JP2001021868A - Manufacture of liquid crystal display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new method for manufacturing a wide viewing angle VA-LCD of which the divided domain structure with a high pretilt angle can be formed without rubbing. SOLUTION: A divided domain structure with a high pretilt angle is formed by forming a bump structure on at least one surface of a substrate of a liquid crystal display element, The bump structure 82 is formed (a) by forming a photosensitive material on the surface of the substrate, (b) by exposing the photosensitive material using a photomask 80 having an opening part with a specified shape, (c) by moving the photomask by a specified moving width in a direction parallel with the surface of the photosensitive material, (d) by repeating the steps (b) and (c) specified times so as to expose only the specified region 84 of the photosensitive material and (e) developing the photosensitive material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly to a method for manufacturing a liquid crystal display device having a wide viewing angle.

[0002]

2. Description of the Related Art In recent years, the technology of portable terminals (PDAs) and notebook type personal computers has been remarkably developed. A display element used for a portable device needs to be lightweight and low in power consumption. The thin film transistor liquid crystal display element (TFT-LCD) satisfies such demands and realizes high pixel density and image quality. In general, a TFT-LCD includes a lower substrate on which a thin film transistor (TFT) and a pixel electrode are formed, and an upper substrate on which a color filter is formed. The liquid crystal is sandwiched between the upper substrate and the lower substrate. Each pixel has a capacitance, and an additional capacitance is formed by a TFT serving as a switching element of the pixel. When a data voltage is applied to the TFT, the orientation of the liquid crystal changes, the optical characteristics change, and an image is displayed.

In general, color characteristics and viewing angles are important characteristics for a liquid crystal display device (LCD). In order to display a color on an LCD, a color filter (C
F) is used. Improving the viewing angle of LCDs has become a trend in LCD-related technology. However, when attempting to manufacture a large-screen LCD, the viewing angle and contrast of the LCD are not yet sufficient.

[0004] Regarding a vertical alignment LCD, for example, SID
1997 Digest (pp. 845-848, K. Ohmu
ro, S.R. Kataoka, T .; Sasaki, Y .; K
oike). There is a VA-LCD
(Vertical alignment LCD) describes an improvement with a region division structure and an optical compensator. This VA-LCD has a wide viewing angle exceeding 70 ° and a fast response speed (<25 m).
s), having a high contrast exceeding 300.

[0005]

However, the above VA-L
In the CD, it is necessary to use a mask in a rubbing step in order to form a region division structure,
There was a problem that the process was complicated and the cost was high. Further, the rubbing step causes ESD (electrostatic discharge) and dust generation. Further, the rubbing step using a mask
It also causes image burn-in.

On the other hand, a liquid crystal alignment control method without rubbing includes a linearly polarized ultraviolet method.
olet process (hereinafter referred to as LPUV method), and a region division structure can be formed by using this method.
However, this method has a problem that it is difficult to obtain a high pretilt angle.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a new manufacturing method of a wide viewing angle LCD which can form a region dividing structure having a high pretilt angle without rubbing. With the goal.

It is another object of the present invention to provide a new method for forming a bump structure for forming such a region division structure.

[0009]

In order to achieve the above object, a method of manufacturing an LCD according to the present invention comprises preparing a pair of polarizing elements, forming a compensator on one of the polarizing elements, and forming a pair of polarizing elements. Forming a transparent insulating substrate on each of the polarizers, forming a bump structure on at least one surface of the transparent insulating substrate, forming an alignment film covering the bump structure and the surface of the transparent insulating substrate, The liquid crystal is interposed between the transparent insulating substrates. The liquid crystal molecules on the bump structure have a large pretilt angle and fall in a predetermined direction for each region divided by the bump structure.

The bump structure can be formed as follows. (A) forming a photosensitive material on the surface of a transparent insulating substrate; (b) exposing the photosensitive material using a photomask having an opening having a predetermined shape; and (c) exposing the photomask to the photosensitive material. (D) The above steps (b) and (c) are repeated a predetermined number of times in a direction parallel to the surface of the photosensitive material, and (e) the photosensitive material is developed.

After a predetermined number of exposures, the exposed areas of the photoresist have, for example, a triangular cross-sectional shape. Therefore, a bump structure is formed by developing this photoresist.

Further, the bump structure can be formed as follows. (A) exposing the photosensitive material using the photomask while moving the photomask having an opening of a predetermined shape at a predetermined speed in a direction parallel to the surface of the photosensitive material; Develop the photosensitive material.

Further, the bump structure can be formed as follows. Forming a first photoresist on a substrate, exposing the first photoresist using a first photomask having a first trapezoidal opening,
Developing a second photoresist on the first photoresist, and forming the second photoresist on the first photoresist having a second trapezoidal opening smaller than the first trapezoidal opening. Exposure using the photomask of No. 2,
The second photoresist is developed.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. Embodiment 1 The present invention provides a method of manufacturing an LCD having a wide viewing angle, and more specifically, a method of manufacturing a two-region chiral homeotropic LCD having a negative compensator. Details of such an LCD are disclosed in U.S. patent application Ser. No. 09 / 009,184 filed on Jul. 20, 1998 entitled "Wide Viewing Angle Liquid Crystal Display Device", the contents of which are incorporated herein by reference. To quote. In the manufacturing method of the present invention, a bump structure is employed to increase the viewing angle of the LCD.

FIG. 1 is a schematic diagram showing a two-region chiral homeotropic LCD with a negative optical compensator. This LCD is provided with a pair of polarizing elements including a polarizer 100 and an analyzer 102. Polarizer 100 and analyzer 1
02 are arranged such that their optical axes are orthogonal to each other.
That is, if there is nothing between the polarizer and the analyzer, the polarizer 10
Light passing through zero is blocked by the analyzer 102, and light passing through the analyzer 102 is blocked by the polarizer 100. Upper transparent insulating substrate 104 (for example, a glass substrate)
Are provided below the polarizer 100. Further, a negative optical compensator 106 is provided on the analyzer 102. The negative optical compensator 106 is used to suppress light leakage depending on the viewing angle. Lower substrate 108
Is made of a transparent insulating material such as glass similarly to the upper substrate 104. Transparent conductive wires (not shown) made of indium tin oxide (ITO) are provided on the lower surface of the upper substrate 104 and the upper surface of the lower substrate 108 so as to be orthogonal to each other. A bump structure 110 is formed on at least one surface of the upper substrate 104 or the lower substrate 108. In FIG. 1, the bump structure 110 is connected to the lower substrate 10.
8. The detailed structure of the bump structure 110 will be described later.

An alignment film 112 is formed over the upper substrate 104 and the surface of the bump structure 110. In general,
The alignment film plays a role in determining the alignment of the liquid crystal molecules. The alignment film 112 is processed by the LPUV method. However, this method is a well-known method and is not a feature of the present invention. The liquid crystal material 114 is sealed between the upper substrate 104 and the lower substrate 108. Liquid crystal material 114
Preferably comprises a chiral homeotropic liquid crystal.
A vertically aligned LCD cell is constituted by the chiral homeotropic liquid crystal molecules and the substrate.

The liquid crystal molecules 114 have a chiral nematic alignment, and have two regions 12 and 1 in one pixel.
6 and an overlap area 1 between the areas 12 and 16
4 The tilt direction (azimuth direction) of the liquid crystal molecules in the overlapping region 14 is not 90 ° with respect to the tilt direction of the liquid crystal molecules in the region 12 or 16 but has a certain angle φ (in some cases, 90 ° or more, ° or less.)

In a state where a voltage is applied (ON state), since the liquid crystal molecules have a chiral nematic alignment, the color dispersion is small. Further, the LCD obtained by the present invention has a feature that the viewing angle of gray gradation is wide. FIG. 2 shows a two-region VA-L having a negative optical compensator.
FIG. 3 is a top view showing a part of a CD. The angle 間 の between the direction of the projection of the liquid crystal molecules in the region 12 onto the substrate and the direction of the projection of the liquid crystal molecules in the region 16 on the substrate is not 180 ° (in some cases, 180 ° or more, 180 °). ° or less).

In a state where no voltage is applied (OFF state), in this embodiment, the liquid crystal molecules in each region have a pretilt angle almost perpendicular to the surface of the substrate, that is, a slight pretilt angle with respect to the normal line. And oriented. Area 12
The angle between the direction of the projection of the liquid crystal molecules of the region 16 onto the substrate and the direction of the projection of the liquid crystal molecules of the region 16 on the substrate is 18
It is not 0 °.

In the VA-LCD, two regions 12,
The pretilt angle that the liquid crystal molecules of the liquid crystal molecules 16 and the overlap region 14 have before the ON state greatly affects the response speed of the VA-LCD. In the present invention, by forming the bump structure 110, the response characteristics of the two-region VA-LCD are improved. FIG. 3 is a side view of the bump structure 110. FIG. FIG. 4 is a schematic perspective view showing the three-dimensional structure of the bump structure 110. The bump structure 110 can be formed by a positive or negative resist. By making the upper surface of the bump structure 110 have an appropriate inclination, the bump structure 1
Preferably, the liquid crystal molecules on 10 have a large pretilt angle. For example, if the bump structure 110 is 2
It is formed by two side surfaces 18 and 20 and two inclined surfaces 22. Here, the two side surfaces 18 and 20 are formed in a triangle. Also preferably, the height H of the two side faces 18, 20
1. The angle H2 is changed from the side 18 to the side 2
Have a slope towards zero. Two slopes 2
2 is connected to the side surfaces 18, 20 at its ends. The slope (angle α) of the inclined surface 22 is preferably about 0.5 to 3 ° with respect to the substrate.

FIGS. 5, 6, 7 and 8 are cross-sectional views each showing another embodiment of the present invention. In each figure,
FIG. 1A shows a cross-sectional view in the horizontal direction of the liquid crystal display element, and FIG. The bump structure 110 may be formed on the surface of one substrate, or may be formed on the surface of both substrates. As shown in the figure, the liquid crystal molecules formed on the bump structure 110 have a large pretilt angle, and the falling direction is determined. Further, a larger pretilt angle can be obtained by the bump structure 110. Note that the bump structure 110 may be formed separately.

Embodiment 2 A reflector of a liquid crystal display device can be formed by forming a metal film on the surface of the bump structure according to the present invention. FIG. 9A shows an example. By forming a metal film 86 on the bump structure 82 formed by the method of the present invention, a reflector of a liquid crystal display element is formed. The metal film 86 is preferably formed of aluminum. The bump structure 82 is preferably formed by two (or plural) inclined surfaces m1 and m2 having different inclination angles. The inclined surfaces m1 and m2 can be formed, for example, by a method of controlling a moving speed of a photomask described later. The incident light and the reflected light travel in the direction of the arrow shown in FIG. As a material for forming the bump structure, a photosensitive material, for example, a negative resist or a positive resist can be used.

Embodiment 3 Next, a method for forming a bump structure will be described. Conventionally, a method of forming a structure similar to a bump structure by performing ordinary exposure using a photomask has been disclosed, but a structure having an inclined surface cannot be obtained by such a method. For example, FIG. 10 shows a photomask pattern disclosed by FUJITU. FIG. 11 is a cross-sectional view of the photoresist 130 taken along the line AA ′ after exposure by a normal method using such a photomask. As shown in FIG. 11, the formed structure has a rectangular cross section and does not have the two inclined surfaces which are a feature of the present invention. On the other hand, according to the method of the present invention, since the exposure is performed by moving the photomask, a structure having two inclined surfaces having a triangular cross section as shown in FIG. 12 can be formed.

FIGS. 13 (a) and 13 (b) are cross-sectional views of a photosensitive material, in which one photomask 80 is moved in the direction of the arrow to form the bump structure of the present invention. Is shown. While sequentially increasing or decreasing the exposure energy, the photomask 80 is moved each time the exposure is performed. As a result, only the region 84 indicated by hatching in the figure is exposed, and the unexposed region 82 forms a bump structure. By controlling the exposure energy to sequentially increase or decrease, a bump structure having two inclined surfaces can be formed as shown in FIG.
As shown in (b), a bump structure having one inclined surface can be formed. In this embodiment, the opening shape of the photomask 80 is rectangular, but may be a trapezoidal opening as shown in FIG. By using a trapezoidal opening, a bump structure having a different cross-sectional shape depending on the position of the cross-section can be obtained.

Further, in the direction perpendicular to the cross section shown in FIG.
By giving a gradient of the exposure intensity, the inclined surface of the bump structure can have a gradient as shown in FIG.

The exposure procedure is as follows. FIG. 13 (a)
First, the photomask 80 is
After exposure, the photomask 80 is moved to the right by a predetermined width and exposed again. By repeating this exposure and movement, the entire surface of the photoresist 84 is exposed. It is preferable that the one-time movement width of the photomask 80 is smaller than the opening width of the photomask 80. The exposure energy is maximized at the left end of the photoresist 84, and is gradually reduced every time the photomask 80 moves. After a predetermined number of movements, the exposure energy is sequentially increased each time the photomask 80 moves. In the photoresist thus exposed, only the hatched portions 84 in the drawing are exposed, and the remaining portions 82 are left unexposed. Therefore, the structure shown in FIG. 14A is obtained by developing the exposed photoresist. The inclined surface of the bump structure thus obtained gives a large pretilt angle to the liquid crystal molecules. The same result can be obtained by sequentially changing the exposure time instead of the exposure energy.

Here, the method of forming the bump structure according to the present invention will be summarized as follows. (A) exposing a photosensitive material using a photomask having an opening having a predetermined shape;
(C) the exposure energy for exposing the photosensitive material is sequentially reduced (or increased) every time the photomask is moved, in a direction parallel to the surface of the photosensitive material by the same width as the opening. And (d) developing the photosensitive material by repeating the steps (a) and (b) a predetermined number of times.

After the above step (c), the following step may be further added. (E) moving the photomask in a direction parallel to the surface of the photosensitive material by approximately the same width as the opening;
(C) increasing (or decreasing) the exposure energy for exposing the photosensitive material sequentially for each movement of the photomask;
(F) The steps (a) and (b) are repeated a predetermined number of times.

Further, instead of the above method, the bump structure may be formed by the following method. (A) exposing a photosensitive material using a photomask having an opening having a predetermined shape;
(C) the exposure time for exposing the photosensitive material is reduced (or increased) sequentially with each movement of the photomask, by moving the photosensitive material in a direction parallel to the surface of the photosensitive material by approximately the same width as the opening. The above steps (a) and (b)
Is repeated a predetermined number of times, and (d) the above-mentioned photosensitive material is developed.

After the above step (c), the following step may be further added. (E) moving the photomask in a direction parallel to the surface of the photosensitive material by approximately the same width as the opening;
(C) increasing (or decreasing) the exposure time for exposing the photosensitive material for each movement of the photomask;
The above steps (a) and (b) are repeated a predetermined number of times.

In these methods, a bump structure is formed by performing a plurality of exposures using one photomask. This photomask has a plurality of openings having the same width. An important aspect of this method is that the photomask is moved after each exposure in a direction parallel to the surface of the photosensitive material (eg, photoresist).
The moving direction is indicated by an arrow in FIG. The exposed portion of the photoresist has a substantially triangular cross section after going through the plurality of steps.

The mechanism for forming a substantially triangular cross section will be described in detail below. For example, a case where exposure is performed five times will be described. However, the number of exposures is not limited to five. FIGS. 15 to 19 schematically show how the photoresist 130 is exposed through the above-described steps for each exposure step. Exposure is performed using the photomask 120. The photomask 120 has a plurality of openings 121. The photoresist 130 may be a positive type or a negative type. For example, polyimide, polyamide, or the like can be used. When a negative resist is used, an inverted structure of a positive resist can be obtained. Here, a positive resist is used.

First, as shown in FIG. 15, a first exposure is performed using a photomask 120. Exposure is terminated _one second after t. In FIG. 15, the exposed area of the photoresist 130 is schematically shown by surrounding it with a boundary line.
Next, as shown in FIG. 16, the photomask 120 is moved by a predetermined movement width in the direction indicated by the arrow A1, and the second exposure is performed through the photomask 120. The second exposure ends after t ₂ seconds from the start of the process. Since the movement of the photomask is performed in a short time, the second exposure time is about (t ₂ −t ₁ ) seconds. In FIG. 16, a region of the photoresist 130 exposed by the second exposure is indicated by oblique lines. Similarly, the third exposure (FIG. 17), the fourth exposure (FIG. 18), and the fifth exposure (FIG. 1)
Perform 9). The third, fourth and fifth exposures are performed t
It ends after ₃ , t ₄ and t ₅ seconds, and each exposure time is (t _3-
t ₂ ), (t ₄ -t ₃ ), and (t ₅ -t ₄ ) seconds. FIG.
7, 18, and 19, the exposed areas of the photoresist 130 are indicated by oblique lines. The final exposure area is as shown in FIG. The depth d _e of the exposed areas can be expressed by the following equation. _{d e (x i) = (} d / 5) x i where, d is the thickness of the photoresist, xi is the total amount of movement of the photomask 120 after exposure of i-th.
The bump structure shown in FIG. 20 can be obtained by developing the photoresist 130 shown in FIG. FIG.
For example, the width of the opening 121 of the photomask 120 is set to W / 2, the interval between the openings 121 is set to W / 2, and the total photomask movement amount (Δx) for five times is also W. / 2. That is, the moving amount of each time is W
/ 10. The width of the bump structure formed under this condition is W.

FIGS. 21 and 22 show another shape of bump structure formed by changing the amount of movement of the photomask. In the case of FIG. 21, Δx <W / 2, and in the case of FIG. 22, Δx> W / 2.

Embodiment 4 Also, instead of moving the photomask for each exposure,
The bump structure can also be formed by a method of exposing while moving the photomask. FIG. 23 is a sectional view schematically showing such a method. The shape of the photomask 120 is the same as in the above embodiment. However, in the present embodiment, the photomask 120 is moved at a constant speed (V) in the direction indicated by the arrow in the figure. The moving direction is a direction perpendicular to the normal line of the photoresist surface as in the above embodiment. Set the moving speed of the photomask to V
By setting = (W / 2) / t, only the hatched portions in FIG. 23 are exposed, and a bump structure can be obtained. By appropriately setting the moving speed of the photomask, the bump structure shown in FIGS. 19, 20 and 21 can be obtained.

Embodiment 5 By using two or more masks, a bump structure can be formed without moving a photomask. For example, two masks 142 and 144 shown in FIGS. 24A and 24B are used. The photomask 144
Having a trapezoidal shape similar or similar to the photomask 142,
The dimensions are smaller than the photomask 142. In this embodiment mode, a positive resist is used. FIG.
FIGS. 5A to 5D are process cross-sectional views showing a process of forming a bump structure using the two photomasks 142 and 144 shown in FIG. FIGS. 26A to 26D show top views of the substrate in the respective steps of FIGS. 25A to 25D. Incidentally, in FIG.
6 is omitted. First, as shown in FIG.
The photoresist 143 applied and prebaked on the glass substrate 140 is exposed using a photomask 142. Next, as shown in FIG. 25B, the photoresist 143 is developed into a trapezoidal shape, and after temporary baking is performed, main baking (hard baking) is performed. Next, as shown in FIG. 25C, a photoresist 143 is applied, baked, and exposed using a photomask 144. Next, as shown in FIG. 25D, the photoresist 145 is developed into a trapezoidal shape smaller than the photoresist 143, and an overcoat agent 146 is applied to complete the bump structure. In this embodiment, an example using a positive resist has been described, but a negative resist may be used.

In the above embodiment, for simplicity, the case where a bump structure of one pixel or several pixels is formed by using the present invention has been described as an example. However, when the present invention is actually applied, The openings and the like of the mask used in the method of the present invention may have a repeating structure corresponding to the number of pixels of the liquid crystal display element.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a top view showing a bump structure of the liquid crystal display element shown in FIG.

FIG. 3 is a side view showing a bump structure of the liquid crystal display element shown in FIG.

FIG. 4 is a perspective view schematically showing an example of a bump structure.

5 (a) and 5 (b) are a horizontal sectional view and a vertical sectional view showing another example of the liquid crystal display element according to the manufacturing method of the present invention.

6 (a) and 6 (b) are a horizontal sectional view and a vertical sectional view showing another example of the liquid crystal display element according to the manufacturing method of the present invention.

FIGS. 7A and 7B are a horizontal sectional view and a vertical sectional view showing another example of the liquid crystal display element according to the manufacturing method of the present invention.

FIGS. 8A and 8B are a horizontal sectional view and a vertical sectional view showing another example of the liquid crystal display element according to the manufacturing method of the present invention.

FIGS. 9A and 9B show a reflector for a liquid crystal display element according to a second embodiment of the present invention, wherein FIG. 9A is a cross-sectional view and FIG.
FIG. 4 is a schematic diagram showing a light reflection state.

FIG. 10 is a schematic view showing an opening shape in an example of a conventional photomask.

FIG. 11 shows a bump structure obtained by a conventional method using the photomask shown in FIG. 10;
FIG. 4 is a schematic sectional view showing an AA ′ section of FIG.

FIG. 12 shows a bump structure obtained by the method of the present invention using the photomask shown in FIG.
0 is a schematic sectional view showing an AA ′ section of FIG.

FIGS. 13A and 13B show Embodiment 3; FIGS.
FIG. 4 is a schematic view showing a state in which a bump structure is formed by the method according to (1).

14 (a) and (b) show FIG. 13 (a).
It is a schematic sectional drawing which shows the bump structure obtained from (b).

FIG. 15 is a schematic cross-sectional view showing an intermediate step in a method for manufacturing a bump structure according to the third embodiment.

FIG. 16 is a schematic cross-sectional view showing an intermediate step following FIG. 15 of the method for manufacturing a bump structure according to the third embodiment.

FIG. 17 is a schematic cross-sectional view showing an intermediate step following FIG. 16 in the method of manufacturing the bump structure according to the third embodiment.

FIG. 18 is a schematic cross-sectional view showing an intermediate step following that of FIG. 17 in the bump structure manufacturing method according to the third embodiment.

FIG. 19 is a schematic cross-sectional view showing a step following the step shown in FIG. 18 of the method for manufacturing a bump structure according to the third embodiment;

FIG. 20 is a cross-sectional view illustrating an example of a bump structure according to the manufacturing method of the present invention.

FIG. 21 is a sectional view showing another example of the bump structure according to the manufacturing method of the present invention.

FIG. 22 is a cross-sectional view showing another example of the bump structure according to the manufacturing method of the present invention.

FIG. 23 is a schematic sectional view showing the method for manufacturing the bump structure according to the fourth embodiment.

FIGS. 24A and 24B show a fifth embodiment.
FIG. 3 is a schematic view showing a photomask used in the method for manufacturing a bump structure according to the embodiment.

FIGS. 25 (a) to 25 (d) show a fifth embodiment.
FIG. 4 is a process cross-sectional view illustrating a method for manufacturing a bump structure according to (1).

FIGS. 26 (a) to 26 (d) show FIGS.
It is a top view of the board | substrate in each process of (d).

[Explanation of symbols]

80, 120, 142 and 144 photomask, 8
4, 130, 143 and 145 photoresist, 86
Metal film, 100 polarizer, 102 analyzer, 104
Upper transparent insulating substrate, 106 Compensator, 108 Lower transparent insulating substrate, 110 bump structure, 112 alignment film, 11
4 Liquid crystal molecules, 121 openings, 140 glass substrates.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) G02F 1/1337 G02F 1/1337 J Eye Road, Rain 16, Number 32 F-term (Reference) 2H089 NA13 NA56 QA12 QA16 2H090 HC10 HC12 JB01 LA04 LA09 LA15 MA02 MA10 MB14 2H091 FA07X FA07Z FA50X FA50Z FC23 FC25 GA01 LA19 LA30

Claims (22)

[Claims] (A) exposing a photosensitive material using a photomask having an opening having a predetermined shape; and (b) moving the photomask in a direction parallel to a surface of the photosensitive material. A method of forming a bump structure by moving the substrate by a width, repeating (c) the steps (a) and (b) a predetermined number of times, and (d) developing the photosensitive material. 2. The method according to claim 1, wherein the movement width is substantially equal to the width of the opening. 3. The method according to claim 1, wherein the movement width is smaller than the width of the opening. 4. The method according to claim 1, wherein the moving width is larger than the width of the opening. 5. A pair of polarizing elements is prepared, a compensator is formed on one of the polarizing elements, a transparent insulating substrate is formed on each of the pair of polarizers, and at least one of the transparent insulating substrates is formed. (A) forming a photosensitive material on the surface, (b) exposing the photosensitive material using a photomask having openings of a predetermined shape, and (c)
(D) moving the photomask in a direction parallel to the surface of the photosensitive material by a predetermined moving width;
And step (c) are repeated a predetermined number of times; (e) developing the photosensitive material to form a bump structure; forming an alignment film covering the bump structure and the surface of the transparent insulating substrate; A method for manufacturing a liquid crystal display device in which a liquid crystal is sandwiched between transparent insulating substrates. 6. The method for manufacturing a liquid crystal display element according to claim 5, wherein said movement width is substantially equal to the width of said opening. 7. The method according to claim 5, wherein the movement width is smaller than the width of the opening. 8. The method according to claim 5, wherein the moving width is wider than the width of the opening. 9. (a) exposing the photosensitive material using the photomask while moving the photomask having an opening of a predetermined shape at a predetermined speed in a direction parallel to the surface of the photosensitive material; And (b) a method for forming a bump structure formed by developing the photosensitive material. 10. A pair of polarizing elements is prepared, a compensator is formed on one of the polarizing elements, a transparent insulating substrate is formed on each of the pair of polarizers, and at least one of the transparent insulating substrates is formed. While (a) forming a photosensitive material on the surface, and (b) moving a photomask having an opening of a predetermined shape at a predetermined speed in a direction parallel to the surface of the photosensitive material, the photomask is used. (C) developing the photosensitive material to form a bump structure; forming an alignment film covering the bump structure and the surface of the transparent insulating substrate; A method for manufacturing a liquid crystal display device in which liquid crystal is sandwiched between insulating substrates. 11. A method comprising: (a) exposing a photosensitive material using a photomask having an opening having a predetermined shape; and (b) placing the photomask in a direction parallel to a surface of the photosensitive material.
(C) repeating the steps (a) and (b) a predetermined number of times while gradually decreasing the exposure energy for exposing the photosensitive material with each repetition; Method of forming bump structure formed by developing photosensitive material 12. After the step (c), (e)
Moving the photomask in a direction parallel to the surface of the photosensitive material by substantially the same width as the opening; (f) exposing the photosensitive material using the photomask;
(G) Step (e) and step (f) while gradually increasing the exposure energy for exposing the photosensitive material for each repetition.
12. The method for forming a bump structure according to claim 11, further comprising the step of repeating a predetermined number of times. (A) exposing a photosensitive material using a photomask having an opening having a predetermined shape; and (b) exposing the photomask in a direction parallel to a surface of the photosensitive material.
(C) repeating the steps (a) and (b) a predetermined number of times while gradually increasing the exposure energy for exposing the photosensitive material with each repetition; Method of forming bump structure formed by developing photosensitive material 14. After the step (c), (e)
Moving the photomask in a direction parallel to the surface of the photosensitive material by substantially the same width as the opening; (f) exposing the photosensitive material using the photomask;
(G) Step (e) and step (f) while gradually reducing the exposure energy for exposing the photosensitive material for each repetition.
14. A method for forming a bump structure according to claim 13, further comprising the step of repeating a predetermined number of times. (A) exposing a photosensitive material using a photomask having an opening having a predetermined shape; and (b) disposing the photomask in a direction parallel to a surface of the photosensitive material.
(C) repeating the steps (a) and (b) a predetermined number of times while gradually decreasing the exposure time for exposing the photosensitive material with each repetition;
(D) A method of forming a bump structure formed by developing the photosensitive material 16. After the step (c), (e)
Moving the photomask in a direction parallel to the surface of the photosensitive material by substantially the same width as the opening; (f) exposing the photosensitive material using the photomask;
(G) a step of repeating the step (e) and the step (f) a predetermined number of times while gradually increasing the exposure time for exposing the photosensitive material for each repetition.
A method for forming the bump structure according to the above. 17. A method comprising: (a) exposing a photosensitive material using a photomask having an opening having a predetermined shape; and (b) disposing the photomask in a direction parallel to a surface of the photosensitive material.
(C) repeating step (a) and step (b) a predetermined number of times while gradually increasing the exposure time for exposing the photosensitive material with each repetition by moving the opening by substantially the same width as the opening;
(D) A method of forming a bump structure formed by developing the photosensitive material 18. After the step (c), (e)
Moving the photomask in a direction parallel to the surface of the photosensitive material by substantially the same width as the opening; (f) exposing the photosensitive material using the photomask;
18. The method according to claim 17, further comprising the step of: repeating step (e) and step (f) a predetermined number of times while gradually reducing an exposure time for exposing the photosensitive material for each repetition.
A method for forming the bump structure according to the above. 19. A method of forming a photosensitive material on a substrate surface, exposing the photosensitive material while moving a photomask in parallel with the surface of the photosensitive material, and developing the photosensitive material, so that different angles are obtained. A method of manufacturing a reflector for a liquid crystal display element, comprising: forming a bump structure having a plurality of inclined surfaces that are inclined at a predetermined angle, and forming a metal film on the surface of the bump structure. 20. The method according to claim 19, wherein the metal film is aluminum. 21. A step of forming a first photoresist on a substrate; a step of exposing the first photoresist by using a first photomask having a first trapezoidal opening; Developing a photoresist; forming a second photoresist on the first photoresist; and disposing the second photoresist in a second trapezoidal opening smaller than the first trapezoidal opening. A method for forming a bump structure, comprising: exposing using a second photomask having: and developing the second photoresist. 22. The first photoresist and the second photoresist.
24. The method according to claim 23, further comprising forming an overcoat layer on the photoresist.