JP2000307284A - Cooling apparatus for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cancel the generation of electrostatic spark caused by static electricity on a joint, by providing a metallic joint on an insulating piping and by providing a grounding means for the joint for discharging the static electricity being charged in the metallic joint when a metallic joint is provided in the middle of an insulation pipe. SOLUTION: A grounding means for a joint is composed of fitting clips 11, 12 and a grounding/connecting line 13. Of the fitting clips 11, 12, one fitting clip 11 has a clip-shape corresponding to a shape of a section of a hexagon nut shape 6b, one face of a hexagonal surface is cut off to make a shape for being mountable from the side of a coupler 6. Moreover, hook parts 11c which are not deviated from the hexagonal nut shape 6b is formed is formed upper and lower sides, and the fitting clip 11 is fitted and fixed from the side of the hexagonal nut shape 6b. Then, a grounding line 13 is connected to an end of the fitting clip 11, and static electricity which is charged on the coupler 6 is discharged through a branching unit 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic device having a metal joint in the middle of an insulating pipe through which a cooling medium of an insulating fluid flows, and an electronic device having an antistatic structure for the metal joint. The present invention relates to a cooling device for an apparatus.

[0002]

2. Description of the Related Art Regarding the prior art, FIG. 4 is a diagram for explaining a connection relationship between an insulating tube and a coupler, and FIG. 5 is a diagram showing an overall configuration of a cooling device of an electronic apparatus and a positional relationship diagram of the coupler. Will be explained. First, the main components of FIG. 5 will be described. The configuration is an example of a configuration including a cooling device (chiller) 50, branch units 20 and 22, joints (couplers) 6 and 9, a cooling heat transfer unit 10, and a heat source 80. Here, the cooling heat transfer units 10 of a plurality of N systems are connected to the connection ports of the branch units 20 and 22, but for simplicity, only one port is shown.

The chiller 50 circulates the cooling medium 2 through the circulation pump 5
This is a well-known cooling device that cools the heat source side by circulating in 4, and in the example of this figure, is an example of an air cooling system using an air cooling fan and an air cooling radiator. Here, the circulating cooling medium 2
Uses an insulating fluid that exhibits electrical insulation resistance, for example, perfluorocarbons (PFCs), which are alternative Freon gases. The connection between the chiller 50 and the branch units 20 and 22 is connected by a thick metal pipe or a flexible pipe.

[0004] The branch units 20 and 22 are provided with a plurality of N port connection ports, and are connected to the corresponding plurality of N cooling heat transfer units 10 to divide and collect the cooling medium 2. Although the number of ports N differs depending on the system configuration, for example, 20 ports are provided. These are grounded to the frame ground of the system mount. This is because, since the cooling medium 2 is an insulating fluid, the generation of static electricity is discharged to the ground with the friction of the flow.

[0005] The cooling heat transfer unit 10 is a heat transfer device for cooling the inside of the cooling heat transfer unit by the circulating cooling medium 2 and cooling the heat source 80 in contact with the cooling heat transfer unit. And, it has a shape capable of satisfactorily conducting heat corresponding to the heat source 80. This cooling heat transfer unit 1
In the case of 0, the number of units to be installed increases or decreases depending on the system configuration.
Further, as described above, the cooling heat transfer unit 10 is also grounded to the frame ground of the system stand, and discharges the charged static electricity to the ground.

[0006] The heat sources 80 are provided at a plurality of locations and are distributed. It is a heat source mainly equipped with electronic circuits with high heat generation density, and there is a system that consumes several kilowatts as a whole. The heat dissipation structure may be, for example, a heat sink structure attached to a plurality of semiconductor chips, or a semiconductor chip or a semiconductor package.
0 or the cooling heat transfer unit 10 via a heat pipe. The circuit ground of the electronic circuit is also connected to the frame ground.

Next, a specific connection diagram of the coupler 6 will be described with reference to FIG. In this figure, a simplified diagram is shown in which only one of the plurality of ports is connected. Insulation tubes 31 and 32 are used to connect the cooling heat transfer unit 10 and the branch units 20 and 22, and a coupler 6 which is a joint that can be fitted and removed is provided in the middle. Insulating tubes 31 and 3
As 2, an insulating material having an electrical insulation resistance is used. This is in practical use because the insulating tube is much cheaper than the expensive metal flexible tube. The coupler 6 is made of metal and has a connection structure that can be fitted and removed with almost no outflow of the cooling medium 2. The coupler 6 is not placed at a fixed position because it varies depending on the system configuration, or is placed in a state of being bundled with thousands of other electric cables for signal propagation. Therefore, many couplers 6 cannot be connected to the frame ground.

[0008]

As described above, in the prior art, some couplers 6 cannot be connected to the frame ground. Here, since the coupler 6 is in an electrically floating state, the coupler is charged with static electricity and increases with the friction of the flow of the cooling medium 2 which is an insulating fluid. When the voltage reaches several thousand volts or more, an electrostatic spark is generated between adjacent objects. This spark noise may cause a malfunction of the system, which is not preferable in this respect and has a practical difficulty. Therefore, the problem to be solved by the present invention is to provide a cooling device for an electronic device having a metal joint in the middle of an insulating pipe that circulates a cooling medium of an insulating fluid, including an electrostatic discharge structure for the metal joint. It is to provide a cooling device for an electronic device.

[0009]

First, in order to solve the above problems, according to the structure of the present invention, an insulating pipe (for example, insulating tubes 31 and 32) through which a cooling medium of an insulating fluid flows.
A cooling device for an electronic device having a metal joint (for example, a coupler) in the middle of a pipe, comprising a joint grounding means for discharging static electricity charged to the metal joint. It is. According to the above invention, in a cooling device for an electronic device having a metal joint in the middle of a pipe of an insulating pipe through which a cooling medium of an insulating fluid flows, an electrostatic discharge structure for discharging static electricity charged to the metal joint A cooling device for an electronic device including:

Second, in order to solve the above-mentioned problems, in the configuration of the present invention, at least one cooling device (chiller) 50 is provided.
The cooling device 50 includes a cooling heat transfer unit 10 serving as one cooling target, and the cooling device 50 circulates and cools the cooling heat transfer unit 10 to cool the cooling heat transfer unit 10. The cooling medium 2 that circulates through the cooling device 50 uses an insulating fluid that exhibits electrical insulation resistance. The cooling heat transfer unit 10 and the cooling device 50 are both electrically grounded, In a cooling device of an electronic device having a configuration in which the cooling heat transfer unit 10 side and the cooling device 50 side are connected by an insulating pipe (eg, insulating tubes 31 and 32) made of an insulating material, a metal that is inserted in the middle of the insulating pipe And a joint grounding means 70 for electrically grounding the metal joint 6 to discharge static electricity to the joint caused by friction of the flow of the insulating fluid. There are cooling devices for electronic devices.

FIG. 3 shows a solution according to the present invention. One embodiment of the joint grounding means 70 includes two fitting structures and a ground connection line, and one of the fitting structures fits in accordance with the outer shape of the metal part of the metal joint 6. A conductive elastic structure that supports and makes electrical contact (for example, a hexagon nut fitting clip 11 or an elastic resin structure that has been made conductive by mixing the surface with metal plating or carbon). The other fitting structure is a conductive elastic structure (for example, a hexagon nut fitting clip 12 or the like) which is fitted to and supported by the joint 7 on the grounded side and makes electrical contact therewith. The line 13 electrically connects the two fitting structures to each other.

One embodiment of the joint grounding means 70 includes a fitting structure and a ground connection line, and the elastic mounting body is fitted and supported in accordance with the outer shape of the metal part of the metal joint 6. A grounding connection line 13 having one end connected to the fitting structure and the other end connected to the grounding portion by, for example, a crimp terminal. There is the cooling device for an electronic device described above, which is provided with a connecting structure.

The above-mentioned electronic device cooling device is characterized in that the metal joint 6 is a coupler having a connection structure that can be fitted and removed without the cooling medium 2 flowing out.

The cooling heat transfer unit 10 cools the inside of the cooling heat transfer unit by the circulating cooling medium 2 to cool a plurality of semiconductor chips or semiconductor packages having a high heat generation density provided in contact with the cooling heat transfer unit. Alternatively, there is the cooling device for an electronic device described above, which is a heat transfer member that cools at least one heat sink structure attached to a semiconductor chip.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings together with embodiments.

In the present invention, a specific example of a fitting clip for grounding the coupler of FIG. 1, a diagram showing the overall configuration of the cooling device of the electronic device of FIG. 2 and a portion for grounding the coupler, and connection to the coupler of FIG. This will be described below with reference to an example of a structure of a fitting clip to be fitted. Elements corresponding to the conventional configuration are denoted by the same reference numerals.

As shown in the configuration of FIG. 2, the component of the present invention has a configuration in which a joint grounding means 70 is added to a conventional component. The joint grounding means 70 is means for connecting the freely movable coupler 6 to the frame ground.
One specific example is shown in FIG. Here, in FIG.
In the following description, it is assumed that a hexagonal nut shape 6b is provided at the end of the branch unit 22 and that the joint 7 of the branch unit 22 also has a hexagonal nut shape.

At this time, the joint grounding means 70 includes the fitting clips 11 and 12 and the ground connection line 13. On the other hand, the first example of the fitting clip 11 is as shown in FIG.
A clip shape corresponding to the hexagonal nut shape 6b portion of the coupler 6 is provided, and a hexagonal surface is cut out to have a shape that can be mounted from the side surface of the coupler 6 and further, a claw portion 11c that does not deviate from the hexagonal nut shape 6b Are formed above and below. This uses an elastic metal material. Then, it is fitted and fixed by being fitted from the side surface of the hexagonal nut shape 6b. A ground connection line 13 is connected to one end 11b of the fitting clip 11. As shown in FIG. 3B, the second example of the fitting clip 11 has a clip shape corresponding to the hexagonal nut shape 6 b of the coupler 6, and has a shape that can be mounted from the parallel direction of the coupler 6. A claw portion 11d which is not easily displaced from the hexagonal nut shape 6b after mounting is formed vertically and provided. Then, the hexagonal nut 6b is fitted and fixed by being fitted in the parallel direction. One end 11 of this fitting clip 11
The ground connection line 13 is similarly connected to b.

In the above description, a specific example of the structure of the coupler having the hexagonal nut shape 6b has been described.
May be another structure that can have a shape that can be fitted in correspondence with the end shape of the coupler. If the metal band is not to be removed later, the band may be strongly tightened using a metal band as required, and a band tightening structure having a connection end of the ground connection line 13 at one end of the metal band may be realized. In the above description, a specific example in which the coupler 6 has a connection structure that can be detachably connected is described. However, the present invention can be similarly applied to a place where a general metal joint is used.

On the other hand, the fitting clip 12 is applied in the same manner as the fitting clip 11 according to the shape of the joint 7.

The ground connection line 13 is attached by winding the fitting clip 11 and the fitting clip 12 along the insulating tube 32 or by spiral winding. As a result, both are electrically connected, and the static electricity charged on the coupler 6 is grounded via the branch unit 22. Therefore, the static electricity of the coupler 6 is discharged, and there is an advantage that unnecessary electrostatic spark is eliminated.

[0022]

According to the present invention, the following effects can be obtained from the above description. As described above, according to the present invention, a cooling medium having an electrical insulation resistance is connected between devices by an insulating pipe (insulating tube), and a metal joint (for example, a coupler) is provided in the middle of the insulating pipe. In the cooling device for an electronic device having a configuration in which the joint is provided, by providing the joint grounding means for grounding the metal joint, there is obtained an advantage that generation of an electrostatic spark caused by static electricity of the joint is eliminated. Therefore, unnecessary malfunction of the electronic device can be eliminated. Therefore, there is obtained an advantage that a cooling device for an electronic device using an inexpensive insulating pipe can be practically implemented.

[Brief description of the drawings]

FIG. 1 shows a specific example of a fitting clip for grounding a coupler according to the present invention.

FIG. 2 is an overall configuration of a cooling device for an electronic device according to the present invention;
The figure which shows the part which grounds a coupler.

FIG. 3 is a structural example of a fitting clip connected to a coupler according to the present invention.

FIG. 4 is a diagram illustrating a conventional connection relationship between an insulating tube and a coupler.

FIG. 5 is an overall configuration diagram of a conventional cooling device for an electronic device and a positional relationship diagram of a coupler.

[Explanation of symbols]

 2 Cooling medium 6 Metal joint (coupler) 7, 9 Joint 10 Cooling heat transfer unit 11, 12 Fitting clip 13 Ground connection line 20, 22 Branch unit 31, 32 Insulation tube 50 Cooling device (chiller) 70 Joint grounding means 80 heat source

Claims (6)

[Claims] 1. A cooling device for an electronic device having a metal joint in the middle of an insulating pipe through which a cooling medium of an insulating fluid flows, wherein a joint grounding means for discharging static electricity charged to the metal joint is provided. A cooling device for an electronic device, comprising: 2. A cooling device (chiller) and at least one cooling heat transfer unit to be cooled. The cooling device circulates and cools the cooling heat transfer unit, and the cooling heat transfer unit is an electronic device. A heat transfer unit that cools a heat source having a high heat generation density on which a circuit is mounted, and a cooling medium that circulates through the cooling device uses an insulating fluid that electrically shows insulation resistance.
The cooling device of the electronic device, wherein the cooling heat transfer unit and the cooling device are both electrically grounded, and the cooling heat transfer unit side and the cooling device side are connected by piping with an insulating pipe made of an insulating material. An electronic device, comprising: a metal joint inserted in the middle of the insulating pipe; and a joint grounding means for electrically grounding the metal joint to discharge static electricity to the joint. For cooling device. 3. The joint grounding means includes two fitting structures and a ground connection line, and one of the fitting structures is fitted and supported in accordance with the outer shape of the metal portion of the metal joint. The other contact fitting structure is a conductive elastic structure that is fitted to and supported by a joint on the grounded side and is in electrical contact with the ground joint. 3. The wire according to claim 1, wherein the wire electrically connects the two fitting structures.
A cooling device for an electronic device according to claim 1. 4. The joint grounding means comprises a fitting structure and a ground connection line, and the elastic mounting body is fitted and supported corresponding to the outer shape of the metal part of the metal joint to make electrical contact. 3. The electronic device according to claim 1, wherein the ground connection line has one end connected to the fitting structure, and the other end connected to a ground portion. 4. Equipment cooling device. 5. The cooling device for an electronic device according to claim 1, wherein the metal joint is a coupler having a connection structure that can be fitted and removed without a cooling medium flowing out. 6. The cooling heat transfer unit cools the inside of the cooling heat transfer unit with a circulating cooling medium and cools a plurality of semiconductor chips or semiconductor packages having a high heat generation density provided in contact with the cooling heat transfer unit. 3. The cooling device for an electronic device according to claim 2, wherein the cooling device is a heat transfer member that cools a heat sink structure attached to the chip.