JP2001035145A - Optical disk driving device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical disk driving device which ensures the heat radiation property of a heat generating member situated within a sealed space on the optical pickup side without impairing the dustproof property to the optical pickup side. SOLUTION: While the heat generating member 3A, etc., is situated in the sealed space on the optical pickup side in a circuit board 2, the heat radiation property of the heat generating member 3A is ensured by bringing the bottom surface of the heat generating member 3A into contact with a base plate 1 by a heat radiating member 5 having the heat conductivity through a hole 4 formed corresponding to a mounting position of the heat generating member 3A in the circuit board 2. At this time, since the hole 4 is smaller than the heat generating member 3A, the sealing property on the optical pickup side is maintained and thus the dustproof property is ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk drive.

[0002]

2. Description of the Related Art Generally, an optical disk drive device includes a spindle motor for rotating and driving an optical disk, and an optical pickup for recording or reproducing information on the optical disk. Here, the optical pickup includes a focusing / tracking actuator for adjusting the state of the objective lens with respect to the optical disk, and also includes a seek mechanism including a motor for moving the optical pickup in a radial direction of the optical disk. These actuators and seek mechanisms are driven by respective driver elements under the control of a control circuit.

Various circuit elements including such driver elements are mounted on a circuit board. Here, conventionally, this type of circuit element is mounted on the circuit board on the side facing the metal base plate forming a part of the housing of the drive device, and the surface on the optical pickup side is flat. . Therefore, even if there is a heat-generating member such as a driver element that generates heat by receiving power supply, it is located on the base plate side, and it is easy to dissipate heat through this base plate.

[0004]

However, in recent years, in order to further reduce the size and thickness of the optical disk drive, the surface of the circuit board on the optical pickup side (with respect to the base plate) must be avoided while avoiding the range of movement of the optical pickup. By mounting a circuit element including a driver element and the like on the surface opposite to the opposing surface), the optical pickup and the circuit components are disposed two-dimensionally without waste, and the surface opposing the base plate tends to be flattened. There is (for example,
No. 50046).

In this case, the surface of the circuit board facing the base plate can be cooled by contacting the outside air through the base plate, but the surface on the optical pickup side is formed as a closed space so that dust and the like do not enter the optical pickup. Therefore, when the driver element or the like generates heat, the heat cannot be dissipated, and the temperature in the sealed space is easily increased, which causes a shortening of the life of the optical pickup.

According to Japanese Patent Application Laid-Open No. H10-50046, it is possible to make a hole in a circuit element itself which generates heat, and to dissipate heat using a metal screw which passes through the hole and is screwed to a base plate side. Although it is described, it is necessary to use a special circuit element with a hole, and it cannot be said that it is a general measure (it cannot be drilled depending on the circuit element). And the workability is poor.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an optical disk drive capable of securing heat radiation of a heat generating member located in a closed space on the optical pickup side without impairing dustproofness on the optical pickup side. And

[0008]

According to the first aspect of the present invention,
An optical disc drive device comprising: a metal base plate; and a circuit board on which a circuit element including a heating member for driving an optical pickup is mounted on a surface on an optical pickup side opposite to a surface facing the base plate. A hole is formed in the mounting portion of the heat-generating member on the substrate, and a heat-radiating member having thermal conductivity that is in contact with the bottom surface of the heat-generating member and the base plate through the hole is provided.

Accordingly, the heat-generating member and the like are located in the closed space on the optical pickup side of the circuit board, but are provided by a heat-radiating member having thermal conductivity through holes formed in the circuit board corresponding to the mounting portion of the heat-generating member. By contacting the bottom surface of the heat generating member and the base plate, heat radiation of the heat generating member can be secured. In particular, basically, it is sufficient to form a hole in the circuit board, and since versatility is high and a heat dissipating member having thermal conductivity is used, the heat dissipating ability can be enhanced more than the heat dissipating by air. .

According to a second aspect of the present invention, in the optical disk drive device of the first aspect, a plurality of holes are provided in a mounting portion of the heat generating member.

Therefore, by filling the hole with silicon oil or the like as a heat dissipating member, it can be easily realized and the heat dissipating property can be made uniform.

According to a third aspect of the present invention, in the optical disk drive device according to the first or second aspect, the size of the portion having the hole is within a range covered by the heat generating member.

Therefore, the hole is formed in the circuit board, but since it is within the range covered by the heat generating member, the hermeticity of the hermetically sealed space on the optical pickup side, that is, the dustproofness to the optical pickup is not impaired.

According to a fourth aspect of the present invention, in the optical disk drive according to the first, second or third aspect, the heat dissipating member is made of a heat dissipating insulating silicon rubber sheet.

Therefore, it can be realized in a state of high heat radiation using easily available members.

According to a fifth aspect of the present invention, in the optical disk drive device according to the fourth aspect, the heat dissipating member foams at a portion located between the circuit board and the base plate and at a portion located in the hole. The magnification is different.

Therefore, even if there is a variation in the distance between the circuit board and the base plate, it is absorbed by increasing the expansion ratio of the heat dissipating member in the portion located in the hole to increase the flexibility, and a stable contact state is obtained. As a result, heat dissipation can be secured.

According to a sixth aspect of the present invention, in the optical disk drive device according to the first aspect, the heat dissipating member is formed in a shape in which a part of the base plate itself is cut and raised to be in contact with the bottom surface of the heat generating member. It consists of a bending piece which has.

Therefore, by processing the opening of the hole or the bent piece,
This can be realized without using a new member.

[0020]

FIG. 1 shows a first embodiment of the present invention.
A description will be given based on FIG. First, there is provided a rectangular plate-shaped base plate 1 which is integrally formed of metal by die casting or the like and forms a part of a housing of an optical disk drive. A circuit board 2 is provided above the base plate 1 at a predetermined interval, and further above the base plate 1 is a spindle motor (not shown) for rotating the optical disk, and an optical pickup is provided with a radius of the optical disk (not shown). It is provided so as to be able to move in the seek direction.

Here, the upper surface (surface on the optical pickup side) 2a of the circuit board 2 is a surface on which various circuit elements 3 are mounted, and the surface 2b facing the base plate 1 is a substantially flat surface. The various circuit elements 3 are located in a closed space on the optical pickup side at a position avoiding the optical pickup and its movement range such as seek movement. A driver element 3A for an actuator for focusing / tracking servo and a seek motor for seek movement is included as a heat generating member. That is, these driver elements 3A are elements that generate heat because they receive power supply and drive actuators and the like.

Further, in the circuit board 2, a hole 4 smaller than the driver element 3A is formed at a position where the driver element 3A is mounted. That is, the hole 4 is formed in a size within a range covered by the driver element 3A mounted on the circuit board 2. A heat dissipating member 5 is provided between the circuit board 2 and the base plate 1 at the position of the hole 4. The heat dissipating member 5 is a base plate 1
A flexible member having a thickness slightly larger than the distance between the upper surfaces of the circuit board 2 and thermally connecting the bottom surface portion of the driver element 3A and the base plate 1 through the hole 4; Those having excellent properties are used. Specifically, the heat dissipating member 5 is formed by punching a heat dissipating insulating silicon rubber sheet (for example, trade name “Cool Sheet”) into an appropriate shape.

According to such a configuration, even if the driver element 3A located in the closed space receives power and drives the optical pickup, it generates heat even if it generates heat. Since the member 5 is in contact with and thermally connected to the metal base plate 1, heat can be radiated through the heat radiation member 5 and the base plate 1. Therefore, there is no thermal adverse effect on the optical pickup located in the closed space. In particular, according to the heat-dissipating member 5 made of the heat-dissipating insulating silicon rubber sheet, a high heat-dissipating effect can be obtained because of its good thermal conductivity. Although the hole 4 is formed in the circuit board 2, the size is within the range covered by the driver element 3 </ b> A, so that the closed space on the optical pickup side can be maintained and the dustproof property on the optical pickup side can be improved. Can be secured. In order to obtain such an effect, a hole 4 is formed in the circuit board 2 and
Since the heat dissipating member 5 may be used, it can be easily realized.

By the way, according to the configuration in which the hole 4 is formed in the circuit board 2 within the area covered by the driver element 3A as in the present embodiment, even in the configuration in which the heat radiation member 5 is not provided, By providing a fan having a space between the circuit board 2 and the base plate 1 as a ventilation area for ventilation, a certain degree of heat radiation can be obtained by exposing the bottom surface of the driver element 3A to the ventilation area via the hole 4. It is.

FIGS. 3 and 4 show a second embodiment of the present invention.
It will be described based on. The same portions as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted (the same applies to each of the following embodiments). In the present embodiment, for example, two holes 6 are formed in the mounting portion of the driver element 5, and a large rubber sheet 7 a located between the circuit board 2 and the base plate 1 as the heat dissipating member 7 is located in the hole 6. A sponge-like sheet 7b smaller than the hole 6 is used. These rubber sheets 7a
The sponge-like sheet 7b and the sponge-like sheet 7b are both made of a heat-dissipating insulating silicon rubber sheet (for example, trade name "Cool Sheet"), and have different flexibility due to different foaming ratios. Has been
Here, the thickness of the rubber sheet 7a is slightly smaller than the distance between the circuit board 2 and the base plate 1, and the thickness of the sponge-like sheet 7b is larger than the thickness of the circuit board 2.

According to such a configuration, in the heat radiation member 7, the rubber sheet 7a has excellent heat conductivity, and the sponge-like sheet 7b has excellent flexibility. Therefore, even if there is a variation in the distance between the circuit board 2 and the base plate 1, the variation can be absorbed by the sponge-like sheet 7b and the state of contact with the bottom surface of the driver element 3A can be reliably maintained, and Heat can be radiated through the base plate 1 with high heat conductivity through the rubber sheet 7a.

In this embodiment, the circuit board 2
Although the individual holes 6 are formed, if they are smaller than the driver element 3A, they may be formed as elongated holes 8 as shown in FIGS. Further, the heat dissipating member 7 having the shape shown in the present embodiment may be integrally formed without having a two-piece structure.

FIGS. 7 and 8 show a third embodiment of the present invention.
It will be described based on. In this embodiment, for example, a plurality of small holes 9 are formed in the mounting portion of the driver element 5, and a large rubber sheet 10 a located between the circuit board 2 and the base plate 1 is injected as a heat radiation member 10 into the hole 9. The used silicone oil 10b is used. The silicone oil 10b has better heat conductivity than air.

Therefore, according to the present embodiment, even if there is a variation in the distance between the circuit board 2 and the base plate 1, the variation is absorbed by the silicon oil 10b injected into the hole 9 and the driver element 3A Can reliably maintain the contact state with the bottom surface of the
Heat can be radiated through the base plate 1 with high heat conductivity through the rubber sheet 10a.

FIGS. 9 and 1 show a fourth embodiment of the present invention.
Description will be made based on 0. In the present embodiment, a bent piece 12 formed by cutting and raising a part of the base plate 1 itself and bending it into an elastic shape so as to be in direct contact with the bottom surface of the driver element 3A through the hole 4 of the circuit board 2 is radiated. It is provided as a conductive member. That is, the bent piece 12 is formed like a leaf spring so as to directly contact the bottom surface of the driver element 3A.

According to such a configuration, even if the driver element 3A located in the closed space receives power supply and drives the optical pickup, it generates heat, so that the bottom surface of the driver element 3A is made of metal. Base plate 1
Can be radiated through the base plate 1 because the bent pieces 12 that form a part thereof are in direct contact with each other. Therefore,
There is no adverse thermal effect on the optical pickup located in the closed space. In order to obtain such an effect, the hole 4 may be formed in the circuit board 2 and a part of the base plate 1 may be processed, which can be easily realized without requiring a separate member.

[0032]

According to the first aspect of the present invention, the heat generating member and the like are located in the closed space on the optical pickup side of the circuit board, but are formed through the holes formed corresponding to the mounting portions of the heat generating member on the circuit board. By contacting the bottom surface of the heat-generating member and the base plate with a heat-radiating member having thermal conductivity, heat radiation of the heat-generating member can be secured.
Basically, it is sufficient to form a hole in the circuit board, and since the heat dissipation member having thermal conductivity is used in addition to high versatility, the heat dissipation ability can be enhanced more than the heat dissipation by air.

According to the second aspect of the present invention, since a plurality of holes are provided in the mounting portion of the heat generating member, the holes can be easily realized by filling the holes with silicon oil or the like as a heat dissipating member. In addition, heat dissipation can be made uniform.

According to the third aspect of the present invention, a hole is formed in the circuit board, but since the hole is formed within the range covered by the heat generating member, the hermeticity of the closed space on the optical pickup side, that is, the dustproof property for the optical pickup. Does not impair.

According to the fourth aspect of the present invention, since the heat dissipating member is made of the heat dissipating insulating silicon rubber sheet, the heat dissipating member can be realized with a high heat dissipating property by using a readily available member.

According to the fifth aspect of the present invention, even if there is variation in the distance between the circuit board and the base plate, absorption is achieved by increasing the expansion ratio of the heat-dissipating member located in the hole to increase the flexibility. As a result, a stable contact state can be obtained and heat radiation can be ensured.

According to the sixth aspect of the present invention, since the heat dissipating member is formed by cutting and raising a part of the base plate itself to be in contact with the bottom surface of the heat generating member and formed of a resilient bent piece, the opening of the hole and The processing of the bent piece can be realized without using a new member.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional side view thereof.

FIG. 3 is an exploded perspective view showing a second embodiment of the present invention.

FIG. 4 is a vertical sectional side view thereof.

FIG. 5 is an exploded perspective view showing a modification.

FIG. 6 is a vertical sectional side view thereof.

FIG. 7 is an exploded perspective view showing a third embodiment of the present invention.

FIG. 8 is a vertical sectional side view thereof.

FIG. 9 is an exploded perspective view showing a fourth embodiment of the present invention.

FIG. 10 is a vertical sectional side view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base plate 2 Circuit board 3 Circuit element 3A Heat generating member 4 Hole 5 Heat radiating member 6 Hole 7 Heat radiating member 8, 9 hole 10 Heat radiating member 12 Bending piece, Heat radiating member

Claims (6)

[Claims] 1. An optical disk drive comprising: a metal base plate; and a circuit board on which a circuit element including a heating member for driving an optical pickup is mounted on a surface of the optical pickup opposite to a surface facing the base plate. In the apparatus, a hole is formed in a mounting portion of the heat generating member on the circuit board, and a heat dissipating member having heat conductivity is provided through the hole to be in contact with a bottom surface of the heat generating member and the base plate. Optical disk drive. 2. The optical disk drive device according to claim 1, wherein a plurality of holes are provided in a mounting portion of the heat generating member. 3. The optical disk drive device according to claim 1, wherein the size of the portion having the hole is within a range covered by the heat generating member. 4. The heat-dissipating member is made of a heat-dissipating insulating silicon rubber sheet.
An optical disk drive device according to any one of the preceding claims. 5. The optical disk drive according to claim 4, wherein the heat radiation member has a different expansion ratio between a portion located between the circuit board and the base plate and a portion located in the hole. apparatus. 6. The heat dissipating member according to claim 1, wherein the heat dissipating member is formed by cutting and raising a part of the base plate itself so as to be in contact with a bottom surface of the heat generating member, and is formed of a bent piece having elasticity. Optical disk drive device.