JP2001002890A - Fixing method of waste plastic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing method of a waste plastic, with regard to a treatment of a plastic, and a particularly serious waste plastic, being a little environmental loading and an energy-save, and enabling a treated polymer to be effectively reused. SOLUTION: The fixing method of a plastic comprises steps of using an epoxy compound (a) as a solvent, forming a resin solution by dissolving a epoxy compound-soluble plastic (b), and then curing a solvent part of the resin solution by a curing agent to form a resinous material. The plastic (b) is desirably a waste plastic and/or foamed polystyrene.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for immobilizing plastics, which makes it possible to treat plastics, especially waste plastics.

[0002]

[Prior Art] Plastic molded products pursue convenience
Its use has been increasing year by year with the spread of disposable life. However, at the same time, a large amount of used plastic molded products are discarded, which is a major environmental problem affecting biological, social, and global environments. For example, foamed polystyrene resin (hereinafter abbreviated as Styrofoam) is used as a container, cushioning material, heat insulating material, and the like, particularly in the field of packaging and construction, because of its excellent impact resistance, light weight, and heat insulating properties. It is a well-known fact that at the same time it produces a large amount of waste.

[0003] These styrofoams which have been used and become unnecessary are often treated by incineration or burial. However, the incineration method has the problem of atmospheric diffusion of harmful substances, such as the generation of carbon dioxide, which is a cause of global warming, and the generation of dioxin, which has been found to be carcinogenic. It is.
On the other hand, in the method based on burial, these are not decomposed and reduced into soil over time, so that they become permanent industrial pollutants, causing a serious problem of an absolute shortage of landfill sites.

[0004] In addition, according to the Containers and Packaging Recycling Law, which has been in force since 2000, it is required to reduce the volume of wastes. In particular, Styrofoam used as a cushioning material, etc., has a large volume, so that it is as soon as possible. Establishment of recycling technology is required. Conventionally, when recycling polystyrene foam, melting by heat and dissolution by an organic solvent are common. However, when the volume is reduced by heating and melting, there is a problem of environmental pollution such as generation of decomposition gas and monomer due to heating, and expensive equipment is required. Also,
There are serious defects in quality such as coloring and deterioration of polymer properties due to thermal decomposition.

[0005] On the other hand, when dissolved in a general organic solvent such as toluene, there are risks and dangers such as fire and health hazards, and air pollution known as VOC (Volatile Organic Compounds) problem. There are environmental problems. Further, in order to reuse the plastic, it is necessary to recover the organic solvent by some method. Therefore, expensive equipment and energy burden are required. In this method, the organic solvent is also changed to a high boiling point solvent or a plasticizer, but the danger and harm are slightly reduced, but the high boiling point makes it extremely difficult to recover the solvent and the plasticizer. . Accordingly, recycled plastics containing such high-boiling solvents and plasticizers have not found any use and have become poorly disposed industrial wastes.

In such a situation, Japanese Patent Application Laid-Open No. 9-253
As disclosed in Japanese Unexamined Patent Publication No. 58-58, as a new styrofoam recycling technology, a dissolving method that is considered to have a relatively small decrease in the material properties of styrene has been studied. Indispensable, expensive equipment is also required. In this way, in the treatment of waste plastics, there is no technical means to reduce environmental impact and save energy by methods of incineration, burial, heat melting, and solvent dissolution. The solution which mentions the method of the above has not yet been proposed.

[0007]

SUMMARY OF THE INVENTION The present invention provides a method for treating plastics, especially waste plastics, which are becoming more serious, with less environmental burden and energy savings, and capable of effectively reusing polymers after treatment. It is intended to do so.

[0008]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have repeated research on a method of burning, burying, heating and melting a plastic, especially a waste plastic, and have studied a polymer after the treatment. The method of dissolving and recovering using an organic solvent was selected from the viewpoint that the effective reuse of the compound was possible. And as already mentioned in this method, the problem lies in the recovery of the organic solvent, so while researching a method that does not require the recovery of the organic solvent, the method eventually loses the organic solvent as a solvent The idea was reached. Therefore, a method was first studied in which the solvent functions as a good solvent at first, and finally becomes a solvent. As a result, a specific low-molecular-weight epoxy compound has a dissolving function for plastics such as styrene, and can be resinified with a curing agent known as an epoxy curing agent. The present inventors have found a processing method that can be effectively used for an injection material, a filling / filling material, an adhesive, a pressure-sensitive adhesive, a paint, and the like, and have completed the present invention.

Hereinafter, the present invention will be described. The present invention provides: Using an epoxy compound (a) as a solvent, dissolving a dissolvable plastic (b) in the resin to form a resin solution, and then curing the solvent portion of the resin solution with an epoxy curing agent (c) to form a resin 1. A method for immobilizing a plastic, comprising: The plastic (b) is waste plastic. 2. The method of immobilizing plastic described in 3. above. 1. The plastic (b) is a polystyrene foam. Or 2. 3. The method for immobilizing plastic described in 4. above. The epoxy compound (a) is a compound having 1 to 5 epoxy groups in a molecule. ~ 3.
4. The method for immobilizing a plastic according to any one of the above, 1. A plastic (b) is used in an amount of 1 to 100 parts by weight per 100 parts by weight of the epoxy compound (a). ~ 4. 4. The method for immobilizing a plastic according to any one of the above.

According to the method of the present invention, the epoxy compound (a) as a solvent is converted into a resin by a chemical reaction with the epoxy curing agent (c). On the other hand, since the dissolved plastic (b) is integrated with the epoxy resin, it is fixed with the epoxy resin. This immobilized product is added as it is or before resinification, and is mixed with an appropriate filler and reinforcing material to be added to an injection material, filling / filling material, or a general-purpose epoxy resin as a compounding component. It is effectively used for agents, adhesives, paints, etc.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be easily implemented by using a conventional stirring device for producing an epoxy resin-based adhesive or the like. First, an epoxy compound (a) serving as a solvent is charged into a stirring vessel, and a plastic (b), for example, waste styrofoam, which is appropriately cut so as to be easily dissolved, is dissolved. At this time, when the plastic (b) is dissolved in the epoxy compound (a), it is appropriately heated (for example, 30 to 60 ° C., preferably 40 to 50 ° C.).
C), the dissolution rate is higher and the dissolution can be performed smoothly. Further, in order to promote the dissolution of the plastic (b), physical means such as stirring and ultrasonic irradiation may be employed.

Next, an epoxy curing agent (c) considering the chemical equivalent is blended with the above-mentioned base material, and a curing reaction is carried out at room temperature or in a heated state to form a resin. In this case, as the epoxy curing agent (c), a moisture-curable latent curing agent such as ketimines, aldimines, oxazolidines, or
When a heat-curing agent such as dicyandiamide or adipic dihydrazide is used, the three components (a) to (c) can be mixed at once to form a one-liquid composition. Specific examples of the epoxy compound (a) include glycidyl ether compounds and glycidyl ester compounds.

Examples of the glycidyl ether compound include epichlorohydrin, 1,2-epoxybutane, propylene oxide, styrene oxide, methyl glycidyl ether, butyl glycidyl ether, stearyl monoglycidyl ether, allyl monoglycidyl ether, and decyl monoglycidyl. ether phenyl glycidyl ether nonylphenyl monoglycidyl ether cresyl monoglycidyl ether p-tert-butylphenyl monoglycidyl ether sec-butylphenyl monoglycidyl ether of 2-ethylhexyl monoglycidyl ether alkyl C ₈ -C ₁₀ mixed alcohols Monoglycidyl ether / alkyl C ₁₂ -C ₁₃ mixed higher alcohol monoglycidyl ether / lauryl alcohol monoglycol Glycidyl ether alkyl C ₁₂ -C ₁₄
In addition to monoepoxy compounds such as monoglycidyl ether of mixed higher alcohols, ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, polytetramethylene glycol, pentaerythritol, resorcinol, resorcinol, cyclohexanedimethanol, glycerin and aliphatic polyols 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, trimethylolethane, trimethylolpropane, dibromoneopentyl glycol, polyglycol, castor oil mono or polyepoxy compound, silane coupling agent Among them, there are compounds having an epoxy group, for example, γ-glycidoxypropyltrimethoxysilane.

The glycidyl ester compound is preferably a glycidyl ester of adipic acid, o-phthalic acid, neodecanoic acid, tetrahydrophthalic acid, hexahydrophthalic acid, diglycidyl p-oxybenzoic acid. One or more of these compounds may be appropriately used depending on the purpose of use, properties and performance.

Among the above compounds, 2-ethylhexyl is preferred because of its good solubility in plastics (b) and good physical properties when the solution is cured by an epoxy curing agent (c) to form a resin. monoglycidyl ether butyl glycidyl ether C ₁₂ -C ₁₃ mono-glycidyl ether 1,6-hexanediol diglycidyl ether p-tert-butylphenyl monoglycidyl ethers of mixed higher alcohols are preferred.

Among these, monoglycidyl ether of butyl glycidyl ether / C ₁₂ -C ₁₃ mixed higher alcohol is particularly preferred because the compatibility is good when the solution is mixed with a general-purpose epoxy resin. . As the plastic (b) that can be dissolved in the epoxy compound (a), waste plastic is more preferable for solving environmental problems, but is not limited thereto.

Specifically, polystyrene, HDPE, LD
PE, PP, PVC, ABS, polycarbonate, acrylic resin, polymethyl methacrylate, rubber, polyethylene terephthalate, Saran, vinylon, polyamide,
Aromatic polyimide, polyurethane, celluloid, PAN
・ There are alkyd resin, phenol resin, melamine resin, or their foams. Among them, plastic (b) is often used as a resin foam among others, and is bulky and has the most serious volume problem as waste, and is easily dissolved in the epoxy compound (a).
Particularly, waste styrofoam is preferable.

As the epoxy curing agent (c), commercially available products used for general-purpose epoxy resins can be used. The amount can be mixed with the epoxy compound (a) to be cured at an arbitrary ratio depending on the purpose of use and application. Usually, the epoxy equivalent and the chemical equivalent of the curing agent (c) (for example, amines (Amine equivalent) is used in the range of 0.2 to 3.0, and is preferably used in the range of 0.8 to 1.2 because of good physical properties and heat resistance after curing. desirable.

More specifically, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenepropylenetriamine, bishexamethylenetriamine, 1,3,6-trisaminomethylhexane, trimethylhexamethylenediamine, polyetherdiamine, diethylaminopropylamine -Mensendiamine-bis (4-amino-3-methylcyclohexyl) methane-N
-Aminoethylpiperazine, meta-xylylenediamine,
A simple substance of metaphenylenediamine / diaminodiphenylsulfone / isophoronediamine / diaminodiphenylmethane and modified products thereof. Examples of the modification method include addition of an epoxy compound, addition of ethylene oxide, addition of propylene oxide, addition of acrylonitrile, addition of Mannich with phenol and its derivative and formalin, addition of thiourea, and ketone blocking.

Other curing agents include phenol novolak, polymercaptan compounds, polysulfides, ketimines, tertiary amine compounds, organic acid hydrazides, dicyandiamide and derivatives thereof, amine imides, carboxylic esters, boron trifluoride-amine complexes, imidazoles Examples include compounds, acid anhydrides, aliphatic acid anhydrides, halogenated acid anhydrides, aromatic diazinium salts, diallyliodonium salts, triallylsulfonium salts, and triallylselenium salts. One or more of these curing agent components may be appropriately used depending on the purpose of use, properties and performance.

Among these hardener components, there are ketimines, acid anhydrides, dicyandiamides, and the like which can be directly converted into one liquid. However, even those hardener components which cannot be directly converted into one liquid, such as molecular sieves and microcapsules, can be used. Can be made into one liquid. Moisture, moisture, oxygen, ultraviolet rays, visible light, infrared rays, electromagnetic waves, electron beams, radiation, pressure, heat, sound waves, impact, friction, and the like can be used as a curing means in the case of one liquid.

In the fixing method of the present invention, 100 parts by weight of the epoxy compound (a) is added to one part of the plastic (b).
It is preferable to use 100 parts by weight, more preferably 5 to 50 parts by weight. If the amount of the plastic (b) is less than 1 part by weight, it hardly contributes to the treatment of plastics, particularly the volume reduction of waste plastics, which is the object of the present invention. If it exceeds 100 parts by weight, the solubility decreases, the solution becomes gel-like and the system becomes non-uniform, or the dissolved plastic is mixed with other components at the stage of being used as an adhesive or the like. It is not preferable because the solubility is sometimes reduced and the plastic component is precipitated. The temperature at which the solution obtained by dissolving the plastic (b) in the epoxy compound (a) using the curing agent (c) is cured is as follows:
Although it is arbitrarily determined according to the purpose of use and the curing method, it is usually in the range of 5 to 120 ° C., but is preferably in the range of 15 to 40 ° C. for reasons such as the curing device and the performance of the cured resin.

The mixture of the three components (a) to (c) is
As it is or before it is made into a resin, a suitable filler, reinforcing material, etc. is blended and added to the injection material, filling and filling material, or as a compounding agent to general-purpose epoxy resin, adhesive,
It is effectively used for adhesives, paints, etc. When processing into an injecting material, a filling / filling material, an adhesive, a pressure-sensitive adhesive, a paint, and the like, the following common additives can be further appropriately compounded. In the case of an injection or a filling / filling material, specifically, an inorganic or organic filler, a plasticizer, an antifoaming agent, a thixotropic agent, a curing accelerator, and a curing retarder can be appropriately selected and blended. adhesive,
For adhesives and paints, specifically organic or inorganic fillers, plasticizers, additives, flame retardants, preservatives, fungicides,
An antimicrobial agent or the like can be suitably added.

Examples of the inorganic filler include heavy calcium carbonate, surface-treated calcium carbonate, magnesium carbonate, talc, clay, kaolin, montmorillonite, fumed silica, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium sulfate, and sulfuric acid. Calcium, aluminum sulfate, Portland cement, early strength cement,
Quick setting cement, blast furnace cement, white cement, silica cement, fly ash cement, silica sand, river sand, rock, gravel, volcanic ash, glass, stone powder, gypsum, bone ash, ceramic powder, asbestos, vermiculite, carbon black, carborundum, graphite, Pitch, extender pigment, titanium oxide, iron oxide, clay, diatomaceous earth, bentonite, zinc oxide, aluminum oxide, calcium oxide,
Magnesium oxide, perlite, silica gel, slag,
Metal powder and the like. Also, industrial waste such as construction waste, rubble, reinforcing steel, concrete, earth and sand, etc., discharged from the construction site can be added.

Examples of the organic filler include polyolefin resin, vinyl (copolymer) resin, acrylic resin, rubber latex resin, epoxy resin, urethane resin, saturated polyester resin, unsaturated polyester resin, and polyamide. Resin, polystyrene resin, phenol resin, urea resin, melamine resin, silicone resin,
Acetal resin, phenoxy resin, allyl resin,
Examples thereof include polysulfone resin, alkyd resin, powders and hollow bodies of cellulose and the like, carbon fibers, aramid fibers, and rubber chips. The filler is one of the above-mentioned ones.
A species or two or more species can be selected and used.

As the plasticizer, xylene resin, phthalic acid esters such as dioctyl phthalate and dibutyl phthalate, and aliphatic carboxylic acid esters such as dioctyl adipate and dibutyl sebacate can be used. Examples of the flame retardant include phosphorus and its compounds, halogen compounds, silicone compounds, metal compounds, boron compounds, inorganic or organic flame retardants such as nitrogen compounds, simple metals, reactive flame-retardant polymers, and the like. Can be used alone or in combination of two or more in accordance with the required level of flame retardancy. Examples of the additives include antioxidants, ultraviolet absorbers, defoamers, thixotropic agents, curing accelerators, curing retarders, pigments, dyes, fragrances, deodorants, various tackifiers, various coupling agents, and the like. Is mentioned.

[0027]

EXAMPLES Hereinafter, the present invention will be described specifically with reference to examples.
However, it should be noted that the present invention is not limited to the following examples.
Needless to say. . In addition, the parsing in Examples and Comparative Examples
The percentage (%) is based on mass. (Examples 1 and 2, Comparative Examples 1 to 6) Examples 1 and 2; waste tray made of styrene foam (b)
Crushed finely, and this is a monoepoxy compound
759 (manufactured by Air Products Japan K.K .: Al
Kill C ₁₂~ C₁₃Monoglycidyl ester of mixed higher alcohol
Dissolved in (a). At this time, the solubility is improved.
The liquid temperature to 40 ° C and use a motor type stirrer
To dissolve. Use this as the main ingredient to calculate the epoxy equivalent.
You. Next, N-aminoethyl pipera is used as a curing agent (c).
Gin, meta-xylylenediamine, triethylenetetrami
Versamide 140, a general-purpose polyamidoamine
(Made by Henkel Japan KK)
And the amount of equivalents to 1.0 was added.
Stir well and pour into a suitable mold and grow at 23 ° C for 7 days
And subjected to various tests such as compression strength and bending strength.

Comparative Examples 1 to 6 The same procedures as in Examples 1 and 2 were carried out except that the waste tray (b) was not added, or DNP (dinonylphenol) (plasticizer) was added instead. Obtained cured product (Examples 1 and 2, Comparative Examples 1 and 2)
For 6), the compressive strength was measured by a method based on JIS K7208, and the bending strength was measured by a method based on JIS K7203. Table 1 shows the results.

According to the results shown in Table 1, in a system in which the waste tray (b) (styrene foam) was not blended, although the epoxy equivalent and the amine equivalent were the same,
In any system, the resin is not cured, but when it is blended, the resin is cured to exhibit mechanical strength. From this, the waste tray (Styrofoam)
(B) corresponds to the third component other than the reaction component, but similarly to DNP (dinonylphenol) (plasticizer), which is the third component, surprisingly has a certain mechanical strength (compressive strength:
2.9 to 3.2 N / mm ² , bending strength: 2.6 to 2.8
N / mm ² ). The composition comprising (a) to (c) can be suitably used as it is or by adding a filler and a reinforcing material in advance, for example, as an injecting material for building and a filling / filling material.

(Examples 3-4, Comparative Examples 7-11) Examples 3-4: A waste tray (b) made of styrofoam was finely crushed and dissolved in EPOIL 759 (a) which is a monoepoxy compound. . At this time, in order to improve the solubility, the solution temperature was set to 40 ° C., and the solution was dissolved using a motor-type stirrer. Next, in order to improve the curability of this solution, Epicoat 8 which is a general-purpose epoxy resin is used.
28 (manufactured by Yuka Shell Co., Ltd .: bisphenol A type epoxy resin) and Aerosil 200CF (manufactured by Nippon Aerosil Co., Ltd .: fumed silica) (thixotropic agent), and sufficiently stirred to make the entire system uniform. did. The epoxy equivalent is calculated using this as a base material. N-aminoethylpiperazine and triethylenetetramine were used as the curing agent (c) for this main component.

The composition comprising the main agent and the curing agent can be suitably used as an adhesive for vinyl flooring.
In the above composition, Epoile 759 also functions as a viscosity reducing agent for Epicoat 828. Next, when the system containing the waste tray (b) (Examples 3 and 4) was used as an adhesive for vinyl flooring, excellent properties such as initial tackiness, reworkability, and tensile adhesive strength were evaluated. This will be described through the following various tests. The initial tackiness and the re-sticking workability were measured using an asbestos slate board (specified in JIS A5430) using a special comb iron, and a vinyl flooring material (symbol NC specified in JIS A5705) was used at regular intervals of deposition time. ) Were evaluated.

Comparative Examples 7 to 11: FTR6100 (manufactured by Mitsui Petrochemical Co., Ltd .: styrene monomer / aliphatic monomer copolymer) (Tackifire) or DNP without adding or replacing the waste tray (b) The procedure was performed in the same manner as in Examples 3 and 4, except that (dinonylphenol) (plasticizer) was added. The results of Examples and Comparative Examples are shown in Table 2. From the results shown in Table 2, it can be seen that the adhesives for the vinyl flooring materials of Examples 3 and 4 are excellent in the following characteristics.

Initial tackiness System containing waste tray (b) (Examples 3 and 4)
Has the same excellent effect as the system containing FTR6100 (tackifier) (Comparative Example 10). Due to this initial tackiness, excellent adhesiveness for suppressing warpage or the like is exhibited with respect to the vinyl flooring material supplied as a roll. By the way, to improve the initial tackiness, FTR61
In a system containing 00 (tackifier) (Comparative Example 10), since FTR6100 (tackifier) does not dissolve in the epoxy resin, the use of a solvent is essential. And causes melting and deformation of the adherend. In addition, a weak solvent such as a mineral spirit having a mild dissolving power has poor volatility and remains at the bonding interface, resulting in poor curing of the adhesive and eventually warping and blistering of the adherend.

On the other hand, Styrofoam dissolves in EPOIL 759 without using a solvent, and therefore, the system (Examples 3 and 4) in which the waste tray (b) is blended does not have such an adverse effect. Further, since no solvent is used, there is little danger of fire, and there is no environmental problem such as air pollution caused by volatile organic compounds (VOC).

Regarding reattachment work When actually applying, when attaching the supplied vinyl flooring, it often shifts from the ink marking position. In this case, the flooring is peeled off and reattached. There is a need.
In such a case, in the system not containing the waste tray (b) (Comparative Examples 7 to 11), stringing at the time of re-attaching is remarkable,
It is not preferable because it involves difficulty in work. On the other hand, only the system (Examples 3 and 4) in which the waste tray (b) is blended has a short stringing at the time of reattachment and gives an appropriate adhesive force. Preferred.

Tensile bond strength The tensile bond strength of the adhesive for vinyl flooring is 1.0 N /
If it has a value of mm ² , it satisfies the value specified in JIS A5536 (adhesive for vinyl flooring), so that the system (Examples 3 and 4) containing the waste tray (b) is excellent. Gives adhesive strength. (Examples 5 to 6, Comparative Examples 12 to 16) Examples 5 to 6: A waste tray (b) made of styrene foam is finely crushed, and this is dissolved in EPOIL 759 (a), which is a monoepoxy compound. At this time, in order to improve the solubility, the liquid temperature was set to 40 ° C., and the solution was dissolved using a motor-type stirrer. In order to improve the curability of this solution, Epicoat 828, a general-purpose epoxy resin, was blended according to the formulation shown in Table 3, and sufficiently stirred again to make the entire system uniform. The epoxy equivalent is calculated using this as a base material. N-aminoethylpiperazine and triethylenetetramine were used as the curing agent (c) for this main agent. The composition comprising the main agent and the curing agent can be suitably used as a bonding agent for a styrene product and as an adhesive.

In the above composition, Eposil 759
Also functions as a viscosity reducing agent for Epicoat 828. Next, a description will be given of a bonding and adhesion test of a styrene product using the composition. Bonding and adhesion tests were performed on styrene-made pipes and plates. In addition, for comparison, a dope bonding test using a solvent (a method in which a surface to be bonded and a bonded body is wetted and dissolved with a solution containing an organic solvent such as MEK, and the dissolved surfaces are pressed together to bond and bond) is also performed. Was.

Comparative Examples 12 to 16: Dope Junction (Comparative Example 1
4-16) or the waste tray (b)
Was carried out in the same manner as in Examples 5 to 6 except that DNP (dinonylphenol) (plasticizer) was used instead of (Comparative Examples 12 to 13). The results are shown in Table 3. As is clear from the results in Table 3, in the system in which the waste tray (b) is blended (Examples 5 to 6), pipes and plate-like bodies can be joined together. No inconvenience such as deformation occurs.

On the other hand, when DNP (dinonylphenol) (plasticizer) is blended (Comparative Examples 12 and 13), joining is impossible. Epoile 759 also slightly affects the styrene resin and thus has the same effect as partially dope. However, DNP (dinonylphenol) (plasticizer) inhibits curing as compared with the system in which the waste tray (b) is blended. Due to the action, no bonding strength is exhibited. In the case where an organic solvent is contained (Comparative Examples 14 to 16), joining is possible. However, since the solvent invades the joining interface of the joined body and the bonded body, the joined body and the bonded body itself are deformed, and a fire, Risks and harms such as health problems and VOC (Volatile Organic Compo
(unds: volatile organic compounds), and environmental problems such as air pollution.

As described above, as shown in the examples, the epoxy compound (a) is used as a solvent, and the dissolvable plastic (b) is dissolved therein to form a resin solution. Thereafter, the solvent portion of the resin solution is epoxy-cured. By hardening with the agent (c) and converting it into a resin, it is possible to treat waste plastic with less environmental burden and energy saving.
And the composition after treatment is used as filling material, filling and filling material,
Alternatively, it can be added to a general-purpose epoxy resin as a compounding agent and effectively reused as an adhesive, a pressure-sensitive adhesive, a paint, and the like.

[0041]

[Table 1]

[0042]

[Table 2]

[0043]

[Table 3]

[0044]

According to the method of the present invention, plastic,
In particular, it is possible to provide a processing method that can reduce the environmental load, save energy, and effectively reuse waste plastic that is becoming more serious.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI theme coat ゛ (reference) C08L 101/16 C08L 101/00 F term (reference) 4F070 AA18 AA46 AC23 AC35 AC46 AE08 FA02 FB05 FB09 4F301 AA15 AB03 CA09 CA14 4J002 AB02X AC00X BB03X BB12X BC02X BD03X BD10X BE02X BG03X BG06X BG10X BN15X CC03X CC033 CC18X CD01W CD02W CD04W CD10W CD16W CF01X CF06X CG00X CH053 CK02X CL00X CN023 EB116 EF006 EH006 EL027 EL136 EN036 EN046 EN076 EQ026 EQ036 ER006 ER026 EU116 EU136 EV006 EV026 EV216 EV296 EX067 EZ006 FD010 FD020 FD143 FD146 GH01 GJ01 GL00

Claims (5)

[Claims] 1. A step of using an epoxy compound (a) as a solvent and dissolving a dissolvable plastic (b) in the resin to form a resin solution, and then converting the solvent portion of the resin solution into an epoxy curing agent (c) And vulcanizing the resin to form a resin. 2. The method according to claim 1, wherein the plastic (b) is waste plastic. 3. The method according to claim 1, wherein the plastic (b) is styrene foam. 4. An epoxy compound (a) having 1 to 1
The method for immobilizing plastic according to any one of claims 1 to 3, wherein the method is a compound having an epoxy group of 5. 5. The method according to claim 1, wherein 1 to 100 parts by weight of the plastic (b) is used for 100 parts by weight of the epoxy compound (a).