JP2000339672A - Glass substrate material for information memory medium and method for processing glass ceramic substrate material - Google Patents

Glass substrate material for information memory medium and method for processing glass ceramic substrate material

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Publication number
JP2000339672A
JP2000339672A JP2000070704A JP2000070704A JP2000339672A JP 2000339672 A JP2000339672 A JP 2000339672A JP 2000070704 A JP2000070704 A JP 2000070704A JP 2000070704 A JP2000070704 A JP 2000070704A JP 2000339672 A JP2000339672 A JP 2000339672A
Authority
JP
Japan
Prior art keywords
substrate material
processing
glass
diamond
information storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000070704A
Other languages
Japanese (ja)
Other versions
JP4049510B2 (en
Inventor
Naoyuki Goto
直雪 後藤
Takayuki Kishi
孝之 岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ohara Inc
Original Assignee
Ohara Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohara Inc filed Critical Ohara Inc
Priority to JP2000070704A priority Critical patent/JP4049510B2/en
Priority to MYPI20001130A priority patent/MY137347A/en
Publication of JP2000339672A publication Critical patent/JP2000339672A/en
Application granted granted Critical
Publication of JP4049510B2 publication Critical patent/JP4049510B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Glass Compositions (AREA)
  • Magnetic Record Carriers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Surface Treatment Of Glass (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To make processing on a prescribed substrate excellent in smoothness and surface defectiveness by forming many tile-like protrusions having flat peak parts by fixation of diamond abrasive grains to a resin blank. SOLUTION: Primary lapping is executed by using a diamond pellet fixed with the diamond abrasive grains to a bond, such as resin, metal or vitrified bond, in order to obtain a surface condition adequate for secondary processing comparatively in a short time. The grain size of the diamond abrasive grains fixed to the diamond pellet is preferably #800 to #1500 in order to suppress the generation of scratches and cracks on the surface of a base plate material. After the primary lapping, the secondary processing involving fine grinding with a diamond pad is executed. The diamond pad forms the many tile-like protrusions having the flat peak parts. The tile-like protrusions are formed by fixing the diamond abrasive grains to the resin blank.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、情報記憶装置に用
いられる情報記憶媒体用ガラス基板材またはガラスセラ
ミックス基板材の加工方法に関する。尚、本明細書にお
いて「情報記憶媒体」とは、パーソナルコンピュータの
ハードディスクとして使用される、固定型ハードディス
ク,リムーバル型ハードディスク,カード型ハードディ
スクや、デジタルビデオカメラ・デジタルカメラにおい
て使用可能なディスク状情報記憶媒体等を意味する。
The present invention relates to a method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium used in an information storage device. In this specification, an "information storage medium" is a fixed hard disk, a removable hard disk, a card hard disk used as a hard disk of a personal computer, or a disk-shaped information storage usable in a digital video camera / digital camera. Means medium and the like.

【0002】[0002]

【従来の技術】近年、従来の固定型情報記憶装置に対し
て、リムーバル方式やカード方式等の情報記憶装置が検
討、実用段階にありデジタルビデオカメラ,デジタルカ
メラ等の用途展開も始まりつつある。この様な動向によ
り、パーソナルコンピュータのマルチメディア化やデジ
タルビデオカメラ,デジタルカメラ等の普及が近年急速
に進みつつあり、動画や音声等の大きなサイズのデータ
を扱うべく、大容量の情報磁気記憶装置が求められてい
る。これに対応するため、情報記憶媒体はビットおよび
トラック密度を増加させ、ビットセルのサイズを縮小化
して面記録密度を大きくなければならず、一方磁気ヘッ
ドはビットセルの縮小化に合わせディスク表面により近
接して作動する、ニアコンタクトレコーディング、更に
コンタクトレコーディング方式を採用する方向へ進みつ
つある。
2. Description of the Related Art In recent years, information storage devices such as a removable type and a card type have been studied with respect to a conventional fixed type information storage device, and they are in a practical stage, and applications of digital video cameras and digital cameras have begun to be developed. Due to such trends, the use of multimedia in personal computers and the spread of digital video cameras, digital cameras and the like have been rapidly advancing in recent years. In order to handle large-sized data such as moving images and voices, large-capacity information magnetic storage devices have been developed. Is required. To address this, information storage media must increase bit and track densities and reduce the size of bit cells to increase the areal recording density, while the magnetic head moves closer to the disk surface as the bit cells shrink. It is moving toward the use of near contact recording and further contact recording.

【0003】このように磁気記録機密度の向上に伴い、
これら情報記憶媒体用基板材に求められる強度やその他
の物性(表面粗度等)もより高度となり、このためアル
ミニウム合金からガラスセラミックスや化学強化ガラス
へ材料のシフトが進行しつつある。これら化学強化ガラ
ス材料やガラスセラミックス材料の加工方法は、一般的
に1次加工→二次加工→研磨の3段階により構成され
る。一次加工については、遊離砥粒(SiC系)による
加工,ラップ方式によるダイヤモンドペレット加工方式
がある。また、二次加工については、近年加工レートの
向上や表面粗度の向上、研磨の短時間化を目的とした幾
つかの加工方法が提案されている。二次加工方法として
提案されているものとしては、ラップ方式による#20
00以上のダイヤモンドペレットによる加工方法,ロー
タリー方式による片面枚葉式のレジンまたはメタルダイ
ヤモンドホイールによる加工方法,さらにロータリー方
式による片面枚葉式のレジンまたはメタルダイヤモンド
ホイールにエリッド機構を施した加工方法が評価されて
いる。
As described above, with the increase in the density of a magnetic recording device,
The strength and other physical properties (such as surface roughness) required for these information storage medium substrates have also become higher, and as a result, materials are shifting from aluminum alloys to glass ceramics and chemically strengthened glass. The processing method of these chemically strengthened glass materials and glass ceramic materials is generally constituted by three steps of primary processing → secondary processing → polishing. As for the primary processing, there are a processing using loose abrasive grains (SiC type) and a diamond pellet processing method using a lap method. Regarding secondary processing, several processing methods have been recently proposed for the purpose of improving the processing rate, improving the surface roughness, and shortening the polishing time. As a secondary processing method, a lapping method # 20 has been proposed.
The processing method using diamond pellets of 00 or more, the processing method using a single-sided single-sided resin or metal diamond wheel using a rotary method, and the processing method using an elid mechanism on a single-sided single-sided resin or metal diamond wheel using a rotary method were evaluated. Have been.

【0004】しかしいずれの加工方法においても、基板
表面のスクラッチ・研削痕・基板材料を固定するための
吸引による吸着痕(枚葉式)・板厚の変動等の問題を有
しており、昨今の加工時間の短時間化・低コスト・高精
度を目的とした、情報記憶媒体用ガラス基板材またはガ
ラスセラミックス基板材の加工方法としては十分に対応
できる加工方法とは言い難いものとなっている。
[0004] However, any of the processing methods has problems such as scratches on the substrate surface, grinding marks, suction marks due to suction for fixing the substrate material (single-sheet type), and variations in plate thickness. It is difficult to say that the processing method of glass substrates or glass ceramic substrates for information storage media can be used satisfactorily with the aim of shortening the processing time, reducing cost, and increasing accuracy. .

【0005】[0005]

【発明が解決しようとする課題】本発明の目的は、前記
従来技術に見られる諸欠点を解消すべく、情報記憶媒体
用ガラス基板材またはガラスセラミックス基板材材に好
適な加工方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a processing method suitable for a glass substrate material or a glass ceramic substrate material for an information storage medium in order to solve the above-mentioned drawbacks in the prior art. It is in.

【0006】[0006]

【課題を解消するための手段】本発明者は、上記目的を
達成するために鋭意試験研究を重ねた結果、情報記憶媒
体用ガラス基板材またはガラスセラミック基板材の加工
方法において、一次ラップ加工はレジン,メタル,ビト
リファイド等のダイヤモンドペレットによるラップ加
工、次いで二次加工はダイヤモンドパッドによる加工と
することにより、表面の平滑性およびスクラッチ・研削
痕・吸引痕等の欠陥がなく、しかも短時間での加工が可
能となることを見い出し、本発明に至った。
Means for Solving the Problems The present inventor has conducted intensive tests and researches in order to achieve the above object, and as a result, in the method of processing a glass substrate material or a glass ceramic substrate material for an information storage medium, the primary lapping process is performed. Lapping with diamond pellets such as resin, metal, vitrified, etc., and secondary processing with diamond pads eliminates surface smoothness and defects such as scratches, grinding marks, suction marks, etc. They have found that processing is possible, and have reached the present invention.

【0007】すなわち、請求項1に記載の発明は、一次
ラップ加工と二次加工を含む基板材の加工方法であっ
て、該一次ラップ加工はレジン,メタル,ビトリファイ
ド等のボンドにダイヤモンド砥粒が固定されたダイヤモ
ンドペレットを用いてラップ加工することを特徴とし、
該二次加工は、該一次ラップ加工の後、ダイヤモンドパ
ッドにて精研削加工する工程であって、該ダイヤモンド
パッドは平坦な頂部を有した多数のタイル状凸起を有
し、該タイル状凸起は樹脂系素材にダイヤモンド砥粒が
固定されてなることを特徴とする、情報記憶媒体用ガラ
ス基板材またはガラスセラミックス基板材の加工方法で
あり、請求項2に記載の発明は、前記一次ラップ加工に
おいて、レジン,メタル,ビトリファイド等のボンドに
固定されたダイヤモンド砥粒の粒度が#800〜#15
00であることを特徴とする、請求項1に記載の情報記
憶媒体用ガラス基板材またはガラスセラミックス基板材
の加工方法であり、請求項3に記載の発明は、前記ダイ
ヤモンドペレットのボンドのヌープ硬度は、300×1
0〜800×10N/mm2の範囲内であることを特徴
とする、請求項1又は2記載の情報記憶媒体用ガラス基
板材またはガラスセラミックス基板材の加工方法であ
り、請求項4に記載の発明は、前記二次加工において、
ダイヤモンドパッドのダイヤモンド粒径が1〜15μm
の範囲内であることを特徴とする、請求項1から3のう
ちいずれか一項記載の情報記憶媒体用ガラス基板材また
はガラスセラミックス基板材の加工方法であり、請求項
5に記載の発明は、前記ダイヤモンドパッドの該タイル
状凸起のビッカース硬度は、5×10〜40×10N/
mm2の範囲内であることを特徴とする、請求項1から
4のうちいずれか一項記載の情報記憶媒体用ガラス基板
材またはガラスセラミックス基板材の加工方法であり、
請求項6に記載の発明は、前記加工方法において二次加
工後のガラス基板材またはガラスセラミックス基板材の
表面粗度Ra(算術平均粗さ)が50〜800Å,Rp
(最大山頂高さ)およびRv(最大谷底深さ)が300
〜3000Åであることを特徴とする、請求項1から5
のうちいずれか一項記載の情報記憶媒体用ガラス基板材
またはガラスセラミックス基板材の加工方法であり、請
求項7に記載の発明は、前記ガラス基板材の加工方法に
おいて、加工されるガラス基板材は、SiO2―Al2
3―R2O(但し、Rはアルカリ金属元素の中から選ばれ
る少なくとも1種以上)系化学強化ガラスであることを
特徴とする、請求項1から6のうちいずれか一項記載の
情報記憶媒体用ガラス基板材の加工方法であり、請求項
8に記載の発明は、前記ガラスセラミック基板材の加工
方法において、加工されるガラスセラミックス基板材
は、SiO2―Al23―Li2O系ガラスセラミックス
またはSiO2―Al23―MgO―TiO2系ガラスセ
ラミックスであることを特徴とする、請求項1から7の
うちいずれか一項記載の情報記憶媒体用ガラスセラミッ
クス基板材の加工方法であり、請求項9に記載の発明
は、前記ガラス基板材またはガラスセラミック基板材の
加工方法において、二次加工におけるダイヤモンドパッ
ドのダイヤモンド粒径が1〜15μmの範囲内であり、
かつ加工スラリーは1.0〜1.5μmの範囲のZrO
2またはAl23のいずれかの研磨材を3〜20wt%
含有することを特徴とする、請求項1から8のうちいず
れか一項記載の情報記憶媒体用ガラス基板材またはガラ
スセラミックス基板材の加工方法であり、請求項10に
記載の発明は、請求項1から9のうちいずれか一項記載
の方法により加工されたことを特徴とする、情報記憶媒
体用ガラス基板材またはガラスセラミックス基板材であ
る。尚、本明細書中において、Rp(最大山頂高さ)は
基板表面の基準長さにおける、粗さ曲線の平均線と最大
凸部の山頂との距離を示し、Rv(最大谷底深さ)は基
板表面の基準長さにおける、粗さ曲線の平均線と最大凹
部の谷底との距離を示す。
That is, the invention according to claim 1 is a method of processing a substrate material including a primary lapping process and a secondary processing, wherein the primary lapping process includes bonding of resin, metal, vitrified or the like with diamond abrasive grains. Characterized by lapping using fixed diamond pellets,
The secondary processing is a step of precision grinding with a diamond pad after the primary lap processing, wherein the diamond pad has a large number of tile-shaped protrusions having flat tops, and the tile-shaped protrusions are formed. 3. A method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium, characterized in that diamond particles are fixed to a resin-based material. In the processing, the particle size of the diamond abrasive fixed to the bond of resin, metal, vitrified, etc. is # 800 to # 15
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to claim 1, wherein the diamond pellet is a Knoop hardness of the bond of the diamond pellet. Is 300x1
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to claim 1, wherein the glass substrate material is within a range of 0 to 800 × 10 N / mm 2 . The invention provides, in the secondary processing,
Diamond size of diamond pad is 1-15μm
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to any one of claims 1 to 3, characterized in that: The Vickers hardness of the tile-shaped protrusion of the diamond pad is 5 × 10 to 40 × 10 N /
characterized in that it is in the range of mm 2, a processing method of any glass substrate member information storage medium of one claim or glass-ceramic substrate material of claim 1 4,
According to a sixth aspect of the present invention, in the processing method, the surface roughness Ra (arithmetic average roughness) of the glass substrate material or the glass ceramic substrate material after the secondary processing is 50 to 800 °, Rp
(Maximum peak height) and Rv (maximum valley depth) are 300
6. The method according to claim 1, wherein the angle is up to 3000 °.
8. A method for processing a glass substrate material for an information storage medium or a glass ceramic substrate material according to any one of the above, wherein the invention according to claim 7 is a glass substrate material processed in the method for processing a glass substrate material. Is SiO 2 —Al 2 O
3 -R 2 O (where, R represents at least one selected from alkali metal elements), wherein the system is a chemically tempered glass, information storage as claimed in any one of claims 1 to 6 A method for processing a glass substrate material for a medium, wherein the glass ceramic substrate material to be processed is SiO 2 —Al 2 O 3 —Li 2 O in the method for processing a glass ceramic substrate material. The processing of the glass ceramic substrate material for an information storage medium according to any one of claims 1 to 7, characterized in that the glass ceramic substrate is an SiO 2 -Al 2 O 3 -MgO-TiO 2 -based glass ceramic. The invention according to claim 9, wherein the method for processing a glass substrate material or a glass ceramic substrate material is characterized in that the diamond pad has a diamond pad in secondary processing. The particle size is in the range of 1 to 15 μm,
The processing slurry has a ZrO content of 1.0 to 1.5 μm.
2-20% by weight of either 2 or Al 2 O 3 abrasive
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to any one of claims 1 to 8, characterized in that the material is contained. 10. A glass substrate material for an information storage medium or a glass ceramic substrate material processed by the method according to any one of 1 to 9. In this specification, Rp (maximum peak height) indicates the distance between the average line of the roughness curve and the peak of the maximum convex portion at the reference length of the substrate surface, and Rv (maximum valley depth) is The distance between the average line of the roughness curve and the valley bottom of the largest concave portion at the reference length of the substrate surface is shown.

【0008】本発明の情報記憶媒体用ガラス基板材また
はガラスセラミックス基板材の加工方法を上記のように
限定した理由を以下に示す。
The reason why the method of processing the glass substrate material for information storage medium or the glass ceramic substrate material of the present invention is limited as described above will be described below.

【0009】本発明の基板材の加工方法は、一次ラップ
加工と二次加工を含む。まず、一次ラップ加工は比較的
短時間で二次加工に好適な表面状態を得るために、レジ
ン、メタル、ビトリファイド等のボンドにダイヤモンド
砥粒が固定されたダイヤモンドペレットを用いて加工す
る。ダイヤモンドペレットに固定されたダイヤモンド砥
粒の粒度は、基板材表面のスクラッチやクラックの発生
を抑制するために、#800以上が好ましい。また、加
工レートの減少に伴い加工時間が長時間化し高価となる
と同時に、ダイヤモンド砥粒の目づまり・目つぶれを防
止するために、該ダイヤモンド砥粒の粒度は#1500
以下が好ましい。一次ラップ加工に用いるダイヤモンド
ペレットのボンドのヌープ硬度は、加工性の点から、3
00×10〜800×10N/mm2の範囲内であるこ
とが好ましく、500×10〜700×10N/mm2
の範囲内であることがより好ましい。次に、二次加工に
ついて説明する。本発明に係る二次加工は、前記一次ラ
ップ加工の後、ダイヤモンドパッドにて精研削加工する
工程である。該ダイヤモンドパッドは平坦な頂部を有し
た多数のタイル状凸起を有し、該タイル状凸起は樹脂系
素材にダイヤモンド砥粒が固定されてなることが、本発
明において最も重要であり、本発明のポイントである。
ガラスセラミックス基板材を、一次ラップ加工した後、
二次加工として、樹脂系素材にダイヤモンド砥粒が固定
されてなるタイル状凸起を有したダイヤモンドパッドに
て精研削加工することによって、例えば、Ni−P等メ
ッキするに好適な表面性状の精研削面を得ることができ
る。また、ガラス又はガラスセラミックス基板材を、遊
離砥粒を用いて研磨する場合にあっては、一次ラップ加
工した後、二次加工として、樹脂系素材にダイヤモンド
砥粒が固定されてなるタイル状凸起を有したダイヤモン
ドパッドにて精研削加工することによって、その後の遊
離砥粒を用いた研磨の際、良好な平滑性の研磨面を短時
間で仕上げることを可能とすることができる。これに対
して、ラップ加工の後直接研磨すると、良好な平滑性の
研磨面に仕上げるのは困難であるか、又は非常に長い加
工時間を必要とする。また、ロータリー式ダイヤモンド
ホイール方式においても、得られる研磨面は十分ではな
い。前記タイル状凸起は平坦な頂部を有する。該タイル
状凸起の平坦な頂部は、該タイル状凸起がダイヤモンド
パッドの一方の面に多数敷かれ、仮想平面を形成するこ
とによって、精研削に供する。前記タイル状凸起は良好
な精研削効果を得るために、約1mm未満の隙間でダイ
ヤモンドパッドの一方の面に多数敷かれることが好まし
い。また、精研削の際、研削液が均等に行き渡り、か
つ、研削屑が円滑に排出されるよう、ダイヤモンドパッ
ドは、複数のタイル状凸起ごとに、幅約1〜10mmの
溝加工を施した物が好ましい。前記タイル状凸起の樹脂
系素材としては、ポリウレタン系、フェノール樹脂系、
メラミン樹脂系等の素材を使用することができる。本発
明の二次加工に用いるダイヤモンドパッドの該タイル状
凸起のビッカース硬度は、5×10〜40×10N/m
2の範囲内であることが好ましく、10×10〜30
×10N/mm2の範囲内であることがより好ましい。
The method for processing a substrate material according to the present invention includes a primary lap processing and a secondary processing. First, in order to obtain a surface state suitable for secondary processing in a relatively short time, primary lap processing is performed using diamond pellets in which diamond abrasive grains are fixed to a bond of resin, metal, vitrified or the like. The particle size of the diamond abrasive grains fixed to the diamond pellet is preferably # 800 or more in order to suppress generation of scratches and cracks on the surface of the substrate material. In addition, the processing time becomes longer as the processing rate decreases and the processing time becomes longer, and at the same time, the grain size of the diamond abrasive grains is set to # 1500 in order to prevent clogging / blinding of the diamond abrasive grains.
The following is preferred. The Knoop hardness of the diamond pellet bond used in the primary lapping process is 3 from the viewpoint of processability.
It is preferably in the range of 00 × 10 to 800 × 10 N / mm 2 , and 500 × 10 to 700 × 10 N / mm 2
Is more preferably within the range. Next, secondary processing will be described. The secondary processing according to the present invention is a step of performing precision grinding with a diamond pad after the primary lap processing. The diamond pad has a large number of tile-shaped protrusions having flat tops, and it is most important in the present invention that the tile-shaped protrusions are formed by fixing diamond abrasive grains to a resin material. This is the point of the invention.
After primary lapping of glass ceramic substrate material,
As secondary processing, for example, by performing fine grinding with a diamond pad having a tile-shaped protrusion in which diamond abrasive grains are fixed to a resin material, for example, surface texture suitable for plating with Ni-P or the like. A ground surface can be obtained. When the glass or glass ceramic substrate material is polished using free abrasive grains, after the primary lap processing, as a secondary processing, a tile-shaped convex in which diamond abrasive grains are fixed to a resin material. By performing precision grinding with a raised diamond pad, it is possible to finish a polished surface with good smoothness in a short time in subsequent polishing using loose abrasive grains. On the other hand, when directly polished after lapping, it is difficult to finish a polished surface with good smoothness, or requires a very long processing time. Further, even in the case of the rotary diamond wheel system, the polished surface obtained is not sufficient. The tile protrusion has a flat top. The flat top of the tile-shaped protrusion is subjected to fine grinding by forming a large number of the tile-shaped protrusions on one surface of the diamond pad to form a virtual plane. It is preferable that a large number of the tile-shaped protrusions are laid on one surface of the diamond pad with a gap of less than about 1 mm in order to obtain a good precision grinding effect. In addition, at the time of precision grinding, the diamond pad was subjected to a groove processing with a width of about 1 to 10 mm for each of a plurality of tile-shaped protrusions so that the grinding fluid was evenly distributed and the grinding chips were smoothly discharged. Are preferred. As the tile-shaped raised resin-based material, polyurethane-based, phenolic-based,
A material such as a melamine resin can be used. The Vickers hardness of the tile-shaped protrusion of the diamond pad used in the secondary processing of the present invention is 5 × 10 to 40 × 10 N / m.
m 2 , preferably 10 × 10 to 30
More preferably, it is within the range of × 10 N / mm 2 .

【0010】ダイヤモンドパッドはその固定されるダイ
ヤモンド砥粒の粒径が15μmを越えると目標とする表
面粗度が得られず、1μm未満では加工時間の増大に伴
うコスト増により、得られる基板材は非常に高価な物と
なってしまう。尚、前記ダイヤモンド粒径で構成される
ダイヤモンドパッドによって加工された後の基板表面粗
度Ra(算術平均粗さ)は、50〜800Å,Rp(最
大山頂高さ)およびRv(最大谷底深さ)は300〜3
000Åの範囲とすることが好ましい。
When the diameter of the fixed diamond abrasive grains exceeds 15 μm, the target surface roughness cannot be obtained. When the diameter of the diamond pad is less than 1 μm, the cost of the processing time increases and the substrate material obtained is large. It becomes very expensive. The substrate surface roughness Ra (arithmetic average roughness) after being processed by the diamond pad composed of the diamond particle diameter is 50 to 800 °, Rp (maximum peak height) and Rv (maximum valley depth). Is 300-3
It is preferably in the range of 000 °.

【0011】また、ダイヤモンドパッドによる加工を行
う時に研削液を用いるが、本発明では研削液の代わりに
加工スラリーとしてZrO2またはAl23の研磨材を
含有した研磨液を併用する事で加工レートの向上や表面
平滑性を向上させることも可能である。これらの研磨材
は1.0〜1.5μmの範囲のいずれかの研磨材を3〜
20wt%含有させたスラリーで加工することが好まし
い。
A grinding liquid is used when processing with a diamond pad. In the present invention, a processing liquid is used together with a polishing liquid containing an abrasive of ZrO 2 or Al 2 O 3 as a processing slurry in place of the grinding liquid. It is also possible to improve the rate and the surface smoothness. These abrasives may be any abrasive in the range of 1.0 to 1.5 μm for 3 to
It is preferable to process with a slurry containing 20 wt%.

【0012】尚、これらの加工方法で加工されるガラス
基板材は、SiO2―Al23―R2O(但し、Rはアル
カリ金属元素の中から選ばれる少なくとも1種以上)系
化学強化ガラス,SiO2―Al23―Li2O系ガラス
セラミックス,SiO2―Al23―MgO―TiO2
ガラスセラミックスに適しており、特にSiO2―Al2
3―MgO―CaO―Li2O―Na2O―ZrO2―Y
23―TiO2―As 23系化学強化ガラス,SiO2
Al23―Li2O―Na2O―ZrO2―As 23系化
学強化ガラスや、SiO2―Al23―MgO―ZnO
―Li2O―P25―ZrO2―K2O―Sb23系ガラ
スセラミックス,SiO2―Al23―MgO―CaO
―BaO―TiO2―P25―As23系ガラスセラミ
ックス,SiO2―Al23―MgO―CaO―SrO
―BaO―TiO2―ZrO2―Bi23―Sb23系ガ
ラスセラミックス材に適している。更に含有している結
晶相でいえば、二珪酸リチウム,SiO2系結晶(石
英,クリストバライト,トリジマイト等),コージェラ
イト,エンスタタイト,チタンサンアルミニウムマグネ
シウム,スピネル系結晶([Mgおよび/またはZn]
Al24,[Mgおよび/またはZn]2TiO4および
これら2結晶間の固溶体を指す),フォルステライト,
スポジューメンおよびこれら結晶の固溶体を結晶相とし
て含有するガラスセラミックスに非常に適したものであ
る。
The glass processed by these processing methods
Substrate material is SiOTwo―AlTwoOThree-RTwoO (where R is al
At least one selected from potassium metal elements)
Chemically strengthened glass, SiOTwo―AlTwoOThree―LiTwoO-based glass
Ceramics, SiOTwo―AlTwoOThree-MgO-TiOTwosystem
Suitable for glass ceramics, especially SiOTwo―AlTwo
OThree-MgO-CaO-LiTwoO-NaTwoO-ZrOTwo-Y
TwoOThree―TiOTwo-As TwoOThreeChemically strengthened glass, SiOTwo
AlTwoOThree―LiTwoO-NaTwoO-ZrOTwo-As TwoOThreeSystematization
Chemically strengthened glass, SiOTwo―AlTwoOThree-MgO-ZnO
―LiTwoOPTwoOFive―ZrOTwo-KTwoO-SbTwoOThreeSystem gala
Ceramics, SiOTwo―AlTwoOThree-MgO-CaO
-BaO-TiOTwo-PTwoOFive-AsTwoOThreeGlass ceramic
Box, SiOTwo―AlTwoOThree-MgO-CaO-SrO
-BaO-TiOTwo―ZrOTwo-BiTwoOThree-SbTwoOThreeSystem
Suitable for lath ceramic materials. Further contained
Speaking of the crystal phase, lithium disilicate, SiOTwoSystem crystal (stone
English, cristobalite, tridymite, etc.), cordilla
Site, enstatite, titanium aluminum
Cium, spinel crystal ([Mg and / or Zn]
AlTwoOFour, [Mg and / or Zn]TwoTiOFourand
Refers to the solid solution between these two crystals), forsterite,
Spodumene and a solid solution of these crystals are used as a crystalline phase.
Very suitable for glass ceramics containing
You.

【0013】[0013]

【発明の実施の形態】次に本発明の好適な実施例につい
て説明する。表1,表2には本発明の加工方法にて加工
した情報記憶媒体用ガラス基板材,ガラスセラミックス
基板材の組成、およびガラス基板材,ガラスセラミック
ス基板材の状態と各材料のヤング率,比重,ビッカース
硬度(Hv)を示した。また表3,表4には表1,表2
に記載のガラス基板材,ガラスセラミックス基板材の実
施加工例11種と、比較加工例として現在一般的に採用
されている加工方法を示した。またこれらの実施加工例
として、一次ラップのダイヤモンドペレットの番手、二
次加工のダイヤモンドパッドのダイヤモンド粒径、加工
スラリー研磨材の種類と粒径,含有量,加工後の表面粗
度Ra,Rv,Rp、および表面外観として、スクラッ
チ(細かい傷),ピット(深い穴状の凹み)の有無をそ
れぞれ示した。さらに本発明の加工方法および一般的な
加工方法で得られた各基板表面の外観状態の顕微鏡写真
(ノマルスキー式顕微鏡写真または表面欠陥検査装置に
よる写真)をそれぞれ図1〜8に示す。ここで図1は実
施加工例5のノマルスキ顕微鏡写真、図2は実施加工例
5の表面欠陥検査装置による写真。図3は実施加工例1
0のノマルスキ顕微鏡写真、図4は実施加工例10の表
面欠陥検査装置による写真。図5は比較加工例1のノマ
ルスキ顕微鏡写真、図6は比較加工例1の表面欠陥検査
装置による写真。図7は比較加工例2のノマルスキ顕微
鏡写真、図8は比較加工例2表面欠陥検査装置による写
真である。
Next, a preferred embodiment of the present invention will be described. Tables 1 and 2 show the composition of the glass substrate material and the glass ceramic substrate material for the information storage medium processed by the processing method of the present invention, the state of the glass substrate material and the glass ceramic substrate material, and the Young's modulus and specific gravity of each material. , Vickers hardness (Hv). Tables 3 and 4 show Tables 1 and 2 respectively.
And 11 processing examples of the glass substrate material and the glass ceramic substrate material described in the above section, and the processing methods generally used at present as comparative processing examples. Examples of these working examples include the number of diamond pellets in the primary lap, the diamond particle diameter in the diamond pad in the secondary processing, the type and particle size and content of the processing slurry abrasive, the surface roughness Ra, Rv, As Rp and surface appearance, the presence or absence of scratches (small scratches) and pits (deep hole-shaped dents) are shown. Further, FIGS. 1 to 8 show micrographs (Nomarski micrographs or photographs by a surface defect inspection apparatus) of the appearance of each substrate surface obtained by the processing method of the present invention and the general processing method. Here, FIG. 1 is a Nomarski microscope photograph of the working example 5, and FIG. 2 is a photograph by the surface defect inspection device of the working example 5. FIG. 3 is a working example 1
0 is a Nomarski microscope photograph, and FIG. 4 is a photograph by the surface defect inspection apparatus of Working Example 10. FIG. 5 is a Nomarski microscope photograph of Comparative Working Example 1, and FIG. 7 is a Nomarski microscope photograph of Comparative Working Example 2, and FIG. 8 is a photograph of the Comparative Working Example 2 by a surface defect inspection apparatus.

【0014】[0014]

【表1】 [Table 1]

【0015】[0015]

【表2】 [Table 2]

【0016】[0016]

【表3】 [Table 3]

【0017】[0017]

【表4】 [Table 4]

【0018】[0018]

【表5】 [Table 5]

【0019】本発明の加工実施例はそれぞれ3.5”デ
ィスク基板を用い、一次ラップ加工は、12B式両面加
工機により#800〜#1500番手のダイヤモンドペ
レット(ボンドのヌープ硬度は、600×10N/mm
2)を用い、加工荷重が100〜250g/cm2,加工
回転数が20〜50rpmの範囲で加工を行った。つい
で二次加工として、それぞれのダイヤモンド粒径のダイ
ヤモンド砥粒が樹脂系素材に固定されたタイル状凸起を
有するダイヤモンドパッドを用いて精研削加工した。こ
こでは、1.34×1.34×0.30mmの寸法のタ
イル状物を0.50mmの隙間で敷してタイル状凸起と
し、更に、11×11個のタイル状凸起ごとに、深さ
0.5mm、幅2.0mmの溝加工を施したダイヤモン
ドパッドを用いた。このダイヤモンドパッドの、タイル
状凸起が敷かれた側の面を、図9に示す。このダイヤモ
ンドパッドのタイル状凸起部分のビッカース硬度は、2
0×10N/mm2であった。ダイヤモンドパッドは約
1〜10mmの溝加工を施した物を12B式両面加工機
の上下定盤へ貼り付け、加工荷重が100〜250g/
cm2,加工回転数が20〜50rpmの範囲で約5〜
25分で加工を行った。
The working examples of the present invention each use a 3.5 "disk substrate, and the primary lapping work is a diamond pellet of # 800 to # 1500 using a 12B double-sided working machine (the Knoop hardness of the bond is 600 × 10N). / Mm
Using 2 ), processing was performed at a processing load of 100 to 250 g / cm 2 and a processing rotation speed of 20 to 50 rpm. Next, as secondary processing, fine grinding was performed using a diamond pad having tile-shaped protrusions in which diamond abrasive grains having respective diamond particle diameters were fixed to a resin material. Here, a tile-like object having a dimension of 1.34 × 1.34 × 0.30 mm is laid with a gap of 0.50 mm to form a tile-like protrusion, and further, for each 11 × 11 tile-like protrusions, A diamond pad having a depth of 0.5 mm and a width of 2.0 mm was used. FIG. 9 shows the surface of the diamond pad on which the tile-shaped protrusions are laid. The Vickers hardness of the tile-shaped protrusion of this diamond pad is 2
It was 0 × 10 N / mm 2 . The diamond pad, which has been subjected to a groove processing of about 1 to 10 mm, is attached to the upper and lower platens of a 12B double-sided processing machine, and the processing load is 100 to 250 g /.
cm 2 , and the number of processing rotations is about 5 to 20 to 50 rpm.
Processing took 25 minutes.

【0020】表3,4および図1〜8に示されるとお
り、本発明の加工方法は、加工後の表面粗度が従来の加
工法に比べて著しく改善され、且つ、従来問題とされた
基板表面のスクラッチ,ピット,研削痕,吸着痕が発生
していないものであり情報記憶媒体用ガラス基板材また
はガラスセラミックス基板材の加工方法として優れる方
法である。尚、本発明の加工方法で加工された基板材
は、後工程の研磨の短時間化を可能にすると同時に、平
滑性に優れた基板を得ることが可能なものであった。
As shown in Tables 3 and 4 and FIGS. 1 to 8, in the processing method of the present invention, the surface roughness after processing is remarkably improved as compared with the conventional processing method, and the substrate which has been regarded as a problem in the prior art is used. Since no scratches, pits, grinding marks and suction marks are generated on the surface, it is an excellent method for processing a glass substrate material for information storage media or a glass ceramic substrate material. In addition, the substrate material processed by the processing method of the present invention was capable of shortening the time required for polishing in a subsequent step and, at the same time, capable of obtaining a substrate having excellent smoothness.

【0021】[0021]

【発明の効果】以上述べたように、本発明の加工方法に
よれば、上記従来技術に見られる諸欠点を解消しつつ、
あらゆる情報記憶媒体用ガラス基板材またはガラスセラ
ミックス基板材の加工が平滑性・表面欠陥性に優れると
同時に、短加工時間による低コスト化に優れた情報記憶
媒体用ガラス基板材またはガラスセラミックス基板材の
加工方法を提供することができる。
As described above, according to the processing method of the present invention, while eliminating the above-mentioned disadvantages of the prior art,
The processing of all glass substrates or glass ceramic substrates for information storage media is excellent in smoothness and surface defects, and at the same time, the cost of glass substrates or glass ceramic substrates for information storage media is excellent in cost reduction due to short processing time. A processing method can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施加工例5のノマルスキ顕微鏡による基板表
面状態の写真。
FIG. 1 is a photograph of a substrate surface state by a Nomarski microscope of Working Example 5.

【図2】実施加工例5の表面欠陥検査装置による基板表
面状態の写真。
FIG. 2 is a photograph of a surface state of a substrate by a surface defect inspection apparatus of Working Example 5;

【図3】実施加工例10のノマルスキ顕微鏡による基板
表面状態の写真。
FIG. 3 is a photograph of a substrate surface state by a Nomarski microscope in Working Example 10.

【図4】実施加工例10の表面欠陥検査装置による基板
表面状態の写真。
FIG. 4 is a photograph of a substrate surface state by the surface defect inspection device of Working Example 10.

【図5】比較加工例1のノマルスキ顕微鏡による基板表
面状態の写真。
FIG. 5 is a photograph of a substrate surface state by a Nomarski microscope of Comparative Processing Example 1.

【図6】比較加工例1の表面欠陥検査装置による基板表
面状態の写真。
FIG. 6 is a photograph of a substrate surface state by a surface defect inspection device of Comparative Processing Example 1.

【図7】比較加工例2のノマルスキ顕微鏡による基板表
面状態の写真。
FIG. 7 is a photograph of a substrate surface state by a Nomarski microscope of Comparative Processing Example 2.

【図8】比較加工例2表面欠陥検査装置による基板表面
状態の写真。
FIG. 8 is a photograph of a substrate surface state by a comparative processing example 2 surface defect inspection apparatus.

【図9】ダイヤモンドパッドのタイル状凸起が敷かれた
側の面。
FIG. 9 is a diagram of a surface of a diamond pad on which tile-shaped protrusions are laid.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G11B 5/73 G11B 5/73 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G11B 5/73 G11B 5/73

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 一次ラップ加工と二次加工を含む基板材
の加工方法であって、該一次ラップ加工はレジン,メタ
ル,ビトリファイド等のボンドにダイヤモンド砥粒が固
定されたダイヤモンドペレットを用いてラップ加工する
ことを特徴とし、該二次加工は、該一次ラップ加工の
後、ダイヤモンドパッドにて精研削加工する工程であっ
て、該ダイヤモンドパッドは平坦な頂部を有した多数の
タイル状凸起を有し、該タイル状凸起は樹脂系素材にダ
イヤモンド砥粒が固定されてなることを特徴とする、情
報記憶媒体用ガラス基板材またはガラスセラミックス基
板材の加工方法。
1. A method of processing a substrate material including a primary lap processing and a secondary processing, wherein the primary lap processing is performed by using diamond pellets in which diamond abrasive grains are fixed to a bond of resin, metal, vitrified or the like. The secondary processing is a step of precision grinding with a diamond pad after the primary lap processing, wherein the diamond pad has a large number of tile-shaped protrusions having flat tops. A method for processing a glass substrate material for an information storage medium or a glass ceramic substrate material, wherein the tile-shaped protrusions are formed by fixing diamond abrasive grains to a resin material.
【請求項2】 前記一次ラップ加工において、レジン,
メタル,ビトリファイド等のボンドに固定されたダイヤ
モンド砥粒の粒度が#800〜#1500であることを
特徴とする、請求項1に記載の情報記憶媒体用ガラス基
板材またはガラスセラミックス基板材の加工方法。
2. In the primary lapping process, a resin,
The method for processing a glass substrate material for information storage media or a glass ceramic substrate material according to claim 1, wherein the particle size of the diamond abrasive grains fixed to the bond of metal, vitrified or the like is # 800 to # 1500. .
【請求項3】 前記ダイヤモンドペレットのボンドのヌ
ープ硬度は、300×10〜800×10N/mm2
範囲内であることを特徴とする、請求項1又は2記載の
情報記憶媒体用ガラス基板材またはガラスセラミックス
基板材の加工方法。
3. The glass substrate material for an information storage medium according to claim 1, wherein the Knoop hardness of the bond of the diamond pellet is in a range of 300 × 10 to 800 × 10 N / mm 2. Or a method of processing a glass ceramic substrate material.
【請求項4】 前記二次加工において、ダイヤモンドパ
ッドのダイヤモンド粒径が1〜15μmの範囲内である
ことを特徴とする、請求項1から3のうちいずれか一項
記載の情報記憶媒体用ガラス基板材またはガラスセラミ
ックス基板材の加工方法。
4. The glass for an information storage medium according to claim 1, wherein, in the secondary processing, a diamond pad has a diamond particle diameter in a range of 1 to 15 μm. Processing method of substrate material or glass ceramic substrate material.
【請求項5】 前記ダイヤモンドパッドの該タイル状凸
起のビッカース硬度は、5×10〜40×10N/mm
2の範囲内であることを特徴とする、請求項1から4の
うちいずれか一項記載の情報記憶媒体用ガラス基板材ま
たはガラスセラミックス基板材の加工方法。
5. The tile pad of the diamond pad has a Vickers hardness of 5 × 10 to 40 × 10 N / mm.
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to any one of claims 1 to 4, wherein the method is within the range of ( 2 ).
【請求項6】 前記加工方法において二次加工後のガラ
ス基板材またはガラスセラミックス基板材の表面粗度R
a(算術平均粗さ)が50〜800Å,Rp(最大山頂
高さ)およびRv(最大谷底深さ)が300〜3000
Åであることを特徴とする、請求項1から5のうちいず
れか一項記載の情報記憶媒体用ガラス基板材またはガラ
スセラミックス基板材の加工方法。
6. A surface roughness R of a glass substrate material or a glass ceramic substrate material after secondary processing in the processing method.
a (arithmetic mean roughness) 50-800 °, Rp (maximum peak height) and Rv (maximum valley depth) 300-3000
The method for processing a glass substrate material for information storage media or a glass ceramic substrate material according to any one of claims 1 to 5, characterized by Å.
【請求項7】 前記ガラス基板材の加工方法において、
加工されるガラス基板材は、SiO2―Al23―R2
(但し、Rはアルカリ金属元素の中から選ばれる少なく
とも1種以上)系化学強化ガラスであることを特徴とす
る、請求項1から6のうちいずれか一項記載の情報記憶
媒体用ガラス基板材の加工方法。
7. The method for processing a glass substrate material according to claim 7,
The glass substrate material to be processed is SiO 2 —Al 2 O 3 —R 2 O
The glass substrate material for an information storage medium according to any one of claims 1 to 6, wherein the glass substrate material is a chemically strengthened glass (where R is at least one selected from alkali metal elements). Processing method.
【請求項8】 前記ガラスセラミック基板材の加工方法
において、加工されるガラスセラミックス基板材は、S
iO2―Al23―Li2O系ガラスセラミックスまたは
SiO2―Al23―MgO―TiO2系ガラスセラミッ
クスであることを特徴とする、請求項1から7のうちい
ずれか一項記載の情報記憶媒体用ガラスセラミックス基
板材の加工方法。
8. In the method for processing a glass ceramic substrate material, the glass ceramic substrate material to be processed is S
wherein the iO is 2 -Al 2 O 3 -Li 2 O system glass-ceramic or SiO 2 -Al 2 O 3 -MgO- TiO 2 system glass ceramics, any one claim among claims 1 to 7 Processing method of glass ceramic substrate material for information storage medium.
【請求項9】 前記ガラス基板材またはガラスセラミッ
ク基板材の加工方法において、二次加工におけるダイヤ
モンドパッドのダイヤモンド粒径が1〜15μmの範囲
内であり、かつ加工スラリーは1.0〜1.5μmの範
囲のZrO2またはAl23のいずれかの研磨材を3〜
20wt%含有することを特徴とする、請求項1から8
のうちいずれか一項記載の情報記憶媒体用ガラス基板材
またはガラスセラミックス基板材の加工方法。
9. The method for processing a glass substrate material or a glass ceramic substrate material, wherein a diamond particle diameter of a diamond pad in the secondary processing is in a range of 1 to 15 μm, and a processing slurry is 1.0 to 1.5 μm. 3 one of the abrasive ZrO 2 or Al 2 O 3 range of
9. The composition according to claim 1, wherein the content is 20 wt%.
The method for processing a glass substrate material or a glass ceramic substrate material for an information storage medium according to any one of the above.
【請求項10】 請求項1から9のうちいずれか一項記
載の方法により加工されたことを特徴とする、情報記憶
媒体用ガラス基板材またはガラスセラミックス基板材。
10. A glass substrate material or a glass ceramic substrate material for an information storage medium, which is processed by the method according to any one of claims 1 to 9.
JP2000070704A 1999-03-24 2000-03-14 Processing method of glass substrate material or glass ceramic substrate material for information storage medium Expired - Fee Related JP4049510B2 (en)

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