the cavity side is lower than the curing temperature of the paint.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of injecting a thermosetting paint between a surface of a resin molded product molded in a mold and a cavity surface of the mold, and then curing the paint in the mold. The present invention relates to an in-mold coating forming method for producing an integral molded product having a coating film adhered to the surface.

[0002]

2. Description of the Related Art In order to improve the quality of resin molded products used for automobiles, home appliances, building materials, and the like by adding added value such as decorativeness, and to reduce costs by reducing the number of molding steps, it is necessary to reduce the cost in a mold. After injecting a thermosetting paint between the surface of the resin molded product molded in step 1 and the cavity surface of the mold, the paint is cured in the mold to form an integral molded product with the coating adhered to the surface of the resin molded product. In-mold coating molding method to be manufactured (hereinafter referred to as “IM
C ". ) Are being considered. In recent years, in view of environmental concerns, the IMC has sought to limit the release of harmful organic substances from the atmosphere to the air from various factories and to emphasize the health protection of employees. It is also attracting attention as an alternative to spray painting.

[0003] At the beginning of development, IMC is exclusively SMC, BMC
And the manufacture of molded products of such thermosetting resins. However, in recent years, thermoplastic resin molding
Attempts have been made to apply C.
No. 251 discloses that, when the surface temperature of the resin and the mold temperature are equal to or higher than the curing temperature of the paint, the mold clamping force of the mold is changed, or the thermosetting paint is applied to the resin at the same mold clamping force. A method is disclosed in which a mold is opened by injecting the paint into a painted surface of a mouth and after the paint is cured.

[0004]

SUMMARY OF THE INVENTION Here, JP-A-5-3
In Japanese Patent No. 01251, a molten resin of about 280 ° C. is injected into a mold cavity by using a molding method similar to ordinary injection molding, and a mold temperature of 130 ° C. is used. Is illustrated using IMC.
Although the curing temperature of the paint varies depending on the material, if the mold must be set at a temperature equal to or higher than the curing temperature of the paint, the heating and heat retaining means of the mold becomes large-scale, and equipment costs and running costs become high. There is a disadvantage that. Further, when the mold is used at a high temperature, there is a concern that the deterioration is accelerated.

Further, when the temperature of the mold is high, the thermoplastic resin as a molded product becomes soft, so it is necessary to cool the molded article to a temperature at which the shape is maintained and then take it out of the mold. Thus, when cooling and heating must be repeated during molding, the production time required for one molding cycle becomes longer, and there is a problem that productivity is reduced. Therefore, in consideration of these various problems, the productivity by the IMC disclosed in JP-A-5-301251 is not necessarily considered to be high, and it is presumed that the cost increases in terms of equipment and production steps. You.

[0006] In order to improve the low productivity when the conventional method such as the method disclosed in Japanese Patent Application Laid-Open No. Hei 5-301251 is used, a mold used for the IMC is actually used. Has been determined to be lower than the curing temperature of commonly used paints in terms of molding cycle and moldability.

However, in the case of a coating film formed under conditions that do not satisfy the predetermined curing conditions, required physical properties may not be obtained in some cases, and usable paints are limited. As described above, considering the handling surface of the paint and the physical properties of the formed coating film, it is desirable that the curing temperature of the paint used for the IMC is high. That is, in the conventional thermoplastic resin IMC, if the emphasis is placed on productivity, the physical properties of the coating film must be sacrificed, while, in order to impart sufficient physical properties to the coating film, the productivity must be sacrificed. It was in a state that I could not do.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to set a mold temperature in a thermoplastic resin IMC at a temperature lower than a curing temperature of a thermosetting paint. While setting the paint at a given temperature, time and other curing conditions, as a result, while improving the productivity by shortening the molding cycle, To improve
An object of the present invention is to provide an in-mold coating molding method which can be improved.

[0009]

That is, according to the present invention,
After injecting a thermosetting paint between the surface of the resin molded article molded in the mold and the cavity surface of the mold, the paint is cured in the mold and applied to the surface of the resin molded article. An in-mold coating molding method for producing an integrated molded product having a coating film adhered thereto, wherein the surface temperature of the resin molded product is higher than the curing temperature of the coating material, and the mold temperature on the cavity side is the coating material. And injecting the paint in a state lower than the curing temperature of the mold.

In this method, the mold is opened at a predetermined interval when the surface of the injected paint has hardened to some extent, thereby suppressing heat diffusion from the surface of the integrally molded article to one of the molds. At the same time, it is also preferable to employ a method in which the temperature of the coating film is raised to a temperature equal to or higher than the curing temperature of the coating material by the heat retained inside the resin molded product, thereby shortening the curing time of the coating film.

Further, according to the present invention, after a thermosetting paint is injected between the surface of a resin molded product molded in a mold and the cavity surface of the mold, the paint is injected into the mold. An in-mold coating molding method for curing and producing an integral molded product in which a coating film adheres to the surface of the resin molded product, wherein the mold is separated by a predetermined distance when the surface of the resin molded product is solidified. Opened, while suppressing heat diffusion from the surface of the resin molded product to one of the molds, the internal temperature of the resin molded product raised the surface temperature of the resin molded product above the curing temperature of the paint. Thereafter, there is provided a method of molding and coating the inside of a mold, characterized by injecting the paint.

In carrying out the above-described method of forming a coating in a mold of the present invention, it is preferable to use an injection molding apparatus having excellent driving characteristics and positioning characteristics of the mold, and a toggle type injection molding machine or a toggle type electric injection molding machine. A molding machine is preferably used.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The method for forming a coating in a mold according to the present invention (I)
The basic idea of MC) is to effectively use the retained heat of the molding resin injected into the mold cavity to cure the thermosetting paint. It is possible to increase the productivity by setting a low value, and to cure the paint under predetermined conditions so that the obtained coating film shows good physical properties. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
It goes without saying that the present invention is not limited to the following embodiments.

As shown in FIG. 1, the IMC of the present invention comprises:
An in-mold coating molding apparatus (hereinafter, referred to as "IMC apparatus") 100 using a general-purpose toggle-type injection molding machine is preferably used. The IMC device 100 is roughly classified into a mold clamping device 1
0, an injection device 20, a control device 30, and a mold device 50. It is also preferable to use a toggle-type electric injection molding machine as the toggle-type injection molding machine.

The mold clamping device 10 includes a fixed platen 11 and a movable platen 12 on which a mold device 50 is mounted.
4 and a mold driving hydraulic cylinder (hereinafter, referred to as
This is referred to as a "clamp cylinder". The movable platen 12 moved forward and backward by 13) moves back and forth with respect to the fixed platen 11, thereby opening and closing the mold device 50.

In the toggle injection molding machine, a large stroke amount can be obtained while driving the mold clamping cylinder 13 with a relatively low oil pressure. Then, this stroke amount is converted into a smaller stroke amount by the mold clamping device 10 and is converted into a larger pressure.

Therefore, as compared with the conventional direct pressure type injection molding machine in which the mold is directly driven by the hydraulic cylinder, the toggle type injection molding machine is driven by the mold clamping cylinder 13 which has excellent driving characteristics, especially high speed driving characteristics. Is performed, and the position controllability of the mold device 50 is made extremely high by the so-called boosting mechanism of the mold clamping device 10, and a sufficiently strong mold clamping force is obtained. As will be described later, this excellent driving characteristic facilitates the conduction control of the retained heat of the molding resin by opening and closing the mold.

A screw 21 having a spiral flight portion is rotated by a hydraulic motor 23 along the inner peripheral surface of a cylindrical barrel 22 in the injection device 20 so that the screw 21 can move forward and backward freely. It is arranged. With the rotation of the screw 21, the resin pellets supplied into the hopper 25 are sent to the front of the screw 21, and are heated by a heater (not shown) attached to the outer peripheral surface of the barrel 22 during this time. At the same time, the resin pellets are melted by receiving the kneading action by the rotation of the screw 21.

When the amount of the molten resin sent to the front of the screw 21 reaches a predetermined amount, the hydraulic motor 23
The rotation of the screw 2 is stopped, and the injection cylinder 24 is driven to move the screw 21 forward.
1 The molten resin stored in front is injected into the mold cavity 53 of the mold apparatus 50 via the nozzle 26.

The mold device 50 includes a fixed mold 51 attached to the fixed platen 11 and a movable mold 52 attached to the movable platen 12. And a temperature sensor 54 for detecting the surface temperature of the resin molded product in the mold cavity 53.

Next, the configuration of the control device 30 will be described. As shown in FIG. 1, the control device 30 includes a mold clamping device 1.
0 and the operation of the injection device 20 are linked, and the control device 3
Molding device controller 3 that controls the entire system
1 and an injection control unit 38 that controls the operation of the injection device 20. These two control units 31 and 38 have the same control function as the control unit in a normal injection molding machine.

On the other hand, as a control unit having a control function unique to the IMC device 100, an injection machine control unit 35 which receives a molding condition data signal from the mold clamping condition setting unit 32 and controls the operation of the paint injection machine 55, and a mold A mold clamping control unit 33 that receives the molding condition data signal from the clamping condition setting unit 32 and controls the operation of the mold clamping device 10 is provided.

Here, in the mold clamping condition setting section 32, the opening / closing speed of the mold clamping device 10, the operation timing, the mold opening, the mold clamping force, the injection amount of the paint injection machine 55, the injection speed, the injection timing, and the injection pressure are set. Each molding condition is set. Then, the molding condition data signal is sent from the mold clamping condition setting unit 32 to the injection machine control unit 35 for the molding conditions relating to the injection amount, the injection speed, the injection timing, and the injection pressure of the paint injecting machine 55. With respect to the molding conditions relating to the opening / closing speed, operation timing, mold opening amount, and mold clamping force of the device 10, the molding condition data signal is sent to the mold clamping control unit 33.

Subsequently, using the IMC device 100 having the control device 30 configured as described above, the IM of the present invention is used.
The operation of the IMC device 100 when performing C will be described.

First, a control signal transmitted from the mold clamping control unit 33 and a data signal (mold clamping speed) of the mold closing speed set in the mold clamping condition setting unit 32 while performing feedback control by the mold clamping servo valve 15. In accordance with the speed pattern, the movable mold 52 is advanced from the mold opening limit position by the mold clamping cylinder 13 and is brought into contact with the fixed mold 51. Subsequently, a molding condition data signal (clamping force pattern) of the mold clamping force set in the mold clamping condition setting unit 32 while performing feedback control by the control signal transmitted from the mold clamping control unit 33 and the mold clamping servo valve 15. ), The movable mold 52 is further advanced by the mold clamping cylinder 13 to
4 is extended, and a predetermined mold clamping force is applied to the mold apparatus 50.

At a predetermined operation timing during the operation of the mold clamping device 10, the injection cylinder 24 controls the screw 21 by controlling the opening of the injection servo valve 27 by a control signal transmitted from the injection control unit 38. When the resin is advanced, the molten resin stored in front of the screw 21 is injected into the mold cavity 53 via the nozzle 26 to form a resin molded product. The operation of the mold clamping device 10 and the operation of the injection device 20 are interlocked with each other by the molding device control section 31 so as to exchange operation timing signals.

Next, after a lapse of a predetermined time required for curing at least the surface portion of the molding resin, feedback control is performed by a control signal transmitted from the mold-clamping control unit 33 and the mold-clamping servo valve 15 to inject paint. The position and the like of the movable mold 52 are controlled by the mold clamping cylinder 13 so that the mold clamping force set in the mold clamping condition setting unit 32 is generally reduced.

When the surface temperature of the resin molded product detected by the temperature sensor 54 reaches a predetermined temperature higher than the curing temperature of the paint, the injection amount of the paint injection machine 55 set in the mold clamping condition setting section 32 The paint injector 55 is driven by a control signal transmitted from the injector control unit 35 according to the injection speed, the injection timing, and the injection pressure, and the paint is injected into the mold cavity 53.

After the temperature sensor 54 detects a predetermined temperature, the mold clamping force may be changed to inject paint.
In such an IMC of the present invention, since the internally held heat of the resin molded product is used for curing the paint, the mold temperature does not need to be higher than the curing temperature of the paint.

Subsequently, the movable mold 52 is moved by the mold clamping cylinder 13 while the control signal transmitted from the mold clamping control section 33 and the feedback control by the mold clamping servo valve 15 are performed.
Is advanced again, and the molding condition data signal (mold opening amount change pattern) and the mold clamping force pattern of the mold opening set in the mold clamping condition setting unit 32 are executed. In this way, the injected paint can be spread over the entire surface of the resin molded product, and at the same time, optimum molding conditions can be given to the appearance and adhesion strength of the coating film.

Thereafter, while performing a feedback control by the control signal transmitted from the mold clamping control unit 33 and the mold clamping servo valve 15, the mold is controlled in accordance with the operation timing and the mold opening speed pattern set in the mold clamping condition setting unit 32. The movable mold 52 is retracted by the tightening cylinder 13 to the mold opening limit position, and the integrally molded product is taken out of the mold apparatus 50. Thus, one molding cycle is completed.

The schematic operation of the IMC device 100 is as described above. In the IMC of the present invention, the injection of the paint in one molding cycle is performed in a state where the surface temperature of the resin molded product is higher than the curing temperature of the paint. This is performed when the mold temperature on the cavity side is lower than the curing temperature of the paint. The temperature difference between the mold temperature on the cavity side and the curing temperature of the paint is preferably 20 ° C. or less,
It is more preferable that the temperature be in the range of 5 ° C to 10 ° C.

By the way, in the above-described IMC of the present invention, when the surface of the injected paint is cured to some extent, the mold is opened at a predetermined interval to form a gap in the mold cavity 53, and the coating film is formed. It is also preferable to isolate from one mold. Since the void functions as a heat insulating layer, heat diffusion from the surface of the integrally molded product in which the coating film is in close contact with the surface of the resin molded product to one of the molds on the cavity side is suppressed.

In this manner, the temperature of the coating film can be raised to a temperature equal to or higher than the curing temperature of the paint by the internal heat of the resin molded article, and the curing of the paint can be performed without raising the mold temperature to the curing temperature of the paint. Thus, it is possible to obtain a desired curing temperature, and to shorten the curing time of the coating film.

The "point of time when the surface of the paint has hardened to some extent" means that even if the mold is opened, the shape of the integrally molded article does not collapse, and the paint and the mold can be separated well. Specifically, "opening the molds at a predetermined interval" means opening the molds 51 and 52 by about 0.5 mm to 2 mm.

Now, in the IMC of the present invention, when the surface of the resin molded product is solidified, the dies 51 and 52 are opened at a predetermined interval, and heat diffusion from the surface of the resin molded product to one of the dies is performed. Alternatively, the paint may be injected after the surface temperature of the resin molded article is raised to a temperature equal to or higher than the curing temperature of the paint by the internal heat of the resin molded article. After the paint is injected, the mold clamping cylinder 13 may be driven to control the thickness of the coating film so that a predetermined mold clamping force is applied to the molds 51 and 52.

In this way, when the molds 51 and 52 are closed again, the retained heat of the resin molded product passes through the coating film and the molds 51 and 52.
52 will diffuse to both, but once the mold 51
By opening 52 and storing heat in the resin molded product, the amount of heat required for curing the paint is secured. Thus, also in the case of the present method, it is possible to form a good coating film without raising the mold temperature to the curing temperature of the paint.

The "point at which the surface of the resin molded product is solidified" in the IMC is such that the resin molded product is not deformed even when the molds 51 and 52 are opened, and the paint is not coated. It means that the surface is in a solidified state to the extent that it can withstand injection pressure and flow pressure. It is preferable that the opening amount of the molds 51 and 52 is about 0.5 mm to 2 mm as in the above method.

As described above, the IMC of the present invention makes it possible to employ a mold temperature lower than the curing temperature of the paint by effectively utilizing the internal heat of the resin molded product. As a result, it is possible to shorten the time conventionally required for heating and cooling the mold, speed up the molding cycle, and improve the productivity. In addition, since the curing temperature of the paint can be maintained at a predetermined condition, it is possible to improve the physical properties of the obtained coating film. Hereinafter, the present invention will be described in more detail with reference to Examples, but it goes without saying that these Examples do not limit the present invention.

[0040]

(Embodiment 1) FIG. 2 shows a molding flowchart and a mold clamping / mold opening sequence of Embodiment 1 using the IMC apparatus shown in FIG. Length 300mm, width 210
mm, depth 50mm, thickness 3mm using a shear edge type mold that can obtain a box-shaped product, first apply 200t of mold clamping force and apply heat-resistant ABS resin (made by Ube Saikon Co., Ltd.
MX40) was injection molded. The resin temperature at this time is 25
The mold temperature at the cavity side was 0 ° C, and the mold temperature at the cavity side was 95 ° C. The cooling time for this resin molding was 20 seconds, and then the mold clamping force was reduced to 5 seconds.
0t, and paint A shown in Table 1 was injected at an injection pressure of 250
13 cc was injected at kg / cm ² . The surface temperature of the resin molded body at the time of coating the paint is 120 ° C. At this temperature, the surface of the resin molded body is not deformed by the injection of the paint. It is known that this paint cures at 100 ° C. for one minute. After the paint was injected, the paint was held for 120 seconds without changing the mold clamping force.

[0041]

[Table 1]

A cured coating film having a thickness of about 100 μm was formed on the entire surface of the integrated molded product taken out. The adhesion to the coating film in the integrally molded product is JIS K-5400
(Coating general test method) The cross-cut cellotape test described was evaluated. As a result, no peeling was observed at one of the 100 grids, and it was confirmed that good adhesion was obtained.

According to the conditions and results of the IMC of Example 1, the mold temperature can be set lower than the curing temperature of the paint by injecting the paint at the time when the surface temperature of the resin is higher than the curing temperature of the paint. Was confirmed. This allows
It is possible to reduce equipment costs and running costs related to maintaining the temperature of the mold, and to prolong the service life of the mold. Further, the time for heating and cooling the mold is reduced.
That is, the time of one molding cycle is reduced, and the productivity can be improved.

(Embodiment 2) Using the IMC device shown in FIG.
Flow chart and mold closing /
FIG. 3 shows the mold opening sequence. Gold used in Example 1
First, apply a mold clamping force of 200t as in the first embodiment.
Heat-resistant ABS resin (MX4, manufactured by Ube Sycon Co., Ltd.)
0) was injection molded. The resin temperature at this time is 250 ° C.
The mold temperature on the cavity side was 90 ° C. This resin component
Allow 20 seconds for the form to cool. After that, the mold clamping force is reduced to 50t.
And the paint A described in Table 1 was injected at an injection pressure of 250 kg.
/ Cm ^TwoThen, 13 cc was injected. Resin molding during paint injection
The body surface temperature is 115 ° C, at which point the paint
By the insertion, the surface of the resin molded body is not deformed.
It should be noted that this paint is cured at 100 ° C. for 1 minute.
After the paint was injected, the mold was
mm, open the mold after holding for another 60 seconds
To remove the integrally molded product.

A cured film having a thickness of about 100 μm was formed on the entire surface of the integrally molded product taken out.
In the same manner as in the above, the adhesion to the coating film of the integrally molded product was evaluated by a cross-cut cellophane tape test described in JIS K-5400 (General Paint Test Method). As a result, no peeling was observed at one of the 100 grids, and it was confirmed that good adhesion was obtained.

In the second embodiment, it is possible to use the internal heat of the resin molded body more effectively for curing the paint, and therefore, it is possible to set the mold temperature 5 ° C. lower than in the first embodiment. Has become. Although the curing time of the paint is the same as that in Example 1, there is an advantage that the handling of the integrally molded product (such as demolding) is easy and the life of the mold is extended.

(Embodiment 3) A flowchart relating to molding of Embodiment 3 using the IMC apparatus shown in FIG.
FIG. 4 shows the mold opening sequence. Using the mold used in Example 1, a mold clamping force of 200 tons is applied first and heat-resistant ABS resin (MX4, manufactured by Ube Sycon Co., Ltd.) is applied in the same manner as in Example 1.
0) was injection molded. The resin temperature at this time is 250 ° C.
The mold temperature on the cavity side was 90 ° C. The cooling time for this resin molding was 30 seconds, and the surface temperature of the resin molded product was 1
When the temperature reached 00 ° C., the mold was opened by 1 mm and waited for 10 seconds. Then, 13 cc of the coating material A shown in Table 1 was injected.
At this time, the time required for the injection of the paint was 2 seconds.
This paint was found to cure at 100 ° C. for 1 minute. After the paint was injected, the mold clamping force was set to 50 tons, and after holding for 120 seconds, the mold was opened to take out the integrally molded product.

A cured film having a thickness of about 100 μm was formed on the entire surface of the integrated molded product taken out.
In the same manner as in the above, the adhesion to the coating film of the integrally molded product was evaluated by a cross-cut cellophane tape test described in JIS K-5400 (General Paint Test Method). As a result, no peeling was observed at one of the 100 grids, and it was confirmed that good adhesion was obtained.

Also in the third embodiment, the internal heat of the resin molded body can be more effectively used for curing the paint.
It is possible to set the mold temperature 5 ° C. lower than in the first embodiment. Although the curing time of the paint is the same as that of Example 1, it was confirmed that when the mold temperature was set to 95 ° C. which is the same as that of Example 1, the curing time of the paint could be reduced to 90 seconds. ing. Thus, it is possible to set the mold temperature lower than the curing temperature of the paint, shorten one molding cycle time, and improve the productivity, and at the same time, cure the paint under predetermined conditions to obtain predetermined coating film characteristics. Becomes

[0050]

As described above, according to the in-mold coating molding method of the present invention, the mold temperature is reduced to a temperature lower than the curing temperature of the paint by effectively utilizing the internal heat of the resin molded product. As a result, an excellent effect of shortening the molding cycle and greatly improving the productivity can be obtained. At the same time, the coating can be cured under a predetermined temperature condition higher than the mold temperature, so that desired coating film characteristics can be obtained. In addition, when the mold temperature is the same as the conventional one, it is possible to use a coating material having a higher curing temperature. In this way, there are various remarkable effects such that the choice of the paint is expanded and a paint excellent in heat resistance and weather resistance can be used.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of an apparatus suitably used in an in-mold coating forming method of the present invention.

FIG. 2 is a flowchart and a mold clamping / mold opening sequence when molding according to the first embodiment is performed using the in-mold coating molding apparatus illustrated in FIG.

FIG. 3 is a flowchart and a mold clamping / mold opening sequence when molding according to a second embodiment is performed using the in-mold coating molding apparatus illustrated in FIG. 1;

FIG. 4 is a flowchart and a mold clamping / mold opening sequence when molding according to a third embodiment is performed using the in-mold coating molding apparatus shown in FIG.

[Explanation of symbols]

10: mold clamping device, 11: fixed plate, 12: movable plate, 13 ...
Mold clamping cylinder, 14 Tie rod, 15 Mold clamping servo valve, 16 Stroke sensor, 17 Mold opening sensor, 18 Mold clamping force sensor, 20 Injection device, 21 Screw, 22 Barrel, 23 Hydraulic motor, 24 injection cylinder, 25 hopper, 26 nozzle, 27 injection servo valve, 30 control device, 31 molding device control unit,
32: mold clamping condition setting section, 33: mold clamping control section, 35: injection machine control section, 38: injection control section, 50: mold apparatus, 51 ...
Fixed mold, 52: movable mold, 53: mold cavity, 5
4 ... Temperature sensor, 55 ... Paint injection machine, 100 ... In-mold coating forming apparatus.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Etsuo Okahara 1980 Yamaguchi Prefecture Ube City, Ogishi-Kogushi-ji, offshore Polymer Research Laboratory Ube Industries, Ltd. (72) Inventor Kazuaki Kobayashi, Ube City, Yamaguchi Prefecture, Ogashi-Kagashi-Okiyama 1980 Ube Industries Co., Ltd.Polymer Research Laboratory (72) Inventor Kenji Yonemochi 878 Nishinomon, Mitsubuchi, Komaki, Aichi Prefecture Dainippon Co., Ltd.Komaki Plant (72) Inventor Yoshiaki Yamamoto Mitsubuchi, Nishi, Komaki, Aichi Prefecture 878 Nomon, in the Komaki Plant of Dai Nippon Paint Co., Ltd. (72) Inventor Kenji Ota 878, Nishinomon, Mitsubuchi, Komaki-shi, Aichi F-term in the Komaki Plant of Dai Nippon Paint Co., Ltd. 4F202 AA36 AA42 AD11 AG03 AR06 AR11 CA01 CA11 CB01 CB12 CB17 CB22 CB30 CL01 CL12 CL22 CL32 CN01 4F206 AA13 AA36 AA42 AC05 AD11 AG03 AR06 AR11 JA07 JB23 JE06 JE10 JF06 J L02 JM05 JM06 JN25 JN35 JQ83 JQ90 JT05 JT32 JW50

Claims (4)

[Claims] 1. A thermosetting paint is injected between a surface of a resin molded product molded in a mold and a cavity surface of the mold, and the paint is cured in the mold to form the resin. An in-mold coating molding method for producing an integral molded product having a coating film adhered to the surface of the molded product, wherein the surface temperature of the resin molded product is higher than the curing temperature of the coating material, and the metal on the cavity side is formed. An in-mold coating molding method, wherein the paint is poured in a state where the mold temperature is lower than the curing temperature of the paint. 2. When the surface of the injected paint has hardened to some extent, the mold is opened at a predetermined interval to suppress heat diffusion from the surface of the integrally molded article to one of the molds, and 2. The method according to claim 1, wherein the temperature of the coating film is raised to a temperature equal to or higher than the curing temperature of the coating material by the internal heat of the molded article to shorten the curing time of the coating film. 3. Injecting a thermosetting paint between a surface of a resin molded product molded in a mold and a cavity surface of the mold, and then curing the paint in the mold to form the resin. An in-mold coating molding method for producing an integral molded product having a coating film adhered to the surface of the molded product, wherein the mold is opened at a predetermined interval when the surface of the resin molded product is solidified, and the resin molding is performed. In addition to suppressing heat diffusion from the surface of the product to one of the molds, and raising the surface temperature of the resin molded product to a temperature equal to or higher than the curing temperature of the paint by the internal heat of the resin molded product, injecting the paint A method for forming an in-mold coating. 4. The method according to claim 1, wherein a toggle-type injection molding machine or a toggle-type electric injection molding machine is used.