JP2000315367A - Coating method of adhesive for bonding slider and suspension as well as bonding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To evenly extend an adhesive to a face to be bonded by moving a nozzle which puts out an adhesive along a straight line on either of the face to be bonded of a slider and the face to be bonded of suspension by a prescribed distance so that a moving locus at the time of leaving of the nozzle from the face to be bonded includes a component in the direction perpendicular to the face to be bonded. SOLUTION: The nozzle 77b is positioned at the standby position where attaching and removing of a connecting jig 50 is not obstructed in the initial state, is loaded at the point P1 at the time of staring the coating motion and the tip part is moved along a moving path R1 to the point P2. Therein, air is fed into a syringe charged with a high viscosity and low elastic epoxy adhesive having thixotropy and the nozzle is moved along the moving path R2 parallel to the face 25a to be bonded of the slider 25 while extruding the adhesive from the nozzle 77b. The nozzle stops the extrusion of the adhesive at the point P3 and is moved up to the point P4 along the moving path R3 in the direction perpendicular to the face to be bonded. Further, the nozzle is moved up to the point 5 along the moving path R4 in an inverse direction with the moving path R2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a head gimbal assembly (hereinafter referred to as an HG assembly) which is a component of a hard disk drive, and more particularly to a method of applying an adhesive for bonding a suspension and a slider. And an adhesive method for spreading the adhesive evenly at an adhesive portion.

[0002]

2. Description of the Related Art Conventionally, when bonding a suspension of an HG assembly to a slider, a cyanoacrylate-based adhesive such as an instantaneous adhesive has been used. Since this kind of adhesive has a low viscosity, if a predetermined amount is applied to one point of the bonding surface of the slider, it spreads uniformly over the entire bonding surface.

Therefore, in the adhesive application step, an amount corresponding to the area of the adhesive surface is calculated and set in advance, and the set amount of adhesive is applied to a predetermined point on the adhesive surface of the slider.

Further, in the step of bonding the slider and the suspension, the bonding surface of the suspension is quickly bonded to the bonding surface of the slider to which the adhesive has been applied so as not to float. Thereby, the low-viscosity adhesive spreads evenly on the bonding surface and adheres in a short time.

[0005]

In an HG assembly bonded with a cyanoacrylate-based adhesive, if the expansion coefficient of the suspension differs from that of the slider, the HG assembly warps due to a subsequent temperature change accompanying a change in environment or the like. And distortion occur.

[0006] In order to solve this inconvenience, a low elasticity epoxy adhesive is used. In the bonded portion bonded with the low elasticity epoxy adhesive, the difference in thermal expansion between the two members is absorbed by the elasticity of the epoxy adhesive, thereby preventing warpage and distortion.

However, this low-elasticity epoxy adhesive has a thixotropy and a high viscosity as compared with a cyanoacrylate-based adhesive, so that the adhesive itself has a shape maintaining power. For this reason, simply applying this adhesive to the slider and bonding the adhesive surface of the suspension cannot spread the adhesive evenly over the entire adhesive surface.

The present invention provides a method of spreading a low-elasticity epoxy adhesive evenly over the entire bonding surface between a slider and a suspension, and bonding the two.

[0009]

When a slider having a head for scanning a disk and a suspension means for holding the slider are bonded to each other, one of the bonding surface of the slider and the bonding surface of the suspension means is bonded. Moving the nozzle that emits the low elasticity epoxy adhesive a predetermined distance along a substantially straight line in the one direction, applying the low elasticity epoxy adhesive during this time, and then separating the nozzle from the one adhesive surface. Wherein the movement trajectory of the nozzle at the time of separation is a first direction perpendicular to the bonding surface and a second direction opposite to the one direction, or a component in the first direction and the second direction. An area for moving the nozzle in the direction in which the directional components are combined is included so that the whiskers of the adhesive fall on the applied adhesive.

[0010] After the two bonding surfaces are bonded, a periodically fluctuating pressure is applied to the bonding portion for a predetermined time so that the adhesive is evenly spread over the entire bonding surface.

[0011]

FIG. 1 is a perspective view of an HG assembly 1 used in an embodiment of the present invention. FIG. 2 is an exploded perspective view showing the superposed components of the HG assembly 1 in an exploded manner and shown in a series.

In FIG. 1, an actuator arm 2 is rotatably held by a holding means of a magnetic disk drive (not shown). At this time, the opening 3 is used for holding,
It rotates in the directions of arrows A and B about a virtual axis 101 (FIG. 1) substantially perpendicular to the plane portion 4 through the center. This rotation drive is performed by a voice coil motor (not shown).

On the other hand, the load beam 6, the mount plate 7, and the flexure 8 are adhered in a predetermined relationship described below. In particular, the load beam 6 and the flexure 8 constitute an integral suspension means.

On the plane portion 4 of the actuator arm 2,
The flat portion 10 of the load beam 6 is fixedly bonded,
At this time, the operation is performed such that the end side 9 of the actuator arm 2 is aligned with the indication line 102 of the load beam 6 (FIG. 2). The load beam 6 has, for example, a thickness of 0.038 m.
It is made of stainless steel having an elasticity of m to 0.05 mm and is designed to be thin and lightweight, and to maintain necessary rigidity.

That is, in a predetermined portion of the load beam 6 which is not adhered to the actuator arm 2, a substantially trapezoidal concave portion 11 which is recessed downward in the drawing by press processing is formed, and both edges along the longitudinal direction are end portions. Part 13 near side 9
The flange 12 (FIG. 3) is formed except for
This increases rigidity. The portion 13 where the flange 13 is not formed has elasticity and forms a hinge portion.

In the recess 11 of the load beam 6,
A tapered oblong restriction hole 14 is formed, and near the tip,
A substantially square opening 16 is formed. This opening 16
A gimbal pivot 15, which will be described later, protrudes upward in the drawing from the center of one side adjacent to the recess 11 toward the center of the opening 16, and is formed at the tip of the load beam 6. A tab 17 is formed.

The mount plate 7 and the flexure 8 are
Both are bonded to the load beam 6. At this time, the mounting plate 7 has the edge 18 at the indication line 102 of the load beam 6.
(FIG. 2). And flexure 8
Is adhered to the load beam 6 so as to cover the trapezoidal concave portion 11 of the load beam 6 and excluding a portion from the indication line 103 (FIG. 2) from the tip.

The flexure 8 is made of, for example, stainless steel having a thickness of about 20 microns and has a desired elasticity.
Then, an arch-shaped opening 1 extends from the bonded portion to the non-bonded portion.
9 is formed, and a suspension tongue 20 projecting toward the center of the opening 19 is formed at the center of the bottom of the opening 19 near the tip of the flexure 8. The mount plate 7 may also be formed of stainless steel of the same material as the flexure 8.

The integrated conductive lead 35 is composed of four leads 3
2 are integrally bonded to the extremely thin insulating sheet 33 so as not to contact each other. One end of each lead is arranged in a row to form the multi-connector section 34, and the other end of each lead is bent to be connected to a connection terminal (not shown) formed on the slider 25.

Then, a portion (excluding the curved portion 36) of the integrated conductive lead 35 from the multi-connector portion 34 to the curved portion 36 is adhered to the mount plate 7 as shown in FIG. Then, a portion from the curved portion 36 to the end portion 37 of the insulating sheet 33 (excluding the curved portion 36) and the bent other end of the lead 32 are bonded to the flexure 8.
This other end is adhered with an insulating sheet 38 interposed.

A slider 25 is provided with a magneto-resistive (Magneto Resistive) head (hereinafter referred to as an MR head) 26 for reading data and an electromagnetic induction type write head 27 at predetermined positions (in the figure). Heads are shown for convenience and are not accurate). The slider 25 is fixed to the suspension tongue 20 by a bonding method described later.

Next, a pair of flexure arms 23 and 24 formed on both sides of the opening 19 of the flexure 8, and a pair of openings 21 and 21 formed near the tip of the flexure 8.
2. Gimbal pivot 1 formed on load beam 6
5 and slider 2 adhered to suspension tongue 20
The mutual arrangement of 5 and the like will be described.

FIG. 3 is a partially enlarged view of the distal end of the HG assembly 1 before the slider 25 is mounted.
Is a cross-sectional view at the position indicated by the indication line 104.

The load beam 6 is provided with the gimbal pivot 15 (FIG. 4) as described above. On the other hand, the flexure 8 is bonded to the load beam 6 up to the indication line 103, and the flexure arms 23,
24 elastically supports the suspension tongue 20 which is continuous with the suspension tongue 20.

The joining of the load beam 6 and the flexure 8 causes the suspension tongue 20 to move the gimbal pivot 15
Supported by one point. This contact part is flexure 8
A 100y axis, which is on the 100x axis (FIG. 3) corresponding to the center line in the longitudinal direction of FIG. At this time, the flexure arms 23 and 24 are slightly warped, and the suspension tongue 20 is pressed against the gimbal pivot 15.

The suspension tongue 20 has a slider 25 and a gimbal pivot 15 at its center as described later.
(Shown by a broken line in FIG. 4). As a result, the slider 25 can move the
Some rotation about the 0y axis becomes possible, and a predetermined inclination in all directions becomes possible.

The four leads 32 are fixed to the flexure 8 up to the end 37 of the insulating sheet 33.
The suspension tongue 20 is inserted between the two openings 21 and 22.
Is fixed to the flexure 8 via an insulating sheet 38 at the platform 39 at the tip of the flexure 8 located on the opposite side of the flexure 8.

During this time, the four leads 32 are bent in a crank shape along the flexure arms 23 and 24 in pairs, and float in the air so as not to contact each other.

The other end of each pair of leads 32 is bent from the platform 39 toward the suspension tongue 20 via the two openings 21 and 22, respectively, and further adhered to the suspension tongue 20. It is bent in a hook shape so as to face a connection terminal (not shown) formed on the slider.

The HG assembly 1 excluding the slider 25 configured as described above is bent at, for example, about 19 degrees at the hinge portion 13 of the load beam 6 as shown by a dashed line in FIG. This bending is due to plastic deformation, and this angle is maintained in a natural state.

Next, a method of bonding the slider 25 to the suspension tongue 20 of the flexure 8 will be described.

FIG. 6 shows the HG before the slider 25 is bonded.
Suspension tongue 20 and slider 25 of assembly 1
FIG. 6 is a perspective view showing a joining jig 50 for positioning and joining the pieces.

On one end of the upper surface 54 of the joining jig 50, a pair of columns 53, 53 for holding the HG assembly holding plate 51 rotatably about a shaft 52 are formed. A mounting portion 59 for mounting the slider 25 is formed at the center of the other end facing the one end.

The HG assembly holding plate 51 is biased in the direction of arrow E by biasing means (not shown), and its rotation in the same direction is restricted at a substantially vertical position shown in FIG.

A concave portion 55 is provided on an end side surface 55 on the mounting portion 59 side.
The slider fixing lever 56 is rotatably held around the shaft 57 in the concave portion 55a. The slider fixing lever 56 is rotationally biased in the direction of arrow I by a toggle spring 58.

FIG. 7 is a partially enlarged view of the mounting portion 59.
The state in which the slider fixing lever 56 is turned in the direction of arrow H by the operator against the biasing force is shown. In this state, the slider 25 is set on the slider fixing base 60 for regulating the position of the slider 25 by three adjacent walls as shown by broken lines in FIG.

When the slider fixing lever 56 is released,
The tip of the slider fixing lever 56 presses the side surface of the slider 25 to fix it. FIG. 6 shows the state at this time. The bonding surface 25a and the front surface 25b of the slider 25
(FIG. 7) is set so as to slightly protrude from the upper surface 54 and the end side surface 55 of the joining jig 50, respectively.

The holding surface 61 of the HG assembly holding plate 51
HG assembly 1 before bonding the slider 25
A housing recess 62 is formed substantially along the outer shape to accommodate the data (FIG. 6). At a predetermined position of the storage recess 62, a position regulating pin 63 and a mounting hook 64 are formed on a longitudinal center line 105 of the HG assembly holding plate 51.

The mounting hook 64 is slidably held within a predetermined range on the center line 105 by a biasing means (not shown), and is biased in the direction of arrow C toward the shaft 52.

When the operator mounts the HG assembly 1 on the HG assembly holding plate 51, first, the engaging hole 40 of the HG assembly 1 is hooked on the mounting hook 64.
Pull in the direction of arrow D against the urging force. Then, the position regulating pin 63 is fitted into the tapered oblong regulating hole 14 of the HG assembly 1.

At this time, the position regulating pin 63 is
4 is engaged with the regulating end portion 65 (FIG. 3) having a small diameter to position the flexure 8 so that the 100x axis (FIG. 3) of the flexure 8 is aligned with the center line 105. Further, as described above, the HG assembly 1 is bent at about 19 degrees at the hinge portion 13 (FIG. 5) in the natural state, but the hinge portion 13 is elastically deformed when it is attached to the HG assembly holding plate 51. It extends almost straight.

A regulating hole 1 is provided at the tip of the position regulating pin 63.
A projection (not shown) is formed on the side of the engagement portion with the projection 4 to prevent the HG assembly 1 from being bent by the restoring force while allowing a certain amount of play.

As described above, the HG assembly 1 and the slider 25 are respectively mounted on the joining jig 50 as shown in FIG. The operator rotates the HG assembly holding plate 51 in the direction of arrow F against the biasing force,
When the locking hook 66 is in a substantially horizontal state, the locking hook 66 is engaged with an engagement receiver 67 formed at a corresponding position on the upper surface 54 so as to face the HG assembly holding plate 51, and this horizontal position is maintained.

At this time, the center line 106 passing through the center of the adhesive surface 25a of the slider and being parallel to the upper surface 54 and orthogonal to the parallel line of the rotating shaft 52 and the 100x axis of the flexure 8 (FIG. 3) are substantially one. As will be described later, an adhesive surface 25 between the suspension tongue 20 of the HG assembly 1 and the slider 25 will be described.
and a.

Next, a method of applying a high-viscosity, low-viscosity epoxy adhesive having a thixotropic property (hereinafter referred to as an adhesive) to the adhesive surface 25a of the slider 25 according to the method of the present invention will be described.

FIG. 8 is a front view showing the structure of the adhesive application device.

The adhesive coating device 70 has a fitting concave portion 71 with which the bottom portion 67 of the mounting jig 50 is fitted to determine the mounting position of the bonding jig 50. The joining jig 50 mounted on the fitting recess 71 holds the HG assembly 1 and the slider 25, respectively, and the HG assembly holding plate 51 is located at a vertical position.

The guide rail 72 is moved in parallel with the center line 106 (FIG. 6) of the mounted jig 50 by the adhesive
0, and the moving body 73 is driven by driving means (not shown).
Are moved along the guide rail 72 in the same direction (X-axis direction). The guide rail 74 is held by a holding member 75 formed on the moving body 73 in parallel with a perpendicular line of the upper surface 54 of the joining jig 50, and drives the syringe holding arm 76 in the same direction (Z-axis direction) by a driving unit (not shown). Move along.

The syringe 77 held in an inclined state by the syringe holding arm 76 is, as shown in FIG.
It comprises a hollow thin tube portion 77a and a nozzle 77b. The nozzle 77b is also directly clamped to the syringe holding arm 76 by holding means (not shown) so that the tip does not move. In order to push out the adhesive 78 filled in the thin tube portion 77a from the nozzle 77b, air is sent from the tube 79 to press the adhesive 78.

The height detector 80 is held by the syringe holding arm 76 similarly to the syringe 77, measures the distance from the tip to the upper surface 54 of the joining jig, and sends the data to the controller 81.

The controller 81 sends air to the syringe 77 via the tube 79, presses the float 77c with a desired air pressure, and controls a driving unit (not shown) to control the entire operation of the adhesive coating device 70.

FIG. 10 shows the movement trajectory of the tip of the nozzle 77b of the syringe 77 whose movement is controlled by the controller 81. This movement trajectory is caused by the movement of the syringe holding arm 76 along each of the X-axis and the Z-axis.
(FIG. 6) and along a plane orthogonal to the upper surface 50 of the joining jig.

In the initial state of the adhesive coating device 70, the syringe 77 is in a standby position (not shown) (a position moved to the upper right from the position shown in FIG. 8) which does not hinder the attachment and detachment of the joining jig 50. Loading is performed at the start of the operation (comes to the point P1), and the tip of the nozzle 77b is positioned in FIG.
Along the movement route R1 shown in FIG. The distance from the bonding surface 25a of the slider 25 to this point P2 is determined by inputting data from the height detector 80 that moves integrally with the nozzle 77b, and is set to a predetermined height.

Next, the tip of the nozzle 77b is moved along the movement path R
The slider 25 moves in a direction indicated by an arrow at a predetermined moving speed substantially parallel to the bonding surface 25a of the slider 25 along the line 2. At this time, the controller 81 sends air into the syringe 77 through the tube 79, presses the adhesive 78 at a predetermined pressure, and
The adhesive 78 is applied to the bonding surface 2 of the slider 25
5a and apply.

In this state, the tip of the nozzle 77b is moved to the point P3, and at the same time as reaching the point P3, the pressure is reduced and the feeding of the adhesive 78 is stopped. The moving speed, the atmospheric pressure, and the amount of application at this time are appropriately determined depending on various properties such as the viscosity of the adhesive 78.

Next, a process of separating the nozzle 77b from the bonding surface 25a will be described.

The tip of the nozzle 77b is moved along the movement path R3 in the direction of the arrow in a direction substantially perpendicular to the point P4 separated by a predetermined distance from the bonding surface 25a.
Along with the adhesive surface 25a of the slider 25 in the direction of the arrow to a point P5. The moving direction of the moving path R4 is opposite to the moving direction of the moving path R2 in which the adhesive 78 is applied to the bonding surface 25a of the slider, and the moving distance of the moving path R4 is set shorter than the moving distance of the moving path R2. Have been.

Next, the tip of the nozzle 77b is moved from the point P5 to the path R further away from the bonding surface 25a of the slider.
Then, the vehicle reaches the point P6 via 5, and then unloads and moves to the standby position.

As shown in FIG. 11, the moving paths R3, R4, and R5 correspond to the whiskers 7 generated during the operation of applying the low-elasticity epoxy adhesive 78 applied to the bonding surface 25a of the slider 25.
8a is a process for bending in the direction of the arrow in the drawing to fall on the adhesive 78 applied on the adhesive surface 25a. The image device 82 indicated by a broken line in FIG.
This is for confirming the state of the adhesive applied on the surface a. By arranging the syringe 77 at an angle, image information from the vertical direction of the adhesive surface 25a can be obtained.

Next, a method for bonding the slider 25 having the adhesive 78 applied to the bonding surface 25a and the suspension tongue 20 of the HG assembly 1 according to the method of the present invention will be described.

After the adhesive 78 is applied to the bonding surface 25a, the HG assembly holding plate 51 is moved in the direction of arrow F (FIG. 6).
To the horizontal position to lock in this position. FIG.
Is a cross-sectional view of the vicinity of the slider 25 when a cross section passing through the center line 106 (FIG. 6) at this time is viewed from the direction of arrow G.

At this time, the thixotropic high-viscosity low-elasticity epoxy adhesive 78 is applied to the adhesive surface 25 a of the slider 25.
And the suspension tongue 20, and is pressed with a small force, but the adhesive 78 itself has a shape maintaining force and does not spread over the entire bonding surface.

FIG. 13 is a front view showing the structure of the vibration bonding apparatus.

The vibration bonding apparatus 85 has a fitting recess 86 in which the bottom 67 of the mounting jig 50 to be mounted is fitted to determine the mounting position of the mounting jig 50. As described above, the joining jig 50 placed in the fitting recess 86 locks the HG assembly holding plate 51 at the horizontal position, and the adhesive 78 sandwiches the adhesive surface 25a of the slider 25 and the suspension tongue 20 with a small force. This is the state shown in FIG.

The guide rail 87 is held by a vibration bonding apparatus 85 in parallel with the perpendicular of the upper surface 54 of the mounted jig 50, and has a holding arm 88 holding a vibration generator 89 by a driving means (not shown). It moves along the direction (Z-axis direction). The vibration generator 89 vibrates the action rod 90 vertically projecting downward at a period of, for example, 5 to 6 Hz along the Z-axis direction.

When the holding arm 88 moves to the load position shown in FIG. 13 as described below, the tip of the working rod 90 is moved to the gimbal pivot 15 of the HG assembly 1 held by the mounted jig 50. (FIG. 12) It is arranged so as to contact the upper surface in the vicinity.

The vibration bonding device 85 is controlled by a controller (not shown). In the initial state of the vibration bonding apparatus 85, the holding arm 88 is at the uppermost standby position of the movement range that does not hinder the attachment and detachment of the joining jig 50, and moves to the load position shown in FIG. 13 at the start of the joining operation. .

FIG. 14 is a cross-sectional view of the vicinity of the slider 25 as viewed from the direction of the arrow G when a cross section passing through the center line 106 (FIG. 6) of the bonding jig 50 mounted on the vibration bonding apparatus 85 at this time is viewed.

At this time, the tip of the working rod 90 presses the upper surface of the gimbal pivot 15 with a predetermined pressure, for example, 3 gf to 4 gf. In this state, for example, 5-6 Hz in the Z-axis direction.
Vibration is applied to the action rod 90 for several seconds in the cycle of, and the viscosity of the adhesive 78 having thixotropy is reduced to reduce the shape maintaining force.

Upon receiving the vibration, the adhesive 78, whose viscosity has been reduced, spreads evenly over the entire adhesive surface between the adhesive surface 25a and the suspension tongue 20, and adheres them evenly.

The present invention is not limited to the above embodiment. For example, the moving locus of the nozzle 77b shown in FIG. 10 may be replaced with the moving locus shown in FIG. That is, the bead 78a shown in FIG. 11 is bent in the direction of the arrow in FIG.
8 or the route R7 or the route R
Unloading may be performed by following the locus of a curve such as 8. This is a movement trajectory including a vector formed by combining a vector component indicating the moving direction of the route R3 and a vector component indicating the moving direction of the route R4.

In the above-described embodiment, the adhesive is applied to the adhesive surface 25a of the slider. However, the adhesive may be applied to the adhesive surface of the suspension, for example, the suspension tongue 20.

Further, in the above embodiment, the adhesive 78 is applied to the path R along the center line 106 (FIG. 7) on the adhesive surface 25a.
2, the coating is not limited thereto, and the coating may be performed in a direction perpendicular to the center line 106 or in a direction obliquely crossing the center line 106.

[0074]

According to the present invention, precise application from a low-viscosity adhesive to a high-viscosity, low-elasticity epoxy adhesive having a shape-maintaining force, and a dot-shaped to elliptical shape according to the shape and area of the bonding surface A free coating shape up to a shape is possible. In addition, since the whiskers generated during the coating operation do not protrude from the desired coating area, it is suitable for ultra-precision coating.

According to the present invention, it is possible to use a low-elasticity epoxy adhesive having a thixotropic property, a high viscosity and a shape maintaining power, and the difference in thermal expansion between the two members to be bonded is determined by the elasticity of the epoxy adhesive. It is absorbed and can prevent shape deformation in a natural state due to warpage or distortion.

[Brief description of the drawings]

FIG. 1 is a perspective view of a head gimbal assembly 1 used in an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the superposed components of the head gimbal assembly 1 in an exploded manner.

FIG. 3 is a partially enlarged view of a distal end portion of the head gimbal assembly 1 before a slider 25 is mounted.

FIG. 4 is a cross-sectional view at a position indicated by an instruction line 104 in FIG.

FIG. 5 shows the head gimbal assembly bent about 19 degrees at the hinge portion 13 of the load beam 6.

FIG. 6 is a perspective view of a joining jig.

FIG. 7 is a partially enlarged view of a mounting portion of the joining jig.

FIG. 8 is a front view showing a configuration of an adhesive application device.

FIG. 9 is an internal structural view of the syringe 77.

FIG. 10 shows a movement trajectory of the tip of the nozzle 77b whose movement is controlled.

FIG. 11 is a diagram for explaining whiskers generated when an adhesive is applied.

FIG. 12 is a cross-sectional view showing a state where a slider and a suspension tongue face each other with an adhesive interposed therebetween.

FIG. 13 is a front view showing the configuration of the vibration bonding apparatus.

FIG. 14 is a cross-sectional view of the vicinity of a slider 25 mounted on the vibration bonding device 85.

FIG. 15 is a diagram showing another possible movement locus of the nozzle 77b.

[Explanation of symbols]

1 head gimbal assembly (HG assembly), 2 actuator arm, 6 load beam,
7 mount plate, 8 flexure, 13 elastic part, 15 gimbal pivot, 20 suspension tongue, 25 slider, 25a adhesive surface, 32 leads,
33 insulating sheet, 39 platform, 50 joining jig, 51 HG assembly holding plate, 56 slider fixing lever, 60 slider fixing base, 67 bottom, 7
0 adhesive application device, 73 moving body, 75 holder, 76
Syringe holding arm, 77 Syringe, 77a thin tube part, 77b nozzle, 78 adhesive, 78a whiskers, 7
9 Tube, 80 Height detector, 81 Controller, 85 Vibration bonding device, 89 Vibration generator, 90 Working rod

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoaki Nojiri 1 Kirihara-cho, Fujisawa-shi, Kanagawa IBM Japan, Ltd. Fujisawa office (72) Inventor Tatsushi Yoshida 1 Kirihara-cho, Fujisawa-shi, Kanagawa Japan IBM Corporation Fujisawa Office (72) Inventor Yuga Yokome 1 Kirihara-cho, Fujisawa City, Kanagawa Prefecture IBM Japan Corporation Fujisawa Office (72) Inventor Naoki Suzuki Kirihara-cho, Fujisawa City, Kanagawa Prefecture No. 1 IBM Japan, Ltd. Fujisawa Plant F-term (reference) 4D075 AC08 DA32 DC21 EA31 EA35 EB33 4F041 AA05 AB01 BA04 BA52 5D059 AA01 BA01 CA29 DA04 DA31 EA02

Claims (7)

[Claims] 1. A method of applying an adhesive for adhering a slider having a head for scanning a disk and a suspension means for holding the slider, comprising: an adhesive surface of the slider and an adhesive surface of the suspension means. Moving a nozzle that emits a low-elasticity epoxy adhesive along a substantially straight line on one adhesive surface by a predetermined distance in one direction, and applying the low-elasticity epoxy adhesive during this time; A moving direction of the nozzle when the nozzle is separated from the first direction perpendicular to the bonding surface and a second direction opposite to the one direction, or the first direction. And a component in which the nozzle is moved in a direction in which the component of the second direction and the component of the second direction are combined. 2. A height detecting unit detects a distance between the nozzle and one of an adhesive surface of the slider and an adhesive surface of the suspension means, and the nozzle detects the distance based on a detection result. 2. The method for applying an adhesive according to claim 1, wherein the movement of the adhesive is controlled. 3. The method for applying an adhesive according to claim 1, wherein said nozzle is applied in a state of being inclined with respect to said one adhesive surface. 4. The method according to claim 1, wherein when the nozzle is separated from the one adhesive surface, the nozzle is first moved in the first direction and then moved in the second direction. Adhesive application method. 5. The method for applying an adhesive according to claim 1, wherein said one adhesive surface is an adhesive surface of a slider. 6. A bonding method for bonding a slider having a head for scanning a disk to a suspension means for holding the slider, wherein a thixotropic property is provided between the bonding surface of the slider and the bonding surface of the suspension means. A bonding method comprising: bonding both bonding surfaces with a low-elasticity epoxy adhesive interposed therebetween; and applying a periodically fluctuating pressure to the bonding portion for a predetermined time. 7. The bonding method according to claim 6, wherein the pressure is applied by applying a vibrating rod to the joint.