|
US5898211A
(en)
*
|
1996-04-30 |
1999-04-27 |
Cutting Edge Optronics, Inc. |
Laser diode package with heat sink
|
|
US6295307B1
(en)
*
|
1997-10-14 |
2001-09-25 |
Decade Products, Inc. |
Laser diode assembly
|
|
US5913108A
(en)
|
1998-04-30 |
1999-06-15 |
Cutting Edge Optronics, Inc. |
Laser diode packaging
|
|
US6636538B1
(en)
*
|
1999-03-29 |
2003-10-21 |
Cutting Edge Optronics, Inc. |
Laser diode packaging
|
|
EP1135440B1
(en)
*
|
1999-09-14 |
2004-08-11 |
Basell Poliolefine Italia S.P.A. |
Impact-resitant polyolefin compositions
|
|
CA2284946A1
(en)
|
1999-10-04 |
2001-04-04 |
Institut National D'optique |
Laser diode array assembly made from a ridged monolithic substrate
|
|
US20040120371A1
(en)
*
|
2000-02-18 |
2004-06-24 |
Jds Uniphase Corporation |
Contact structure for a semiconductor component
|
|
US6674775B1
(en)
*
|
2000-02-18 |
2004-01-06 |
Jds Uniphase Corporation |
Contact structure for semiconductor lasers
|
|
US6647035B1
(en)
|
2000-10-17 |
2003-11-11 |
The Regents Of The University Of California |
Ruggedized microchannel-cooled laser diode array with self-aligned microlens
|
|
US6533193B2
(en)
|
2001-03-29 |
2003-03-18 |
Dan White |
Solution introduction system for watering installations
|
|
US6700913B2
(en)
|
2001-05-29 |
2004-03-02 |
Northrop Grumman Corporation |
Low cost high integrity diode laser array
|
|
US7305016B2
(en)
*
|
2005-03-10 |
2007-12-04 |
Northrop Grumman Corporation |
Laser diode package with an internal fluid cooling channel
|
|
US7960032B2
(en)
*
|
2005-05-24 |
2011-06-14 |
Demers Joseph R |
High thermal conductivity, high yield strength, metal composite and method
|
|
US7656915B2
(en)
*
|
2006-07-26 |
2010-02-02 |
Northrop Grumman Space & Missions Systems Corp. |
Microchannel cooler for high efficiency laser diode heat extraction
|
|
US20080056314A1
(en)
*
|
2006-08-31 |
2008-03-06 |
Northrop Grumman Corporation |
High-power laser-diode package system
|
|
US20080089371A1
(en)
*
|
2006-10-11 |
2008-04-17 |
Patrick Reichert |
Bright light source with two-dimensional array of diode-laser emitters
|
|
US20080262484A1
(en)
*
|
2007-04-23 |
2008-10-23 |
Nlight Photonics Corporation |
Motion-controlled laser surface treatment apparatus
|
|
US7724791B2
(en)
*
|
2008-01-18 |
2010-05-25 |
Northrop Grumman Systems Corporation |
Method of manufacturing laser diode packages and arrays
|
|
US8160115B2
(en)
*
|
2009-01-21 |
2012-04-17 |
Coherent, Inc. |
Two-dimensional diode-laser array with broad-band output
|
|
US8345720B2
(en)
|
2009-07-28 |
2013-01-01 |
Northrop Grumman Systems Corp. |
Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
|
|
US9065236B2
(en)
|
2010-04-30 |
2015-06-23 |
Seagate Technology |
Method and apparatus for aligning a laser diode on a slider
|
|
US8345517B2
(en)
|
2010-04-30 |
2013-01-01 |
Seagate Technology Llc |
Method and apparatus for aligning a laser diode on a slider
|
|
US9590388B2
(en)
|
2011-01-11 |
2017-03-07 |
Northrop Grumman Systems Corp. |
Microchannel cooler for a single laser diode emitter based system
|
|
EP2680377B1
(en)
*
|
2012-06-29 |
2017-05-10 |
C2C Link Corporation |
Method for making a laser module
|
|
US9197027B2
(en)
|
2012-07-05 |
2015-11-24 |
C2C Link Corporation |
Method for making laser module
|
|
US8937976B2
(en)
|
2012-08-15 |
2015-01-20 |
Northrop Grumman Systems Corp. |
Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier
|
|
CN103633550B
(zh)
*
|
2012-08-30 |
2016-02-24 |
苏州长光华芯光电技术有限公司 |
一种半导体激光器bar条垂直阵列的封装方法
|
|
US8804781B2
(en)
|
2012-10-29 |
2014-08-12 |
Coherent, Inc. |
Macro channel water-cooled heat-sink for diode-laser bars
|
|
US8804782B2
(en)
|
2012-10-29 |
2014-08-12 |
Coherent, Inc. |
Macro-channel water-cooled heat-sink for diode-laser bars
|
|
US20140160751A1
(en)
*
|
2012-12-11 |
2014-06-12 |
Vixar Inc. |
Low cost optical package
|
|
CN103457151B
(zh)
*
|
2013-08-08 |
2016-01-20 |
中国科学院苏州生物医学工程技术研究所 |
一种高温硬焊料准连续半导体激光器巴条叠阵封装方法
|
|
US9728935B2
(en)
|
2015-06-05 |
2017-08-08 |
Lumentum Operations Llc |
Chip-scale package and semiconductor device assembly
|
|
DE102015013511B3
(de)
|
2015-10-15 |
2017-03-16 |
Jenoptik Laser Gmbh |
Laserstrahlungsquelle und Verfahren zur Herstellung einer Laserstrahlungsquelle und Verwendung eines Lötprozesses
|
|
JP6928440B2
(ja)
*
|
2016-11-24 |
2021-09-01 |
浜松ホトニクス株式会社 |
半導体レーザ装置
|
|
US11025031B2
(en)
|
2016-11-29 |
2021-06-01 |
Leonardo Electronics Us Inc. |
Dual junction fiber-coupled laser diode and related methods
|
|
DE202017007096U1
(de)
|
2017-06-23 |
2019-07-04 |
Jenoptik Optical Systems Gmbh |
Diodenlaser mit Einhausung
|
|
CN209029679U
(zh)
|
2017-06-23 |
2019-06-25 |
业纳激光有限公司 |
具有壳体的二极管激光器以及一种用于对表面进行均匀照明的装置
|
|
WO2020036998A1
(en)
|
2018-08-13 |
2020-02-20 |
Lasertel, Inc. |
Use of metal-core printed circuit board (pcb) for generation of ultra-narrow, high-current pulse driver
|
|
DE102019121924A1
(de)
|
2018-08-14 |
2020-02-20 |
Lasertel, Inc. |
Laserbaugruppe und zugehörige verfahren
|
|
US11296481B2
(en)
|
2019-01-09 |
2022-04-05 |
Leonardo Electronics Us Inc. |
Divergence reshaping array
|
|
EP3685872B1
(en)
|
2019-01-22 |
2024-01-03 |
Wellspect AB |
A method of manufacuring a urinary catheter having an injection molded tip and the urinary catheter
|
|
US11752571B1
(en)
|
2019-06-07 |
2023-09-12 |
Leonardo Electronics Us Inc. |
Coherent beam coupler
|
