JP2000332061A5 - - Google Patents
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- Publication number
- JP2000332061A5 JP2000332061A5 JP2000074710A JP2000074710A JP2000332061A5 JP 2000332061 A5 JP2000332061 A5 JP 2000332061A5 JP 2000074710 A JP2000074710 A JP 2000074710A JP 2000074710 A JP2000074710 A JP 2000074710A JP 2000332061 A5 JP2000332061 A5 JP 2000332061A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000074710A JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-70229 | 1999-03-16 | ||
| JP7022999 | 1999-03-16 | ||
| JP2000074710A JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000332061A JP2000332061A (ja) | 2000-11-30 |
| JP2000332061A5 true JP2000332061A5 (ru) | 2005-07-07 |
| JP3916366B2 JP3916366B2 (ja) | 2007-05-16 |
Family
ID=26411400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000074710A Expired - Fee Related JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3916366B2 (ru) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821381B1 (en) | 1999-03-16 | 2004-11-23 | Toray Engineering Co., Ltd. | Tool for thermo-compression-bonding chips, and chip packaging device having the same |
| WO2002041385A1 (fr) * | 1999-03-16 | 2002-05-23 | Toray Engineering Co., Ltd. | Outil pour lier les puces par compression thermique et dispositif d'encapsulation de puces muni de cet outil |
| AT414079B (de) * | 2002-12-20 | 2006-08-15 | Datacon Semiconductor Equip | Einrichtung zum positionieren |
| AT412603B (de) * | 2003-03-12 | 2005-04-25 | Datacon Semiconductor Equip | Einrichtung zum verbinden von elektronischen schaltungen |
| KR100993079B1 (ko) | 2005-10-12 | 2010-11-08 | 가부시키가이샤 무라타 세이사쿠쇼 | 접합장치 |
| JP6106320B2 (ja) * | 2016-06-24 | 2017-03-29 | 東レエンジニアリング株式会社 | 実装装置 |
| CN115394689B (zh) * | 2022-09-05 | 2023-09-01 | 江苏富乐华功率半导体研究院有限公司 | 一种功率半导体器件热压烧结装置 |
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2000
- 2000-03-16 JP JP2000074710A patent/JP3916366B2/ja not_active Expired - Fee Related