JP2000277366A - Board-mount electronic component holding fitting and structure for mounting electronic component on board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase mounting efficiency, when electronic components are mounted on a board by an automatic mounting apparatus while ensuring their mounting strength, ease of mounting and of replacement. SOLUTION: A board-mounting electronic component holding fitting 10 for mounting a cylindrical electronic component on a board with its side laid down on the surface of the board is made of a resilient metallic plate and has a cylindrical configuration having a flat top Ω-shaped cross section. The cylindrical inner portion of the part 10 constitutes a component, containing section 11 for allowing the electronic component to be inserted thereinto and held therein. The outer flat top surface constitutes a suction surface 12 for an automatic mounting apparatus. Leg parts on both sides of the Ω-shaped part 10 constitute soldered parts 13a to 13d to be soldered to pads of the board. A facet plate 14 is provided on one of the ends of the cylindrical part 10, so that the distal end of the plate 14 serves as a soldering terminal 13e.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holding bracket for mounting a substrate and an electronic component substrate mounting structure, and more particularly to a mounting electronic component holding bracket for mounting a cylindrical electronic component on a substrate and an electronic component substrate mounting. Belongs to the structure.

[0002]

2. Description of the Related Art When mounting cylindrical (cylindrical, cross-sectionally elliptical, quadrilateral, etc.) electronic components such as capacitors and crystal units on a substrate, the lead terminals of these electronic components are connected to pads or through-holes on the substrate. Often, these components are soldered to the holes and laid on their side to reduce their height relative to their basic surface.

FIGS. 3A and 3B show an example of such an electronic component substrate mounting structure. In this example, the lead terminal 210 of the electronic component 200 laid horizontally on the substrate surface is bent and soldered to the pad 110 of the substrate 100, and the load is excessively applied to the lead terminal 210 and sufficient strength cannot be obtained. For this reason, the main body of the electronic component 200 is bonded with the adhesive 300 to reinforce the lead terminal 210.

In this example, since the surface of the substrate 100 and the main body of the electronic component 200 are bonded and fixed with the adhesive 300, it takes a long time for the adhesive 300 to dry and the electronic component 200 When it becomes necessary to replace the worm, it is extremely difficult to replace the worm.

Therefore, electronic component holders for mounting on a board have come to be used so that the electronic component 200 can be held and fixed in a short time and easily, and can be replaced very easily. FIGS. 4A and 4B are perspective views showing a first conventional example of such an electronic component holder for mounting a substrate and an electronic component substrate mounting structure using the same.
See Japanese Utility Model Laid-Open Publication No. 4-26524).

The electronic component holder 20 for mounting a substrate according to the first example is formed of an insulating material, is curved in an arc shape, and has a component storage portion 21 for holding and storing the electronic component 200, and side and bottom surfaces thereof. In addition, a lead terminal groove 22 for bending and attaching the lead terminal 210 of the electronic component 200 is formed.

The electronic component substrate mounting structure using the electronic component holder 20 for mounting a substrate is as follows. First, the cylindrical electronic component 200 is stored in the component storage portion 21 of the electronic component holder 20 for mounting a substrate.
The main body portion is held and fixed, and the lead terminal 210 is inserted into the lead terminal groove 22 so as to be fitted thereinto, bent and attached to the side surface and the bottom surface.

The electronic component 200 held and fixed to the electronic component holder 20 for mounting a board is mounted so that its lead terminal 210 is in contact with the pad 110 of the substrate 100, and the lead terminal 210 is formed by reflow soldering or the like. -It has a mounting structure in which the pads 110 are soldered.

In the first example, the mounting of the electronic component 200 on the substrate 100 can be extremely easily performed by a reflow soldering process or the like, and replacement thereof is also easy. Also,
Sufficient strength can be obtained for the lead terminal 210 of the electronic component 200.

FIGS. 5 (a), 5 (b) and 5 (c) are perspective views showing a second conventional example of an electronic component mounting structure for mounting a substrate and an electronic component substrate mounting structure using the same, and FIGS. And a second side view (see, for example, JP-A-7-226339). The electronic component holding metal fitting for board mounting 10y of the second example is obtained by bending a metal plate into a semi-cylindrical shape and forming
1y, a part of the semi-cylindrical metal plate is cut and raised to provide two soldering terminals 13y, and a part of the metal plate is bent at one end surface of the semi-cylindrical shape to form a positioning piece 1
5 is provided.

The electronic component substrate mounting structure using the electronic component holding bracket 10y for mounting a substrate has a cylindrical electronic component 20.
No. 0 is inserted and held in the component storage portion 11y of the board mounting electronic component holding metal fitting 10y until the end surface opposite to the lead terminal 210 side contacts the positioning piece 15, and the lead terminal 210 and the solder are fixed. Each of the attachment terminals 13y is mounted so as to be in contact with the corresponding pad 110 of the substrate 100, and the lead terminals 21y are formed by reflow soldering or the like.
0 and the pad 110 are soldered.

In the second example, the main body of the electronic component 200 is held by the board mounting electronic component holding fitting 10y, and the holding fitting (10y) is soldered to the board 100 by the soldering terminal 13y. The strength of attachment to the board 100 is increased, and mounting on the board 100 and replacement of electronic components are easy.

[0013]

The above-described conventional electronic component holder and electronic component substrate mounting structure for board mounting are of the first type.
In the example, the electronic component 200 has a structure in which the electronic component 200 is held and fixed in the component storage portion 21 formed of an insulating material and curved in an arc shape, and the lead terminal 210 is fitted into the lead terminal groove 22 on the side surface and the bottom surface. The mounting structure is such that a lead terminal 210 fitted in the lead terminal groove 22 is soldered to a corresponding pad 110 of the substrate 100 by using a holder 20, and in the second example, a semi-cylindrical metal plate is used. The electronic component holding metal fitting 10y for board mounting having a structure provided with a component storage portion 11y formed in the above and a part of this semi-cylindrical metal plate is cut and raised, and two soldering terminals 13y are provided. Each of the lead terminals 210 and the soldering terminals 13y of the electronic component 200 held and fixed in the housing portion 11y is soldered to the corresponding pad 110 of the substrate 100. Therefore, the reinforcement of the lead terminal 210 of the electronic component 200 is performed, so that the mounting strength to the substrate 100 is increased, and the mounting on the substrate 100 and the replacement of the electronic component 200 are facilitated. The upper part of both the fixture 20 and the holding fixture (10y) has a structure in which the electronic component 200 is exposed.
When an electronic component or the like is mounted using an automatic mounting apparatus that adsorbs the surface of the electronic component or the like and mounts the electronic component or the like on a substrate, if the electronic component 200 is, for example, cylindrical, the exposed part is automatically Since there is no flat surface on which the suction arm of the mounting apparatus can suck, there is a problem that this automatic mounting apparatus cannot be used and mounting efficiency is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an automatic mounting apparatus capable of ensuring sufficient mounting strength on a substrate, ease of mounting, and easiness of replacement in consideration of the problems of the prior art. An object of the present invention is to provide an electronic component holding bracket for mounting a substrate and an electronic component substrate mounting structure capable of improving mounting efficiency.

[0015]

According to the present invention, there is provided an electronic component holding bracket for mounting a substrate on a substrate, wherein the cylindrical electronic component is mounted and held on the surface of the substrate such that the central axis of the tube is parallel to the surface of the substrate. Electronic component holding bracket for board mounting for
In order to achieve the above object, an elastic metal plate is formed into a tubular shape having a flat Ω-shaped cross section and a flat surface on an upper surface, and an inner portion of the tubular shape is inserted. A flat part of the upper surface of the cylindrical mold becomes a flat surface for suction to the suction arm of the automatic mounting apparatus, and the left and right sides of the cylindrical shape have a Ω-shaped cross section. It is characterized in that both leg portions have a structure that becomes a soldering terminal portion to the board pad.

Further, the soldering terminal portion is provided partially with respect to the entire length of the cylindrical mold, and is configured as a structure having a reduced total area. Also, on one end surface portion of the cylindrical shape of the board mounting electronic component holding bracket, the one end surface portion extends from the upper surface portion of the cylindrical shape and covers this one end surface portion. It is configured as a structure having an end face plate.

Further, the electronic component substrate mounting structure of the present invention comprises:
An electronic component substrate mounting structure for mounting and fixing an electronic component on the surface of a substrate by using the electronic component holding bracket for mounting a substrate, wherein the electronic component substrate mounting structure includes the following structures. (B) An electronic device in which a main body portion of an electronic component is held and fixed in a component storage portion of the electronic component holding hardware for board mounting, and each soldering terminal portion of the electronic component holding hardware for board mounting is soldered to a pad on the surface of the board. Component body mounting structure (b) Electronic component lead terminal connection structure in which the lead terminal of the electronic component is bent and its tip is soldered and connected to a corresponding pad on the substrate surface.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention is an elastic metal plate having a flat upper surface.
It is formed in a cylindrical shape having a U-shaped cross section and a flat surface on the upper surface, and an inner portion of the cylindrical shape serves as a component housing for holding and fixing the inserted electronic component, and the upper surface of the cylindrical shape is formed. Has a configuration and structure in which the flat surface is a suction plane to the suction arm of the automatic mounting apparatus, and the open leg portion having the Ω-shaped cross section of the cylindrical shape is a solder terminal portion to the board pad. I have.

In the electronic component board mounting structure using the electronic component holding hardware for board mounting, the main body portion of the electronic component is held and fixed in the component storage portion of the electronic component holding hardware for board mounting. An electronic component body mounting structure in which each soldering terminal portion of the electronic component holding bracket is soldered to a pad on the board surface, and a lead terminal of the electronic component is bent and its tip is soldered to a corresponding pad on the board surface. And an electronic component lead terminal connection structure attached and connected.

[0020] Such an electronic component holding bracket for board mounting,
In addition, the electronic component substrate mounting structure using the same can maintain the mounting strength of the electronic component on the substrate sufficiently high, so that the mounting is easy, and the electronic component can be easily replaced, and furthermore, the automatic mounting is performed. Since mounting can be performed by the device, mounting efficiency can be increased.

[0021]

Next, an embodiment of the present invention will be described with reference to the drawings. 1A to 1C are a top view showing an example of an electronic component holding bracket for mounting a substrate according to the present invention, and first and second embodiments.
FIGS. 2A to 2C are a top view and first and second side views showing an example of an electronic component substrate mounting structure using the electronic component holding bracket for mounting a substrate.

The electronic component holding bracket 10 for mounting a board of this embodiment is formed of an elastic metal plate into a cylindrical shape having a flat Ω-shaped cross section with a flat upper surface. An inner part of the cylindrical mold is a component storage unit 11 for holding and fixing the inserted cylindrical electronic component, and a flat surface of the cylindrical upper surface is a suction plane 12 to the suction arm of the automatic mounting apparatus. The left and right leg portions having a Ω-shaped cross section serve as soldering terminals 13a to 13d to the board pad, and extend from the upper portion of the cylindrical shape to cover one end surface portion of the cylindrical shape. It has a structure provided with an end face plate 14 whose leading end portion becomes a soldering terminal 13e to a substrate pad.

In this embodiment, the entire cross section of the cylindrical shape is not Ω-shaped.
It is partially cut off, so that the heat absorbed by the elastic metal plate during soldering is reduced, and the soldering speed is increased.

The electronic component substrate mounting structure in which the electronic component 200 is mounted on the surface of the substrate 100 by using the electronic component holding bracket 10 for mounting the substrate, as shown in FIGS. An electronic component main body mounting structure in which the main body portion is inserted into the component storage portion 11 of the electronic component holding bracket 10 for board mounting, held and fixed, and the soldering terminals 13 a to 13 e are soldered to the pads 110 on the surface of the substrate 100. The lead terminal 210 of the electronic component 200 is bent, and the tip portion is bent to the corresponding pad 1 on the surface of the substrate 100.
10 and an electronic component lead terminal connection structure connected by soldering.

In order to complete the electronic component substrate mounting structure, first, the main body of the electronic component 200 obtained by bending the lead terminals 210 is attached to the electronic component holding metal fitting 10 for board mounting (hereinafter simply referred to as the holding metal (10). ) May be inserted and held and fixed in the component storage section 11), and then the suction plane 12 of the holding fitting (10) is sucked by the suction nose of the automatic mounting apparatus. The electronic component 200 held by the holding fitting (10) is moved and fixed to a position where each of the lead terminal 210 and the soldering terminals 13a to 13e comes into contact with a corresponding pad on the substrate 100, and is fixed by reflow soldering or the like. What is necessary is just to solder between these lead terminals and soldering terminals and pads.

Incidentally, the component storage portion 11 of the holding fitting (10) is provided.
Insertion and holding and fixing of the electronic component 200 into the holding bracket (1)
0) has a Ω-shaped cross-section and is made of an elastic metal plate, so that it can be easily inserted from both the left and right legs of the Ω-shape, and the main part of the electronic component 200 is formed by the elastic force of the elastic metal plate. Can be firmly held and fixed.

Even if the cross-sectional shape of the electronic component is elliptical or quadrilateral other than the circular shape as shown in FIG. 2, the cross-sectional shape of the holding member (10) is basically flat at the top. Ω
The present invention can be applied as long as it has a cylindrical shape.

By using the holding fitting (10) having such a structure and an electronic component board mounting structure using the holding fitting (10), the mounting strength of the electronic component to the board can be sufficiently ensured, and at the same time, the electronic component can be secured. Components can be fixed by reflow soldering or the like without using an adhesive, so mounting and replacement are easy, and mounting of electronic components on their boards is performed by an automatic mounting device regardless of the cross-sectional shape. Therefore, mounting efficiency can be improved.

Although the board mounting electronic component holding bracket 10 shown in FIGS. 1A to 1C is provided with an end plate 14, this end plate 14 is not always necessary.
However, when the end face plate 14 is provided, the holding bracket (1) when a strong impact is applied to the electronic component 200 is provided.
0), the mounting strength is increased, and the electronic components 20
There are advantages such as a guide when inserting 0.

[0030]

As described above, according to the present invention, an electronic component holding bracket for mounting a substrate is formed by using an elastic metal plate to form a cylinder having a flat Ω-shaped cross section and a flat surface on the upper surface. Formed into a mold, the inner part of this cylindrical mold is used as a part storage part,
The flat surface is used as a suction plane for the automatic mounting device, the left and right Ω-shaped legs are soldered to the board pads, and this board mounting electronic component holding bracket is used.
With a mounting structure that mounts and connects electronic components to the board surface, the electronic components have sufficient mounting strength to the board,
After securing the ease of mounting and the ease of replacement, the mounting can be performed by the automatic mounting apparatus, and the mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a top view showing an example of an electronic component holding bracket for mounting a board according to the present invention, and first and second side views.

FIG. 2 is a top view showing an example of an electronic component substrate mounting structure using the electronic component holding hardware for mounting a substrate shown in FIG. 1, and first and second side views.

FIG. 3 is a perspective view and a side view showing an example of a conventional electronic component substrate mounting structure using an adhesive.

FIG. 4 is a perspective view showing a first example of a conventional electronic component holder for mounting a substrate, and a perspective view showing an example of an electronic component substrate mounting structure using the same.

FIG. 5 is a perspective view of a second example of a conventional electronic component holding bracket for substrate mounting, and first and second side views showing an example of an electronic component substrate mounting structure using the same.

[Explanation of symbols]

 Reference Signs List 10, 10y electronic component holding bracket for board mounting 11, 11y component storage portion 12 suction planes 13a to 13e, 13y soldering terminal 14 end face plate 15 positioning piece 20 electronic component holding device for substrate mounting 21 component storage portion 22 groove for lead terminal REFERENCE SIGNS LIST 100 substrate 110 pad 200 electronic component 210 lead terminal 300 adhesive

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroshi Akimoto 1-21-2 Dogenzaka, Shibuya-ku, Tokyo Japan Aviation Electronics Industry F-term (reference) 5E319 AA03 AB01 CC22 CD11 5E336 AA04 AA09 AA16 BB01 BB02 CC03 CC08 CC22 CC25 CC53 DD03 DD16 EE03 GG09 GG30

Claims (4)

[Claims] 1. A board mounting electronic component holding metal fitting for mounting and fixing a cylindrical electronic component on a surface of a substrate such that a central axis of the tube is parallel to the surface of the substrate, wherein the elastic metal plate is provided. The upper part has a flat Ω-shaped cross section and is formed in a cylindrical shape having a flat surface on the upper surface, and the inner part of the cylindrical shape serves as a component storage portion for holding and fixing the inserted electronic component. The flat surface portion of the upper surface of the cylindrical mold serves as a suction plane for the suction arm of the automatic mounting apparatus, and the left and right legs of the cylindrical shape having a Ω-shaped cross section serve as solder terminal portions to board pads. An electronic component holding bracket for mounting a substrate, characterized by having a structure as follows. 2. The electronic component holding metal fitting for board mounting according to claim 1, wherein said soldering terminal portion is provided partially with respect to the entire length of said cylindrical mold, and has a structure in which the total area is reduced. 3. An electronic component holding metal part for mounting on a board according to claim 1, wherein the one end face of the cylindrical shape extends from the upper surface of the cylindrical shape and covers the one end face, and the tip end portion is a substrate pad. An electronic component holding bracket for mounting on a board having a structure including an end plate serving as a terminal for soldering to a substrate. 4. An electronic component board mounting structure for mounting, holding and fixing an electronic component on a surface of a substrate using the electronic component holding bracket for mounting a board according to claim 1 and includes the following structures. An electronic component substrate mounting structure, characterized in that: (B) An electronic device in which a main body portion of an electronic component is held and fixed in a component storage portion of the electronic component holding hardware for board mounting, and each soldering terminal portion of the electronic component holding hardware for board mounting is soldered to a pad on the surface of the board. Component body mounting structure (b) Electronic component lead terminal connection structure in which the lead terminal of the electronic component is bent and its tip is soldered and connected to a corresponding pad on the substrate surface.