JP2001028411A - Spherical semiconductor packaging wiring board and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spherical semiconductor packaging wiring board of a structure, where spherical semiconductor materials can be mounted with a required strength and the heat dissipation characteristics of the semiconductor materials are also improved. SOLUTION: A spherical semiconductor packaging wiring board 1 comprises mounting parts 20, which are formed in the vicinity of the main surface 3 of the board 1 and respectively have a plurality of pads 18, spherical semiconductor materials 30, which are mounted on the mounting parts 20 by connecting each bump 34 in the vicinities of the bottoms of the spherical semiconductor materials 30 with each pad 18 on the mounting parts 20 via each solder bump 28, and a filling resin 39, which is formed on the main surface 3 and encircles the semiconductor materials 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting a spherical semiconductor on a main surface of a spherical semiconductor and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, a conventional semiconductor has a flat plate shape obtained by cutting out a large number of elements each having an integrated circuit formed on a wafer. On the other hand, in recent years, spherical semiconductors having a spherical main body have been proposed. Such spherical semiconductor 40
6A, an integrated circuit (not shown) is formed on a spherical surface of a spherical main body 42 made of silicon single crystal, and an electric conduction with the integrated circuit is formed near the bottom of the main body 42, as shown in the upper left of FIG. A plurality of substantially spherical bumps 44 are arranged in a ring shape.

As shown on the left side of FIG. 6A, in order to mount the spherical semiconductor 40 on a main surface 47 of a wiring board 46,
This is performed by connecting a plurality of terminals 48 arranged in a ring shape on the main surface 47 to the respective bumps 44 via solder bumps 49. Further, as shown on the right side of FIG.
5 are arranged in a ring shape, and the main surface 47 of the wiring board 46 is arranged.
In some cases, adjacent spherical semiconductors 40, 40 are mounted between the bumps 45, 45 via solder bumps 49 in advance (see US Pat. No. 5,877,943).

However, since the main body 42 of the spherical semiconductor 40 is spherical, only the bumps 44 near the bottom of the main body 42 can be connected to the main surface 47 of the wiring board 46 and connected to the terminals 48. That is, since the connection between the main surface 47 and the spherical semiconductor 40 depends on each of the bumps 44 near the bottom of the main body 42, the strength in mounting is insufficient and the solder bumps 49 are inadvertently detached by external force and disconnected. There was a problem that it was easy to do. Further, since the heat generated from each spherical semiconductor 40 is transmitted to the wiring board 46 via only the bumps 44 and is radiated, the heat is not sufficiently released, and the operation of the spherical semiconductor 40 itself is not smooth. there were. Furthermore,
Since the number of terminals 48 that can be connected to the bumps 44 of the spherical semiconductor 40 on the main surface 47 of the wiring board 46 is limited, the function inherent in the mounted spherical semiconductor 40 cannot be fully utilized. there were.

[0005] In order to solve the above-mentioned problems, increase the mounting strength of the spherical semiconductor 40, and increase the number of terminals connectable to the wiring board 46, an adapter 5 as shown on the left side of FIG.
0 has also been proposed. This adapter 50 is a box-shaped main body 5
2, a substantially hemispherical recess 54 opening upward is formed, and a plurality of wirings 56 vertically penetrating the main body 52 are arranged in parallel between the recess 54 and the bottom surface of the main body 52.
As shown in the figure, the spherical semiconductor 41 also has a plurality of bumps 43 arranged in a ring shape on the outer periphery of each bump 44 near the bottom.

[0006] As shown on the right side of FIG.
0, the lower half of the spherical semiconductor 41 is inserted into the recess 54,
The upper ends of the bumps 43 and 44 and the wiring 56 are connected in advance by soldering. Next, the adapter 50 is disposed on the main surface 47 of the wiring board 46, and the terminals 48 and the lower ends of the wirings 56 arranged in a double ring shape on the main surface 47 are individually soldered. . Thus, the spherical semiconductor 41 can be firmly mounted on the main surface 47 of the wiring board 46, the heat radiation characteristics can be improved, and the large number of bumps 4
Since the terminals 3 and 44 can be connected to the terminals 48, the function of the mounted spherical semiconductor 41 can be sufficiently utilized (see US Pat. No. 5,877,943).

[0007]

However, when the above-described adapter 50 is used, the adapter 50 is required for each spherical semiconductor 41 to be mounted, so that the manufacturing cost is increased and the number of assembling steps is increased, resulting in an increase in cost. In addition, a space for arranging the adapter 50 is required on the main surface 47 of the wiring board 46, and there is a problem that it is not possible to meet the demand for a smaller and thinner wall board 46. The present invention solves the above-mentioned problems in the prior art, a spherical semiconductor mounting wiring board that can mount a spherical semiconductor with a required strength, and also has good heat radiation characteristics,
An object of the present invention is to provide a method of manufacturing the above-mentioned spherical semiconductor mounting wiring board, which can be easily and reliably manufactured according to the number of spherical semiconductors to be mounted.

[0008]

In order to solve the above-mentioned problems, the present invention has been made with the idea of enclosing a spherical semiconductor mounted on a main surface with a filling resin. That is, the spherical semiconductor mounting wiring board of the present invention is formed by connecting a mounting portion formed near the main surface and having a plurality of pads, and a bump near the bottom of the spherical semiconductor to a pad of the mounting portion.
It is characterized by including a spherical semiconductor mounted on the mounting portion and a filling resin formed on the main surface and surrounding the spherical semiconductor.

According to this, the spherical semiconductor mounted on the main surface by connecting each pad in the mounting portion near the main surface and each bump near the bottom portion is further surrounded by the filled resin. Therefore, it is possible to increase the strength in mounting and to connect, and it is possible to prevent a situation in which the solder bumps come off and break. Moreover, heat generated from the integrated circuit on the spherical surface of the mounted spherical semiconductor is also radiated to the main surface side of the wiring board through the filling resin layer, so that the operation of the spherical semiconductor can be stabilized. The filling resin is obtained by applying an epoxy-based, acrylic-based, phenol-based, urethane-based, silicon-based, or rubber-based resin on the main surface of the wiring board, and drying and curing the resin. Further, the vicinity of the main surface includes not only the position on the main surface but also the position immediately below the main surface and the inside of the concave portion formed on the main surface.

A plurality of the spherical semiconductors are individually mounted on the plurality of mounting portions, and the spherical semiconductors adjacent to each other are connected via bumps protruding from respective peripheral side surfaces,
Further, the present invention also includes a spherical semiconductor mounting wiring board in which a connection portion including the bump is embedded in the filling resin. According to this, the spherical semiconductors adjacent to each other on the main surface of the wiring substrate are also directly connected via the bumps on the peripheral side surface, and such connection portions are embedded in the filling resin. The operation can be directly transmitted, and the connection portion can be protected by the filling resin.

Furthermore, bumps near the bottom of each of the spherical semiconductors in the upper stage are connected to bumps near the top of the plurality of spherical semiconductors, and the spherical semiconductors adjacent to each other in the upper stage protrude from the peripheral side surfaces. The present invention also includes a spherical semiconductor mounting wiring board which is connected to each other via a bump and a connection portion including the bump is embedded in the filling resin. According to this, a large number of spherical semiconductors can be mounted on the main surface of the wiring board in a plurality of steps, and adjacent spherical semiconductors are directly connected to each other in each step, and the mounting parts on the main surface are connected to each other. The spherical semiconductor in each step and the connection between them can be firmly protected by the filling resin, and the heat radiation characteristics of each spherical semiconductor can be enhanced. In addition, a large number of spherical semiconductors can be directly connected to the mounting portion and the adjacent spherical semiconductor, and high-density mounting in a small space on the main surface becomes possible.

On the other hand, according to the method of manufacturing a spherical semiconductor mounted wiring board of the present invention, each pad is connected to each bump near the bottom of the spherical semiconductor to a mounting portion composed of a plurality of pads provided near the main surface of the wiring board. The method includes a step of mounting the spherical semiconductor and a step of forming a filling resin on the main surface so as to surround the spherical semiconductor mounted on the mounting portion. According to this, the above-mentioned spherical semiconductor mounting wiring board can be easily and reliably manufactured according to the number of spherical semiconductors.
In addition, since a conventional adapter is not required, the number of steps, cost, and mounting space can be reduced.

A plurality of the spherical semiconductors are individually mounted on the plurality of mounting portions, and the spherical semiconductors adjacent to each other are connected to each other in advance through bumps protruding from respective peripheral side surfaces. The manufacturing method of the mounting wiring board is also included. According to this, the adjacent spherical semiconductors on the main surface of the wiring board can be mounted on each mounting portion of the wiring board in a state where they are connected in advance, and the filled resin including the connection portion between the adjacent spherical semiconductors can be filled in the filling resin. And a plurality of spherical semiconductors can be efficiently mounted. Further, by alternately repeating the mounting process of the spherical semiconductor and the forming process of the filling resin, the spherical semiconductor is mounted on the main surface of the wiring board in a plurality of stages, and the spherical semiconductor of each stage is surrounded. Forming the filling resin so that
A method for manufacturing a spherical semiconductor mounted wiring board is also included. According to this, it is possible to reliably and efficiently obtain a spherical semiconductor mounted wiring board on which a large number of spherical semiconductors extending over a plurality of stages on the main surface are arranged firmly and densely and mounted.

[0014]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1A shows the appearance of a spherical semiconductor mounted wiring board 1 according to the present invention. This substrate 1
Comprises a wiring board 2 having a thin box shape, a plurality of spherical semiconductors 30 having a size of about 1 mm in diameter mounted on the main surface 3 thereof, and a filling resin 39 surrounding these except for their tops. Have. As shown in FIG. 1B, the wiring board 2 has a thickness of about 1.2 mm, a core board 4 made of BT resin positioned at the center in the thickness direction, and a plurality of Of the through hole conductor 5. On the upper and lower surfaces of the core substrate 4, first, second, and third wiring layers 6, 10, and 14, and first and second insulating layers 8, which are located therebetween and are made of epoxy resin, 12 are formed, and via conductors 9 and 13 for conducting the wiring layers above and below the insulating layers 8 and 12 are arranged to penetrate the insulating layers 8 and 12 respectively.

As shown in FIG. 1B, thin solder resist layers 16 are formed on the upper and lower second insulating layers 12 and the third wiring layers 14, respectively. Part of the third wiring layer 14 on the main surface 3 side is made of the resist layer 16
A plurality of pads 18 that are not covered with a pad are formed. Further, a part of the third wiring layer 14 on the bottom side is exposed in the opening 26 provided in the resist layer 16 to form an external terminal 27. The wiring layers 6, 10, 14 and the via conductors 9, 13 are formed by a known photolithography technique. The pad 18 and the terminal 27 are covered with a thin Ni plating film and Au plating film on the surface.
Further, as shown in FIG. 1B, each of the pads 18 on the main surface 3 side
Are arranged in a ring shape in plan view, and a mounting portion 20 for individually mounting the spherical semiconductors 30 is formed near the main surface 3.

As shown in FIG. 1B, each spherical semiconductor 30
6 bumps 34 near the bottom of the spherical body 32
Are protruded, and are connected to the respective pads 18 of the mounting portion 20 via solder bumps 28. Thereby, the integrated circuit (not shown) formed on the main body 32 of each spherical semiconductor 30 and the wiring layers 6, 10, and 14 in the wiring board 2 are electrically connected. A plurality of bumps 36 are also provided on the peripheral side surface of each of the main bodies 32 of the adjacent spherical semiconductors 30, 30. The semiconductors 30 are connected to each other, and the integrated circuits formed on the surface of each main body 32 are electrically connected to each other.

Further, as shown in FIGS. 1A and 1B, each spherical semiconductor 30 is buried and surrounded by a filling resin 39 except for the top of its main body 32. For this reason, each spherical semiconductor 30 is firmly mounted on each mounting portion 20 of the wiring board 2, while maintaining the above-described conductive state and the main body 32.
Heat generated by the integrated circuit on the surface can also be released to the wiring board 2 via the filling resin 39. Therefore, according to the spherical semiconductor mounting wiring board 1, the plurality of spherical semiconductors 30
Can be reliably mounted on the main surface 3 and can accurately conduct with the wiring layers 6, 10, and 14 inside the wiring board 2, and the plurality of spherical semiconductors 30 can also communicate with each integrated circuit on the surface of the main body 32. it can. In addition, since each spherical semiconductor 30 can easily radiate heat via the filling resin 39, it is possible to exhibit its function stably. The spherical semiconductor 30
Alternatively, the entire body 32 may be embedded in the filling resin 39.

Here, a method of manufacturing the above-described spherical semiconductor mounted wiring board 1 will be described with reference to FIGS. FIG. 2A shows an end surface near the main surface 3 of the wiring board 2, and a plurality of mounting portions 20 each including six pads 18 are arranged on the second insulating layer 12. As shown in FIG.
Is covered with the solder resist layer 16 and is exposed to the main surface 3 through the opening 22. FIG.
As shown in FIG. 2B, a required number of spherical semiconductors 30 in which bumps 36 on the peripheral side surface of each body 32 are connected to adjacent spherical semiconductors 30 via solder bumps 38 are formed in advance. Next, as shown in FIG.
The bump 34 at the bottom of the main body 32 of the spherical semiconductor 30 is brought into contact with the hemispherical solder bump 28 formed in advance on the surface 8. By heating the solder bumps 28 in this state, the plurality of spherical semiconductors 30 are individually mounted on the mounting portions 20 near the main surface 3 of the substrate 2.

Then, as shown in FIGS. 3A and 3B,
A filling resin 39 is filled on the main surface 3 and between the mounted spherical semiconductors 30, 30 using a dispenser (not shown) to form a layer thereof. The filling resin 39 is made of, for example, an epoxy resin, and is discharged in a liquid state from the dispenser by a fixed amount, dried, and cured. As shown in FIG. 3A, each of the mounting portions 20 is buried by sequentially filling the filling resin 39 into one or several layers. Further, as shown in FIG.
The connection portions (36, 38, 36) between the spherical semiconductors 30 are also buried, and each spherical semiconductor 30 is filled with a resin 39 except for the vicinity of the top of the main body 32.
Surround with.

As a result, the mounting strength of each of the spherical semiconductors 30 mounted on the main surface 3 can be reinforced and stabilized, and the connection portions (36, 38, 38) between the spherical semiconductors 30, 30 can be provided.
36) can also be protected. Note that, as the filling resin 39, an acrylic resin, a phenol resin, a urethane resin, a silicon resin, a rubber resin, or the like can be used. Further, each spherical semiconductor 30 projecting on the surface of the filling resin 39 is formed.
An identification mark indicating the type of the spherical semiconductor 30 can be provided on the top of the main body 32 of the first embodiment. Or Figure 1
As shown in FIG. 3, in the mode in which the spherical semiconductors 30 are mounted on the main surface 3 of the wiring board 2 in only one step, each spherical semiconductor 3
It is also possible to embed and surround the entirety of the main body 32 of the zero.

FIG. 4 relates to a spherical semiconductor mounted wiring board of a different form. In the following, the same reference numerals are used for the same parts and elements as in the above embodiment. FIG. 4 (A)
In the same manner as in FIGS. 2 and 3, a plurality of spherical semiconductors 30 are mounted on the mounting surface 20 in one step on the main surface 3 of the wiring board 2, and these are filled with resin except for near the top of the main body 32. 3
9 shows a state of being surrounded. Body 3 of each spherical semiconductor 30
In the vicinity of the top of 2, two bumps 35 are provided in advance in plan view. Next, as shown in FIG. 4B, a plurality of second-stage spherical semiconductors 30 in which bumps 36 on the peripheral side surface of each main body 32 are connected in advance to adjacent spherical semiconductors 30 via solder bumps 38 are formed. The bumps 35 and 34 of the first-stage spherical semiconductor 30 are connected to each other via solder bumps 38.

As a result, the first-stage and second-stage spherical semiconductors 30 are electrically connected to each other on the surface thereof, and the second-stage spherical semiconductors 30 are also connected to the wiring. It is electrically connected to the wiring layers 6, 10, and 14 in the substrate 2, respectively. Then, as shown in FIG. 4 (B), by enclosing each spherical semiconductor 30 in the second stage with the filling resin 39 except for the vicinity of the top of the main body 32, many spherical semiconductors 30 are three-dimensionally formed. Can be obtained. Note that, at the top of the main body 32 of each spherical semiconductor 30 in the second stage, together with the spherical semiconductor 30, an identification mark indicating the type of the first stage spherical semiconductor 30 located immediately below the spherical semiconductor 30 may be attached. good.
In addition, the bumps 35 are also protruded from the tops of the main bodies 32 of the spherical semiconductors 30 in the second stage in the same manner as described above.
On these, a large number of spherical semiconductors 30, 30,... Located at the third stage or higher can be connected. Also in this embodiment, each spherical semiconductor 30 in the uppermost stage is surrounded by the filling resin 39 except for the vicinity of the top of the main body 32. Of course, the main body 32 of each spherical semiconductor 30 at the top can be embedded in the filling resin 39.

FIG. 4C shows a mounting section 21 having a different form. The mounting portion 21 includes the six pads 18 located on the inner peripheral side in a plan view, and twelve pads 18a arranged around the pads 18 in a ring shape. As shown in FIG. 4D, a low solder bump 2 is formed on each pad 18 on the inner peripheral side.
8, a slightly high solder bump 29 is erected on each pad 18a on the outer peripheral side. In addition, the same number of bumps 34 a corresponding to each of the solder bumps 29 protrude from the bottom of the main body 32 of the spherical semiconductor 30 outside the bump 34 corresponding to the solder bump 28. Therefore, FIG.
As shown in the figure, the solder bumps 28, 29 and the bumps 34, 3
4a, the integrated circuit formed on the surface of the main body 32 of the spherical semiconductor 30 and the wiring layers 6, 10, and 14 in the wiring board 2 can be conducted more densely, and the mounted spherical semiconductor 30 functions can be more reliably extracted. The main body 32 of the spherical semiconductor 30 is also surrounded by the filling resin 39 as in the above-described embodiment.

FIGS. 5A and 5B show a mounting section 24 having a further different form. The mounting portion 24 has a circular concave portion 11 in a plan view in the solder resist layer 16 and the second insulating layer 12 of the wiring board 2, and a first concave portion 11 is formed on the first insulating layer 8 exposed in the concave portion 11. The six ends of the two wiring layers 10 are substantially centripetally arranged, and the solder bumps 28a are fixed on the pads 18b at the ends thereof. Further, solder bumps 28 are fixed on the twelve pads 18 arranged along the periphery of the concave portion 11, respectively. The mounting section 24 as described above is also formed near the main surface 3 of the wiring board 2.

As shown in FIG. 5C, six bumps 34 near the bottom of the main body 32 of the spherical semiconductor 30 and twelve bumps 34a on the outside thereof are placed on the solder bumps 28a, 28 of the mounting part 24. Placed and each bump 28a, 28
Heat. Thus, the bumps 34, 34a of the spherical semiconductor 30 and the pads 18b, 18 of the mounting portion 24 are connected via the bumps 28a, 28. This spherical semiconductor 30
Except for the vicinity of the top of the main body 32 as well, as shown in FIG. According to such an embodiment, the spherical semiconductor 30 is electrically connected to the wiring layers 6, 10, and 14 in the wiring board 2 via the many bumps 34 and 34a, so that the integrated circuit on the main body 32 can function sufficiently. The main body 32 can also be firmly mounted on the mounting portion 24 by the filling resin 39.

The present invention is not limited to the embodiments described above. For example, the main surface 3 of the wiring board 2
The number of the spherical semiconductors 30 mounted on the upper surface is arbitrary, and the number of each stage on the main surface 3 is also arbitrary. Further, the spherical semiconductors 30 having different diameters may be mounted on the main surface 3 or arranged in each stage. At this time, the mounting unit 2
The positions of 0, 21, and 24 are arranged according to the diameter of each spherical semiconductor. Moreover, the arrangement of the mounting portions 20, 21, 24 is arbitrary, and the pads 18 and the like may be arranged on the main surface 3. Further, the filling resin 39 can be formed by being divided into a plurality of portions on the main surface 3 according to the mounting pattern of the spherical semiconductor 30. The wiring board to which the present invention is applied includes a ceramic wiring board in which a wiring layer is disposed between ceramic insulating layers. Further, the present invention includes not only a resin or ceramic multilayer wiring board but also a resin or ceramic single layer wiring board.

[0027]

According to the spherical semiconductor mounting wiring board of the present invention described above, the spherical semiconductor mounted on the main surface has its spherical main body surrounded by the filling resin.
The mounting strength can be increased, and the disconnection of the connection portion can be prevented. In addition, heat generated from the spherical integrated circuit in the mounted spherical semiconductor is also radiated to the main surface side of the wiring board through the filling resin layer, so that the operation of the spherical semiconductor can be stabilized. According to the spherical semiconductor mounting wiring board of the third aspect, a large number of spherical semiconductors can be mounted on the main surface in a plurality of stages at high density, and adjacent spherical semiconductors are directly connected to each other in each stage. You. Moreover,
The mounting portion near the main surface, the spherical semiconductor in each step, and the connecting portion between them can be firmly protected by the filling resin, and the heat radiation characteristics of each spherical semiconductor can be improved.

On the other hand, according to the manufacturing method of the present invention, the spherical semiconductor mounting wiring board can be easily and reliably manufactured in accordance with the number of the spherical semiconductors, and the conventional adapter is not required. , And the mounting space can be reduced. Further, according to the manufacturing method of the sixth aspect, a spherical semiconductor mounted wiring board in which a large number of spherical semiconductors are densely and firmly three-dimensionally mounted on a main surface in a plurality of stages and mounted is reliably and efficiently obtained. be able to.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a spherical semiconductor mounting wiring board of the present invention, FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A, and FIG.
3 is a schematic plan view showing a mounting portion of the wiring board in (B).

FIGS. 2A to 2C are schematic diagrams showing respective manufacturing steps of a spherical semiconductor mounted wiring board of the present invention.

3 (A) and 3 (B) are schematic views showing respective manufacturing steps following FIG. 2 (C).

4 (A) and 4 (B) are schematic views showing respective manufacturing steps for obtaining a spherical semiconductor mounting wiring board having different forms, FIG. 4 (C) is a schematic plan view showing a mounting section having different forms, and FIG. 4 (D). FIG. 4 is a schematic cross-sectional view taken along line DD in FIG. 4C, showing a state in which a spherical semiconductor is mounted on the mounting portion of FIG.

5A is a schematic plan view showing a mounting portion in a further different form, FIG. 5B is an end view along line BB in FIG. 5A, and FIG. FIG. 3 is a schematic diagram showing a mounted state.

FIGS. 6A and 6B are schematic diagrams showing a conventional technique for mounting a spherical semiconductor on a main surface of a wiring board.

[Explanation of symbols]

 1, 1a ………………………………………………………………………………………………………… Wiring board 3 ………………………………… Main surface 18, 18a, 18b ...... Pad 20,21,24 ............ Mounting part 30 ...... Spherical semiconductor 34,34a, 35,36 Bump 39 ............ Filled resin

Claims (6)

[Claims] 1. A mounting portion formed near a main surface and having a plurality of pads; and a spherical semiconductor mounted on the mounting portion by connecting a bump near a bottom portion of the spherical semiconductor to a pad of the mounting portion; And a filling resin formed on the main surface and surrounding the spherical semiconductor. 2. A plurality of spherical semiconductors are individually mounted on a plurality of mounting portions, and adjacent spherical semiconductors are
The spherical semiconductor mounting wiring board according to claim 1, wherein the connection is made via bumps projecting from the respective peripheral side surfaces, and a connection part including the bumps is embedded in the filling resin. 3. A bump near the bottom of each of the spherical semiconductors in the upper stage is connected to a bump near the top of the plurality of spherical semiconductors, and the spherical semiconductors adjacent to each other in the upper stage protrude from respective peripheral side surfaces. The spherical semiconductor-mounted wiring board according to claim 2, wherein the connection part connected to each other via the bump and including the bump is buried in the filling resin. 4. A step of connecting each bump near the bottom of the spherical semiconductor to each pad to a mounting section comprising a plurality of pads provided near the main surface of the wiring board to mount the spherical semiconductor; Forming a filling resin on the main surface so as to surround the mounted spherical semiconductor. 5. A plurality of said spherical semiconductors are individually mounted on a plurality of said mounting portions, and mutually adjacent spherical semiconductors are connected to each other in advance via respective bumps projecting from respective peripheral side surfaces. 5. The method for manufacturing a spherical semiconductor mounted wiring board according to claim 4, wherein: 6. A process for mounting the spherical semiconductor on the main surface of the wiring board in a plurality of steps by alternately repeating the mounting step of the spherical semiconductor and the forming step of the filling resin, and the spherical surface of each step. The method according to claim 4, wherein the filling resin is formed so as to surround the semiconductor.