JP2000297150A - Polyamide resin - Google Patents

Polyamide resin

Info

Publication number
JP2000297150A
JP2000297150A JP10672199A JP10672199A JP2000297150A JP 2000297150 A JP2000297150 A JP 2000297150A JP 10672199 A JP10672199 A JP 10672199A JP 10672199 A JP10672199 A JP 10672199A JP 2000297150 A JP2000297150 A JP 2000297150A
Authority
JP
Japan
Prior art keywords
polyamide resin
weight
polyamide
molecular weight
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10672199A
Other languages
Japanese (ja)
Inventor
Masaaki Miyamoto
正昭 宮本
Masanori Yamamoto
正規 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP10672199A priority Critical patent/JP2000297150A/en
Publication of JP2000297150A publication Critical patent/JP2000297150A/en
Pending legal-status Critical Current

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  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a polyamide resin or a polyamide resin compsn. suitable for preparing a polyamide film having excellent physical properties and transparency. SOLUTION: This polyamide resin comprises an ε-caprolactam as a main polymer constituting component, and having a low mol.wt. component with a mol.wt. of 1,000-10,000 in a concn. of 10.0 wt.% or less based on 100 wt.% of a polyamide having a mol.wt. of 1,000 or more, the mol.wt. being measured by gel permeation chromatography and being polystyrene-converted.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、透明性に優れたポ
リアミドフィルムを製造するためのポリアミド樹脂組成
物および該組成物を用いたポリアミドフィルムに関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin composition for producing a polyamide film having excellent transparency, and a polyamide film using the composition.

【0002】[0002]

【従来の技術】ポリアミドフィルムは酸素バリアー性、
耐薬品性、耐ピンホール性等の優れた特性を有している
が、成型時の結晶化により透明性が悪化するという欠点
を有している。この欠点を克服するために、脂肪酸アミ
ドやカプロラクタムのような低分子量成分をポリアミド
樹脂に添加する方法(例えば特開昭64−85315号
公報)や、共重合により結晶性を低下させる方法が知ら
れているが、添加された低分子量成分は該ポリアミド成
型物の使用中に徐々に外部に溶け出し、外部への移行を
起こしたり、使用中に次第に透明性を低下させたりする
問題がある。また共重合ポリアミドによる改良では一般
的に共重合成分が多いほど透明性は良好になるが、同時
に強度や耐薬品性等の物性も低下するため要求性能と透
明性を両立することは困難な場合が多い。一方、ポリア
ミドから成るフィルムはブロッキングし易く梱包や包装
時の作業性を損なうことが知られており、ブロッキング
性を改良させるために、一般的にはシリカやタルク、カ
オリン等の微粉化した無機物を添加する場合が多いが、
微粉化した無機物の添加は、成形品の透明性を悪化させ
その商品価値を落とすと同時にフィルム中の異物となり
延伸時に破断を引き起こすため、これらの無機物を添加
しても透明性を悪化させず延伸破断しないポリアミドが
望まれていた。
2. Description of the Related Art Polyamide films have an oxygen barrier property,
Although it has excellent properties such as chemical resistance and pinhole resistance, it has a drawback that transparency is deteriorated due to crystallization during molding. In order to overcome this drawback, a method of adding a low molecular weight component such as a fatty acid amide or caprolactam to a polyamide resin (for example, JP-A-64-85315) and a method of reducing crystallinity by copolymerization are known. However, there is a problem that the added low molecular weight component gradually dissolves to the outside during use of the polyamide molded product, causing migration to the outside, and gradually decreasing transparency during use. In addition, in the improvement by copolymerized polyamide, generally, the more copolymerized components, the better the transparency, but at the same time, the physical properties such as strength and chemical resistance also deteriorate, so it is difficult to achieve both required performance and transparency. There are many. On the other hand, a film made of polyamide is known to easily block and impair the workability during packing and packaging, and in order to improve the blocking property, generally, finely divided inorganic substances such as silica, talc, and kaolin are used. Often added,
The addition of finely divided inorganic substances deteriorates the transparency of the molded product and lowers its commercial value, and at the same time, becomes a foreign substance in the film and causes breakage during stretching. Therefore, even if these inorganic substances are added, the transparency is not deteriorated and the stretching is performed. A polyamide that does not break has been desired.

【0003】[0003]

【発明が解決しようとする課題】かかる現状において本
発明は前記した従来技術の欠点を解消するべくなされた
ものであり、本発明の目的は、ポリマー物性を損なうこ
となく透明性の改良されたポリアミドフィルムを製造す
るのに適したポリアミド樹脂またはポリアミド樹脂組成
物を提供することにあり、中でも延伸フィルムにその効
果が著しい樹脂または樹脂組成物を提供することを目的
とする。
SUMMARY OF THE INVENTION Under these circumstances, the present invention has been made to solve the above-mentioned disadvantages of the prior art, and an object of the present invention is to provide a polyamide having improved transparency without impairing the physical properties of the polymer. An object of the present invention is to provide a polyamide resin or a polyamide resin composition suitable for producing a film, and more particularly to provide a stretched film with a resin or a resin composition having a remarkable effect.

【0004】[0004]

【課題を解決するための手段】本発明者は上記課題につ
いて鋭意検討を重ねた結果、特定の分子量範囲のオリゴ
マーが一定量以下のポリアミド樹脂またはポリアミド樹
脂組成物を用いたフィルムが特異的に優れた物理的性質
及び透明性を有することを見出し、本発明に到達した。
すなわち本発明の要旨は、ゲルパーミエイションクロマ
トグラフィーで測定したポリスチレン換算の分子量が1
000以上のポリアミドを100重量%とした場合に、
分子量1000〜10000である低分子量物の比率が
10.0重量%以下であることを特徴とするε−カプロ
ラクタムを主なポリマー構成成分とするポリアミド樹
脂、に存する。
Means for Solving the Problems As a result of diligent studies on the above-mentioned problems, the present inventors have found that a film using a polyamide resin or a polyamide resin composition in which an oligomer having a specific molecular weight range is a certain amount or less is specifically excellent. The present invention has been found to have excellent physical properties and transparency.
That is, the gist of the present invention is that the molecular weight in terms of polystyrene measured by gel permeation chromatography is 1
When 100% by weight or more of polyamide of 000 or more is
A polyamide resin containing ε-caprolactam as a main polymer component, characterized in that the ratio of low molecular weight compounds having a molecular weight of 1,000 to 10,000 is 10.0% by weight or less.

【0005】また本発明の要旨は、成分A:微粒子を
0.5〜20重量%含むポリアミド樹脂組成物 1〜8
0重量部、及び成分B:実質的に微粒子を含まない上記
ポリアミド樹脂 99〜20重量部、を混合して成るポ
リアミド樹脂組成物、に存する。さらに本発明の要旨
は、これらのポリアミド樹脂またはポリアミド樹脂組成
物を用いたポリアミド系樹脂フィルム、に存する。
[0005] The gist of the present invention is to provide a component A: a polyamide resin composition 1 to 8 containing 0.5 to 20% by weight of fine particles.
0 parts by weight and component B: a polyamide resin composition obtained by mixing 99 to 20 parts by weight of the above polyamide resin substantially containing no fine particles. Further, the gist of the present invention resides in a polyamide-based resin film using the polyamide resin or the polyamide resin composition.

【0006】[0006]

【発明の実施の形態】以下、本発明につき詳細に説明す
る。本発明のポリアミド樹脂またはポリアミド樹脂組成
物を製造するために使用されるポリアミド樹脂とは、ε
−カプロラクタムを主なポリマー構成成分とする重合体
であり、共重合成分として3員環以上のラクタム、アミ
ノ酸、ジカルボン酸またはジアミンを少量、好ましくは
3重量%以下、より好ましくは1重量%以下含んでいて
も良いし、必要に応じてモノカルボン酸やジカルボン
酸、モノアミンやジアミンで末端を修飾することもでき
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The polyamide resin used for producing the polyamide resin or the polyamide resin composition of the present invention is ε
-A polymer having caprolactam as a main polymer component, and containing a small amount of a lactam, amino acid, dicarboxylic acid or diamine having three or more rings as a copolymer component, preferably 3% by weight or less, more preferably 1% by weight or less. Alternatively, the terminal may be modified with a monocarboxylic acid or dicarboxylic acid, a monoamine or a diamine as needed.

【0007】本発明のポリアミド樹脂またはポリアミド
樹脂組成物を用いたフィルムが特異的に優れた透明性を
発現するには、ゲルパーミエイションクロマトグラフィ
ーで測定したポリスチレン換算の分子量が1000以上
のポリアミドを100重量%とした場合に、分子量10
00〜10000である低分子量物の比率が、10.0
重量%以下であることが必要で、好ましくは9.5重量
%以下、より好ましくは9.0重量%以下、特には8.
5重量%以下が好適である。分子量1000〜1000
0である低分子量物の比率が、10.0重量%より多い
と透明性が悪化する。
In order for a film using the polyamide resin or polyamide resin composition of the present invention to exhibit specifically excellent transparency, a polyamide having a polystyrene equivalent molecular weight of 1,000 or more measured by gel permeation chromatography must be used. When the weight is 100% by weight, the molecular weight is 10
The ratio of low molecular weight substances of from 00 to 10,000 is 10.0
% By weight, preferably 9.5% by weight or less, more preferably 9.0% by weight or less, especially 8.
5% by weight or less is preferred. Molecular weight 1000-1000
If the ratio of the low molecular weight compound of 0 is more than 10.0% by weight, the transparency is deteriorated.

【0008】本発明のポリアミド樹脂の示差走査熱量計
による等温結晶化法により185℃で保持して測定した
半結晶化時間は通常180秒以上であり、好ましくは2
20秒以上、より好ましくは250秒以上である。ま
た、一旦溶融させた後の再結晶化温度は155〜162
℃、好ましくは156〜162℃、特に好ましくは15
7〜161℃である。分子量1000〜10000であ
る低分子量物の比率が10.0重量%より多いと結晶化
を促進し、等温結晶化法による半結晶化時間が短くな
り、再結晶化温度も高くなって結果的にフィルムの透明
性を悪化させる。
The half-crystallization time of the polyamide resin of the present invention measured at 185 ° C. by an isothermal crystallization method using a differential scanning calorimeter is usually 180 seconds or more, preferably 2 seconds.
It is at least 20 seconds, more preferably at least 250 seconds. Further, the recrystallization temperature after melting once is 155 to 162.
° C, preferably 156 to 162 ° C, particularly preferably 15 ° C.
7-161 ° C. If the ratio of the low molecular weight compound having a molecular weight of 1,000 to 10,000 is more than 10.0% by weight, crystallization is promoted, the half-crystallization time by the isothermal crystallization method is shortened, and the recrystallization temperature is also increased. Deteriorates the transparency of the film.

【0009】本発明のポリアミド樹脂の製造法は公知の
中で条件等を選択することができるが、ゲルパーミエイ
ションクロマトグラフィーで測定したポリスチレン換算
の分子量が1000以上のポリアミドを100重量%と
した場合に、分子量1000〜10000である低分子
量物の比率を10.0重量%以下にするためには、ε−
カプロラクタムのいわゆる重付加反応を促進させてやる
ことが好ましい。一般的に行われる溶融重合の場合、重
合初期段階に添加する水、6−アミノカプロン酸、ε−
カプロラクタムを主成分とするポリアミドオリゴマー等
の重付加反応促進剤量を1.0重量%以上とし、これら
とε−カプロラクタムの反応を十分に行わせε−カプロ
ラクタムの開環、重付加を促進させてやるために、22
0℃以上、好ましくは250℃以上、中でも260℃以
上の高温で処理する段階を経ることが好ましい。また、
添加する重付加反応促進剤が水などの揮発成分の場合に
は、これらの揮散を防ぎながら、前記の温度を維持する
ために反応器内を加圧にしてやることが好ましい。保持
圧力は重付加反応促進剤の沸点と反応器内温により決定
されるが、水の場合には通常ゲージ圧力で0.2MPa
以上、好ましくは0.3MPa以上、特には0.5MP
a以上が好適である。なお一般にε−カプロラクタムを
主成分とするポリアミドは未反応ε−カプロラクタム、
ε−カプロラクタムからなるオリゴマー等を含むため重
合後、通常ペレット化し沸騰水や低級アルコール等を用
いて可溶成分を取り除くことが行われるが、ゲルパーミ
エイションクロマトグラフィーで測定したポリスチレン
換算の分子量が分子量1000〜10000である低分
子量物は、このような抽出操作では取り除くことができ
ない。
The method for producing the polyamide resin of the present invention can be selected from among known conditions, but the polyamide having a polystyrene equivalent molecular weight of 1,000 or more measured by gel permeation chromatography was defined as 100% by weight. In order to reduce the ratio of low molecular weight compounds having a molecular weight of 1,000 to 10,000 to 10.0% by weight or less, ε-
It is preferable to promote the so-called polyaddition reaction of caprolactam. In the case of melt polymerization generally performed, water, 6-aminocaproic acid, ε-
The amount of a polyaddition reaction accelerator such as a polyamide oligomer containing caprolactam as a main component is set to 1.0% by weight or more to sufficiently react ε-caprolactam with these to promote ring opening and polyaddition of ε-caprolactam. 22 to do
It is preferable to go through a step of treating at a high temperature of 0 ° C. or higher, preferably 250 ° C. or higher, especially 260 ° C. or higher. Also,
When the polyaddition reaction accelerator to be added is a volatile component such as water, it is preferable to pressurize the inside of the reactor in order to maintain the above-mentioned temperature while preventing such volatilization. The holding pressure is determined by the boiling point of the polyaddition reaction promoter and the temperature inside the reactor. In the case of water, the gauge pressure is usually 0.2 MPa.
Or more, preferably 0.3MPa or more, especially 0.5MPa
a or more is preferable. In general, polyamide having ε-caprolactam as a main component is unreacted ε-caprolactam,
After polymerization to contain oligomers and the like composed of ε-caprolactam, the pellets are usually pelletized and soluble components are removed using boiling water or lower alcohols.The molecular weight in terms of polystyrene measured by gel permeation chromatography is low. Low molecular weight substances having a molecular weight of 1,000 to 10,000 cannot be removed by such an extraction operation.

【0010】また、重合を速やかに行わせるために、公
知の重合促進剤を添加することは有効であり、中でもリ
ン酸、亜燐酸、次亜リン酸、またはその塩やエステル等
のリン化合物が好適に用いられる。本発明のポリアミド
樹脂の分子量に特に制限はないが、低すぎると低分子量
成分が多くなり、高すぎると成形性が悪化するため、通
常98%硫酸中で測定した相対粘度で2.0〜6.5、
中でも2.5〜6.0、特には3.0〜5.0が好まし
い。
It is effective to add a known polymerization accelerator in order to promptly carry out the polymerization. In particular, phosphoric acid, phosphorous acid, hypophosphorous acid, or a phosphorus compound such as a salt or ester thereof is used. It is preferably used. Although the molecular weight of the polyamide resin of the present invention is not particularly limited, if the molecular weight is too low, the low molecular weight component increases, and if it is too high, the moldability deteriorates. .5,
Among them, 2.5 to 6.0, particularly 3.0 to 5.0 is preferable.

【0011】本発明のポリアミド樹脂を用いたフィルム
の耐ブロッキング性を改良するために、シリカ、タル
ク、カオリン、マイカ、ゼオライト等の無機微粒子やア
クリル系、スチレン系等の高分子有機微粒子を添加する
ことができるが、中でもシリカ、タルク、カオリン、マ
イカ、ゼオライト等の無機微粒子の添加が好ましく、透
明性の観点からは特にシリカが好適に用いられる。ま
た、これらの無機微粒子はシラン系カップリング剤、チ
タネート系カップリング剤等で表面処理を施してもよ
い。
In order to improve the blocking resistance of the film using the polyamide resin of the present invention, inorganic fine particles such as silica, talc, kaolin, mica, zeolite and the like, and high molecular organic particles such as acrylic and styrene are added. Among them, addition of inorganic fine particles such as silica, talc, kaolin, mica, and zeolite is preferable, and silica is particularly preferably used from the viewpoint of transparency. Further, these inorganic fine particles may be subjected to a surface treatment with a silane coupling agent, a titanate coupling agent, or the like.

【0012】微粒子の添加はフィルムの耐ブロッキング
性を向上させる一方で透明性を悪化させるため、その添
加量は製品の要求性能に依存するが、一般的に0.01
〜1重量%、特には0.05〜0.5重量%が好まし
い。微粒子の平均粒子径が大き過ぎるとフィルム中にフ
ィシュアイを生じ商品価値を落とす原因となり、小さす
ぎると耐ブロッキング効果が損なわれるので、特にコー
ルターカウンター法で測定した平均粒径が0.1〜20
μmであることが好ましく、中でも0.3〜15μm、
さらには1.0〜5.0μmが好ましい。
Since the addition of fine particles increases the blocking resistance of the film while deteriorating the transparency, the amount added depends on the required performance of the product.
To 1% by weight, particularly preferably 0.05 to 0.5% by weight. If the average particle size of the fine particles is too large, fish eyes are formed in the film, which causes a reduction in commercial value. If the average particle size is too small, the blocking resistance is impaired.In particular, the average particle size measured by the Coulter counter method is 0.1 to 20.
μm, preferably 0.3 to 15 μm,
Further, the thickness is preferably 1.0 to 5.0 μm.

【0013】これらの微粒子の添加方法としては、重合
時に添加する方法、押出機等で混練する方法、成型時に
混練する方法を適用することができるが、透明性の観点
からは、重合時に添加する方法が好ましい。また、ε−
カプロラクタムを主なポリマー構成成分とする重合体中
に微粒子を高濃度で含有するマスターバッチ(成分A)
を本発明の実質的に微粒子を含まないポリアミド樹脂ま
たはポリアミド樹脂組成物(成分B)と混合して樹脂組
成物を得、これをフィルムに成形すると透明性の改良効
果が大きいので特に好ましい。マスターバッチの微粒子
濃度は特に制限はないが、通常0.5〜20重量%、中
でも0.8〜5重量%、特には1〜2重量%が推奨され
る。マスターバッチの製造法については、ポリアミド樹
脂を重合する際に微粒子を添加する方法、ポリアミド樹
脂と微粒子をドライブレンドした後、1軸または2軸の
押出機等で溶融混練する方法があるが、重合時に添加し
た場合に透明性の改良効果が大きい。また、マスターバ
ッチもゲルパーミエイションクロマトグラフィーで測定
したポリスチレン換算の分子量が1000以上のポリア
ミドを100重量%とした場合に、分子量1000〜1
0000である低分子量物の比率が、10.0重量%以
下、好ましくは9.5重量%以下、より好ましくは9.
0重量%以下、特には8.5重量%以下であることが好
適である。
As a method for adding these fine particles, a method of adding at the time of polymerization, a method of kneading with an extruder or the like, and a method of kneading at the time of molding can be applied, but from the viewpoint of transparency, they are added at the time of polymerization. The method is preferred. Also, ε-
Masterbatch containing a high concentration of fine particles in a polymer mainly composed of caprolactam (component A)
Is mixed with a polyamide resin or a polyamide resin composition (component B) substantially free of fine particles of the present invention to obtain a resin composition, which is formed into a film, which is particularly preferable since the transparency is greatly improved. The concentration of the fine particles in the masterbatch is not particularly limited, but is usually 0.5 to 20% by weight, preferably 0.8 to 5% by weight, particularly preferably 1 to 2% by weight. As for the production method of the master batch, there are a method of adding fine particles when polymerizing the polyamide resin, a method of dry-blending the polyamide resin and the fine particles, and then melt-kneading with a single-screw or twin-screw extruder. When added sometimes, the effect of improving transparency is great. The master batch also has a molecular weight of 1000 to 1 when a polyamide having a molecular weight of 1000 or more in terms of polystyrene measured by gel permeation chromatography is defined as 100% by weight.
The ratio of the low molecular weight substance of 0000 is 10.0% by weight or less, preferably 9.5% by weight or less, more preferably 9.
It is preferably 0% by weight or less, particularly preferably 8.5% by weight or less.

【0014】マスターバッチと本発明のポリアミド樹脂
またはポリアミド樹脂組成物のブレンド比率は特に制限
はないが、一般的には1〜80重量部対99〜20重量
部、中でも3〜20重量部対97〜80重量部、さらに
は3〜10重量部対97〜90重量部が好ましい。ま
た、マスターバッチと本発明のポリアミド樹脂またはポ
リアミド樹脂組成物のブレンド方法については、重合時
にブレンドする方法、1軸または2軸の押出機等で混練
する方法、成型時に成型機中で混練と成形を同時に行う
方法等が適用できるが、中でも成型時に成型機中で混練
と成形を同時に行う方法が簡便であるので好ましい。
The blending ratio of the masterbatch and the polyamide resin or polyamide resin composition of the present invention is not particularly limited, but is generally 1 to 80 parts by weight to 99 to 20 parts by weight, and especially 3 to 20 parts by weight to 97 parts by weight. The amount is preferably from 80 to 80 parts by weight, more preferably from 3 to 10 parts by weight to 97 to 90 parts by weight. The method of blending the masterbatch with the polyamide resin or the polyamide resin composition of the present invention includes a method of blending at the time of polymerization, a method of kneading with a single-screw or twin-screw extruder, and a method of kneading and molding in a molding machine at the time of molding. And the like can be applied at the same time. Among them, a method of simultaneously performing kneading and molding in a molding machine during molding is preferable because it is simple.

【0015】また、柔軟性や耐ピンホール性を改良する
ために、他の樹脂、例えばアイオノマー樹脂、酸変性ポ
リエチレン、アクリルゴム、ポリエステル系エラストマ
ー等を添加することができる。。本発明のポリアミドま
たはポリアミド樹脂組成物は、他の慣用の成分、例えば
熱安定剤、光安定剤、紫外線吸収剤、酸化防止剤、帯電
防止剤、防腐剤、接着促進剤、着色剤、発泡剤、ブロッ
キング防止剤、結晶化促進剤、滑剤、展着剤、殺菌剤、
可塑剤、離型剤、増粘剤、防滴剤、衝撃性改良剤、など
を含み得るが、特に下記一般式で表されるビスアミド化
合物を添加すると、フィルムによりすぐれた透明性を与
えることができるので好ましい。
Further, in order to improve flexibility and pinhole resistance, other resins, for example, ionomer resin, acid-modified polyethylene, acrylic rubber, polyester elastomer and the like can be added. . The polyamide or polyamide resin composition of the present invention may contain other conventional components such as heat stabilizers, light stabilizers, ultraviolet absorbers, antioxidants, antistatic agents, preservatives, adhesion promoters, coloring agents, and foaming agents. , Anti-blocking agents, crystallization accelerators, lubricants, spreading agents, fungicides,
It may contain a plasticizer, a release agent, a thickener, a drip-proofing agent, an impact modifier, etc., but especially when a bisamide compound represented by the following general formula is added, it is possible to give the film a better transparency. It is preferable because it is possible.

【0016】[0016]

【化1】 Embedded image

【0017】またはOr

【0018】[0018]

【化2】 Embedded image

【0019】(式中、R1 は2価の炭化水素残基、R2
およびR3 は1価の炭化水素残基、R 4 およびR5 は水
素原子または1価の炭化水素残基を示す)
(Wherein R1Is a divalent hydrocarbon residue, RTwo
And RThreeIs a monovalent hydrocarbon residue, R FourAnd RFiveIs water
Represents an atom or a monovalent hydrocarbon residue)

【0020】上記一般式(1)で表されるビスアミド化
合物としては、ジアミノメタン、ジアミノエタン、ジア
ミノプロパン、ジアミノブタン、ジアミノヘキサン、ジ
アミノドデカン等のアルキレンジアミン、フェニレンジ
アミン、ナフチレンジアミン等のアリレーンジアミン、
キシリレンジアミン等のアリーレンジアルキルジアミン
等のジアミンとステアリン酸、ヘキサン酸、オクタン
酸、デカン酸、ラウリン酸、パルミチン酸、アラキジン
酸、ベヘン酸、オレイン酸、モンタン酸等の脂肪酸との
反応等によって得られるアルキレンビス脂肪酸アミド、
アリーレンビス脂肪酸アミド、アリーレンジアルキレン
ビス脂肪酸アミド等が挙げられるが、中でもN,N’−
メチレンビスステアリン酸アミド、N,N’−エチレン
ビスステアリン酸アミドが好適に用いられる。
Examples of the bisamide compound represented by the above general formula (1) include alkylene diamines such as diaminomethane, diaminoethane, diaminopropane, diaminobutane, diaminohexane, diaminododecane, and arylenes such as phenylenediamine and naphthylenediamine. Diamine,
Obtained by the reaction of diamines such as arylenedialkyldiamines such as xylylenediamine with fatty acids such as stearic acid, hexanoic acid, octanoic acid, decanoic acid, lauric acid, palmitic acid, arachidic acid, behenic acid, oleic acid and montanic acid. Alkylene bis fatty acid amide,
Examples include arylene bisfatty acid amides and arylenedialkylene bisfatty acid amides, among which N, N'-
Methylene bisstearic acid amide and N, N'-ethylenebisstearic acid amide are preferably used.

【0021】また、上記一般式(2)で表されるビスア
ミド化合物としては、メチルアミン、エチルアミン、ブ
チルアミン、ヘキシルアミン、デシルアミン、オクタデ
シルアミン、ドデシルアミン等のアルキルアミン、アニ
リン、ナフチルアミン等のアリールアミン、ベンジルア
ミン等のアラルキルアミン、シクロヘキシルアミン等の
シクロアルキルアミン、等のモノアミンとアジピン酸、
セバシン酸、テレフタル酸、イソフタル酸、p−フェニ
レンジプロピオン酸等のジカルボン酸との反応によって
得られるものが挙げられるが、中でもN,N’−ジオク
タデシルテレフタル酸アミド等のジオクタデシル二塩基
酸アミドが好ましい。これらのビスアミド化合物は単独
でも混合物としても用いることができる。
Examples of the bisamide compound represented by the general formula (2) include alkylamines such as methylamine, ethylamine, butylamine, hexylamine, decylamine, octadecylamine and dodecylamine; arylamines such as aniline and naphthylamine; Aralkylamines such as benzylamine, cycloalkylamines such as cyclohexylamine, and monoamines such as adipic acid;
Examples thereof include those obtained by reacting with dicarboxylic acids such as sebacic acid, terephthalic acid, isophthalic acid, and p-phenylenedipropionic acid. Among them, dioctadecyl dibasic amides such as N, N'-dioctadecyl terephthalamide Is preferred. These bisamide compounds can be used alone or as a mixture.

【0022】かかるビスアミドの添加は、フィルムの成
型時に水冷方式を取る場合に透明性の改良効果が大きい
ので特に好ましい。これらビスアミドの添加量はフィル
ムの場合、本発明のポリアミド樹脂またはポリアミド樹
脂組成物100重量部に対して0.01〜0.5重量
部、特に0.05〜0.3重量部が好ましい。かかるビ
スアミドの添加量が多すぎると包装材やフィラメント中
に凝集が起こり外観を損なう。また少なすぎると透明性
の改良効果が小さい。
The addition of such a bisamide is particularly preferable because the effect of improving the transparency is great when a water cooling system is employed at the time of molding the film. In the case of a film, the addition amount of these bisamides is preferably 0.01 to 0.5 part by weight, particularly preferably 0.05 to 0.3 part by weight, based on 100 parts by weight of the polyamide resin or the polyamide resin composition of the present invention. If the added amount of the bisamide is too large, agglomeration occurs in the packaging material or the filament and the appearance is impaired. If the amount is too small, the effect of improving transparency is small.

【0023】かかるビスアミドの添加は公知の方法を用
いることができ、具体的にはポリアミド樹脂の重合時に
添加する方法、ポリアミド樹脂またはポリアミド樹脂組
成物とドライブレンドし1軸もしくは2軸の押出機で溶
融混練する方法、フィルムまたはフィラメント成型時に
ドライブレンドする方法等が挙げられるが、簡便性の点
からは包装体成型時にドライブレンドする方法が好まし
い。また、本発明で言うフィルムは、Tダイ法、インフ
レーション法等公知の方法で成形されるが、特に1軸ま
たは2軸延伸されたフィルムが好適である。延伸倍率に
ついては特に制限はないが、通常1.2〜6倍、特には
2〜4倍に延伸されたフィルムで透明性の改良効果が大
きい。フィルムは単層構造であっても他の樹脂と共押出
やラミネート等の手法を用いて複層構造にしてもよい。
本発明のポリアミド樹脂またはポリアミド樹脂組成物を
用いたフィルムは、従来知られているものに比べ透明性
に優れているため利用価値が大きい。
A known method can be used for the addition of such a bisamide. Specifically, a method of adding at the time of polymerization of a polyamide resin, a dry blend with a polyamide resin or a polyamide resin composition, and a single or twin screw extruder. A method of melt-kneading, a method of dry-blending at the time of molding a film or a filament, and the like are mentioned. From the viewpoint of simplicity, a method of dry-blending at the time of molding a package is preferable. The film referred to in the present invention is formed by a known method such as a T-die method and an inflation method, but a film stretched uniaxially or biaxially is particularly preferable. Although there is no particular limitation on the stretching ratio, a film which is stretched usually from 1.2 to 6 times, particularly from 2 to 4 times, has a large effect of improving transparency. The film may have a single-layer structure or a multilayer structure using a technique such as coextrusion or lamination with another resin.
The film using the polyamide resin or the polyamide resin composition of the present invention has excellent transparency as compared with conventionally known films, and thus has a large utility value.

【0024】[0024]

【実施例】以下、本発明を実施例により更に詳細に説明
するが、本発明はその要旨を越えない限りこれらの実施
例に限定されるものではない。なお、実施例中「部」は
「重量部」を示す。また、測定は以下の方法で行った。
EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples unless it exceeds the gist. In the examples, “parts” indicates “parts by weight”. The measurement was performed by the following method.

【0025】(1)ゲルパーミエイションクロマトグラ
フィー(GPC)の測定 乾燥させたポリアミド樹脂ペレットをトリフルオロ酢酸
で処理しトリフルオロアセチル化させテトラヒドロフラ
ン(THF)可溶な試料とした後、THFを溶離液とし
(流量:1.0ml/min)、TOSOH TSK
GEL G2000H、G3000H、G4000H、
G5000H、計4本のカラムを用い、示差屈折計を検
知器として測定した。分子量および分子量分布の決定
は、市販の単分散標準ポリスチレンの溶出時間からポリ
スチレン換算として求めた。分子量1000〜1000
0である低分子量物の比率は、GPCのチャートを切り
取り、重量法で求めた。
(1) Measurement of Gel Permeation Chromatography (GPC) The dried polyamide resin pellets were treated with trifluoroacetic acid and trifluoroacetylated to obtain a tetrahydrofuran (THF) -soluble sample, and then THF was eluted. Liquid (flow rate: 1.0 ml / min), TOSOH TSK
GEL G2000H, G3000H, G4000H,
G5000H was measured using a total of four columns and a differential refractometer as a detector. The molecular weight and the molecular weight distribution were determined in terms of polystyrene from the elution time of commercially available monodispersed standard polystyrene. Molecular weight 1000-1000
The ratio of the low-molecular-weight product, which is 0, was determined by cutting out a GPC chart and determining the weight ratio.

【0026】(2)ポリアミドの相対粘度 JIS K6810−1970に従って98%硫酸を用
いて測定した。 (3)ポリアミドの半結晶化までの時間 パーキンエルマー社製DSC2を用い、ポリアミド樹脂
5±0.5mgをアルミ製パンに量り取り、窒素雰囲気
下、室温から20℃/minで260℃まで昇温した
後、この温度で3分間保持し、続いて100℃/min
以上の速度で185℃まで冷却しこのままの温度で保持
して結晶化ピークの頂点が出るまでの時間を測定した。
(2) Relative viscosity of polyamide Measured using 98% sulfuric acid according to JIS K6810- 1970. (3) Time to semi-crystallization of polyamide Using DSC2 manufactured by PerkinElmer, 5 ± 0.5 mg of polyamide resin is weighed into an aluminum pan, and the temperature is raised from room temperature to 260 ° C at 20 ° C / min under a nitrogen atmosphere. After that, it is kept at this temperature for 3 minutes, and then at 100 ° C./min.
The temperature was cooled to 185 ° C. at the above rate, and the temperature was maintained as it was, and the time until the peak of the crystallization peak appeared was measured.

【0027】(4)ポリアミドの再結晶化温度 SEIKO SSC−5000を用い、ポリアミド樹脂
5±0.5mgをアルミ製パンに量り取り、窒素雰囲気
下、室温から20℃/minで260℃まで昇温した
後、3分間保持し20℃/minで80℃まで降温した
際に現れる結晶化ピークの温度を測定した。
(4) Recrystallization temperature of polyamide 5 ± 0.5 mg of polyamide resin was weighed into an aluminum pan using SEIKO SSC-5000, and the temperature was raised from room temperature to 260 ° C. at a rate of 20 ° C./min under a nitrogen atmosphere. After that, the temperature was held for 3 minutes, and the temperature of the crystallization peak that appeared when the temperature was lowered to 80 ° C. at 20 ° C./min was measured.

【0028】(5)延伸破断 80℃で3×3倍に同時2軸延伸した時の破断枚数を調
べた。 (6)ペレット中のシリカ量 ペレットを灰化処理し、灰分重量より求めた。 (7)フィルムの耐ブロッキング性(滑り性) 東洋精機製作所社製、摩擦測定器TR型を使用し、AS
TM D1894に準拠し、23℃65%RHにおける
静止摩擦係数で評価した。 (8)フィルムの曇価 東京電色社製ヘーズメーターを使用してヘーズ値で評価
した。
(5) Stretching and Breaking The number of broken pieces when the film was simultaneously biaxially stretched 3 × 3 times at 80 ° C. was examined. (6) Amount of Silica in Pellet The pellet was incinerated and determined from the ash weight. (7) Blocking resistance (slipperiness) of film AS was measured using a friction measuring device TR type manufactured by Toyo Seiki Seisaku-sho, Ltd.
The static friction coefficient was evaluated at 23 ° C. and 65% RH according to TM D1894. (8) Haze value of film The haze value was evaluated using a haze meter manufactured by Tokyo Denshoku Co., Ltd.

【0029】実施例1 ε−カプロラクタムを60kg、H2 Oを1.8kg、
Na2 HPO3 の5%水溶液0.1Lを200Lのオー
トクレーブに仕込み、窒素置換後、反応器を封じ込めた
まま16rpmで攪拌しながらジャケットを加温し、内
温270℃、ゲージ圧0.7MPaに達した時点で大気
圧まで放圧し、続いて400torr迄減圧した。所定
攪拌動力になったところで攪拌を停止し、N2 で複圧後
内容物をストランド状に抜出し回転式カッターでペレッ
ト化した。続いてこのペレットを150Lの沸騰純水を
用いて抽出する操作を5回繰り返し、未反応モノマーお
よび低分子量物を除いた後、120℃、1torrで水
分量が0.1%以下になるまで乾燥した。得られたポリ
アミド樹脂の相対粘度は3.7、分子量1000〜10
000である低分子量物の比率は8.0重量%であっ
た。実施例5及び比較例1で得られた樹脂の相対粘度、
低分子量物の比率と共に表−1にまとめて示す。
Example 1 60 kg of ε-caprolactam, 1.8 kg of H 2 O,
0.1 L of a 5% aqueous solution of Na 2 HPO 3 was charged into a 200 L autoclave, and after purging with nitrogen, the jacket was heated while stirring at 16 rpm while the reactor was sealed, and the internal temperature was increased to 270 ° C. and the gauge pressure to 0.7 MPa. When the pressure reached, the pressure was released to atmospheric pressure, and then reduced to 400 torr. When a predetermined stirring power was reached, the stirring was stopped, and after double-pressing with N 2 , the contents were drawn out in a strand shape and pelletized with a rotary cutter. Subsequently, the operation of extracting the pellet with 150 L of boiling pure water is repeated 5 times to remove unreacted monomers and low molecular weight substances, and then dried at 120 ° C. and 1 torr until the water content becomes 0.1% or less. did. The resulting polyamide resin has a relative viscosity of 3.7 and a molecular weight of 1,000 to 10.
The ratio of low molecular weight substances, which was 000, was 8.0% by weight. Relative viscosity of the resin obtained in Example 5 and Comparative Example 1,
Table 1 shows the ratios of the low molecular weight substances together.

【0030】このポリアミド樹脂100部に対し、エチ
レンビスステアリン酸アミドを0.08部ドライブレン
ドした後、プラコー製水冷インフレーション成型機を使
用し、樹脂温度240℃で厚み135μmの単層フィル
ムを成形した。続いてこのフィルムをロング社製2軸延
伸機を用い、80℃で3×3倍に同時2軸延伸した後、
210℃でヒートセットして厚み15μmの2軸延伸ポ
リアミドフィルムを得た。得られたフィルムの延伸破
断、静止摩擦係数、ヘーズ値を求め、他の実施例、比較
例で得たフィルムの結果と共に表−2にまとめて示す。
After 0.08 parts of ethylenebisstearic acid was dry-blended with 100 parts of this polyamide resin, a single-layer film having a thickness of 135 μm was formed at a resin temperature of 240 ° C. using a water-cooled inflation molding machine manufactured by Placo. . Subsequently, the film was simultaneously biaxially stretched 3 × 3 times at 80 ° C. using a long biaxial stretching machine,
Heat setting was performed at 210 ° C. to obtain a biaxially stretched polyamide film having a thickness of 15 μm. The stretch rupture, static friction coefficient, and haze value of the obtained film were determined, and the results are shown in Table 2 together with the results of the films obtained in other Examples and Comparative Examples.

【0031】実施例2 実施例1で得られたポリアミド樹脂100部に微粉タル
ク(サイプスマインズ社製、商品名:ミストロンベーパ
ー)を0.03部、エチレンビスステアリルアミドを
0.1部ドライブレンドし、シリンダ径40mm、L/
D22の単軸押出機を用いて樹脂温度240℃で溶融、
Tダイより連続的に押し出し、これを表面温度80℃の
金属製ロール上に引き取って厚み30μmの単層フィル
ムを成形した。
Example 2 To 100 parts of the polyamide resin obtained in Example 1, 0.03 part of fine talc (trade name: Mistron Vapor, manufactured by Sipes Mines) and 0.1 part of ethylene bisstearylamide were dried. Blend, cylinder diameter 40mm, L /
Melted at a resin temperature of 240 ° C. using a single screw extruder of D22,
It was continuously extruded from a T-die and was taken out on a metal roll having a surface temperature of 80 ° C. to form a 30 μm thick single layer film.

【0032】実施例3 平均粒径1.4μmのシリカ微粒子(富士シリシア社
製、商品名:サイリシア310)0.9kgを80%カ
プロラクタム水溶液中に5%濃度となるように高速攪拌
機分散させ、Na2 HPO3 の5%水溶液0.1Lとと
もに200Lのオートクレーブに仕込んだ。次いでトー
タルのカプロラクタム量が60kgになるように追加の
カプロラクタムを仕込み、実施例1と同様の方法で重合
を行った。所定攪拌動力になったところで攪拌を停止
し、N2で複圧後内容物をストランド状に抜出し回転式
カッターでペレット化した。続いてこのペレットを15
0Lの沸騰純水を用いて抽出する操作を5回繰り返し、
未反応モノマーおよび低分子量物を除いた後、120
℃、1torrで水分量が0.1%以下になるまで乾燥
した。得られたポリアミドの相対粘度は3.7、灰分量
は1.6重量%であった。このマスターバッチ6部と実
施例1のポリアミド樹脂94部、エチレンビスステアリ
ン酸アミドを0.08部ドライブレンドした後、プラコ
ー社製水冷インフレーション成型機を使用し、樹脂温度
240℃で厚み135μmの単層フィルムを成形した。
続いてこのフィルムをロング社製2軸延伸機を用い、8
0℃で3×3倍に同時2軸延伸した後、210℃でヒー
トセットして厚み15μmの2軸延伸ポリアミドフィル
ムを得た。
Example 3 0.9 kg of silica fine particles (manufactured by Fuji Silysia Ltd., trade name: Sylysia 310) having an average particle size of 1.4 μm was dispersed in an 80% aqueous solution of caprolactam with a high-speed stirrer so as to have a 5% concentration. It was charged in a 200 L autoclave together with 0.1 L of a 5% aqueous solution of 2 HPO 3 . Next, additional caprolactam was charged so that the total caprolactam amount became 60 kg, and polymerization was carried out in the same manner as in Example 1. When a predetermined stirring power was reached, the stirring was stopped, and after double-pressing with N2, the contents were extracted in a strand shape and pelletized with a rotary cutter. Then, put the pellet into 15
The operation of extracting with 0 L of boiling pure water is repeated 5 times,
After removing unreacted monomers and low molecular weight substances, 120
It dried at 0.1 degreeC and 1 torr until the water content became 0.1% or less. The relative viscosity of the obtained polyamide was 3.7, and the ash content was 1.6% by weight. After dry blending 6 parts of this master batch, 94 parts of the polyamide resin of Example 1 and 0.08 part of ethylenebisstearic acid amide, using a water-cooled inflation molding machine made by Placo Co., Ltd., the resin temperature was 240 ° C. and the thickness was 135 μm. A layer film was formed.
Subsequently, this film was subjected to 8
After simultaneously biaxially stretching 3 × 3 times at 0 ° C., heat setting was performed at 210 ° C. to obtain a 15 μm-thick biaxially stretched polyamide film.

【0033】実施例4 実施例3のマスターバッチと実施例1のポリアミド樹脂
のブレンド比率を8部対92部にした他は実施例3と同
様にして厚み15μmの2軸延伸ポリアミドフィルムを
得た。 実施例5 ε−カプロラクタムを60kg、H2 Oを0.6kg、
Na2 HPO3 の5%水溶液0.1Lを200Lのオー
トクレーブに仕込み、窒素置換後、反応器を封じ込めた
まま16rpmで攪拌しながらジャケットを加温し、内
温240℃、ゲージ圧0.3MPaに達した時点で大気
圧まで放圧し、続いて400torr迄減圧した。所定
攪拌動力になったところで攪拌を停止し、N2 で複圧後
内容物をストランド状に抜出し回転式カッターでペレッ
ト化した。続いてこのペレットを150Lの沸騰純水を
用いて抽出する操作を5回繰り返し、未反応モノマーお
よび低分子量物を除いた後、120℃、1torrで水
分量が0.1%以下になるまで乾燥した。得られたポリ
アミドの相対粘度は3.8、分子量1000〜1000
0である低分子量物の比率は9.6重量%であった。こ
のポリアミド樹脂94部と実施例3記載のマスターバッ
チ6部、エチレンビスステアリン酸アミドを0.08部
ドライブレンドした後、プラコー製水冷インフレーショ
ン成型機を使用し、樹脂温度240℃で厚み135μm
の単層フィルムを成形した。続いてこのフィルムをロン
グ社製2軸延伸機を用い、80℃で3×3倍に同時2軸
延伸した後、210℃でヒートセットして厚み15μm
の2軸延伸ポリアミドフィルムを得た。
Example 4 A biaxially stretched polyamide film having a thickness of 15 μm was obtained in the same manner as in Example 3 except that the blend ratio of the master batch of Example 3 and the polyamide resin of Example 1 was changed to 8 parts to 92 parts. . Example 5 60 kg of ε-caprolactam, 0.6 kg of H 2 O,
0.1 L of a 5% aqueous solution of Na 2 HPO 3 was charged into a 200 L autoclave, and after purging with nitrogen, the jacket was heated while stirring at 16 rpm while the reactor was sealed, and the internal temperature was increased to 240 ° C. and the gauge pressure to 0.3 MPa. When the pressure reached, the pressure was released to atmospheric pressure, and then reduced to 400 torr. When a predetermined stirring power was reached, the stirring was stopped, and after double-pressing with N 2 , the contents were drawn out in a strand shape and pelletized with a rotary cutter. Subsequently, the operation of extracting the pellet with 150 L of boiling pure water is repeated 5 times to remove unreacted monomers and low molecular weight substances, and then dried at 120 ° C. and 1 torr until the water content becomes 0.1% or less. did. The resulting polyamide has a relative viscosity of 3.8 and a molecular weight of 1,000 to 1,000.
The ratio of low molecular weight substances, which was 0, was 9.6% by weight. After 94 parts of this polyamide resin, 6 parts of the masterbatch described in Example 3, and 0.08 part of ethylene bisstearic acid amide were dry-blended, a water-cooled inflation molding machine made by Placo was used.
Was formed. Subsequently, the film was simultaneously biaxially stretched 3 × 3 times at 80 ° C. using a long-axis biaxial stretching machine, and then heat-set at 210 ° C. to a thickness of 15 μm.
Was obtained.

【0034】比較例1 ε−カプロラクタムを60kg、H2 Oを0.24k
g、Na2 HPO3 の5%水溶液0.1Lを200Lの
オートクレーブに仕込み、窒素置換後、攪拌を行わずに
ジャケットを加温し、内温150℃、ゲージ圧0.1M
Paに達した時点で0.1MPaを維持するように放圧
しながらさらに内温を上昇させた。内温が210℃に達
した時点で大気圧まで放圧し、続いて400torr迄
減圧した。所定攪拌動力になったところで攪拌を停止
し、N2 で複圧後内容物をストランド状に抜出し回転式
カッターでペレット化した。続いてこのペレットを15
0Lの沸騰純水を用いて抽出する操作を5回繰り返し、
未反応モノマーおよび低分子量物を除いた後、120
℃、1torrで水分量が0.1%以下になるまで乾燥
した。得られたポリアミドの相対粘度は3.7、分子量
1000〜10000である低分子量物の比率は11.
0重量%であった。このポリアミド樹脂を用い実施例1
と同様の方法で2軸延伸ポリアミドフィルムを得た。表
−2記載の通り実施例1に比べ透明性が悪化した。
Comparative Example 1 60 kg of ε-caprolactam and 0.24 k of H 2 O
g, 0.1 L of a 5% aqueous solution of Na 2 HPO 3 was charged into a 200 L autoclave, and after the atmosphere was replaced with nitrogen, the jacket was heated without stirring, and the internal temperature was 150 ° C. and the gauge pressure was 0.1 M.
When the pressure reached Pa, the internal temperature was further increased while releasing the pressure so as to maintain 0.1 MPa. When the internal temperature reached 210 ° C., the pressure was released to atmospheric pressure, and then reduced to 400 torr. When a predetermined stirring power was reached, the stirring was stopped, and after double-pressing with N 2 , the contents were drawn out in a strand shape and pelletized with a rotary cutter. Then, put the pellet into 15
The operation of extracting with 0 L of boiling pure water is repeated 5 times,
After removing unreacted monomers and low molecular weight substances, 120
It dried at 0.1 degreeC and 1 torr until the water content became 0.1% or less. The relative viscosity of the obtained polyamide is 3.7, and the ratio of low molecular weight compounds having a molecular weight of 1,000 to 10,000 is 11.1.
It was 0% by weight. Example 1 using this polyamide resin
A biaxially stretched polyamide film was obtained in the same manner as described above. As described in Table 2, transparency was worse than that of Example 1.

【0035】比較例2 比較例1で得られたポリアミド樹脂を用い実施例2と同
様の方法で厚み30μmの単層フィルムを得た。表−2
記載の通り実施例2と滑り性は同等であったが、透明性
が悪化した。 比較例3 実施例1のポリアミド樹脂の替わりに比較例1で得られ
たポリアミド樹脂を用いた他は、実施例3と同様の方法
で厚み15μmの2軸延伸ポリアミドフィルムを得た。 表−2記載の通り実施例3と滑り性はほぼ同等であった
が、透明性が悪化し、延伸破断も見られた。
Comparative Example 2 Using the polyamide resin obtained in Comparative Example 1, a single-layer film having a thickness of 30 μm was obtained in the same manner as in Example 2. Table-2
As described, the slipperiness was equal to that of Example 2, but the transparency was deteriorated. Comparative Example 3 A 15-μm-thick biaxially stretched polyamide film was obtained in the same manner as in Example 3, except that the polyamide resin obtained in Comparative Example 1 was used instead of the polyamide resin of Example 1. As described in Table 2, the slipperiness was almost the same as that of Example 3, but the transparency was deteriorated and the stretch fracture was observed.

【0036】比較例4 実施例1のポリアミド樹脂の替わりに比較例1で得られ
たポリアミド樹脂を用いた他は、実施例4と同様の方法
で厚み15μmの2軸延伸ポリアミドフィルムを得た。
表−2記載の通り実施例4と滑り性はほぼ同等であった
が、透明性が悪化し、延伸破断も見られた。
Comparative Example 4 A biaxially stretched polyamide film having a thickness of 15 μm was obtained in the same manner as in Example 4 except that the polyamide resin obtained in Comparative Example 1 was used instead of the polyamide resin of Example 1.
As described in Table 2, the slipperiness was almost the same as that of Example 4, but the transparency was deteriorated, and a break in stretching was also observed.

【0037】[0037]

【表1】 [Table 1]

【0038】[0038]

【表2】 [Table 2]

【0039】[0039]

【発明の効果】本発明のポリアミド樹脂またはポリアミ
ド樹脂組成物は、フィルムに加工した場合に透明性に優
れるため利用価値が大きい。特に透明性と易滑性を同時
に満足し延伸破断もないため、生産性を落とすことな
く、美麗さが要求される包装用途等に適用することがで
きその効果が顕著である。
Industrial Applicability The polyamide resin or polyamide resin composition of the present invention has high utility value because it is excellent in transparency when processed into a film. In particular, since transparency and lubricity are simultaneously satisfied and there is no stretching breakage, the present invention can be applied to packaging and the like that requires a beautiful appearance without lowering the productivity, and the effect is remarkable.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F071 AA22 AA31 AA54 AA81 AB26 AF27 AF30 AH04 BB08 BC01 4J001 DA01 DB01 DC12 EA06 EE00E FA03 JA12 JB42 4J002 BC022 BG002 CL011 DJ006 DJ016 DJ036 DJ046 DJ056 FA082 FA086 FD012 FD016 GG02  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA22 AA31 AA54 AA81 AB26 AF27 AF30 AH04 BB08 BC01 4J001 DA01 DB01 DC12 EA06 EE00E FA03 JA12 JB42 4J002 BC022 BG002 CL011 DJ006 DJ016 DJ036 DJ046 DJ056 FA082 FA0016 012

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ゲルパーミエイションクロマトグラフィ
ーで測定したポリスチレン換算の分子量が1000以上
のポリアミドを100重量%とした場合に、分子量10
00〜10000である低分子量物の比率が10.0重
量%以下であることを特徴とするε−カプロラクタムを
主なポリマー構成成分とするポリアミド樹脂。
When a polyamide having a molecular weight of 1,000 or more in terms of polystyrene measured by gel permeation chromatography is defined as 100% by weight, a molecular weight of 10
A polyamide resin containing .epsilon.-caprolactam as a main polymer component, wherein the ratio of low molecular weight substances having a molecular weight of from 00 to 10,000 is 10.0% by weight or less.
【請求項2】 請求項1のポリアミド樹脂に微粒子を
0.01〜1重量%含むことを特徴とするポリアミド樹
脂組成物。
2. The polyamide resin composition according to claim 1, wherein the polyamide resin contains 0.01 to 1% by weight of fine particles.
【請求項3】 成分A:微粒子を0.5〜20重量%含
むポリアミド樹脂組成物 1〜80重量部、及び成分
B:実質的に微粒子を含まない請求項1に記載のポリア
ミド樹脂 99〜20重量部、を混合して成るポリアミ
ド樹脂組成物。
3. The polyamide resin composition according to claim 1, wherein component A: 1 to 80 parts by weight of a polyamide resin composition containing 0.5 to 20% by weight of fine particles, and component B: substantially no fine particles. Parts by weight of a polyamide resin composition.
【請求項4】 請求項1〜3のいずれかに記載のポリア
ミド樹脂またはポリアミド樹脂組成物を用いることを特
徴とするポリアミド系樹脂フィルム。
4. A polyamide resin film using the polyamide resin or the polyamide resin composition according to claim 1.
【請求項5】 1軸もしくは2軸に延伸されたことを特
徴とする請求項4に記載のポリアミド系樹脂フィルム。
5. The polyamide resin film according to claim 4, wherein the film is uniaxially or biaxially stretched.
JP10672199A 1999-04-14 1999-04-14 Polyamide resin Pending JP2000297150A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10672199A JP2000297150A (en) 1999-04-14 1999-04-14 Polyamide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10672199A JP2000297150A (en) 1999-04-14 1999-04-14 Polyamide resin

Publications (1)

Publication Number Publication Date
JP2000297150A true JP2000297150A (en) 2000-10-24

Family

ID=14440827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10672199A Pending JP2000297150A (en) 1999-04-14 1999-04-14 Polyamide resin

Country Status (1)

Country Link
JP (1) JP2000297150A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003012407A (en) * 2001-06-27 2003-01-15 Mitsubishi Chemicals Corp Polyamide film
JP2009001782A (en) * 2007-05-21 2009-01-08 Mitsubishi Gas Chem Co Inc Stretched product of thermoplastic resin composition having good gas-barrier property
JP2018192707A (en) * 2017-05-18 2018-12-06 東レフィルム加工株式会社 Bagging film
US11525035B2 (en) 2017-04-27 2022-12-13 Advansix Resins & Chemicals Llc Method and composition for improved agglomeration resistance of polyamide polymers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003012407A (en) * 2001-06-27 2003-01-15 Mitsubishi Chemicals Corp Polyamide film
JP2009001782A (en) * 2007-05-21 2009-01-08 Mitsubishi Gas Chem Co Inc Stretched product of thermoplastic resin composition having good gas-barrier property
US11525035B2 (en) 2017-04-27 2022-12-13 Advansix Resins & Chemicals Llc Method and composition for improved agglomeration resistance of polyamide polymers
JP2018192707A (en) * 2017-05-18 2018-12-06 東レフィルム加工株式会社 Bagging film

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