JP2000336148A - Epoxy resin-low electron impedance polymer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an improved epoxy resin-low electron impedance polymer which maintains an excellent conductive function without obstructing the electric current path of a coating film with a resin. SOLUTION: A metal ion courpound solution is formed by dissolving a metal salt in an acid as shown by formula I, adding an alcohol to the solution, dehydrating the reaction product, adding a complex ion polymer to the dehydrated product, adding an alkaline solution such as an amine solution to the mixture to obtain the low electron impedance polymer intermediate such as an intermediate having units of formula II, wherein the intermediate has one or more sites capable of binding to a thermosetting engineering resin containing epoxy groups, such as a unit of formula III, adding the intermediate to such an epoxy resin (bisphenol-A type epoxy resin) as expressed by formula IV, adding 5 to 50 wt.% of an epoxy resin and a cross-linking agent such as a tertiary amine or a polyamide to the mixture, homogeneously stirring the mixture in a heated state to produce such the product as expressed by formula V. In the low electron impedance polymer intermediate, the π electron is replaced by the electron of the epoxy resin polymer to form an electric current path. The low electron impedance polymer-epoxy resin thermosetting polymer product reaching an intrinsic volume resistance of 10-2 (Ω/cm) is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin low electronic impedance high molecular weight polymer. In existing high molecular weight polymer systems, there is still no high molecular weight polymer that can be copolymerized, crosslinked with a resin monomer, and cured to form a conductive polymer. The epoxy resin itself, particularly when applied to epoxy resin floor coating, becomes an insulator having excellent insulation properties, withstand voltage, electrical conductivity, and the like. Generally, epoxy resin has a volume resistance coefficient of 10
¹² to 10 ¹⁷ (Ω / cm). To achieve static resistance or even the purpose of preventing explosion, the volume resistivity coefficient of the epoxy resin must be reduced to <10 ^-8 (Ω / cm).

With respect to the state of the art, it is common to add conductive metal particles, carbon black powder, surfactant crystallized particles, metal short fibers for electroplating, etc. to the epoxy resin base material to form another type of epoxy resin. It acts as a filler. Such a filler itself cannot participate in the cross-linking reaction between the epoxy resin polymers. Electric current is transmitted by contact between molecules of the conductive filler. Since the conductive filler does not undergo a crosslinking reaction with the epoxy resin, the formed epoxy resin conductive floor layer has many defects. For example, the basic physical properties of epoxy resin are impaired, mechanical strength is reduced, processing technology is limited, and the most serious thing is that the resin itself is not only non-conductive, It also impedes the continuity of the current in the conductive filler. Thus, the conductivity is unstable and the conductive floor will gradually lose its conductivity as it wears.

[0003] In this high-tech era, the electronics and chemical industries have been further developed and advanced. Various automatic manufacturing apparatuses are used at high efficiency and high speed. This leads to static electricity problems. Particularly in the field of the semiconductor industry, static electricity causes damage to semiconductor electronic circuits and causes large amounts of fine dust to adhere. As a result, the dust-free chamber is heavily contaminated. If an excessive amount of static electricity is accumulated, an electrostatic discharge spark may occur. Any flammable or explosive gas present could cause a catastrophic gas explosion. Therefore, in the field of floors of industrial factories, conductive epoxy resin floors play an important role.

In accordance with the above background, in the present invention,
The high molecular weight polymer as a non-filler directly participates in the cross-linking reaction between the epoxy resin polymers, copolymerizes with it, and cures to form a two-part cross-linking thermosetting engineering plastic. Such plastics have excellent electrical conductivity, general physical, chemical and mechanical properties, alkali / acid resistance, weather resistance, abrasiveness, long life of original epoxy resin Etc. can be kept sufficiently. In other words, this plastic is
It is a high molecular weight epoxy resin polymer with low electronic impedance.

More importantly, when a conductive floor coating is applied to a passageway, a series of conductive filler products that significantly limit processing techniques and methods in order to achieve the desired objectives. A different, high molecular weight epoxy resin polymer can be used in conventional processing of epoxy resins.

Undoubtedly, the epoxy resin conductive floor coating system of the present invention can be used in place of existing epoxy resin conductive floor coating systems made of conductive filler material. Thus, the sequential products according to the invention can be fully commercialized and widespread and specified when needed.

[0007]

BACKGROUND OF THE INVENTION As noted above, the state of the art of conductive and antistatic polymeric polymers is limited to the addition of conductive fillers, and the conductive and antistatic polymers that participate directly in the reaction. Alternatively, there is no high-molecular polymer having antistatic properties yet.

References currently being gathered, for example, Taiwan Patent No. 1052 entitled "Conductive Resin Compounds"
No. 27, this patent includes (1) 25-99.5.
There is disclosed a resin compound containing 1% by weight of an isomerized polymer and (2) 0.5 to 75% by weight of a conductive black. This reference states that the resin can be used with other “conductive filler materials”.

The so-called "conductive filling material" is, for example, graphite powder, silver powder, copper powder, nickel powder, stainless steel powder, tin dioxide powder, copper / silver mixture powder, nickel / silver mixture powder, silver-coated glass. It means a metal microparticle system such as a sphere or a copper gas sphere. Also, for example,
Metal fragment systems such as aluminum fragments, bronze fragments, nickel / iron alloy fragments are also meant. Further, it also means short metal fibers including carbon fiber, aluminum fiber, bronze fiber, aluminum strip, cold-plated glass fiber, carbon-coated glass fiber, and the like.

As can be seen from the specification of the above-mentioned Taiwanese patent,
The "conductive filler material" does not actually undergo a polymerization reaction with the high molecular weight polymer. Further, as clearly shown in the comparison table disclosed in this reference, when the four resins A / B / C / D are free from any conductive filler material, All measured volume resistivity coefficients are 10 ¹⁶ Ω
/ Cm. Therefore, it can be proved that the resin itself is a completely non-conductive high molecular polymer.

Further, Japanese Patent Publication No. 2-2904 entitled "Conductive Floor" discloses a conductive floor coating material made of a colored compound resin solidified at a standard temperature. Compound resins such as epoxy resins, unsaturated polyester resins and the like are mixed with conductive filler materials such as zinc white powder, aluminum microparticles and the like. This mixture is used with fibrous reinforcing materials such as carbon fiber, stainless steel fiber, glass fiber and anti-wear metal bone material (stainless steel microparticles). The conductive polymerization or reaction associated with this resin is not known from the specification of this reference. The specification of this application only describes what kind of conductive filler material is added and how this filler material is added to achieve better conductivity. Therefore, it is still concluded that the polymer resin itself is not conductive but is almost insulating.

It is interesting to note in this reference that the conductive flooring material has a viscosity of 4000-13000 cps and therefore good flowability. Therefore, a so-called "flat fluidized bed surface processing method" can be cited as a solution of the processing method.
However, in this method, only a flat surface and various colors can be obtained as selection methods. Processing issues for "mirror polishing" and "film thickness" are not mentioned. This further proves the fact that polymeric resins are essentially not conductive.

[0013] Further, Taiwan Patent Publication No. 343987 entitled "Antistatic Resin" discloses that 5-50% of a hydrophilic copolymer and 50-95% of a thermoplastic resin are used.
Antistatic resin compounds are disclosed. In fact, this hydrophilic copolymer is polymerized by an automatic emulsion polymerization method,
Related to the class of antistatic surfactants. Such antistatic agents are better than common ones. However, basically, this patent is also a kind of conductive filler material. It is clear from the table that when mixed with ABS resin, the lowest resistance coefficient of all examples is 7 × 10 ⁹ . Everything else is over 10 ¹⁰ . The electronic impedance of the surface of the formed product is still quite high. Therefore, such materials are not suitable as conductive additives for thermosetting resin floor coatings. In other words, adding such a conductive filler to the conductive floor coating cannot achieve a practical purpose.

Japanese Patent Nos. 165559 and 3rd
No. 6297 discloses the use of a kind of electroplating short fiber as a conductive filling material. These patents focus on methods of painting epoxy resin conductive floors. The materials used include: 1. carbon fiber mesh (conductive fiber mat material formed by carbon fiber); 2. alloy short fibers for electroplating; 3. Various metal scales (mainly copper, aluminum and stainless steel); There are various epoxy resin liquids. However, because the resin itself is not conductive,
To achieve satisfactory conductivity, a large amount of conductive filler material must be added to it. Basically, once the matting of the conductive carbon fiber is immersed in the non-conductive laminated resin, the conductive function immediately decreases, and it is necessary to add more short metal fibers to increase the conductivity. . Accordingly, material costs are increased and work time is considerably prolonged. Furthermore, if a large amount of conductive filler material is added, the gloss of the floor surface becomes dull. In addition, the fine particles of the filling material are oxidized and separated into dust. This not only leads to contamination, but also tends to cause unidentified sparks due to friction. Therefore, such coatings are full of potential hazards and are not ideal.

[0015]

According to the present invention, to solve the above-mentioned problems, a polymer having low electronic impedance is copolymerized with an epoxy resin so that the resin liquid itself is good and stable. A resin liquid having conductivity is formed. This avoids inconvenience and waste caused by adding a large amount of conductive filler material. The resin liquid can be used as a general epoxy resin floor coating.

With respect to the fiber laminate, the laminated epoxy resin liquid itself copolymerized with the low electronic impedance polymer of the present invention has a conductive function. Therefore,
Non-conductive glass fiber matting (GRF) can be immediately changed to a "conductive FRP complex laminate material" with excellent electrical conductivity. This is another feature of the present invention.

It is a principal object of the present invention to provide an epoxy resin polymer having low electronic impedance. This purpose can be explained from two perspectives. The first objective relates to the description of low electronic impedance high molecular weight polymer intermediates. The second objective relates to the description of the intermediate participating in the copolymerization of the epoxy resin to form a conductive low electronic impedance high molecular weight epoxy resin polymer.

[0018]

SUMMARY OF THE INVENTION To prepare an intermediate of a low electronic impedance high molecular polymer, a metal salt is mixed with a certain amount of an inorganic acid, which is sufficiently stirred to dissolve the metal ion. Form a solution. Next, alcohol is added to the solution, and a second dehydration is performed to form a complex ion polymer having a double bond and π electrons. Since the polymer is in an acidic environment, it itself continuously reacts and polymerizes.
Therefore, the acidic environment of the polymer is first neutralized and the pH is adjusted to 6
It is necessary to end the reaction while maintaining the value in the range of ８8 to ８8. This is the procedure for producing an intermediate of a low electronic impedance high molecular polymer. Generally, the best way to neutralize an acidic environment is to add a certain amount of amine to achieve the neutralization pH,
The end of the polymer reaction is to turn the polymer into a stable and useful material.

With respect to co-polymerizing between a low electronic impedance high molecular weight polymer intermediate and an epoxy resin to form a low electronic impedance high molecular weight epoxy resin polymer, it involves thermosetting engineering.・
Applicable to laminated products related to plastic products, painted films or epoxy resins. For example, there are civil engineering engineering systems, antistatic epoxy resin floor surfaces and conductive electrostatic spark / explosion prevention floor surfaces, and paint systems used for walls, operating room antistatic floor surfaces, ceiling / wall surfaces. Paint, anti-static paint on the plastic case surface of electrical appliances, furthermore, there are laminated complex materials, acid / alkali barrel laminate or storage tank laminate, for walls, floors, roof outer walls, etc. It is an electromagnetic interference prevention laminated coating.

The copolymerization of a low electronic impedance polymer intermediate and an epoxy resin will be described below with reference to a standard temperature two-part epoxy resin floor pavement material. During the stirring of the epoxy resin (bisphenol A type), a low electronic impedance polymer intermediate (pH 6 ~
8) is added to the epoxy resin and completely dissolved together. The various necessary auxiliaries especially used for the color paste and the conductive epoxy resin are then added to form the complete base agent mode of the conductive floor paint. Next, 5 to 50 of agents such as epoxy resin base agent
% Of a crosslinking reaction curing agent and uniformly stirred with the epoxy resin base material.

Thereafter, the mixture is applied to the surface of an unpainted article to form a coated film, or injected into a molding die, cured, released, and formed into a molded model body. This is a low electronic impedance high molecular polymer. During the crosslinking reaction, the low electronic impedance high molecular weight polymer intermediate plays an important guiding role. The resonance of the double bond and the π electrons contained therein and the mutual convolution between the molecular structures of the formed product form a current path to achieve the conductive function.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The description of the present invention is based on the low electronic impedance high molecular weight polymer intermediate, and the low electronic impedance high formed by the copolymerization cross-linking reaction and curing of the polymer intermediate and thermosetting engineering plastic or standard temperature two-part epoxy resin. Molecular polymer, which is divided into two main parts.

The production method, materials used, coating method, processing method, and formed body test comparison table for the two main parts will be described below one by one.

(A) Polymerization of low electronic impedance polymer
Interbody: 1. Preparation: The metal salt is added to an inorganic acid having a weight of 0.5 to 2.0 times its weight. In a sealed stirred tank, the mixture is thoroughly stirred to completely dissolve both and form a metal ion solution as shown in general formula (I):

Embedded image Calcium oxide and hydrochloric acid, upon dissolution, form calcium cations, chloride anions, and water, commonly referred to as metal ion compound solutions. While stirring slowly, a tertiary alcohol having a weight of 0.5 to 2.0 times the weight of the metal ion compound solution is slowly added to the metal ion compound solution. After performing the dehydration and polymerization twice, a complex ion polymer having a double bond, a hydroxyl group (-OH), and a positively charged π electron is formed.

Embedded image At this point, as shown in the general formula (II), the newly formed complex ionic polymer is in an acidic environment as an acidic polymer, the polymer itself is still active, and further reacts, It polymerizes and plasticizes. To terminate the reaction of the polymer, neutralize the pH (within about 6 to 8) by adding an amine-alkali solution having a weight of 0.5 to 2.0 times the weight of the polymer, The properties of the polymer must be stabilized to actually form a low electronic impedance high molecular weight polymer. This polymer has a bonding portion for bonding to a thermosetting engineering plastic polymer resin as in the structure of the general formula (III). This is one of the features of the present invention.

[0025]

Embedded image 2. Materials: The metal salt mentioned in the content of the production method 1 is selected from an acid salt or an alkali salt soluble in inorganic acids, alcohols, glycerin, water and the like. For example, calcium oxide, copper oxide, nickel oxide, silver oxide, aluminum oxide, chromium oxide, zinc oxide, ammonium chloride,
Barium chloride, lithium chloride, aluminum chloride, iron (III) chloride, silver chloride, zinc chloride, lithium carbonate, silver nitrate,
Select from lithium nitrate, lithium sulfate, barium sulfate, etc. The inorganic acid described in the content of the production method 1 is selected from sulfuric acid, hydrochloric acid, nitric acid, hydrobromic acid, hydroiodic acid, peroxochloroic acid, fluorosulfonic acid, trifluoromethylsulfonic acid and the like. The alcohol for dehydration is selected from tertiary alcohol, glycerin and the like. The alkaline solution for neutralizing the acid polymer is selected from amines such as aqueous ammonia.

(B) During polymerization of low electronic impedance polymer
Copolymerization of Interstitial with Thermosetting Standard Temperature Two-Part Epoxy Resin: Production method: 100 components of a thermosetting standard temperature two-part crosslinking epoxy resin monomer containing an epoxy group are placed in a sealed container. While stirring, slowly add a mixture of 5 to 25 components of the low electronic impedance high molecular weight polymer intermediate. At a standard temperature or a temperature of 60-70 ° C., the mixture is thoroughly stirred to completely dissolve both to form a low electronic impedance epoxy resin copolymer. This copolymerization treatment is as shown by the general formula (IV). Next, 5 to 25 components of a color filling material and necessary auxiliary agents are added to form a "base agent" of the low electronic impedance epoxy resin floor coating two-part liquid. 100% by weight of low electronic impedance epoxy resin floor coating base material and 5 to 50% of the weight of this base material
Is sufficiently mixed at a standard temperature with an epoxy resin crosslinking reaction crosslinking agent having a weight of, and uniformly stirred. At this time, the low electronic impedance high molecular weight polymer intermediate, epoxy resin base material and epoxy resin curing agent (crosslinking reaction crosslinking agent) copolymerize,
The crosslinking reaction cures to form a low electronic impedance copolymer product. During the cross-linking cure treatment, the π-electrons with a positive charge are exchanged with the electrons of the epoxy resin polymer in the low-electron impedance polymer polymer intermediate to form a current path by the mutual rotation between the structural molecules of the product. Become. Therefore, the low electronic impedance polymer epoxy resin thermosetting product has low electronic impedance,
Good conductivity.

Embedded image 2. Materials: The thermosetting resin described in the content of the production method 1 means a two-pack type epoxy resin polymer containing an epoxy group, which is a bisphenol A-based epoxy resin,
Select from phenolic epoxy, polyphenolic epoxy, polyhydroxyl benzene epoxy resin, carboxylic acid epoxy resin, aromatic bicarboxyl epoxy resin, cyclohexene epoxy resin, etc. In most cases, bisphenol A based epoxies are used. The cross-linking reaction cross-linking agent described in the content of the production method 1 is selected from fatty polyamines, aromatic amines, secondary and tertiary amines, polyamides and the like. The colors described in the contents of the preparation method 1 are lead yellow, zinc / chromium / yellow chromate, barium sulfate / lead sulfate sulfate, cobalt violet and manganese violet phosphate, cadmium yellow, cadmium red. And sulfides of mercury sulfide, iron cyanide, carbonates of calcium carbonate and magnesium carbonate, oxides of titanium white, zinc white, indian red and chromium oxide green, silicates of calcium silicate and ultramarine and aluminum Select from metal powder. The filling material mentioned in the content of the first manufacturing method is selected from inorganic materials. For example, calcium carbonate, mica powder, titanium white powder, carbon black, talc powder, feldspar powder, kaolin, barium carbonate, barium sulfate, magnesium carbonate, silicon carbide, quartz sand, quartz powder, potassium titanate, barium titanate, diatomaceous earth , Glass powder, barite, plaster of Paris, copper sulfate, chalk, etc. Auxiliaries referred to in the contents of the production method 1 include dispersants, humidifiers, leveling agents, abrasives, UV inhibitors, foam inhibitors, sediment inhibitors, thickeners, anti-scub agents (anti-sc
abbing agents), color floating inhibitors, color layering cap agents, gas whitening agents, reaction diluents, reaction accelerators and the like.

(C) Epoxy resin low electronic impedance
Description of Characteristics of High Polymer : (1) Resonant π electrons of the molecular structure form a current path by mutually reciprocating between molecules of the high polymer, thereby achieving the purpose of conductivity. This is different from typical conductive paints, which achieve a conductive function by adding large amounts of conductive fillers such as metallic microparticles or carbon powder. (2) When the low electronic impedance high polymer of the present invention is used as an epoxy resin conductive floor coating, the main component of the epoxy resin itself is a low electronic impedance high polymer having an excellent conductive function. Thus, the current path of the formed paint film is not hindered by the resin, and the excellent conductive function is maintained. Therefore,
During the processing of the conductive floor surface, it is not necessary to lay a copper mesh on the base material in advance as in the case of the conventional conductive floor surface, and it is only necessary to secure a connector for connecting to an outdoor ground wire. This reduces labor and costs. (3) Even when the low electronic impedance high molecular weight polymer of the present invention is used as an epoxy resin conductive floor coating, tensile strength, compression resistance, acid / alkali resistance, chemical resistance,
Epoxy resin, such as abrasion resistance, dust resistance, impact resistance, adhesive strength, low shrinkage, temperature difference resistance, bending strength, oil resistance, solution resistance, low water absorption, bright color, gloss etc. Still maintain various excellent mechanical properties, good physical and chemical properties. (4) When the low-impedance high-molecular polymer of the present invention is used as an epoxy resin conductive floor coating, the processing method is exactly the same as a general epoxy resin floor coating processing method. Workers can finish the epoxy resin floor surface with perfect appearance, excellent mechanical properties and conductive function simply by working according to the general standard floor processing method. In other words, the method of processing the epoxy resin conductive floor is not limited at all. (5) When the low-impedance high-molecular polymer of the present invention is used as an epoxy resin conductive floor coating, there is a characteristic that cannot be achieved by a general conductive floor coating. That is, the intermediate coating and the surface coating can be formed thick by bending to obtain gloss and brightness similar to those of a general epoxy resin floor surface. This is different from a conventional epoxy resin conductive floor surface which can obtain only a dull floor surface even when painted with a roller. (6) When the low-impedance high-molecular polymer of the present invention is used as an epoxy resin conductive floor coating, it is formed integrally without joining seams and without scattering dust. . This is different from the conventional conductive paint in which the resin component becomes insufficient due to the addition of a large amount of the conductive filler material. Conventional conductive paints are inevitably worn or oxidized. In such a situation, the conductive filling material of the fine particles is separated into dust, which impairs the cleanliness of the dustproof chamber. (7) When the low electronic impedance high polymer of the present invention is used as an epoxy resin conductive floor coating, it has very good electrical conductivity. Its surface volume resistivity is within 10 ⁸ to 10 ⁻² (Ω / cm). (8) When the low electronic impedance high molecular weight polymer of the present invention is used as an epoxy resin conductive laminated reinforcing complex paint,
The epoxy resin laminate liquid itself is a low electronic impedance high molecular polymer, which has an excellent conductive function after being immersed and cured. It can be changed to a conductive fiber sheet having a sexual function.

(D) Epoxy resin low electronic impedance
Description of Uses of High-Polymer: (1) The specific volume resistance of antistatic paint for floor, ceiling, and wall is generally within 10 ⁸ to 10 ⁶ (Ω / cm). Therefore, hospital operating rooms, laboratories, electronic factory dust-free rooms, semiconductor production lines, computer mainboard production lines, high transparency plastic film production lines, food packaging rooms, which must be dust-free and free of electrostatic interference It can be applied to aseptic rooms, precision machinery and equipment factories, printing factories, computer control rooms, aircraft aerodynamic simulation laboratories, etc. (2) The explosion-proof conductive floor has a specific volume resistance of 10 ⁵ to
10 ² (Ω / cm). This includes military ammunition and ammunition storage, firecrackers and firecracker storage, chemical factories, solvent, oil, natural gas supply and storage,
Gas production plant, body paint room, rice mill, grain processing plant,
Applicable to food manufacturing factories, silos, etc. (3) The specific volume resistance of the laminated coating for blocking electromagnetic waves is 10 ²
10 ⁻² (Ω / cm). These include electromagnetic wave generator drive protection shield, high power transmission tower drive / driven electromagnetic wave protection shield, aircraft / satellite control center drive / driven electromagnetic wave protection shield, communication machine room, robot production line control room, etc. Applicable.

(E) Epoxy resin low electronic impedance
Description of processing method of high-molecular polymer: (1) Coating method: What is required for antistatic function is 10 ⁹
It is only within the range of 〜１０10 ⁷ (Ω / cm).
This is a simple processing method used for sections that do not require much brightness, non-acidic / alkaline wet manufacturing treatment sections, and the like. The tools used are rollers and hairbrushes. This is because the film thickness is 0.5m
m or less, which is a method for processing a flat finish thin coating. (2) Self-plane smoothing coating method: For places where the conductive function is more strictly required, the surface impedance coefficient is 10 ⁶ to 10 ² (Ω / cm). This processing method can be applied to these places. This processing method
It is characterized in that thick coating is performed with a bending iron.
The surface is conductive, resulting in a glossy finish. This clearly distinguishes the features of the present invention from other technologies. (3) Resin sand / plasma processing method: In the case of a warehouse workshop where a heavy forklift runs or is exposed to a heavy load, the surface impedance value is 10 ⁶ to 10.
⁴ (Ω / cm). This processing method can be applied to such a place. This processing method is characterized in that the surface is conductive, is thickly coated, and can withstand heavy loads. (4) Glass fiber lamination processing method: This processing method can be applied to an acid / alkali liquid, an impact at the time of punching processing, or an area where a base has severe cracks. The impedance value is 1
0 ⁸ to 10 ⁵ (Ω / cm). When used as an electromagnetic wave protection shield, the impedance value is 10 ⁶ to 10 ^-2 (Ω / c
m), and the glass fiber laminated roof / wall covering method can be applied. A common feature is that non-conductive glass fibers can be turned into glass fiber sheets with excellent conductive functions.

(F) Low electronic impedance of the present invention
When the polymer is used as an epoxy resin conductive paint
It is comparable to existing epoxy resin conductive paints. (1) The basic conductivity factor is different: (a) The basic conductivity factor of the epoxy resin low electronic impedance polymer of the present invention is a copolymer of a metal salt complex ion compound, an epoxy resin and a crosslinking reaction crosslinking agent. And combine to form a low electronic impedance copolymer product. The π electrons displace the electrons of the epoxy resin polymer and form a current path through the mutual convolution between the structural molecules of the product. (B) The basic conductivity factor of existing epoxy resin conductive paints is that a conductive filler material such as fine metal particles, carbon powder, metal fragments, and short metal fibers is added to the non-conductive epoxy resin paint. It is. The current travels through a current path formed by the contact between the metal particles. However, the epoxy resin itself is still a polymer having no conductivity. (2) Different conductive energies: (a) Since the epoxy resin low electronic impedance polymer of the present invention itself is a conductor, the products have high conductive energy and low electronic impedance. In a room where the room temperature is 23 ° C. and the relative humidity is 50%, the specific volume resistance is 10 ⁹ to 10 ⁻² (Ω / cm). This reaches any level of explosion protection. (B) In existing epoxy resin conductive paints, the epoxy resin is a non-conductive high molecular weight polymer that blocks the current path during the reaction and formation procedure and greatly reduces conductive energy. At room temperature of 23 ° C. and 50% relative humidity, the specific volume resistivity is only 10 ⁹ to 10 ⁵ (Ω / cm). This can hardly reach the explosion protection level. (3) The continuity of the conductive function is different: (a) Since the epoxy resin of the present invention itself is a conductor, the product continues the current path by the crosslinking reaction of the polymer. There is no way to prevent it. Thus, the conductive function is durable. (B) In the existing epoxy conductive paint, since the high molecular polymer itself is nonconductive, the current path of the fine particles of the conductive filler material is gradually blocked by the crosslinking reaction of the polymer. become. Therefore, the conductive function of the formed product is not persistent and gradually deteriorates with time. (4) Different accessories for the conductive floor surface: (a) Since the epoxy resin low electronic impedance high molecular weight polymer itself of the present invention is a conductor, when used as a floor surface paint, a bottom paint layer and an intermediate paint layer The surface paint layers all have good conductive energy, thus simplifying their accessories. It is only necessary to provide a connector in the corner of the wall for connecting to an external ground wire. This eliminates considerable trouble when working and reduces costs. (B) In the existing epoxy resin conductive paint, since the conductive filler material is blocked by the non-conductive resin, the conductive function is interfered and becomes unstable. Therefore,
One way to increase conductivity is to use an earth mesh (conductive copper foil, copper mesh,
Metal mesh, conductive tape, etc.) must be added to the raw cement base. This complicates the processing operation and causes material waste. (5) Different paint color restrictions: (a) When used as a conductive paint, the epoxy resin low electronic impedance polymer of the present invention is a conductive filler material that will affect color brightness. (For example, metal microparticles, carbon powder, etc.), so no matter what color the formed product has,
The product can retain its gloss indefinitely. (B) In existing epoxy resin conductive paints, a large amount of conductive filler material is added, which affects the color gloss and the color of the formed product is green, gray, brown, black. It will be limited. There is little choice and the gloss of such colors is poor. (6) The amount of solvent to be added is different: (a) When used as a conductive paint, the epoxy resin low electronic impedance high molecular weight polymer of the present invention contains a usual amount of solvent for a general epoxy resin floor paint ( Good flowability can be obtained without or even with a solvent. Therefore, not only excellent workability can be achieved, but also the amount of the solvent to be added is within an allowable range, so that the basic chemical properties, physical properties, and mechanical properties of the epoxy resin coated film can be reliably maintained. In addition, the coated film is durable without decomposing or separating. (B) In existing epoxy resin conductive paints, a large amount of conductive filler material is added, so the paints tend to settle, have poor fluidity and are mushy. Therefore, the processing operation is difficult. As a result, solvents such as toluene and acetone must be added in excess (20% or more) for processing. This leads to environmental protection problems. More seriously, the addition of large amounts of solvent reduces the various basic physical and chemical properties of the epoxy resin and hasten the aging of the paint film. This increases the shrinkage of the coating film, and the coating film is easily cracked and separated. (7) Different processing methods: (a) When used as a conductive coating, apply the epoxy resin low electronic impedance high molecular weight polymer of the present invention thinly to a glossy flat surface with a roller according to a coating processing method. Can be. As another method, the conductive paint of the present invention can be thickly applied with a bending iron according to a spraying method to obtain a glossy finished surface. In addition, the resin sand plasma processing method with the addition of quartz sand,
It can also be applied as a laminating method for glass fiber FRP complex reinforcing materials. Therefore, the conductive paint of the present invention can be processed universally. (B) The existing epoxy resin conductive paint is limited by the conductive filler material, and can only be processed by a thin coating method using a roller. When a thick coating is applied by bending, the conductive filler material precipitates, while the non-conductive resin rises to the surface, blocking the current path and losing the conductive function. Furthermore, due to the effect of the conductive filler material, it is not possible to carry out a laminating process on glass fiber FRP complex reinforcing materials. Therefore, the processing method is completely limited, and it is not possible to obtain a glossy finished surface of a general epoxy resin floor surface.

(G) The conductive floor paint of the present invention and an existing conductive paint
Comparison of key physical properties with conductive floor coatings:

[Table 1]

Claims (22)

[Claims] 1. A metal ionic compound solution formed by adding a metal salt to an inorganic acid, alcohol or water, wherein the metal salt is dissolved with an acid to obtain a calcium cation as exemplified in the general formula (I). To form chlorine anions and water, A certain amount of alcohol (tertiary alcohol) is slowly added to this metal ion compound, and after dehydration twice, a complex ion polymer having a double bond, a hydroxyl group (-OH) and a π electron having a positive charge is formed. In addition, the compound has a low pH,
In order to terminate the reaction of the polymer, the pH is neutralized by adding an alkaline solution such as an amine to obtain a low electronic impedance high molecular weight polymer intermediate as shown by the general formula (II). It has a bonding part for bonding to a thermosetting engineering resin containing an epoxy group as shown by the general formula (III), and the above-mentioned low electronic impedance high molecular weight polymer intermediate is converted to an epoxy group as shown by the general formula (IV) A certain amount of epoxy resin (bisphenol A-based) containing
Cross-linking reaction with ~ 50% by weight of an epoxy resin, such as a tertiary amine, polyamide, etc., is added and the mixture is stirred thoroughly and uniformly at standard temperature or with adequate heating, copolymerizing and crosslinking three times. The reaction and curing are performed to form a product as shown by the general formula (V). In the low electron impedance polymer intermediate, the π electron having a positive charge at this time is the same as the electron of the epoxy resin polymer. Displaces and forms a current path through the mutual convolutions between the product's structural molecules, thereby forming a low electronic impedance high molecular weight epoxy resin thermoset polymer product with excellent electrical conductivity, under the conditions of 3 ° C. room temperature and 50% relative humidity, characterized in that the specific volume resistance of the low electronic impedance high molecular weight epoxy resin thermoset polymer product has reached 10 ^-2 (Ω / cm) Metal ion compounds solution. Embedded image Embedded image Embedded image Embedded image 2. The metal ion compound solution according to claim 1, wherein the metal salt is dissolved in an acidic environment, and contains a cation, an anion and water as shown in the general formula (I). A metal ion compound solution which forms a high metal ion compound solution. Embedded image 3. The metal salt according to claim 2, wherein the metal salt is selected from an acid salt or an alkali salt soluble in an inorganic acid, alcohol, glycerin, water, and the like. 4. The acidic environment according to claim 2, wherein
An acidic environment characterized by adding a metal salt to an inorganic acid having a weight of 0.5 to 2.0 times the weight of the metal salt and achieving sufficient stirring in a sealed acid / alkali resistant container. . 5. The metal ion compound solution according to claim 2, wherein the metal ion compound solution contains various metal cations derived from a metal salt. 6. The polymer intermediate of claim 1, wherein a tertiary alcohol is added to the metal ion compound solution according to the general formula (IV).
After dehydration and polymerization, a complex ion polymer having a double bond, a hydroxyl group and a π electron having a positive charge is added as shown in the general formula (II), and the polymer has low electronic impedance, Has a low pH under the environment, the polymer itself is still active, further reacting and plasticizing, neutralizing the pH by adding a certain amount of alkaline solution to terminate the polymer reaction And stabilize the complex ion polymer,
A low electronic impedance high molecular weight polymer intermediate, characterized by obtaining a low electronic impedance high molecular weight polymer intermediate as shown by the general formula (II). Embedded image Embedded image Embedded image 7. The tertiary alcohol according to claim 6, wherein the alcohol is selected from alcohols containing trihydroxyl groups according to the general molecular formula C _N H _{2 N} CnHHHHH2n ₊₁ OH, the alcohol used being almost glycerin. Characterized tertiary alcohol. 8. The method for adding a tertiary alcohol to a metal ion compound according to claim 6, wherein the tertiary alcohol having a weight of 0.5 to 2.0 times the weight of the metal ion compound is stirred. A method comprising slowly adding to a metal ion compound solution. 9. The metal ion compound solution according to claim 6, wherein two dehydration and polymerization are sequentially completed during the operation of slowly adding the tertiary alcohol to the metal ion compound. Ionic compound solution. 10. The metal ionic compound solution according to claim 6, wherein a tertiary alcohol is added to the metal ionic compound solution, and after two dehydrations and polymerizations, the complex ionic polymer formed has a hydroxyl group. Low pH under acidic conditions, containing resonant π electrons with heavy bonds and positive charges
To terminate the polymer reaction, neutralize the pH by adding an amount of an alkaline solution, wherein the alkaline solution is selected from amines such as aqueous ammonia, and the weight of the alkaline solution is Is a metal ion compound solution, which is 0.5 to 2.0 times the weight of the complex ion polymer, and after neutralization, obtains a low electronic impedance high molecular weight polymer intermediate having excellent electrical conductivity. . 11. The polymerized intermediate having a low electronic impedance according to claim 10, wherein the intermediate has a pH of 6-8. 12. The neutralized low electronic impedance high molecular weight polymerized intermediate of claim 10, wherein the intermediate is a 1-18 alkyl group chain, 2-3 benzene group as shown in the following general formula: A low electronic impedance high molecular weight polymer intermediate having a bonding portion for bonding to a thermosetting polymer engineering resin containing an epoxy group. Embedded image 13. The thermosetting polymer engineering resin according to claim 1, further comprising a bonding portion for bonding to a thermosetting polymer engineering resin containing an epoxy group. Is a standard temperature 2 such as bisphenol A type, phenol type, polyphenol type, polyhydroxyl group benzene type, carboxylic acid type, aromatic bicarboxyl type, cyclohexene type epoxy (mostly, pisphenol A type epoxy is used). A low electronic impedance high molecular weight polymer intermediate, which is selected from liquid epoxy resin high molecular weight polymers. 14. The low electronic impedance high molecular weight polymer intermediate according to claim 1, further comprising a bonding portion for bonding to a thermosetting polymer engineering resin containing an epoxy group, wherein the reactive crosslinking agent comprises: A low electronic impedance high molecular weight polymer intermediate selected from fatty polyamines, aromatic amines, secondary and tertiary amines, polyamides and the like. 15. The low electronic impedance high molecular weight polymer intermediate according to claim 1, wherein the weight of the polymer intermediate is 5 to 30% of the weight of the epoxy resin, and the weight of the crosslinking agent is the weight of the epoxy resin. Low-impedance high-molecular-weight polymer intermediate, characterized by being 5 to 50% of the following. 16. The thermosetting engineering epoxy resin of claim 1, further comprising various colors, filler materials and adjuvants. 17. The low-impedance polymer intermediate containing the epoxy group and the crosslinking agent according to claim 1, and a copolymer formed by a thermosetting engineering resin, wherein the copolymer has the general formula (VII) After sufficiently stirring the copolymer uniformly, an epoxy resin conductive paint dispersed in a liquid is uniformly applied on the surface of the article with various working tools, and a paint film of 8 to 2 is applied.
After 4 hours, after cross-linking reaction and curing, by π-electron resonance and cooperative mutual convolution between the structural molecules of the product,
A copolymer characterized by forming a current path to obtain a low electronic impedance high molecular weight epoxy resin thermosetting polymer product having excellent electrical conductivity. Embedded image 18. The work implement according to claim 17, wherein a roller, a paint brush, a thin-painted gasless injection gun,
A work implement including a thick-painted bent iron and others, wherein the thickness of the thick-painted bent iron reaches 3 mm each time. 19. The low-impedance high-molecular epoxy resin polymer according to claim 17, wherein, in the case of a thickly-painted bent iron, the inspection surface can be finished at a mirror finish of 60 degrees exceeding 60 degrees. Electronic impedance polymer epoxy resin polymer. 20. The low electronic impedance high molecular weight epoxy resin polymer according to claim 17, wherein
A low electronic impedance high molecular weight epoxy resin polymer wherein the RP reinforcing complex material acts as a laminating coating to convert the non-conductive FRP into a FRP product with excellent electrical conductivity. 21. The low electronic impedance high molecular weight epoxy resin polymer of claim 17, wherein the formed product has a non-inspection specific volume resistance of 10 ⁸ at 23 ° C. room temperature and 50% relative humidity. Low-impedance high-molecular-weight epoxy resin polymer characterized by having a resistivity of 10 to 10 ^-2 (Ω / cm). 22. The low electronic impedance high molecular epoxy resin polymer according to claim 17, wherein each color system has a luminance characteristic without limiting selection of a color system. Molecular epoxy resin polymer.