JP2001007239A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method by which a work of dicing into individual semiconductor devices can be made easy. SOLUTION: There are provided an electrically insulating flexible film 1, a plurality of semiconductor chips 2 and a support frame 3. The support frame 3 is a plate-like body, has an aperture 5 and is bonded on the electrically insulating flexible film 1 having interconnections. The semiconductor chips 2 are bonded on the electrically insulating flexible film 1 inside the aperture 5 of the support frame 3. Two or more slits 6, 6 patterned after the shape of the semiconductor chip 2 are formed in a laminate of the electrically insulating film 1 and the support frame 3. A connecting portion 8 between the slits 6, 6 is cut so that individual semiconductor devices 4 are separated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to a semiconductor device having a package structure of a type in which a semiconductor chip is attached to an electrically insulating flexible film and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the trend toward higher performance and lighter, thinner and smaller electronic devices, semiconductor devices have been increasingly integrated and functionalized. A BGA (Ball Gr), which is a surface mount type package in which solder balls are replaced with external terminals of the package,
A semiconductor device called an “id Array” has come to be used.

Further, in order to realize a more compact and higher-density semiconductor device, a semiconductor device having a laminated structure of a semiconductor chip having connection pads on its surface and a film carrier has been proposed as a small BGA. Have been.

In a film carrier used in this semiconductor device, a wiring layer is formed on the front surface, and conductive protrusions are formed on the back surface. The wiring layer and the protrusions are connected to electrodes through through holes in the film. And a part of the wiring layer of the film carrier is connected to a pad of the semiconductor chip.

In general, a package of a semiconductor device of this kind has substantially the same size as a semiconductor chip to be mounted, and the semiconductor device is configured by attaching the semiconductor package to the semiconductor chip. is there.

FIG. 3 shows an example of the structure of a semiconductor device having a BGA structure. The semiconductor device shown in FIG.
2 is bonded to the electrically insulating flexible film 11,
The semiconductor chip 12 is sealed with a mold resin 19 except for a surface adhered to the electrically insulating flexible film 11.

[0007] The electrically insulating flexible film 11
Attached to the semiconductor chip 12 using an adhesive 20,
The surface of the semiconductor chip 12 is covered with an electrically insulating flexible film 11 made of polyimide or the like except for the electrode pad portion.

[0010] Wiring is provided on the electrically insulating flexible film 11, and although not shown, the wiring is provided with conductive protrusions electrically connected to the electrode pads of the semiconductor chip 12.

The electrically insulating flexible film 1
The wiring on 1 is protected by a cover coat.

When the plurality of semiconductor devices 14 connected to the electrically insulating flexible film 11 are separated from each other, a metal mold corresponding to the package size is used, and the electrically insulating flexible film 11 follows the outer shape of the semiconductor device 14. This is performed by cutting at the cutting point 18.

The above-mentioned semiconductor device is manufactured in units of an electrically insulating flexible film in the manufacturing process, and transportation, supply and storage between the processes are performed using a carrier or the like.

[0012]

Incidentally, it is expected that the size of a semiconductor device having a semiconductor package will increase in the future in the same manner as a semiconductor chip. In order to cope with such an increase in the number of types of semiconductor devices, a dedicated external shape cutting die is required for each package size.

The molding resin 19 for sealing the semiconductor chip 12 may cause burrs during molding, and the individual semiconductor devices 14 are separated from the electrically insulating flexible film 11 by a mold along the outer shape of the semiconductor chip. When cutting is performed including burrs, there is a problem that the blade of the mold is damaged.

Further, since the material of the electrically insulating flexible film is polyimide or the like, the insulating film bends and cannot be held in a fixed form.
It is difficult to carry out the handling work of transporting and receiving the plate mechanically, so that manual work or use of a carrier or the like has been forced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device and a method of manufacturing the same, which facilitate the work of cutting into individual semiconductor devices and the handling work before cutting.

[0016]

According to a first aspect of the present invention, there is provided a semiconductor device having an electrically insulating flexible film, a plurality of semiconductor chips, and a support frame. The flexible flexible film has wiring to be connected to the semiconductor chip, the support frame is a plate-like body, and has an opening on the plate surface in the shape of each semiconductor chip. The semiconductor chip is housed in the opening of the support frame, and is adhered to the electrically insulating flexible film in the opening, and the electrically insulating flexible film and the support frame have the shape of the semiconductor chip. To form a slit that is divided into two or more with a connecting part. DOO is by cutting the connecting portion between adjacent slits cut to separate the individual semiconductor devices.

The individual semiconductor chips are resin-sealed and fitted and held in respective frame molds. The frame mold is provided at an opening edge of the support frame. The semiconductor chip including the frame is separated from the electrically insulating flexible film and the support frame.

Further, the support frame has a self-retaining property, and mechanically reinforces the electrically insulating flexible film to maintain a predetermined shape.

Further, in the method of manufacturing a semiconductor device according to the present invention, there is provided a method of manufacturing a semiconductor device having a support frame attaching process and a semiconductor chip mounting process.
The support frame attaching process is a process of attaching a support frame to one surface of an electrically insulating flexible film, and the support frame is a plate-shaped body having a self-retaining property, and a plurality of openings for receiving a semiconductor chip are provided on the plate surface. The support frame and the electrically insulative flexible film are provided with a cut-off slit that is partially connected to the periphery of the support frame in the shape of the opening of the support frame, and is used for mounting the semiconductor chip. Is a process of bonding an electrically insulating flexible film to a semiconductor chip held in a mold through an opening in a support frame.Each semiconductor device cuts a connecting portion between slits to form an electrically insulating flexible film. It is separated from the stack with the support frame.

The support frame having a plurality of openings according to the present invention can be manufactured by etching or processing using a metal mold. By using a support frame having a plurality of openings, the equipment can be automated. In addition, productivity can be improved and mass productivity can be improved.

Also, an electrically insulative flexible film can be manufactured by cutting, and the support frame having a plurality of openings and the electrically insulative flexible film are commonly provided with slits that model a semiconductor device. No die for each package size is required for external cutting like this, and the external part of the semiconductor device can be cut by cutting the connecting part between adjacent slits with a cutting tool or laser processing. It has a high degree of freedom and is also excellent in mass productivity in this respect.

[0022]

Embodiments of a semiconductor device and a method of manufacturing the same according to the present invention will be described below with reference to the drawings. In FIG. 1, a semiconductor device according to the present invention comprises a combination of an electrically insulating flexible film 1, a plurality of semiconductor chips 2, and a support frame 3, and is later separated into individual semiconductor devices 4.

A semiconductor device according to the present invention can be obtained by sequentially performing a support frame attaching process and a semiconductor chip mounting process. The support frame attaching process is a process of attaching the support frame 3 to one surface of the electrically insulating flexible film 1.

The support frame 3 has a plurality of openings 5 for receiving the semiconductor chip 2 vertically and horizontally, and the support frame 3 and the electrically insulating flexible film 1 are laminated.
In the periphery of the opening shape of the support frame 3, a partly connected separation slit 6 is commonly provided.

In the mounting process of the semiconductor chip, the semiconductor chip 2 held in the mold
This is a process of adhering to one surface of the electrically insulating flexible film 1 through the inside. The mold 7 is provided at an opening edge of the support frame 3.

The individual semiconductor devices 4 connected to the electrically insulating flexible film 1 are separated from the adjacent slits 6, 6.
It can be obtained by cutting the connecting portion 8 between them and separating from the laminate of the electrically insulating flexible film 1 and the support frame 3.

FIG. 1C shows an example in which the mold 7 is attached to the opening 5 of the support frame 3. The mold 7 is formed integrally with the opening 5 of the support frame 3 in advance. You may. That is, the mold 7 may be formed on a part of the support frame 3 so as to protrude from the opening edge of the opening 5, and the resin-sealed semiconductor chip 2 may be fitted and held in the mold 7.

The material of the electrically insulating flexible film 1 is a material having flexibility such as polyimide and has wiring to be connected to the semiconductor chip 2. The support frame 3 is made of a plate-like body having a self-retaining property, for example, a copper plate, and the opening 5 is made by, for example, etching the copper plate.

The semiconductor chip 2 is sealed in a mold resin 9 except for a surface to be bonded to the electrically insulating flexible film 1, and is fitted in the frame mold 7. Frame type 7
Is accommodated in the opening 5 of the support frame 3, and one surface of the support frame 3 and the
The surface of the semiconductor chip 2 held in the opening 5 is adhered to the electrically insulating flexible film 1 in the opening 5.

The slit 6 is a cut formed commonly in the lamination of the electrically insulating flexible film 1 and the support frame 3. In the embodiment shown in FIG.
The outer shape of the semiconductor chip 2 has a quadrangular shape. In this embodiment, the slits 6 are respectively provided in parallel with the respective sides along the respective sides of the quadrangle, and the adjacent slits 6 are mutually separated at the corners of the quadrangle. It has been separated.

Therefore, each slit 6 becomes a connecting portion 8 between the adjacent slits at each corner of the quadrangle, and the four connecting portions 8 are laser-processed or simply cut with a cutting tool to obtain an electrically insulating flexible portion. The semiconductor device 4 is separated from the stack of the film 1 and the support frame 3 into individual semiconductor devices 4.

The connecting portion 8 between the two adjacent slits 6, 6 is not limited to the case where it is formed at four corners of a quadrangular shape representing the shape of a semiconductor chip. In the example of FIG. 2, a pair of slits 6, 6 enclosing the shape of the semiconductor chip are cut off at the center of one side of the quadrangle, that is, a pair of slits 6, 6 having the center of one side as a connecting portion 8 are formed. It is an example. In this example, the semiconductor device 4 can be separated into individual semiconductor devices 4 by separating the two connecting portions 8.

[0033]

As described above, according to the semiconductor device and the manufacturing method of the present invention, the electrically insulating flexible film and the support frame are formed with two or more common parts which are formed in common with the outer shape of the semiconductor chip. Can be separated into individual semiconductor devices simply by cutting the connecting portions of the slits, and there is no need to use a dedicated cutting bracket for each package size as in the past for separating the semiconductor device.
The semiconductor device can be easily separated using a cutting tool having a simple structure.

Further, according to the present invention, a semiconductor chip comprises:
Since it is fitted and held in the mold, the burrs of the sealing resin do not protrude to the periphery, and the cutting tool is not damaged when cutting into individual semiconductor devices.

Further, since the electrically insulating flexible film is reinforced by the support frame having a self-retaining property, it does not bend and can be kept in a fixed form, and can be transported and other handling can be performed mechanically. Having.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, in which (a)
FIG. 3B is a partial cross-sectional plan view of the semiconductor device, FIG.
(C) is an exploded perspective view of a main part.

FIG. 2 shows another embodiment of the present invention, in which (a)
FIG. 2 is a partial cross-sectional plan view of the semiconductor device, and FIG.

FIG. 3 shows a configuration of a conventional semiconductor device, in which (a)
FIG. 2 is a partial cross-sectional plan view of the semiconductor device, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrically insulating flexible film 2 Semiconductor chip 3 Support frame 4 Individual semiconductor device 5 Opening 6 Slit 7 Formwork 8 Connecting part 9 Mold resin 10 Adhesive

Claims (4)

[Claims] 1. A semiconductor device having an electrically insulating flexible film, a plurality of semiconductor chips, and a support frame, wherein the electrically insulating flexible film has wiring to be connected to the semiconductor chip. The frame is a plate-like body, has an opening in the shape of each semiconductor chip on the plate surface, is adhered to one surface of the electrically insulating flexible film, and the semiconductor chip is housed in the opening of the support frame. The slit is adhered to the electrically insulative flexible film in the opening, and the electrically insulative flexible film and the support frame are shaped into the shape of a semiconductor chip, surround the periphery thereof, and are separated into two or more slits by connecting portions. The slits are separated into individual semiconductor devices by cutting the connection between adjacent slits. Wherein a is cut that. 2. An individual semiconductor chip is sealed with a resin and fitted and held in a frame, respectively.
2. The semiconductor according to claim 1, wherein the slit is provided at an opening edge of the support frame, and the slit separates the semiconductor chip including the frame from the electrically insulating flexible film and the support frame. apparatus. 3. The semiconductor device according to claim 1, wherein the support frame has a self-retaining property, and mechanically reinforces the electrically insulating flexible film so as to maintain a predetermined shape. . 4. A method of manufacturing a semiconductor device having a support frame attaching process and a semiconductor chip mounting process, wherein the support frame attaching process is a process of attaching a support frame to one surface of an electrically insulating flexible film. , The support frame is a plate-like body having a self-maintaining property, and has a plurality of openings for receiving a semiconductor chip on a plate surface, and the support frame and the electrically insulating flexible film model the opening shape of the support frame. Around the periphery, a partly connected slit for separation is attached in common. The mounting process of the semiconductor chip is performed by passing the semiconductor chip held in the mold through the opening of the support frame and electrically insulating flexible This is the process of bonding films. Each semiconductor device cuts the connection between slits. A semiconductor device which is separated from a laminate of an electrically insulating flexible film and a support frame.