JP2000345028A - Thermosetting polyamide resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition used to form a slurry having excellent storage stability by including a thermosetting polyamide resin having amide bonds, ester bonds, and secondary hydroxy groups with a cellulose compound. SOLUTION: This composition comprises 100 pts.wt. (A) thermosetting polyamide resin having amide bonds, ester bonds, and secondary hydroxy groups, 1-500 pts.wt. (B) cellulosic compound, and, optionally, adjuvants such as a curing agent (e.g. melamine resin) and a diluent. Component A has a chemical structure represented by formula I or the like and is obtained by reacting a carboxy- terminated polyamide resin represented by formula II with an epoxy resin. Component B is exemplified by methyl cellulose, hydroxyethyl cellulose, or carboxymethyl cellulose. In the formula, R1 is a 4-20C diisocyanate residue, or a 2-120C diamine residue; R2 is a 2-120C dicarboxylic acid residue; R3 is an epoxy resin residue; and m and n are each a positive integer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a thermosetting polyamide resin composition.

[0002]

2. Description of the Related Art Polyamide resins are excellent in chemical resistance, heat resistance, adhesiveness to base materials, etc. because of their strong amide bond and are widely used as binders for paints and adhesives. Have been. However, when used as a binder for various powders corresponding to pigments in the case of paints, in a slurry of a polyamide-based resin dissolved in a solvent, especially a powder having a large specific gravity is mixed and dispersed, and then mixed,
The problem that the powder gradually settles out with the passage of time is likely to occur, and the storage stability of the slurry has not always been satisfactory.

[0003]

According to the first aspect of the present invention, when used as a binder for various kinds of powders, even when used in combination with a powder having a high true specific gravity, the powders do not settle down without being settled. An object of the present invention is to provide a thermosetting polyamide resin composition capable of preparing a slurry having excellent properties.

[0004]

The present invention relates to a thermosetting polyamide having (A) an amide bond, an ester bond formed by the reaction of a carboxyl group and an epoxy group, and a secondary hydroxyl group formed by the reaction. The present invention relates to a thermosetting polyamide-based resin composition containing a base resin and (B) a cellulose compound.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The thermosetting polyamide resin composition of the present invention comprises (A) an amide bond in the main chain, an ester bond formed by a reaction between a carboxyl group and an epoxy group, and the above-mentioned reaction. The thermosetting polyamide resin having a secondary hydroxyl group and the cellulose compound (B) are essential components.

The component (A) in the present invention is produced, for example, by reacting a carboxyl group-terminated polyamide resin (a) with an epoxy resin (b). As the component (a),
There is no particular limitation, for example, the general formula (I) obtained by reacting diisocyanate (a1) or diamine (a1 ′) with dicarboxylic acid (a2).

Embedded image (Wherein, R ¹ represents a diisocyanate residue having 4 to 20 carbon atoms or a diamine residue having ² to 120 carbon atoms, R ² represents a dicarboxylic acid residue having ² to 120 carbon atoms, and n is a positive integer. ) Are included.

Here, a diisocyanate residue having 4 to 20 carbon atoms, a diamine residue having 2 to 120 carbon atoms,
Each of the 120 dicarboxylic acid residues independently has 6 to 1 carbon atoms.
0 aromatic group, aliphatic group having 2 to 40 carbon atoms or 6 carbon atoms
May have an alicyclic group having from 10 to 10, and these groups further include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, a halogen atom and the like. You may have it as a substituent. These components (a) are used alone or in combination of two or more.

The diisocyanate (a1) for producing the component (a) is not particularly limited, and examples thereof include aromatic diisocyanates (4,4'-diphenylmethane diisocyanate, 2,6-tolylene diisocyanate,
2,4-tolylene diisocyanate, 1,5-naphthalene diisocyanate, tolidine diisocyanate, p-
Phenylene diisocyanate, 4,4'-diphenyl ether diisocyanate, m-xylylene diisocyanate, m-tetramethyl xylylene diisocyanate, etc., aliphatic diisocyanates (1,6-hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, etc.), alicyclic diisocyanate (isophorone diisocyanate, 4,4'-dicyclohexylmethane diisocyanate (hydrogenated 4,4'-diphenylmethane diisocyanate), transcyclohexane-1, 4-diisocyanate, hydrogenated m-xylylene diisocyanate, etc.), and heterocyclic diisocyanate (3,9-bis (3-
Isocyanate propyl) -2,4,8,10-tetraspiro [5.5] undecane, etc., among which aromatic diisocyanates are preferred from the viewpoint of improving heat resistance and the like.

Diamine (a) for producing component (a)
1 ') is not particularly limited and includes, for example, aliphatic diamine (alkylenediamine, diaminopolydimethylsiloxane, polyoxyalkylenediamine, etc.) and alicyclic diamine (isophorone diamine, 4,4'-dicyclohexylmethanediamine, etc.). , A heterocyclic diamine (3,9-
Bis (3-aminopropyl) -2,4,8,10-tetraspiro [5.5] undecane and the like; aromatic diamines (p-phenylenediamine, m-phenylenediamine,
p-xylylenediamine, m-xylylenediamine,
4,4'- (or 3,4'-, 3,3'-, 2,4 '
-, 2,2 '-) diaminodiphenylmethane, 4,4'
-(Or 3,4'-, 3,3'-, 2,4'-, 2,
2'-) diaminodiphenyl ether, 4,4'- (or 3,4'-, 3,3'-, 2,4'-, 2,2'-)
Diaminodiphenyl sulfone, 4,4 '-(or 3,
4 '-, 3,3'-, 2,4 '-, 2,2'-) diaminodiphenyl sulfide, 4,4'- (or 3,3 '
-) Benzophenonediamine, 2,2-bis [4- (4
-Aminophenoxy) phenyl] propane, 4,4'-
Diaminobenzanilide) and the like.

As the diisocyanate (a1) or the diamine (a1 ') for producing the component (a), either of them may be used. However, in view of easiness of production of the component (A) and improvement in yield. Diisocyanate (a1) is more preferred. These components (a1) and (a1 ′) can be used alone or in combination of two or more.

The dicarboxylic acid (a2) for producing the component (a) is not particularly limited, and examples thereof include aliphatic dicarboxylic acids (succinic acid, glutaric acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, Dodecane diacid, eicosane diacid, dicarboxylic acid containing alkylene ether bond, dicarboxylic acid containing alkylene carbonate bond, dicarboxylic acid containing butadiene bond, dicarboxylic acid containing hydrogenated butadiene bond, dicarboxylic acid containing dimethylsiloxane bond, etc.), alicyclic dicarboxylic acid Acid (dimer acid, hydrogenated dimer acid, 1,4-cyclohexanedicarboxylic acid, etc.), heterocyclic dicarboxylic acid (pyridinedicarboxylic acid, etc.), aromatic dicarboxylic acid (isophthalic acid, terephthalic acid, phthalic acid, 1,5 -Naphthalenedicarboxylic acid, 4,
4'-diphenyl ether dicarboxylic acid, 4,4'-diphenyl sulfone dicarboxylic acid, 4,4'-benzophenone dicarboxylic acid, bis (4-carboxymethoxyphenyl) dimethylmethane, etc.), dicarboxylic acid containing imide bond (trimellitic anhydride) / Diamine = 2 mol / 1 mol reaction product), amide bond-containing dicarboxylic acid, ester bond-containing dicarboxylic acid, and the like. These components (a2) can be used alone or in combination of two or more.

The mixing ratio of diisocyanate (a1) or diamine (a1 ') and dicarboxylic acid (a2) for producing component (a) (carboxyl group in component (a2) / isocyanate group in component (a1) Or (a1 ')
The amino group in the component) is preferably less than 1/1 at an equivalent ratio, more preferably 1 / 0.5 to 1 / 0.97, and more preferably 1 / 0.67 to 1/0. .95, particularly preferably 1 / 0.75 / 1 / 0.91. When the compounding ratio is 1/1 or more, the component (a1) or the component (a1 ′) tends to remain as an unreacted product, and the terminal of the reaction product hardly becomes a carboxyl group. Component yields tend to decrease.

The component (a1) or the component (a1 ′) and the component (a)
2) The reaction of the components can be performed in an organic solvent. Such an organic solvent is not particularly limited, for example,
Amide solvents (N-methyl-2-pyrrolidone, N, N-
Dimethylacetamide, N, N-dimethylformamide, etc.), urea-based solvents (N, N-dimethylethyleneurea,
N, N-dimethylpropylene urea, tetramethyl urea, etc.), lactone solvents (γ-butyrolactone, γ-caprolactone, etc.), carbonate solvents (propylene carbonate, etc.), ketone solvents (methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.) , Ester solvents (ethyl acetate, n-butyl acetate, butyl cellosolve acetate, butyl carbitol acetate, ethyl cellosolve acetate, ethyl carbitol acetate, etc.), glyme solvents (diglyme, triglyme,
Tetraglyme), hydrocarbon solvents (toluene, xylene, cyclohexane, etc.), sulfone solvents (sulfolane, etc.) and the like. Among them, amide solvents, Urea-based solvents are preferred. Among them, N-methyl-2-pyrrolidone is preferred because it has no active hydrogen which easily inhibits the reaction between the component (a1) or the component (a1 ′) and the component (a2). , N, N-dimethylacetamide, N, N-dimethylethylene urea, N, N-dimethylpropylene urea, and tetramethyl urea, among which N-methyl-2-pyrrolidone is particularly preferred.

The amount of the organic solvent used is preferably 30 to 2000 parts by weight based on 100 parts by weight of the total of the component (a1) or the components (a1 ') and (a2).
The content is more preferably 50 to 1000 parts by weight,
It is particularly preferred that the amount be from 400 to 400 parts by weight. If the amount is less than 30 parts by weight, the solubility is poor, and the reaction system tends to be non-uniform or highly viscous. If the amount exceeds 2,000 parts by weight, the reaction does not easily proceed and the reaction tends to be difficult to complete. . These organic solvents can be used alone or in combination of two or more.

The component (a1) or the component (a1 ′) and the component (a)
2) The reaction temperature with the component is preferably 40 to 300 ° C, more preferably 100 to 250 ° C, and particularly preferably 120 to 220 ° C. If the reaction temperature is lower than 40 ° C., the reaction does not easily proceed and the reaction tends to be difficult to complete. If the reaction temperature exceeds 300 ° C., gelation or the like due to side reactions tends to occur, and the reaction tends to be difficult to control. The reaction time is about 10 minutes to 50 hours.

The component (b) is not particularly limited, and examples thereof include bifunctional aromatic glycidyl ethers (bisphenol A epoxy resin, tetrabromobisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, Naphthalene type epoxy resin, biphenyl type epoxy resin, tetramethyl biphenyl type epoxy resin, etc.), polyfunctional aromatic glycidyl ether (phenol novolak type epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene-
Phenol type epoxy resin, tetraphenylolethane type epoxy resin, etc., bifunctional aliphatic glycidyl ether (polyethylene glycol type epoxy resin, polypropylene glycol type epoxy resin, neopentyl glycol type epoxy resin, dibromoneopentyl glycol type epoxy resin, hexane Diol type epoxy resin),
Bifunctional alicyclic glycidyl ether (hydrogenated bisphenol A type epoxy resin, etc.), polyfunctional aliphatic glycidyl ether (trimethylolpropane type epoxy resin, sorbitol type epoxy resin, glycerin type epoxy resin, etc.), bifunctional aromatic glycidyl Esters (such as diglycidyl phthalate), bifunctional alicyclic glycidyl esters (such as diglycidyl tetrahydrophthalate, diglycidyl hexahexaphthalate and diglycidyl dimer), and bifunctional aromatic glycidylamines (N, N-diglycidylaniline, N, N-diglycidyltrifluoromethylaniline, etc.), polyfunctional aromatic glycidylamine (N, N, N ', N'-tetraglycidyl-4,4-diaminodiphenylmethane, 1,3- Screw (N, N-glycidic Aminomethyl) cyclohexane,
N, N, O-triglycidyl-p-aminophenol, etc., bifunctional alicyclic epoxy resin (alicyclic diepoxy acetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxylate, vinylcyclohexene dioxide) Etc.), bifunctional heterocyclic epoxy resins (such as diglycidyl hydantoin), polyfunctional heterocyclic epoxy resins (such as triglycidyl isocyanurate), and bifunctional or polyfunctional silicon-containing epoxy resins (such as organopolysiloxane type epoxy resins) And a dicarboxylic acid-modified epoxy resin (such as a dimer acid-modified epoxy resin) and a rubber-modified epoxy resin. Among them, a bifunctional epoxy resin is preferable from the viewpoint of easy control of the reaction, and a bifunctional epoxy resin is preferable. Among resins, bifunctional in terms of improving heat resistance More preferably aromatic glycidyl ethers, among which, in view of low cost, etc., bisphenol A type epoxy resins are particularly preferred. These components (b) can be used alone or in combination of two or more.

In the present invention, the compounding ratio of the carboxyl group-terminated polyamide resin (a) and the epoxy resin (b) for producing the component (A) (the epoxy group /
(Carboxyl group in component (a)) is 1/1 by an equivalent ratio.
Less than 1 / 0.25 / 1 / 0.9
0, more preferably 1 / 0.33 to 1/0.
83 is particularly preferable, and 1 / 0.45 to 1 /
It is extremely preferred to be 0.67. If the compounding ratio is 1/1 or more, the thermosetting property tends to be impaired, and the chemical resistance tends to decrease. When producing the component (A), the above-mentioned dicarboxylic acid (a2) for producing the component (a) may be used, if necessary, in addition to the component (a).
It may be used in a proportion of 10 to 90% by weight in the component (a).

The reaction between the components (a) and (b) can be carried out in an organic solvent. Such an organic solvent is not particularly limited, and examples thereof include an organic solvent that can be used when producing the component (a) described above. Among these, nitrogen-containing polar solvents (amide solvents, urea solvents) are preferred from the viewpoint of high solubility, high reaction promoting properties, and the like. Among these, components (a) and (b)
N-Methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylethyleneurea, N, N
-Dimethylpropylene urea and tetramethyl urea are more preferred, among which N-methyl-2-pyrrolidone is particularly preferred.

The amount of the organic solvent used is (a) component and (b)
The amount is preferably 30 to 2,000 parts by weight, more preferably 50 to 1,000 parts by weight, and particularly preferably 70 to 400 parts by weight based on 100 parts by weight of the total amount of the components. If the amount is less than 30 parts by weight, the solubility is poor, and the reaction system tends to be non-uniform or highly viscous. If the amount exceeds 2,000 parts by weight, the reaction does not easily proceed and the reaction tends to be difficult to complete. . These organic solvents can be used alone or in combination of two or more.

The reaction temperature between component (a) and component (b) is 4
0 to 300 ° C, preferably 100 to 250 ° C
The temperature is more preferably set to 120 to 220 ° C. If the reaction temperature is lower than 40 ° C., the reaction does not easily proceed and the reaction tends to be difficult to complete. If the reaction temperature exceeds 300 ° C., gelation or the like due to side reactions tends to occur, and the reaction tends to be difficult to control. The reaction time is
It is about 10 minutes to 50 hours.

In the production of the component (A), a catalyst can be used if necessary. Such catalysts are not particularly limited, and include, for example, tertiary amines (triethylamine, triethylenediamine, N, N-dimethylaniline, N, N-diethylaniline, N, N-dimethylbenzylamine, N-methylmorpholine, N-ethylmorpholine, N, N'-dimethylpiperazine, pyridine, picoline, 1,8-diazabicyclo [5.4.0] undecene-7 and the like, imidazole compounds (2-methylimidazole, 2-ethylimidazole, 2- Ethyl-4-methylimidazole, 2-methyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-
Cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole,
2-phenyl-4,5-dihydroxymethylimidazole, 1-azine-2-methylimidazole, etc.), organotin compounds (dibutyltin dilaurate, 1,3-diacetoxytetrabutyldistannoxane, etc.), quaternary onium salts ( Tetraethylammonium bromide, tetrabutylammonium bromide, benzyltriethylammonium chloride,
Trioctylmethylammonium chloride, cetyltrimethylammonium bromide, tetrabutylammonium iodide, dodecyltrimethylammonium iodide, benzyldimethyltetradecylammonium acetate, tetraphenylphosphonium chloride, triphenylmethylphosphonium chloride, tetramethylphosphonium bromide, etc.), Organic phosphorus compounds (such as 3-methyl-1-phenyl-2-phospholene-1-oxide), alkali metal salts of organic acids (such as sodium benzoate and potassium benzoate), and inorganic salts (zinc chloride, iron chloride, lithium chloride, Lithium bromide and the like, metal carbonyl compounds (octacarbonyldicobalt (cobaltcarbonyl) and the like), metal ether compounds (tetrabutoxytitanium and the like) and the like. These catalysts can be used alone or in combination of two or more. The use amount of these catalysts is 0.01 to
It is about 10% by weight.

As described above, the component (A) usually obtained in the form of a solution dissolved in an organic solvent has, for example, the chemical structure represented by the following general formula (II).

Embedded image (Wherein, the definitions of R ¹ , R ² , and n are the same as those of formula (I), R ³ represents an epoxy resin (b) residue, and m is a positive integer.)

Weight average molecular weight of component (A) (measured by gel permeation chromatography, lithium bromide monohydrate and phosphoric acid as buffering agents at concentrations of 0.03 mol / l and 0.06 mol / l, respectively) Using an eluent of an equal volume mixed solvent of N, N-dimethylformamide and tetrahydrofuran prepared as follows, and calculated as a polysterene conversion value from a calibration curve prepared using standard polysterene) is 1,000 to 1,000,000. It is preferably from 10,000 to 500,000, more preferably from 30,000 to 300,000, and most preferably from 50,000 to 200,000. If the weight average molecular weight is less than 1,000, chemical resistance and flexibility tend to decrease, and
If it exceeds 00, the solubility in an organic solvent is reduced, the viscosity of the resin solution is increased, and the resin is easily precipitated from the resin solution.

The cellulose compound (B) in the present invention is not particularly limited, and examples thereof include cellulose, cellulose ether (methyl cellulose, ethyl cellulose, propyl cellulose, isopropyl cellulose, butyl cellulose, benzyl cellulose, trityl cellulose, cyanethyl cellulose, hydroxyethyl cellulose, Ethyl cellulose, hydroxypropyl cellulose, hydroxypropyl methyl cellulose, carboxymethyl cellulose, carboxyethyl cellulose, carboxypropyl cellulose, carboxymethyl ethyl cellulose, carboxymethyl hydroxyethyl cellulose, ethyl hydroxyethyl cellulose, aminoethyl cellulose, diethylaminoethyl cellulose, dihydroxypropyl cellulose, hydroxy Ethyl hydroxypropyl cellulose, etc.) and cellulose esters (cellulose acetate, etc.). Among them, cellulose ether is preferred from the viewpoint of improving solubility in an organic solvent and the like. Among them, the storage stability of the slurry is preferable. In terms of being superior,
Methylcellulose is more preferable, and methylcellulose having a hydroxyl group derived from cellulose is particularly preferable from the viewpoint of improving chemical resistance, and the viscosity of a 2% by weight aqueous solution at 20 ° C. at 20 ° C. from the viewpoint of handleability as a solution. However, methyl cellulose of 0.01 to 10 Pa · s is very preferable. These components (B) are used alone or in combination of two or more. As the component (B), a commercially available product can be usually used as it is, but if necessary, a product obtained by chemically modifying a commercially available product by a known method may be used.

The amount (solid content) of component (B) in the thermosetting polyamide resin composition of the present invention is as follows:
The amount is preferably 1 to 500 parts by weight, more preferably 5 to 100 parts by weight, and particularly preferably 10 to 50 parts by weight based on 00 parts by weight (solid content). If the amount is less than 1 part by weight, the storage stability of the slurry tends to decrease, and if it exceeds 500 parts by weight, the thermosetting property tends to be impaired and the chemical resistance tends to decrease.

[0026] The thermosetting polyamide resin composition of the present invention is usually obtained by removing the used organic solvent from the solution of the component (A) (reaction solution after resin production) obtained in the form of a solution dissolved in an organic solvent. Instead, it is blended with the solution of the component (B) as it is to prepare. The solvent for dissolving the component (B) is not particularly limited, and for example, N-methyl-2-pyrrolidone is particularly preferable in terms of high solubility and the like.

The thermosetting polyamide resin composition of the present invention may further comprise, if necessary, a curing agent (a polyfunctional compound such as a melamine resin, an epoxy resin, a blocked isocyanate compound, or a maleimide resin), in addition to the above essential components. Various additives such as a thermoplastic resin (a polyamide resin, a polyimide resin, a polyamide imide resin, a polyester resin, a polyurethane resin, an acrylic resin, a fluororesin, etc.), a diluting solvent, and the like can be blended.

The thermosetting polyamide resin composition of the present invention described above can be used, for example, as a binder for paints and adhesives.

[0029]

The present invention will be described below with reference to examples. Synthesis Example 1 142.646 g of 4,4'-diphenylmethane diisocyanate as diisocyanate (a1) in a 2-liter separable flask equipped with a stirrer, thermometer, cooling condenser and nitrogen gas inlet tube under a nitrogen atmosphere.
(0.570 mol), 49.980 g (0.342 mol) of adipic acid as dicarboxylic acid (a2), 34.585 g (0.171 mol) of sebacic acid, hydrogenated dimer acid (acid value: 193.6 KOHmg / g) ) 99.103 g (0.
171 mol) and 381.36 g of N-methyl-2-pyrrolidone as an organic solvent were charged and heated to 130 ° C. On the way, the reaction system became a homogeneous solution at about 100 ° C., and carbon dioxide gas began to be generated due to the amidation reaction. When the reaction was allowed to proceed at 130 ° C. for 1 hour and then at 170 ° C. for 2 hours, generation of carbon dioxide gas was stopped, and a solution of the carboxyl group-terminated polyamide resin (a) was obtained.

Subsequently, the solution of the carboxyl group-terminated polyamide resin (a) was cooled to room temperature, and the epoxy resin (b) was used as a bisphenol A type epoxy resin (epoxy equivalent: 187 g / eq.) 116.565 g (0.5 g). 31
2 mol), hydrogenated butadiene bond-containing dicarboxylic acid as dicarboxylic acid (a2) (acid value: 52.7 KOHmg / g)
148.200 g (0.070 mol) and 430.02 g of N-methyl-2-pyrrolidone as an organic solvent were added, and the temperature was raised to 170 ° C again. After proceeding the reaction at the same temperature for 2.5 hours, 450.77 g of N-methyl-2-pyrrolidone was added as a diluting solvent, and the mixture was cooled to give a weight average molecular weight of 71.
000 (N) -methyl-2-pyrrolidone solution (solid content 30% by weight) was obtained.

Example 1 N-methyl-2-pyrrolidone solution (solid content 30% by weight) of the component (A) obtained in Synthesis Example 1 was 333.33 parts by weight (solids content 100 parts by weight), and (B) As a component, an N-methyl-2-pyrrolidone solution of methylcellulose (solid content: 5% by weight) having a residual ratio of cellulose-derived hydroxyl groups of 40% and a 2% by weight aqueous solution at 20 ° C of 0.02 to 0.03 Pa · s in viscosity. 533.40 parts by weight (solid content 26.67)
Parts by weight), 6.67 parts by weight of a melamine resin (hexamethoxymethylol melamine) as a curing agent, and 1031.46 parts by weight of N-methyl-2-pyrrolidone as a diluting solvent. 1904.86 parts by weight (solid content 13% by weight)
3.34 parts by weight).

Comparative Example 1 N-methyl-2-pyrrolidone solution (solid content 30% by weight) of component (A) obtained in Synthesis Example 1 was 333.33 parts by weight (solids content 100 parts by weight) and used as a curing agent. 5.26 parts by weight of a melamine resin (hexamethoxymethylolmelamine) and N-methyl-2-pyrrolidone 116 as a diluting solvent
By blending 5.12 parts by weight, 1503.71 parts by weight (solids content: 105.26 parts by weight) of a thermosetting polyamide resin composition for comparison (solid content: 7% by weight) was obtained.

The thermosetting polyamide resin compositions of Example 1 and Comparative Example 1 were each mixed with an amorphous carbon powder having a true specific gravity of 1.52 and an average particle size of 20 μm by a total of 95% in terms of solid content.
A slurry for storage stability evaluation was prepared by mixing and dispersing the slurry so as to obtain a weight percent. About half of each slurry was placed in a 4.5 cc polypropylene container with an inner diameter of φ15 × diameter of φ17 × 38 mm in height and allowed to stand at 20 ° C. for 72 hours. Then, the slurry at the bottom of the container was stirred with a spatula to obtain amorphous carbon. The sedimentation state of the powder was examined. The storage stability of the slurry was determined to be good when no sedimentation of the amorphous carbon powder was recognized by palpation with a spatula, and poor when sedimentation of the amorphous carbon powder was clearly recognized. Table 1 shows the results.

[0034]

[Table 1]

From the above results, when the thermosetting polyamide resin composition of the present invention is used as a binder for various powders, the powders settle even in combination with a powder having a large true specific gravity. It can be seen that a slurry having excellent storage stability, which cannot be obtained with a comparative thermosetting polyamide-based resin composition, which is not obtained, can be prepared.

[0036]

The thermosetting polyamide resin composition according to claim 1 is used as a binder for various powders.
Even in combination with a powder having a large true specific gravity, a slurry having excellent storage stability without causing the powder to settle can be prepared.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 AB01X AB02X AB03X CD13W CL09W GH01 GJ01 4J036 AB01 AB02 AB05 AB09 AB10 AB15 AB17 AC01 AC03 AD05 AD08 AD09 AE07 AF06 AF08 AF15 AG06 AG07 AH01 AH06 AH07 AH10 AJ21 AJ11 DC FB09 JA01 KA01

Claims (1)

[Claims] 1. A thermosetting polyamide resin having an amide bond, an ester bond formed by a reaction between a carboxyl group and an epoxy group, and a secondary hydroxyl group formed by the reaction, and (B) a cellulose-based resin. A thermosetting polyamide-based resin composition containing a compound.