JP2001027422A - Thin floor heating panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a thickness of an overall floor heating panel by forming piping in a flat sectional state, forming a minor axis direction of the section in the same as a depth direction of a groove to contain the piping in the groove in the panel containing the piping for distributing a heating medium in the groove of a base board. SOLUTION: A floor heating panel 11 having piping 5 arranged at a rear side of a floor to distribute warm water in the piping to heat a floor has a zigzag groove 3 on a base board 1, and contains the piping 5 in the groove 3. In this case, the piping 5 is contained in the overall length of the groove 3 by forming its section in a flat state and directing a minor axis direction A of the section in the same as a depth direction of the groove 3. Thus, a thickness of the overall panel 11 is thinly constituted, and the panel 11 can be reduced to a minimum at its step to a non-floor heating when floor heater is provided by using the panel 11. Connecting tubes 9, 10 of a circular section are mounted at both ends of the piping 5, and when the panel 11 is laid, the tubes 9, 10 are connected to one another at the windows 12, 13, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin floor heating panel, and more particularly, to a thin floor heating panel whose overall thickness can be made much thinner than before.

[0002]

2. Description of the Related Art Buildings in which piping such as copper is disposed on the back side of a floor and hot water flows through the piping to warm the floor, thereby improving the livability are widely used.

FIG. 2 shows the structure of a floor heating panel conventionally used for this purpose, wherein 1 denotes a base board, 3 denotes a groove provided in the base board 1, and
It is provided in a meandering manner as shown in FIG.

[0006] 5 is a pipe housed in a meandering manner in the groove 2, 6 is a heat transfer plate attached to the base board 1 by extending the lower part into contact with the pipe 5, and 7 is a base board 1.
A heatsink attached to the upper surface of the substrate, and a back plate 8 attached to the opposite surface.

The floor heating panel 11 having the above configuration is
It is provided on a joist of a building and forms a predetermined floor heating by covering the upper surface with flooring such as flooring. The pipe 5 is connected between the panels 11 at the connection windows 12 and 13. Are connected, whereby a plurality of floor heating panels 11 are laid in a predetermined area.

[0006] By flowing hot water through the pipe 5, heat is radiated from the surface of the floor material, thereby performing predetermined floor heating. Demand for underfloor heating of the above configuration for new or existing buildings is expected to increase further in the future.

[0007]

However, according to the conventional floor heating panel, it is difficult to make the entire thickness t shown in FIG. 2B thin, so that a step is formed between the panel and the floor which is not heated. This often causes problems in adjusting the height of the floor, such as hindering the opening and closing of the door. Above all, from the viewpoint of barrier-free, the step of the floor is a serious problem.

Accordingly, it is an object of the present invention to provide a floor heating panel which can be made thinner as a whole.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a floor heating panel containing a pipe for flowing a heat medium through a groove of a base board, wherein the cross section of the floor heating panel is flat. A thin floor heating panel characterized by having a pipe housed in the groove so that the minor axis direction of the groove is the same as the depth direction of the groove.

As a specific cross-sectional shape of the pipe having a flat cross section, an elliptical shape, a rectangular shape, or a shape in which both ends of a rectangular shape are arc-shaped can be considered. The pipe is configured in this manner, and the pipe is housed in the groove so that the minor axis direction in the cross section is the same as the depth direction of the groove. As a result, the flow rate of the heat medium is not reduced, and the entire panel is not caused. Can be reduced in thickness.

[0011] There is basically no dimensional restriction in this kind of floor heating in the thickness direction but in the width direction.
If the piping is made as flat as possible, it is possible to construct a floor heating panel that is much thinner than before. This is an effect that cannot be expected from a conventional floor heating panel using a pipe having a circular cross section.

It is a preferred embodiment to provide connecting pipes having circular cross sections at both ends of the pipe. A tool or a tool used for connecting pipes is generally intended for pipes having a circular cross section, and therefore, it is practical to make both ends of the pipes circular. The connecting pipe may be formed by squeezing out of the pipe, or a separately prepared connecting pipe may be attached.

The meandering groove formed on the base board should be configured so that the number of straight lines in the meandering is even. In the case of an even number, both ends of the pipe are located on the same side, so that the connection of the pipe is easy when laying the panel, and the assembly of the entire floor heating system is simplified.

It is preferable that the base board is divided into a plurality of parts to disperse the thermal expansion force under a thermal load, thereby preventing the base board from being deformed. As a constituent material of the baseboard, a medium fiberboard (Medium Densit) formed by heating and adding an adhesive component to a fibrous material of wood is used.
It is preferable to use (y Fiberboard).

This medium fiber board is excellent in heat insulation, sound insulation, water resistance and strength. Therefore, when the base board is formed of this material, the thickness of the base board can be reduced. As a specific example of the medium fiber board, for example, a NEO board manufactured by N & E Corporation can be recommended.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a thin floor heating panel according to the present invention will be described. In FIG. 1, reference numeral 1 denotes a base board made of a medium fiber board,
Have six meandering grooves 3.

The base board 1 includes a plurality of divided bodies 1
, 1 ′,..., So that the thermal expansion force is dispersed.
Reference numeral 4 denotes an aluminum adhesive tape attached to the joint of the divided body 1 '.

Reference numeral 5 denotes a copper pipe accommodated in the groove 3 and having a flat cross section and accommodated over the entire length of the groove 3 such that the minor axis direction A in the cross section is the same as the depth direction of the groove 3. ing. Reference numeral 6 denotes a heat transfer plate which is attached to the base board 1 with the lower part in contact with the pipe 5 and the upper part is expanded. The reference numeral 7 denotes a heat sink attached to the upper surface of the base board 1 with an adhesive. 4 shows a back plate attached with an adhesive.

At both ends of the pipe 5, connecting pipes 9 and 10 having a circular cross section are attached, and when the floor heating panel 11 is laid, these are connected to each other at the windows 12 and 13. . In the floor heating panel 11 of the present embodiment, since the number of the linear portions 2 in the meandering shape of the groove 3 is an even number, the windows 12 and 13 are located on the same side. When connecting the floor heating panels 11 in the vertical direction, the connection of the connection pipes 9 and 10 is facilitated, and the assembly of the entire floor heating system is simplified.

According to the floor heating panel 11 of the present embodiment configured as described above, for example, by adopting the following configuration, the entire thickness t1 can be set to about 6 mm.・ Base board 1: 5.5mm thick ・ Piping 5: 0.45mm thick and 1 outside diameter
A 0.5 mm circular copper tube with a short diameter A of 4 mm and a long diameter B
Used a plate with a flat cross section of 12 mm. ・ Heat radiation plate 7, back plate 8: 0.3 mm thick (steel plate)

In the case of the configuration of the conventional floor heating panel shown in FIG. 2, since the pipe 5 has a thickness of 10.5 mm, the thickness t of the entire panel becomes 11 mm or more.
The thickness is almost twice that of the present embodiment. 6mm and 11mm
This is a remarkable difference, and on an actual floor surface, the difference will be greater than the numerical value.

[0022]

As described above, according to the thin floor heating panel of the present invention, the pipe having a flat cross section is formed so that the minor axis direction in the cross section is the same as the depth direction of the groove of the base board. In order to be accommodated in the groove
The thickness of the entire panel can be reduced. Therefore, when the floor heating is configured using the panel of the present invention, it is possible to minimize the level difference with the non-heating floor.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an embodiment of a thin floor heating panel according to the present invention, wherein (a) is a plan view and (b) is an enlarged sectional view of a main part.

FIG. 2 is an explanatory view showing a conventional floor heating panel;
(A) is a plan view, and (b) is a cross-sectional view of a main part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base board 2 Straight part 3 Groove part 4 Aluminum adhesive tape 5 Piping 6 Heat transfer plate 7 Heat sink 8 Back plate 9, 10 Connection pipe 11 Floor heating panel 12, 13 Window part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takashi Iida 507-2 Shinhocho, Tokai City, Aichi Prefecture Toho Gas Co., Ltd. Product Technology Development Department (72) Inventor Nobuo Suzuki 3550 Kida Yomachi, Tsuchiura City, Ibaraki Hitachi Electric wire F-term in Tsuchiura Works (reference) 3L070 BC11 BC15 BD11 BD15 DD02

Claims (5)

[Claims] 1. A floor heating panel accommodating a pipe through which a heat medium flows in a groove of a base board, wherein a cross section is configured to be flat, and a minor axis direction of the cross section is the same as a depth direction of the groove. A thin floor heating panel having a pipe housed in the groove. 2. The thin floor heating panel according to claim 1, wherein the pipe has connection pipes having circular cross sections at both ends. 3. The thin floor heating panel according to claim 1, wherein the groove is formed in a meandering shape with an even number of straight portions. 4. The thin floor heating panel according to claim 1, wherein the base board is constituted by a combination of a plurality of divided bodies. 5. The thin floor heating panel according to claim 1, wherein the baseboard is formed of a medium fiberboard formed by adding an adhesive component to a fibrous material of wood.