JP2000288723A - Soldering iron - Google Patents
Soldering ironInfo
- Publication number
- JP2000288723A JP2000288723A JP11095769A JP9576999A JP2000288723A JP 2000288723 A JP2000288723 A JP 2000288723A JP 11095769 A JP11095769 A JP 11095769A JP 9576999 A JP9576999 A JP 9576999A JP 2000288723 A JP2000288723 A JP 2000288723A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- iron
- soldering iron
- tip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気半田ゴテの連続作
業時における温度回復性能を良好にする構造に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for improving the temperature recovery performance during continuous operation of an electric soldering iron.
【0002】[0002]
【従来の技術】電子部品を基板に取り付ける際に用いら
れる半田ゴテは、セラミックヒータを発熱させて、コテ
先を加熱するように構成されている。半田ゴテの構造は
特開平9−300068号に記載されているように構成
されている。また、特開平8−118004号に記載さ
れているように、使用する際に負荷への接触により熱が
奪われて、コテ先の温度が低下してしまう。半田ゴテの
コテ先の温度は、半田付け作業に適した温度で安定する
のが望ましい。2. Description of the Related Art A soldering iron used when an electronic component is mounted on a substrate is configured so that a ceramic heater generates heat to heat an iron tip. The structure of the soldering iron is configured as described in JP-A-9-300688. Further, as described in Japanese Patent Application Laid-Open No. H08-118004, when used, heat is taken away by contact with a load, and the temperature of the iron tip decreases. The temperature of the soldering iron tip is desirably stabilized at a temperature suitable for the soldering operation.
【0003】[0003]
【発明が解決しようとする課題】本発明では、環境温度
の影響が少なく、コテ先の温度が負荷への接触によって
低下しにくく、かつ低下したコテ先の温度が回復しやす
い半田ゴテを提供することを目的とする。SUMMARY OF THE INVENTION According to the present invention, there is provided a soldering iron which is less affected by the environmental temperature, the temperature of the iron tip is hardly reduced by contact with a load, and the reduced temperature of the iron tip is easy to recover. The purpose is to.
【0004】[0004]
【課題を解決するための手段】上記目的を達成するため
に、電気半田ゴテに、ヒーターパイプの外周をを覆うカ
バーと、前記カバーを半田ゴテに締結するための締結手
段とを備えた。In order to achieve the above object, the electric soldering iron is provided with a cover for covering the outer periphery of the heater pipe, and fastening means for fastening the cover to the soldering iron.
【0005】[0005]
【実施例】以下、本発明の半田ゴテの実施例を図面に基
づいて説明する。図1は本発明の半田ゴテの外観を示す
もので、半田ゴテ本体1は一般的に用いられているもの
で、リング13によってコテ先11とヒーターパイプ1
2が取り外し可能に取り付けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a soldering iron according to the present invention will be described below with reference to the drawings. FIG. 1 shows the appearance of a soldering iron according to the present invention. The soldering iron main body 1 is generally used.
2 is removably mounted.
【0006】半田ゴテ1のネック部14に、カバー20
がホースバンド21で取り付けられている。カバー20
は金属製で円筒形に曲げられており、先端部は絞られて
いる。カバー20は、ヒーターパイプ12の外周をを覆
う形状で、コテ先11の一部または全部が露出してい
る。このカバー20を半田ゴテ1に取り付けるための締
結手段として、ホースバンド21が示されているが、カ
バーを固定する手段であれば良い。従来はヒーターパイ
プ12が外気と接触していたが、カバー20でヒーター
パイプ12を覆うように構成したので、外気の影響が少
なくなり、コテ先温度が安定した。[0006] A cover 20 is attached to the neck 14 of the soldering iron 1.
Is attached with a hose band 21. Cover 20
Is made of metal and is bent into a cylindrical shape, and the tip is narrowed. The cover 20 has a shape that covers the outer periphery of the heater pipe 12, and a part or all of the iron tip 11 is exposed. The hose band 21 is shown as a fastening means for attaching the cover 20 to the soldering iron 1, but any means for fixing the cover may be used. Conventionally, the heater pipe 12 was in contact with the outside air. However, since the heater pipe 12 was configured to cover the heater pipe 12, the influence of the outside air was reduced and the temperature of the iron tip was stabilized.
【0007】 基板 :ガラエポ基板 負荷 :3Aショットキバリアダイオード 室温 :25℃±3℃ 湿度 :50%±5% 設定温度:350℃ 上記条件において、コテ先11を負荷に1秒間接触し、
1秒間離すサイクルを2分間繰り返した。Substrate: glass epoxy substrate Load: 3A Schottky barrier diode Room temperature: 25 ° C. ± 3 ° C. Humidity: 50% ± 5% Set temperature: 350 ° C. Under the above conditions, the iron tip 11 is brought into contact with the load for 1 second.
The cycle of releasing for 1 second was repeated for 2 minutes.
【0008】本実施例を用いた半田ゴテのコテ先11
と、カバー20を外した状態でのコテ先11の温度変化
をグラフにして図3に示す。グラフに示すように、本実
施例の半田ゴテのコテ先温度は15度ほど下がった所で
±3度で安定し、カバー20を外した状態では25度下
がった所で±5度で安定した。[0008] Soldering iron tip using this embodiment 11
FIG. 3 is a graph showing the temperature change of the iron tip 11 with the cover 20 removed. As shown in the graph, the iron tip temperature of the soldering iron of this example was stabilized at ± 3 degrees when the temperature was lowered by about 15 degrees, and stabilized at ± 5 degrees when the temperature was lowered by 25 degrees when the cover 20 was removed. .
【0009】図4には、セラミックヒータへの通電開始
からコテ先温度が安定するまでの、本発明半田ゴテのコ
テ先11の温度変化と、従来の半田ゴテのコテ先の温度
変化を同条件の環境で測定した結果が示されている。カ
バー20を有した半田ゴテの方が、短時間で設定温度に
上昇することがわかった。FIG. 4 shows that the temperature change of the iron tip 11 of the soldering iron of the present invention and the temperature change of the iron tip of the conventional soldering iron from the start of energization to the ceramic heater to the stabilization of the iron tip temperature under the same conditions. The results measured in the environment shown in FIG. It was found that the soldering iron having the cover 20 rose to the set temperature in a shorter time.
【0010】このカバー20は脱着可能なため種々の半
田ゴテに取り付けることもできる。Since the cover 20 is detachable, it can be attached to various soldering irons.
【0011】[0011]
【発明の効果】本発明の半田ゴテは以下の効果を奏す
る。半田ゴテの先端の温度変化が少なく、短時間で安定
する。半田ゴテの落下によって、コテ先が曲がってしま
うという不具合があったが、本発明半田ゴテは、落下し
てもカバーが当たるため、コテ先が曲がりにくくなくな
る。温度変化が少なくなったため、セラミックヒーター
の寿命が延びる。カバーの無い半田ゴテに比べ消費電力
が少なくなる。The soldering iron of the present invention has the following effects. The temperature change at the tip of the soldering iron is small and stable in a short time. Although there was a problem that the tip of the soldering iron bends due to the fall of the soldering iron, the tip of the soldering iron of the present invention is less likely to bend because the cover hits the cover even if it falls. Since the temperature change is reduced, the life of the ceramic heater is extended. Power consumption is lower than that of a soldering iron without a cover.
【図1】本発明による実施例の外観図である。FIG. 1 is an external view of an embodiment according to the present invention.
【図2】本発明による実施例の分解図である。FIG. 2 is an exploded view of an embodiment according to the present invention.
【図3】本発明による実施例と従来技術とのコテ先温度
の変化を測定し、比較したグラフである。FIG. 3 is a graph in which the change in the temperature of the iron tip between the embodiment according to the present invention and the prior art is measured and compared.
【図4】実施例と従来技術とのセラミックヒータへの通
電開始からのコテ先温度変化を測定し、比較したグラフ
である。FIG. 4 is a graph in which a change in the temperature of the iron tip from the start of energization to the ceramic heater between the embodiment and the prior art is measured and compared.
1 半田ゴテ本体 11 コテ先 20 カバー 21 ホースバンド DESCRIPTION OF SYMBOLS 1 Solder iron body 11 Iron tip 20 Cover 21 Hose band
Claims (1)
の外周をを覆うカバーと、前記カバーを半田ゴテに締結
するための締結手段と、を有することを特徴とする半田
ゴテ。1. An electric soldering iron, comprising: a cover covering an outer periphery of a heater pipe; and fastening means for fastening the cover to the soldering iron.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11095769A JP2000288723A (en) | 1999-04-02 | 1999-04-02 | Soldering iron |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11095769A JP2000288723A (en) | 1999-04-02 | 1999-04-02 | Soldering iron |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000288723A true JP2000288723A (en) | 2000-10-17 |
Family
ID=14146706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11095769A Pending JP2000288723A (en) | 1999-04-02 | 1999-04-02 | Soldering iron |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000288723A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005056227A1 (en) * | 2003-11-21 | 2005-06-23 | Hakko Corp. | Soldering iron with replaceable tip cap |
WO2005115670A2 (en) | 2004-05-25 | 2005-12-08 | Hakko Corporation | Soldering iron with replaceable tip |
US7030339B2 (en) | 2002-11-26 | 2006-04-18 | Hakko Corporation | Soldering iron tip with metal particle sintered member connected to heat conducting core |
US7679032B2 (en) | 2003-07-04 | 2010-03-16 | Hakko Corporation | Soldering or desoldering iron |
US8237091B2 (en) | 2002-11-26 | 2012-08-07 | Hakko Corporation | Soldering iron with replaceable tip |
KR20150037310A (en) * | 2013-09-30 | 2015-04-08 | 주식회사 엘지화학 | Electric Soldering Iron For Preventing Badness Solder Ball |
-
1999
- 1999-04-02 JP JP11095769A patent/JP2000288723A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7030339B2 (en) | 2002-11-26 | 2006-04-18 | Hakko Corporation | Soldering iron tip with metal particle sintered member connected to heat conducting core |
US7490751B2 (en) | 2002-11-26 | 2009-02-17 | Hakko Corporation | Method of soldering iron tip with metal particle sintered member connected to heat conducting core |
US8237091B2 (en) | 2002-11-26 | 2012-08-07 | Hakko Corporation | Soldering iron with replaceable tip |
US7679032B2 (en) | 2003-07-04 | 2010-03-16 | Hakko Corporation | Soldering or desoldering iron |
WO2005056227A1 (en) * | 2003-11-21 | 2005-06-23 | Hakko Corp. | Soldering iron with replaceable tip cap |
WO2005115670A2 (en) | 2004-05-25 | 2005-12-08 | Hakko Corporation | Soldering iron with replaceable tip |
EP1752018A2 (en) * | 2004-05-25 | 2007-02-14 | Hakko Corporation | Soldering iron with replaceable tip |
EP1752018A4 (en) * | 2004-05-25 | 2009-04-08 | Hakko Corp | Soldering iron with replaceable tip |
EP2224783A2 (en) | 2004-05-25 | 2010-09-01 | Hakko Corporation | Soldering iron with replaceable tip |
KR20150037310A (en) * | 2013-09-30 | 2015-04-08 | 주식회사 엘지화학 | Electric Soldering Iron For Preventing Badness Solder Ball |
KR101864459B1 (en) * | 2013-09-30 | 2018-06-04 | 주식회사 엘지화학 | Electric Soldering Iron For Preventing Badness Solder Ball |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000288723A (en) | Soldering iron | |
TW200634883A (en) | X ray tube and X ray source | |
JP2548923Y2 (en) | Cathode structure for electron tube | |
JPS5928475Y2 (en) | Buzzer | |
KR100618284B1 (en) | A prem lot | |
CN109725063A (en) | Ultrasonic probe | |
JP2006066377A5 (en) | ||
KR200268051Y1 (en) | Heating write used in electric bedding | |
CN208859966U (en) | A kind of ice shaver heating chip architecture | |
KR970003457Y1 (en) | Combination structure of sump heater | |
JPH0723106Y2 (en) | Electric soldering iron | |
JPH0374097U (en) | ||
JPH1186929A (en) | Terminal fitting for pattern substrate | |
JPH053858Y2 (en) | ||
JPH0226222Y2 (en) | ||
JPH0623963Y2 (en) | Sensor | |
JPH0524149Y2 (en) | ||
KR200299775Y1 (en) | CRT socket | |
Mangin | Conversion cost update | |
JPS5461471A (en) | Semiconductor device | |
JPS5939641Y2 (en) | Combustion stabilization device for gas combustion equipment, etc. | |
JP2000200954A (en) | Ic mounting structure using ic socket | |
JPH06257567A (en) | Sealed compressor | |
JPH04259739A (en) | Cathode body structure for cathode-ray tube | |
JP2006090702A (en) | High frequency heating device |