JP2000357805A - Light module, its manufacture and light-transmitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light module that can be incorporated into a final product without applying any operation to a light element, its manufacturing method, and a light-transmitting device. SOLUTION: The light module includes a substrate 40 where a wiring pattern is formed, a platform 10 that is mounted to the substrate 40, an optical fiber 30 that is positioned at the platform 10 for supporting, and a light element 20. The light element 20 has an electrode 24 and an optical part 22 while the optical part 22 is directed toward the end face of the optical fiber 30 and an electrode 24 mounted to the platform 10 is electrically connected to the wiring pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical module, a method of manufacturing the same, and an optical transmission device.

[0002]

2. Description of the Related Art In recent years, information communication has been trending toward higher speed and larger capacity, and optical communication has been developed. Generally, in optical communication, an electric signal is converted into an optical signal, the optical signal is transmitted through an optical fiber, and the received optical signal is converted into an electric signal. The conversion between an electric signal and an optical signal is performed by an optical element.

For example, Japanese Patent Application Laid-Open No. H10-339824 describes that an optical module is formed by positioning and fixing an optical fiber on a platform having a V-groove formed therein.

Since the publication does not describe a method for electrically connecting an optical element to the outside, the platform is incorporated into the final product, and then the connection between the optical element and the outside is made using a wire. It is thought to aim at. Therefore, since the wire is bonded to the optical element at the final stage of the manufacturing process, inconvenience such as displacement of the optical fiber may occur at this time.

An object of the present invention is to solve this problem, and an object of the present invention is to provide an optical module which can be incorporated into a final product without acting on an optical element, a method of manufacturing the same, and an optical transmission device. Is to do.

[0006]

(1) An optical module according to the present invention comprises a substrate on which a wiring pattern is formed, a platform attached to the substrate, an optical fiber disposed on the platform, electrodes, An optical element having an optical part, the optical part being mounted on the platform with the optical part facing the end face of the optical fiber, and the electrode being electrically connected to the wiring pattern.

According to the present invention, since the electrode of the optical element is electrically connected to the wiring pattern, the electrode of the optical element can be electrically connected to the outside via the wiring pattern. As a result, no action is applied to the optical element at the time of electrical connection with the outside, so that the position of the optical part of the optical element and the optical fiber do not shift.

(2) In this optical module, the substrate may be provided with an external terminal electrically connected to the wiring pattern.

(3) In this optical module, the electrode may be formed on a surface of the optical element opposite to the optical part.

(4) In this optical module, the optical fiber may be disposed substantially parallel to a surface of the substrate.

(5) In this optical module, the surface of the electrode may be located substantially perpendicular to the surface of the substrate.

(6) In this optical module, one of a solder and a conductive paste may be provided between the electrode and the wiring pattern to achieve electrical continuity.

According to this, by using one of the solder and the conductive paste, even if the electrode and the wiring pattern do not face each other, they can be electrically connected.

(7) In this optical module, a conductive member having elasticity may be provided on the wiring pattern, and the conductive member may be in contact with the electrode by elasticity.

According to this, since the elasticity of the conductive member is used, the electrical connection between the conductive member and the electrode can be easily achieved, and even if the electrode and the wiring pattern do not face each other, both can be connected. Can be electrically connected.

(8) In this optical module, the electrode and the wiring pattern are connected by a wire,
One end of the wire may be bonded to the wiring pattern, and a portion other than the end of the wire may be bonded to the electrode.

According to this, the middle part of the wire is bonded to the electrode. In general, wire bonding is performed on an electrode facing upward. However, if an intermediate portion of the wire is used, bonding can be performed on an electrode facing in the horizontal direction.

(9) In this optical module, a support member is provided on the substrate, one end of a wire is bonded to the wiring pattern, and a portion excluding the end of the wire is connected to the support member by the support member. The electrode may be connected to the electrode by being sandwiched between the electrode and the electrode.

According to this, by sandwiching the wire between the support member and the electrode, the electrical connection between the wire and the electrode can be easily achieved.

(10) In this optical module, a conductive layer may be formed on the platform, and the conductive layer may be electrically connected to the wiring pattern.

(11) The optical module may further include a sealing portion for sealing at least an electrical connection portion between the electrode and the wiring pattern.

(12) In this optical module, the sealing portion seals the first resin portion for sealing an electrical connection portion between the electrode and the wiring pattern, and seals the first resin portion. And a second resin part.

(13) In this optical module, the first resin portion may have higher flexibility than the second resin portion.

According to this, since no large stress is applied to the electrical connection between the electrode and the wiring pattern, the connection is protected.

(14) An optical transmission device according to the present invention includes an optical fiber, and optical modules attached to both ends of the optical fiber, wherein the optical module includes: a substrate on which a wiring pattern is formed; A platform having the optical fiber formed thereon, the platform having an electrode and an optical portion, the optical portion being mounted on the platform with the optical portion facing an end surface of the optical fiber, the electrode being provided with the wiring pattern; And an optical element electrically connected to the optical element.

According to the present invention, since the electrode of the optical element is electrically connected to the wiring pattern, the electrode of the optical element can be electrically connected to the outside via the wiring pattern. As a result, no action is applied to the optical element at the time of electrical connection with the outside, so that the position of the optical part of the optical element and the optical fiber do not shift.

(15) A method of manufacturing an optical module according to the present invention comprises the steps of: mounting an optical element on a platform;
Attaching the platform on which the optical element is mounted to a substrate on which a wiring pattern is formed; aligning and supporting an optical fiber on the platform; and forming an electrode formed on the optical element and the wiring pattern. And electrically connecting the above.

According to the present invention, since the electrode of the optical element is electrically connected to the wiring pattern, the electrode of the optical element can be electrically connected to the outside via the wiring pattern. As a result, no action is applied to the optical element at the time of electrical connection with the outside, so that the position of the optical part of the optical element and the optical fiber do not shift.

(16) In this method of manufacturing an optical module, the step of electrically connecting the electrode and the wiring pattern is performed by providing a solder or a conductive paste between the electrode and the wiring pattern. Is also good.

According to this, by using one of the solder and the conductive paste, even if the electrode and the wiring pattern do not face each other, they can be electrically connected.

(17) In this method of manufacturing an optical module, the step of electrically connecting the electrode and the wiring pattern includes the step of providing a conductive member having elasticity in the wiring pattern, and then connecting the conductive member to the electrode. May be carried out.

According to this, since the elasticity of the conductive member is utilized, electrical connection between the conductive member and the electrode can be easily achieved, and even if the electrode and the wiring pattern do not face each other, the two can be connected. Can be electrically connected.

(18) In the method for manufacturing an optical module, the step of electrically connecting the electrode and the wiring pattern includes bonding one end of a wire to the wiring pattern, and then bonding the end of the wire to the wiring pattern. May be bonded to the electrode.

According to this, the intermediate part of the wire is bonded to the electrode. In general, wire bonding is performed on an electrode facing upward. However, if an intermediate portion of the wire is used, bonding can be performed on an electrode facing in the horizontal direction.

(19) In this method of manufacturing an optical module, the step of electrically connecting the electrode and the wiring pattern includes bonding one end of a wire to the wiring pattern to form a support member and the platform. After attaching one to the substrate, the other of the support member and the platform may be attached to the substrate by sandwiching a portion except for the end of the wire between the support member and the electrode.

According to this, by sandwiching the wire between the support member and the electrode, the electrical connection between the wire and the electrode can be easily achieved.

(20) The method for manufacturing an optical module may include a step of providing an external terminal electrically connected to the wiring pattern on the substrate.

(21) In this method of manufacturing an optical module, a conductive layer may be formed on the platform, and a step of electrically connecting the conductive layer and the wiring pattern may be included.

(22) In this method of manufacturing an optical module, a step of sealing the electrical connection between the electrode and the wiring pattern with the first resin to form a first resin part, and thereafter, And a step of sealing the first resin portion with a second resin to form a second resin portion.

(23) In this method of manufacturing an optical module, the first resin portion may have higher flexibility than the second resin portion.

According to this, since a large stress is not applied to the electrical connection between the electrode and the wiring pattern, the connection is protected.

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a view showing an optical module according to a first embodiment to which the present invention is applied. The optical module according to the present embodiment includes a platform 10, an optical element 20, an optical fiber 30, and a substrate 40.

The overall shape of the platform 10 is not particularly limited, and may be, for example, any of a rectangular parallelepiped, a cube, and a plate. Generally, any one surface of the platform 10 is connected to the other surface or side at an angle. The material constituting the platform 10 is not particularly limited, and may be any of an insulator, a conductor, and a semiconductor. For example, it may be any of a metal such as silicon, ceramic, iron and copper, or a resin.

An optical element 20 is mounted on one of the surfaces of the platform 10. When the platform 10 has a rectangular parallelepiped or plate shape, the optical element 20 is mounted on the largest surface. The platform 10 may have a through hole 12 formed therein. One opening in the through hole 12 is formed on a surface on which the optical element 20 is mounted,
Other openings are formed on the surface other than the surface on which the optical element 20 is mounted. The through-hole 12 is for inserting the optical fiber 30 and positioning it. The through hole 12
The optical fiber 30 may be a round hole or a square hole.
It is preferable that the inner surface of the through hole 12 is in contact with the optical fiber 30 to such an extent that positioning can be performed.

The platform 10 may have a conductive layer 16 formed thereon. The conductive layer 16 is formed on the platform 10.
Can be formed on the surface on which the optical element 20 is mounted. The opening of the through hole 12 is formed on this surface, and the conductive layer 16 is formed avoiding the opening of the through hole 12. When the platform 10 is made of a conductive material, it is preferable to form the conductive layer 16 via an insulating film. For example, when the platform 10 is made of silicon, a silicon oxide film may be formed on the surface, and the conductive layer 16 may be formed thereon.

Since the conductive layer 16 is electrically connected to the optical element 20, it may have a wiring pattern as required. The conductive layer 16 may be formed up to a surface different from the surface of the platform 10 on which the optical element 20 is mounted. For example, the conductive layer 16 may be formed on a surface on which the optical element 20 is mounted up to a side surface connected at an angle.

The optical element 20 may be a light emitting element or a light receiving element. A surface-emitting element as an example of a light-emitting element,
In particular, a surface emitting laser can be used. A surface emitting device such as a surface emitting laser emits light in a direction perpendicular to a substrate. The optical element 20 has an optical part 22. When the optical element 20 is a light emitting element, the optical part 22 is a light emitting part, and when the optical element 20 is a light receiving element, the optical part 22 is a light receiving part. When the optical part 22 is a light emitting part, it is preferable to determine the size of the light emitting part and the diameter of the through hole 12 so that all the light from the light emitting part enters the through hole 12. For example, the diameter of the through hole 12 may be larger than the diameter of the light emitting unit.

The optical element 20 has an electrode 24. When the optical element 20 is a semiconductor laser such as a surface emitting laser,
The electrode 2 is provided on the surface opposite to the surface on which the optical portion 22 is provided.
4 may be provided. Further, a plurality of electrodes 26 may be provided on the surface of the optical element 20 where the optical portion 22 is formed. At least one of the plurality of electrodes 26 may be a dummy electrode that is not electrically connected. Electrode 2 at the position where all are connected by straight lines to draw a polygon of triangle or more
6 may be provided to mount the optical element 20 on the platform 10 via the electrode 26. By doing so, the optical element 20 is stably supported at a position where a polygon that is more than a triangle is drawn.

The optical element 20 is mounted on the platform 10. Specifically, the optical element 20 is mounted with the optical part 22 facing the inside of the through hole 12 of the platform 10.

The optical element 20 may be electrically connected to the conductive layer 16 formed on the platform 10. FIG.
Here, the electrode 26 of the optical element 20 and the conductive layer 16 are joined. For example, the electrode 26 and the conductive layer 16 are bonded by using metal bonding such as solder or a conductive adhesive.

The optical fiber 30 includes a core and a clad that concentrically surrounds the core. Light is reflected at the boundary between the core and the clad, and the light is confined and propagated in the core. Also, the periphery of the cladding is often protected by a jacket.

The optical fiber 30 is connected to the platform 10
Are inserted into the through holes 12 of the first and second through holes. As described above, the optical portion 22 of the optical element 20 mounted on the platform 10 faces into the through hole 12 of the platform 10. Therefore, the optical fiber 30 inserted into the through hole 12 is in a state where it is aligned with the optical part 22.

In this embodiment, the optical fiber 30 is disposed substantially parallel to the substrate 40. The optical portion 22 of the optical element 20 is directed toward the end face of the optical fiber 30, so that it is substantially parallel to the substrate 40. The electrodes 24 of the optical element 20 are oriented substantially perpendicular to the substrate 40. In such a state, the platform 10 is attached to the substrate 40 via, for example, the adhesive 14.

The substrate 40 may be formed of any of an organic or inorganic material, and may be formed of a composite structure thereof. A wiring pattern 42 is formed on the substrate 40. The substrate 40 includes
A plurality of external terminals 44 may be provided. External terminal 44
Are electrically connected to the wiring pattern 42. For example, the wiring pattern 42 is formed on one surface of the substrate 40, the external terminal 44 is provided on the other surface, and the external terminal 44 is electrically connected to the wiring pattern 42 through a through hole formed in the substrate 40. It may be connected. A solder ball may be used as the external terminal 44.

In the present embodiment, the electrode 24 of the optical element 20
And the wiring pattern 42 formed on the substrate 40 are electrically connected. The electrode 24 and the wiring pattern 42
It can be electrically connected by solder (for example, solder balls) or conductive paste (for example, silver paste or UV paste).

In FIG. 1, the solder ball 46 is used to
An example in which the wiring pattern 42 and the wiring pattern 42 are electrically connected is shown. Specifically, a solder ball 46 is provided on the wiring pattern 42, and the side surface of the solder ball 46 and the electrode 20 of the optical element 20 are joined.

The conductive layer 16 is provided on the platform 10.
Is formed, the conductive layer 16 may be electrically connected to the wiring pattern 42 formed on the substrate 42 (see the fifth embodiment). The above-described means can be applied to the connection. FIG. 1 shows an example in which the conductive layer 16 and the wiring pattern 42 are electrically connected by the solder balls 48.

The semiconductor chip 50 may be mounted on the substrate 40. The semiconductor chip 50 has a built-in circuit for driving the optical element 20. FIG. 1 shows a semiconductor chip 5.
0 shows an example of face-up bonding.
In this case, for example, the semiconductor chip 50 may be bonded on the substrate 40 with the adhesive 52 while avoiding the wiring pattern 42. Alternatively, the semiconductor chip 50 may be bonded onto the wiring pattern 42 with an insulating adhesive. When the semiconductor chip 50 is subjected to face-down bonding, the semiconductor chip 50 is connected to the substrate 4 by using an anisotropic conductive film on the wiring pattern 42 or by bonding metal such as solder.
Fix to 0.

The semiconductor chip 50 and the optical element 20 are electrically connected. For example, the electrode 5 of the semiconductor chip 50
4 and the conductive layer 16 of the platform 10 may be connected by a wire 56. In this case, the electrode 2 of the optical element 20
As long as 6 and conductive layer 16 are electrically connected, semiconductor chip 50 and optical element 20 are electrically connected via conductive layer 16.

The optical module according to the present embodiment may include a sealing section 60. The sealing portion 60 seals at least an electrical connection between the electrode 24 of the optical element 20 and the wiring pattern 42 formed on the substrate 40. Sealing part 60
Is composed of a first resin part 62 and a second resin part 64.

The first resin portion 62 is provided on the electrode 2 of the optical element 20.
The electrical connection (including the solder ball 46) between the wiring pattern 4 and the wiring pattern 42 formed on the substrate 40 is sealed. Further, the first resin portion 62 may seal an electrical connection between the optical element 20 and another component. For example, the first resin portion 62 includes the conductive layer 16 connected to the electrode 26 of the optical element 20.
And an electrical connection portion with the wire 56 connected to the semiconductor chip 50 may be sealed. Also, the first resin portion 62
Is a conductive layer 16 connected to the electrode 26 of the optical element 20,
The electrical connection (including the solder ball 48) with the wiring pattern 42 formed on the substrate 40 may be sealed. The first resin part 62 includes the platform 10 and the optical element 2.
At least one of 0, preferably both may be sealed. Further, the first resin portion 62 may seal a part of the optical fiber 30 to prevent the optical fiber 30 from coming off from the platform 10.

The second resin portion 64 seals the first resin portion 62. The second resin portion 64 may seal a part of the optical fiber 30 to prevent the optical fiber 30 from coming off from the platform 10. The second resin portion 64 may seal an electrical connection between the semiconductor chip 50 and another component. For example, the second resin portion 64 is provided on the
The electrical connection between the wire and the wire 56 is sealed.

It is preferable that the first resin portion 62 has higher flexibility than the second resin portion 64. For example, it is preferable that the stress generated when the first resin portion 62 contracts or expands is lower than that of the second resin portion 64. Or the first
It is preferable that the resin portion 62 absorbs the stress applied from the outside more easily than the second resin portion 64. The first resin portion 62 having high flexibility can protect an electrical connection portion (including the solder ball 46) between the electrode 24 of the optical element 20 and the wiring pattern 42 formed on the substrate 40. On the other hand, the second resin portion 64 is not required to be as flexible as the first resin portion 62, so that the range of material selection is expanded.

The present embodiment is configured as described above, and its manufacturing method will be described below.

The method for manufacturing an optical module includes a step of mounting the optical element 20 on the platform 10. For example,
The optical element 20 is mounted on the platform 10 and the conductive layer 1
6 electrically. Optical part 22 of optical element 20
Is directed into the through hole 12. The optical element 20 and the conductive layer 16 of the platform 10 are connected by an electrode 26. The optical element 20 and the platform 10 may be fixed by joining the conductive layer 16 and the electrode 26. Further, the dummy electrode of the electrodes 26 and the conductive layer 16 may be joined.

Further, the optical fiber 30 is mounted on the platform 10 while being aligned. For example, the optical fiber 30 may be inserted into the platform 10. This step may be performed before or after the step of mounting the platform 10 on the substrate 40.

In the present embodiment, the platform 10 is attached to the substrate 40. When performing this mounting, it is preferable that the optical element 20 is already mounted on the platform 10. The platform 10 may be bonded to the substrate 40 with an adhesive 14 or the like.

Next, the electrode 24 of the optical element 20 and the substrate 40
A method for electrically connecting the wiring pattern 42 formed in the above will be described. For example, in the example shown in FIG.
And the wiring pattern 42 are located at right angles to each other. In this case, a solder ball 46 is attached between the electrode 24 and the wiring pattern 42, and the solder ball 46 is heated and melted in a reflow process or the like to be joined between the two. Alternatively, a solder ball 46 is attached to the wiring pattern 42 in advance, heated and melted and joined to the wiring pattern 42, the platform 10 is mounted on the substrate 40, and the solder ball 46 is
May be heated and melted and joined to the electrode 24. Further, solder other than a ball shape or a conductive paste may be used. In the case of a conductive paste, it can be cured by irradiating heat or radiation such as ultraviolet rays.

In a similar manner, the conductive layer 16 of the platform 10 and the wiring pattern 42 may be electrically connected by solder such as solder balls 48 or conductive paste.

Further, the following steps may be performed if necessary. For example, a semiconductor chip 50 for driving the optical element 20 may be mounted on the substrate 40. The semiconductor chip 50 may be mounted on the substrate 40 after the platform 10 is mounted on the substrate 40. Further, the electrode 42 of the semiconductor chip 50 and the conductive layer 16 of the platform 10 may be connected by a wire 56.

In this embodiment, the platform 10
After mounting on the substrate 40, the sealing portion 60 may be provided.
For example, first, the first resin portion 62 is formed by sealing the electrical connection portion (including the solder ball 46) between the electrode 24 of the optical element 20 and the wiring pattern 42 with the first resin. After that, the first resin portion 62 is sealed with the second resin to form the second resin portion 64. Here, the first and second resins are selected such that the first resin portion 62 has higher flexibility than the second resin portion 64.

By doing so, for example, the first resin portion 6
The stress generated when 2 contracts or expands is lower than that of the second resin portion 64. Alternatively, the first resin portion 62 more easily absorbs stress applied from the outside than the second resin portion 62. The first resin portion 62 having high flexibility can protect an electrical connection portion between the electrode 24 and the wiring pattern 42. On the other hand, the second resin portion 64
Since flexibility is not required to be as high as that of the first resin portion 62, the range of material selection for the second resin is expanded.

According to the present embodiment, since the electrode 24 of the optical element 20 and the wiring pattern 42 are electrically connected, the outside and the optical element 20 are electrically connected via the wiring pattern 42. be able to. Therefore, when the connection with the outside is performed, no action is applied to the optical element 20, so that the position of the optical part 22 and the optical fiber 30 does not shift. In particular, if external terminals 44 electrically connected to the wiring patterns 42 are provided on the substrate 40 on which the wiring patterns 42 are formed, electrical connection to the outside can be achieved by the external terminals 44.

The present invention is not limited to the above embodiment, and various modifications are possible. Hereinafter, other embodiments will be described.

(Second Embodiment) FIG. 2 is a view showing an optical module according to a second embodiment to which the present invention is applied. This embodiment is different from the first embodiment in the means for electrically connecting the wiring pattern 42 formed on the substrate 40 and the electrode 24 of the optical element 20. For other configurations, the contents described in the first embodiment are also applied to the present embodiment.

In this embodiment, the conductive member 70 is provided on the wiring pattern 42. The conductive member 70 has elasticity. For example, the conductive member 70 is
And an elastic portion 74 rising from the fixing portion 72. The elastic portion 74 may have a plate shape or a wire shape. The elastic portion 74 is preferably a spring. By providing the conductive member 70 on the wiring pattern 42, the elastic portion 74 comes into contact with the electrode 24 of the optical element 20 due to its elasticity. That is, the elastic portion 74
It is in a state of being biased by the electrode 24. Thus, the wiring pattern 42 and the electrode 24 can be electrically connected via the conductive member 70.

In the method for manufacturing an optical module according to the present embodiment, it is preferable that the conductive member 70 is provided on the wiring pattern 42 and then the platform 10 on which the optical element 20 is mounted is mounted on the substrate 40. The elastic part 74 of the conductive member 70 may be bent in the direction of the electrode 24 of the optical element 20 before the platform 10 is attached. When the platform 10 on which the optical element 20 is mounted is attached to the substrate 40 while pushing the elastic portion 74 in this state back in the direction opposite to the bending direction, the elastic portion 74 and the electrode 24 come into contact with an urging force. This embodiment also achieves the same effects as the first embodiment.

(Third Embodiment) FIG. 3 is a view for explaining a method of manufacturing an optical module according to a third embodiment of the present invention. In this embodiment, a wire 80 is used instead of the solder ball 46 used in the first embodiment.
Use In other respects, the first embodiment also has the first
Since the contents described in the above embodiment can be applied, the same members will be described with the same reference numerals.

As shown in FIG. 3, a platform 10 on which an optical element 20 is mounted is mounted on a substrate 40. In the present embodiment, one end of the wire 80 is bonded to the wiring pattern 42 formed on the substrate 40. For this bonding, a bonder used for manufacturing a semiconductor device may be used. For example, a ball (not shown) formed at the tip of the wire 80 is bonded to the wiring pattern 42 using a normal single point bonder. This bonding may be performed before attaching the platform 10 to the substrate 40 or afterwards.

Next, a portion excluding both ends of the wire 80, that is, an intermediate portion, is bonded to the electrode 24 of the optical element 20. For example, after bonding the wire 80 to the wiring pattern 42, the wire 80 is
Is pulled out, and the intermediate portion of the wire 80 is bonded to the electrode 24 using the tool 82. The tool 82 applies at least one of heat and ultrasonic waves to the wire 80 and presses an intermediate portion of the wire 80 to the electrode 24.

Thus, the electrode 24 and the wiring pattern 42 can be electrically connected by the wire 80.
After that, by performing the steps described in the first embodiment, an optical module can be obtained. Also in the present embodiment, the effects described in the first embodiment can be achieved.

(Fourth Embodiment) FIG. 4 is a diagram showing an optical module according to a fourth embodiment to which the present invention is applied. Also in this embodiment, the same members as those described in the first embodiment are denoted by the same reference numerals and described. In the present embodiment, the wiring pattern 4 formed on the substrate 40
2 and the electrode 24 of the optical element 20 are electrically connected by a wire 90. One end of the wire 90 is bonded to the wiring pattern 42, and a portion excluding both ends, that is, an intermediate portion is a support member 92 and the electrode 2.
4 and is in contact with the electrode 24. Thus, the intermediate portion of the wire 90 is electrically connected to the electrode 24.

The support member 92 is provided on the substrate 40. For example, when the semiconductor chip 50 is mounted on the substrate 40, the support member 9
2 can be mounted and provided on the substrate 40. When electrical conduction with other members is to be achieved via the support member 92, it is preferable that at least a part of the support member 92 be made of a conductive material. When electrical conduction between the support member 92 and other members is to be avoided, at least a part, preferably the entirety of the support member 92 is made of an insulator. For example, when the support member 92 is attached to a part (for example, a side surface) of the semiconductor chip 50, the support member 9
2 is preferably an insulating member. Alternatively, an oxide film such as a silicon oxide film may be formed on a part (for example, a side surface) of the semiconductor chip 50, and this may be used as the support member 92.

Alternatively, the support member 92 may be bonded to the substrate 40. The other end of the wire 90 may be bonded to the electrode 54 of the semiconductor chip 50. Also in the present embodiment, the sealing portion 60 described in the first embodiment is used.
Can be applied.

Next, a method for manufacturing the optical module according to the present embodiment will be described. First, one end of the wire 90 is bonded to the wiring pattern 42, and one of the support member 92 and the platform 10 is attached to the substrate 40. The order of these two steps does not matter. Then, the other of the support member 92 and the platform 10 is
Attach to At this time, a portion excluding both ends of the wire 90, that is, an intermediate portion is sandwiched between the support member 92 and the electrode 24.
Thus, the wire 90 is sandwiched between the support member 92 and the electrode 24, and is electrically connected to the electrode 24. Also in the present embodiment, the same effects as in the first embodiment can be achieved.

(Fifth Embodiment) FIG. 5 is a diagram showing an optical module according to a fifth embodiment to which the present invention is applied. In the present embodiment, the configuration of the platform 100 is the same as the platform 1 described in the first embodiment.
Different from 0.

The platform 100 includes the optical element 20
The conductive layer 102 is continuously formed on the surface on which is mounted and on other surfaces (for example, side surfaces). The conductive layer 102 of the platform 100 is joined to a wiring pattern 104 formed on the substrate 40. For example, the conductive layer 102 and the wiring pattern 42 can be bonded by using a conductive adhesive or by metal bonding.
FIG. 5 shows an example in which the anisotropic conductive film 106 is used. In this case, the bump 10 is
8 is preferably formed. Anisotropic conductive film 106
The conductive particles are interposed between the conductive layer 102 and the wiring pattern 104 (specifically, the bumps 108) to achieve electrical continuity therebetween.

For the other configurations, the contents described in the first embodiment can be applied to this embodiment, and the same effects as those of the first embodiment can be achieved. Also, the optical element 2 in the platform 100
The conductive layer 1 is also formed on a surface (for example, a side surface) other than the surface on which the
Forming No. 02 and joining this surface (for example, the side surface) to the wiring pattern 104 can also be applied to the second to fourth embodiments.

Further, in the above-described embodiment, the configuration in which one optical fiber 30 is provided has been described. However, the present invention can be applied to a configuration in which a plurality of optical fibers 30 are arranged. That is, a plurality of optical fibers 30 are arranged in parallel, and the optical element 20 and the semiconductor chip 5
0 may be arranged.

FIG. 6 is a diagram showing an optical transmission device according to an embodiment to which the present invention is applied. The optical transmission device 110 interconnects electronic devices 112 such as a computer, a display, a storage device, and a printer. Electronic equipment 1
Reference numeral 12 may be an information communication device. Optical transmission device 11
0 may be a cable 114 in which plugs 116 are provided at both ends. The cable 114 includes one or more (at least one) optical fibers 30. Platforms 10 are provided at both ends of the optical fiber 30. The mounting state of the optical fiber 30 and the platform 10 is as described above. Plug 116
Has a built-in platform 10, and the platform 10 is mounted on a substrate 40, and a semiconductor chip 50 may be mounted on the substrate 40.

The optical element 20 mounted on one platform 10 connected to the optical fiber 30 is a light emitting element. An electric signal output from one of the electronic devices 112 is converted into an optical signal by the optical element 20 which is a light emitting element. The optical signal propagates through the optical fiber and is input to the optical element 20 mounted on the other platform 10. The optical element 20 is a light receiving element, and converts an input optical signal into an electric signal. The electric signal is transmitted to the other electronic device 11
2 is input. Thus, according to the optical transmission device 110 according to the present embodiment, the electronic device 112
Information can be transmitted.

[Brief description of the drawings]

FIG. 1 is a diagram showing an optical module according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating an optical module according to a second embodiment to which the present invention is applied.

FIG. 3 is a diagram illustrating a method for manufacturing an optical module according to a third embodiment to which the present invention is applied.

FIG. 4 is a diagram illustrating an optical module according to a fourth embodiment to which the present invention is applied.

FIG. 5 is a diagram showing an optical module according to a fifth embodiment to which the present invention is applied.

FIG. 6 is a diagram illustrating an optical transmission device according to an embodiment to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Platform 12 Through-hole 16 Conductive layer 20 Optical element 22 Optical part 30 Optical fiber 40 Substrate 42 Wiring pattern 44 External terminal 60 Sealing part 62 1st resin part 64 2nd resin part

Claims (23)

[Claims] 1. A substrate having a wiring pattern formed thereon, a platform attached to the substrate, an optical fiber disposed on the platform, an electrode and an optical part, wherein the optical part is an optical fiber An optical element mounted on the platform toward an end surface of the optical element, wherein the electrode is electrically connected to the wiring pattern. 2. The optical module according to claim 1, wherein the substrate is provided with an external terminal electrically connected to the wiring pattern. 3. The optical module according to claim 1, wherein the electrode is formed on a surface of the optical element opposite to the optical part. 4. The optical module according to claim 1, wherein the optical fiber is disposed substantially parallel to a surface of the substrate. 5. The optical module according to claim 1, wherein the surface of the electrode is positioned substantially perpendicular to the surface of the substrate. 6. The optical module according to claim 1, wherein one of a solder and a conductive paste is provided between the electrode and the wiring pattern to achieve electrical continuity. Optical module. 7. The optical module according to claim 1, wherein an elastic conductive member is provided on the wiring pattern, and the conductive member contacts the electrode by elasticity. Optical module. 8. The optical module according to claim 1, wherein the electrode and the wiring pattern are connected by a wire, and one end of the wire is bonded to the wiring pattern. An optical module in which a portion excluding an end of the wire is bonded to the electrode; 9. The optical module according to claim 1, wherein a support member is provided on the substrate, one end of a wire is bonded to the wiring pattern, and an end of the wire is provided. An optical module comprising a portion excluding a portion connected to the electrode by being sandwiched between the support member and the electrode. 10. The optical module according to claim 1, wherein a conductive layer is formed on the platform, and the conductive layer is electrically connected to the wiring pattern. Optical module. 11. The optical module according to claim 1, further comprising a sealing portion for sealing at least an electrical connection portion between the electrode and the wiring pattern. 12. The optical module according to claim 11, wherein the sealing portion seals an electrical connection between the electrode and the wiring pattern, and the first resin portion. A second resin part for sealing the optical module. 13. The optical module according to claim 12, wherein the first resin portion has higher flexibility than the second resin portion. 14. An optical module comprising: an optical fiber; and optical modules attached to both ends of the optical fiber, wherein the optical module is attached to the substrate, and the optical fiber is attached to the substrate. And an optical element having an electrode and an optical part, the optical part being mounted on the platform with the optical part facing the end face of the optical fiber, and the electrode being electrically connected to the wiring pattern. An optical transmission device comprising: 15. A step of mounting an optical element on a platform, a step of attaching the platform on which the optical element is mounted to a substrate on which a wiring pattern is formed, and positioning and supporting an optical fiber on the platform. A method for manufacturing an optical module, comprising: a step of: electrically connecting an electrode formed on the optical element and the wiring pattern. 16. The method for manufacturing an optical module according to claim 15, wherein in the step of electrically connecting the electrode and the wiring pattern, a solder or a conductive paste is provided between the electrode and the wiring pattern. Manufacturing method of optical module. 17. The method for manufacturing an optical module according to claim 15, wherein the step of electrically connecting the electrode and the wiring pattern includes: providing a conductive member having elasticity in the wiring pattern;
Then, a method for manufacturing an optical module, in which the conductive member is brought into contact with the electrode. 18. The method for manufacturing an optical module according to claim 15, wherein the step of electrically connecting the electrode and the wiring pattern includes bonding one end of a wire to the wiring pattern, and then connecting the wire to the wiring pattern. A method of manufacturing an optical module by bonding a portion except for an end of the optical module to the electrode. 19. The method for manufacturing an optical module according to claim 15, wherein the step of electrically connecting the electrode and the wiring pattern includes bonding one end of a wire to the wiring pattern, After attaching one of the platforms to the substrate, a light excluding the end of the wire is sandwiched between a support member and the electrode, and the other of the support member and the platform is attached to the substrate. Module manufacturing method. 20. The method for manufacturing an optical module according to claim 15, further comprising: providing an external terminal electrically connected to the wiring pattern on the substrate. Method. 21. The method for manufacturing an optical module according to claim 15, wherein a conductive layer is formed on the platform, and the conductive layer and the wiring pattern are electrically connected to each other. A method for manufacturing an optical module including a connecting step. 22. The method for manufacturing an optical module according to claim 15, wherein an electrical connection between the electrode and the wiring pattern is sealed with a first resin. An optical module manufacturing method, comprising: forming a first resin part; and thereafter, sealing the first resin part with a second resin to form a second resin part. 23. The method of manufacturing an optical module according to claim 22, wherein the first resin portion has higher flexibility than the second resin portion.