JP2000269076A - Structure and method for packaging capacitor and capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To expand, add, or select characteristics by providing a connection means for connecting a sub capacitor or other parts to a main capacitor for obtaining specific characteristics. SOLUTION: A main capacitor 1 is a large-capacity capacitor such as a square-type surface-mount tantalum solid electrolytic capacitor with a main capacitor electrode 1a that becomes the terminal of a thick-film conductor at both ends at the nucleus of the capacitor. Also, the main capacitor 1 is joined to a sub capacitor 2 such as a square-type surface-mount lamination ceramic capacitor (capacitor) with a sub capacitor electrode 2a at both ends. Then, the main capacitor 1 is provided with a connection means 3 for soldering or engaging the sub capacitor 2 to the surface of the main capacitor 1 by forming a thick-film conductor, a thin-film conductor, or a metal plate conductor. Also, the sub capacitor 2 is a capacitor with a small capacity with a terminal for joining to the main capacitor 1 at both ends and has smaller external dimensions than the main capacitor 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply circuit of a printed circuit board for stabilizing a circuit which consumes a large current in a short time at a high frequency in a digital circuit such as a logic circuit or a pulse circuit. Mainly related to mounting structure and mounting method of square surface mount capacitors and capacitors for decoupling that can be inserted between ground circuits to form a low impedance conduction path for currents higher than a predetermined frequency. The present invention relates to a mounting structure and a mounting method of a capacitor capable of expanding, adding and selecting a characteristic of a slave capacitor or another component to and from a characteristic provided by a component and further reducing a mounting area of the component on a printed circuit board, and realizing the capacitor.

[0002]

2. Description of the Related Art FIG.
FIG. 12C shows a mounting structure of the capacitor 51 for decoupling and the like mounted between the power supply circuit and the ground circuit of the conventional printed circuit board shown in the side view of FIG. Thus, the large-capacity capacitor of the normal tantalum solid electrolytic capacitor 61 is mounted at the power supply inlet of the printed circuit board 70, and the small-capacity capacitor of the multilayer ceramic capacitor 62 is mounted near the load component 63 of the power supply. Each of the capacitors 51 has a structure in which the capacitor electrode 52 has no connection means for joining with other components. In addition, a mounting method is adopted in which mounting is performed at a predetermined position in a state in which processing including a connecting means for joining with another component is not performed in advance. Therefore, separate mounting spaces are required for the large-capacity capacitor and the small-capacity capacitor. In particular, in the case of a small-sized printed circuit board configured with high density, the mounting structure of the capacitor and the mounting method of the capacitor can cause irrationality in which the dimensions of the printed circuit board are changed because the load components are close to each other and the arrangement of the components is troublesome. It has become. Also, selecting the most suitable decoupling capacitor characteristics for the printed circuit board based on trial and error by exchanging small-capacitance capacitors is a connection structure by soldering. There is a danger of damaging it, making implementation difficult.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to solve the following problems in the mounting structure of the conventional capacitor and the mounting method of the capacitor. The decoupling capacitor has a structure that does not have connection means for joining with other components, and the decoupling capacitor has not been subjected to a process of providing connection means for joining with other components in advance. Separate mounting space is required for each capacitor. Choosing the best decoupling capacitor characteristics for the printed circuit board based on trial and error by replacing small-capacity capacitors may damage the conductors of the printed wiring board, making implementation difficult. .

[0004]

In order to solve the above-mentioned problems, the present invention is characterized in that a connecting means for joining a capacitor or another component to a main capacitor is provided so as to obtain predetermined characteristics. I do. By this means, connecting means for joining the main capacitor to the capacitor or other components is provided, so that the characteristics of the slave capacitor or other components can be expanded and added or selected to the characteristics of the main capacitor, and Provided are a capacitor mounting structure, a capacitor mounting method, and a capacitor that can reduce a mounting area on a printed circuit board by stacking.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, as shown in FIG. 1, in the present invention, a connection means 3 for joining a capacitor 2 to a main capacitor 1 is provided so as to obtain predetermined characteristics. By this means, the connection means for joining the capacitor to the main capacitor is provided, so that the characteristics of the capacitor can be added and expanded according to the characteristics of the main capacitor, and by further stacking the components on the printed circuit board. The effect that the mounting area can be reduced can be obtained.

Next, as shown in FIG. 2, in the present invention, the connecting means 3 is connected to an electrode 4 formed on the surface of the main capacitor 1.
The secondary capacitor 2 was soldered. By this means, the auxiliary capacitor can be soldered and stacked on the electrode formed on the surface of the main capacitor, so that the effect of reducing the mounting area on the printed circuit board is obtained.

Further, as shown in FIG. 3, in the present invention, the connection means 3 is constituted by fitting the slave capacitor 2 to the socket 5 formed on the surface of the main capacitor 1. By this means, the socket formed on the surface of the main capacitor,
Since the secondary capacitor can be fitted, the characteristics of the main capacitor can be added, expanded or selected according to the characteristics of the main capacitor, and the effect of selecting the optimum characteristic based on the replacement of the secondary capacitor can be obtained.

Further, as shown in FIG. 4, in the present invention, the connection means 3 is formed by soldering or fitting a plurality of sub-capacitors 2 to electrodes 4 or sockets 5 formed on the surface of the main capacitor 1. did. By this means,
Since multiple slave capacitors can be soldered or fitted to the electrode or socket formed on the surface of the master capacitor, the characteristics of multiple slave capacitors can be added to or expanded from those of the master capacitor, or selected by replacing the slave capacitor. In addition, the effect that the mounting area of the capacitor on the printed circuit board can be further reduced is obtained.

Further, as shown in FIG. 5, in the present invention, a first step of forming connecting means 3 for joining the sub-capacitor 2 on the surface of the main capacitor 1 in advance, and forming a conductor in the first step A second step of mounting the main capacitor 1 to a printed wiring board coated with a solder paste;
A third step of applying a solder paste to the surface of the main capacitor 1 mounted on the printed wiring board in the step of mounting the sub-capacitor 2; And a fourth step of melting and joining the components. By this means, the solder paste can be applied to the connection means formed on the surface of the main capacitor, so that the auxiliary capacitor can be stacked and soldered simultaneously with components other than the component concerned.

Next, as shown in FIG. 6, according to the present invention, the connecting means 3 for joining the capacitor 2 in accordance with the main capacitor 1 comprises:
The electrode 4 was obtained by forming a thick conductor on the surface of the main capacitor 1 in advance. By this means, the sub capacitor can be simultaneously stacked and soldered on the electrode formed on the surface of the main capacitor together with components other than the component concerned, so that the mounting area on the printed circuit board can be reduced and the normal area can be reduced. An effect can be obtained that can be processed in the same manner as the printed circuit board mounting process using the surface mount components.

In the present invention, as shown in FIG. 7, the connecting means 3 for joining the capacitor 2 in accordance with the main capacitor 1 comprises:
The electrode 4 had a thin film conductor formed on the surface of the main capacitor 1 in advance. By this means, the auxiliary capacitor can be stacked and soldered on the electrode formed on the surface of the main capacitor, which can be easily formed, so that the mounting area on the printed circuit board can be compressed and the normal surface mount component can be used. An effect is obtained that can be processed in the same manner as the mounting step of the used printed circuit board.

Further, as shown in FIG. 8, according to the present invention, a first step of forming a socket 5 on a surface of a main capacitor 1 on which a metal plate conductor for bonding a sub-capacitor 2 has been previously formed; A second step of mounting the main capacitor 1 having the conductor formed thereon in the printed wiring board to which the solder paste has been applied, and the main capacitor 1 mounted on the printed wiring board in the second step and other components. At the same time, the mounting of the capacitor includes a third step of melting and joining the solder paste and a fourth step of inserting and joining the capacitor 2 in accordance with the main capacitor 1 mounted on the printed wiring board in the third step. Method. By this means, the electrode formed on the surface of the main capacitor can be used as an electrode or socket, and the slave capacitor can be soldered or fitted, so that the characteristics of the main capacitor can be added and expanded, or the characteristics of the slave capacitor can be replaced or replaced Can be selected, the mounting area of the capacitor on the printed circuit board can be reduced, and the same processing can be performed as in the process of mounting a printed circuit board using ordinary surface mount components.

Next, as shown in FIG. 9, according to the present invention, the form of the capacitor at the time of purchase is changed
And a connecting means 3 for joining the components to obtain predetermined characteristics. By this means, since connection means for joining other components to the capacitor are provided, it is possible to add, expand or select the characteristics provided by the other components to the characteristics provided by the capacitor, and to further reduce the mounting area of the component on the printed circuit board. An effect is obtained in that the capacitor can be compressed, and the step of forming an electrode to be formed on the surface of the main capacitor in advance can be omitted.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention; FIG. In the following,
The same portions are denoted by the same reference numerals, and detailed description may be omitted.

FIGS. 1A and 1B are diagrams showing the principle of the present invention. FIG. 1A is a top view and FIG. 1B is a side view.
In the figure, reference numeral 1 denotes a main capacitor, which is a capacitor mounting structure and a capacitor mounting method according to the present invention, and a rectangular surface mounting having a main capacitor electrode 1a which is a main component of the capacitor and has, for example, terminals made of thick film conductors at both ends. Large capacity capacitors such as tantalum solid electrolytic capacitors. In addition, the secondary capacitor 2 is joined to a secondary capacitor 2 such as a square surface mount multilayer ceramic capacitor having a secondary capacitor electrode 2a formed of a thick film conductor at both ends to obtain predetermined characteristics. Soldering by forming a thick film conductor on the surface of the capacitor 1 or forming a thin film conductor on the surface of the main capacitor 1 in advance, or forming and processing a metal plate conductor on the surface of the main capacitor 1 in advance; Alternatively, it is provided with connection means 3 which can be fitted. Reference numeral 2 denotes a slave capacitor, which is used to obtain predetermined characteristics by joining with the main capacitor 1 which is the main component of the present invention. Is a small capacity capacitor. The outer dimensions are smaller than the main capacitor 1. 3 is connection means,
In order to join the main capacitor 1 and the slave capacitor 2,
A thick film conductor is previously formed on the surface of the main capacitor 1 to be described later, soldering is performed by forming a thin film conductor on the surface of the main capacitor 1 in advance, or a metal plate conductor is formed on the surface of the main capacitor 1 in advance. Soldering
Alternatively, a means for fitting can be provided. Reference numeral 10 denotes a printed wiring board, which constitutes a wiring of a digital circuit such as a logic circuit or a pulse circuit, and forms a footprint which is a conductor to be joined to the main capacitor 1 by soldering. With this, the connection means for joining the main capacitor and the slave capacitor is provided, so that the characteristics of the capacitor can be added and expanded according to the characteristics of the main capacitor, and further stacked on the printed circuit board of the capacitor. Can be reduced in mounting area.

FIGS. 2A and 2B are views showing an embodiment of the present invention. FIG. 2A is a top view, and FIG. 2B is a side view.
In the figure, reference numeral 4 denotes an electrode, which is formed on the surface of the main capacitor 1 as a means for soldering the main capacitor 1 and the sub capacitor 2, for example, a thick film conductor is formed on the surface of the main capacitor 1 described later in advance. In this case, a thin film conductor is formed on the surface of the main capacitor 1 in advance, or a metal plate conductor is formed on the surface of the main capacitor 1 in advance. This allows the auxiliary capacitor to be soldered and stacked on the electrode formed on the surface of the main capacitor, so that the mounting area on the printed circuit board can be reduced to only the main capacitor portion.

FIGS. 3A and 3B show another embodiment of the present invention. FIG. 3A is a top view, and FIG. 3B is a side view. In the figure, reference numeral 5 denotes a socket, which serves as a means for fitting the main capacitor 1 and the sub-capacitor 2; for example, the front end of the main capacitor 1 is bent at an acute angle or the front end is slightly warped. Capacitor electrode 1a
A connection terminal of a socket structure made of a spring material having a predetermined width capable of contacting and fitting with the capacitor electrode 2a is formed by welding. As a result, the slave capacitor can be brought into contact with and fitted to the socket formed on the surface of the master capacitor. Can also be added,
Further, by replacing the slave capacitor, it is possible to select the most suitable characteristics for the printed circuit board.

FIGS. 4A and 4B show another embodiment of the present invention. FIG. 4A is a top view and FIG. 4B is a side view. In the figure, a socket 5 is a main capacitor electrode 1a.
A wide socket formed on the surface of the main capacitor 1 serving as a means for fitting the plurality of sub capacitor electrodes 2a to the main capacitor electrode 1a. A metal plate conductor having a socket structure made of a spring material having a cut in the middle so as to correspond to the external dimensions of the capacitor 2 is formed by welding. As a result, a plurality of sub-capacitors can be fitted to the socket formed on the surface of the main capacitor. Further, the mounting area of the capacitor on the printed circuit board can be reduced to only the main capacitor portion.

FIG. 5 is a schematic view showing an example of a process of mounting a capacitor according to the present invention.

In the figure, first, in a first step, a connecting means 3 made of a thick-film conductor or a thin-film conductor for joining the sub-capacitor 2 is formed on the surface of the main capacitor 1 in advance.

Next, in a second step, the main capacitor 1 having the conductor formed in the first step is mounted on a printed wiring board to which a solder paste has been applied.

In the third step, a solder paste is applied to the surface of the main capacitor 1 mounted on the printed wiring board in the second step, and the slave capacitor 2 is mounted.

Further, in the fourth step, the main capacitor 1
And the secondary capacitor 2 are joined together with other components by melting the solder paste.

FIG. 6 shows details of the steps shown in FIG. 5 and is an example of an outline of steps for mounting a capacitor by forming a thick film conductor according to the present invention.

In the figure, first, in the application of a conductive paste in step P001, a plurality of main capacitors are arranged at predetermined intervals, and a predetermined surface of the main capacitors is coated with a conductive paste by screen printing.

Next, in the step P002 of curing the conductive paste, the thick film conductor formed by the application of the conductive paste in the step P001 is cured by exposing it to an environment such as a predetermined pressure or temperature, and the foot of the secondary capacitor is cured. Form conductors that can be printed. If the main capacitor has a conductor large enough to accommodate the footprint of the slave capacitor, the application of the conductive paste in the step P001 and the hardening of the conductive paste in the step P002 can be omitted, and processing can be performed by a mounting step shown in FIG.

In the application of the solder paste in the process P003, a solder paste is applied by screen printing on a footprint which is a conductor for soldering and joining the surface-mounted components of the printed wiring board by reflow soldering.

Further, in the component mounting in the step P004, the solder paste is applied by an automatic component mounting machine or the like, including the main capacitor in which the thick film conductor is formed by the conductive paste application in the step P001 and the conductive paste curing step in the step P002. A predetermined part is mounted on the set footprint.

Further, in the application of the solder paste in the step P005, the application of the conductive paste in the step P001 and the application of the
A solder paste is applied to the surface of the main capacitor with a dispenser or the like in order to solder and join the main capacitor to the main capacitor on which the thick film conductor has been formed by the conductive paste curing step of No. 02.

Further, in the component mounting in step P006, a predetermined sub-capacitor is mounted on the main capacitor coated with the solder paste in step P005 by an automatic component mounting machine or the like.

Next, in the reflow soldering in the step P007, the surface-mounted components after the component mounting in the step P004 and the component mounting in the step P006 are collectively exposed to an environment such as a predetermined gas phase and temperature. Melts the solder paste and joins by soldering.

FIG. 7 shows the details of the process shown in FIG. 5 and is an example of a mounting process of a capacitor by forming a thin film conductor according to the present invention.

In the figure, first, in the thin-film vacuum deposition formation in step P011, a thin-film conductor is formed on a predetermined surface of the main capacitor by vacuum deposition, and a conductor corresponding to the footprint of the slave capacitor is formed. In the case where the main capacitor has a conductor large enough to cope with the footprint of the slave capacitor, the thin film vacuum deposition in the step P011 can be omitted and the process can be performed by a mounting step shown in FIG.

Next, in the application of the solder paste in the process P012, a solder paste is applied by screen printing on a footprint which is a conductor for soldering and joining the surface mount components of the printed wiring board by reflow soldering.

Further, in the component mounting in the step P013, a predetermined component is mounted on the footprint on which the solder paste is applied by an automatic component mounting machine or the like, including the main capacitor having the thin film conductor formed in the thin film vacuum deposition forming step in the step P011. Attach.

In the step P014, the solder paste is applied to the surface of the main capacitor by a dispenser or the like so that the capacitor is soldered on the main capacitor on which the thin film conductor is formed by the thin film vacuum deposition in the step P011. Is applied.

Further, in the component mounting in step P015, a predetermined sub-capacitor is mounted by an automatic component mounting machine or the like on the main capacitor coated with the solder paste in step P014.

Next, in the reflow soldering in the step P016, the surface-mounted components after the component mounting in the step P013 and the component mounting in the step P015 are collectively exposed to the environment such as a predetermined gas phase and temperature at the same time. Melts the solder paste and joins by soldering.

FIG. 8 is a diagram showing a detailed example of a mounting process of a capacitor by forming a metal plate conductor according to the present invention.

In the figure, first, in the metal plate conductor welding in the step P021, a thin metal conductor is bent on a predetermined surface of the main capacitor, and the metal plate obtained by punching is joined to the main capacitor electrode by welding to form a socket.

Next, in the application of the solder paste in the process P022, a solder paste is applied by screen printing on a footprint, which is a conductor for soldering and joining the surface mounted components of the printed wiring board by reflow soldering.

Further, in the component mounting in the process P023, predetermined components are mounted on the footprint on which the solder paste is applied by the automatic component mounting machine or the like, including the main capacitor formed with the metal plate conductor welding conductor in the process P021.

Next, in the reflow soldering in the step P024, the surface mount component after the component mounting in the step P023 is exposed to an environment such as a predetermined gas phase or temperature to melt and paste the solder paste. .

In the component insertion in step P025, a predetermined sub-capacitor is manually inserted into the socket conductor on the main capacitor in which the socket conductor was formed in the metal plate conductor welding step in step P021.

FIGS. 9A and 9B show another embodiment of the present invention. FIG. 9A is a top view, and FIG. 9B is a side view. In the figure, the form at the time of purchase can be applied to a filter circuit using a capacitor and a resistor, for example.
A connection means 3 such as a socket for joining another component 7 indicated by a two-dot chain line to a predetermined portion of the capacitor 6 is provided to obtain predetermined characteristics. With this configuration, since the connection means for joining the capacitor at the time of purchase to the capacitor and other components is provided, the characteristics of the capacitor can be added and expanded to the characteristics of the capacitor, and the printed circuit board of the component can be added. Capacitors that can compress the mounting area above only to the capacitor part can be made, and in the capacitor mounting method, a thick film conductor is formed on the surface of the capacitor in advance, or a thin film conductor is formed on the surface of the main capacitor in advance. The process of P001 and P002 in FIG. 6 or the process of FIG. 7 or P021 in FIG. 8 can be omitted. 0 or can be processed by the mounting process shown in FIG. 11.

FIG. 10 shows a case where the main capacitor or the capacitor has a conductor large enough to accommodate the footprint of the slave capacitor or other parts of the present invention, and the formation of the thick film conductor or the thin film conductor can be omitted. FIG. 11 is a diagram illustrating an example of a mounting process of a capacitor in a case where a form at the time of purchase includes a connecting means by forming a thick-film conductor or a thin-film conductor for joining other components to the capacitor.

In the figure, first, in the solder paste application in step P031, a solder paste is applied by screen printing on a footprint, which is a conductor for soldering and joining the surface mount components of the printed wiring board by reflow soldering.

Next, in the component mounting in the process P032, the main capacitor having a conductor large enough to correspond to the footprint of the slave capacitor or the other component, or the form at the time of purchase of the capacitor is used to join another component to the capacitor. A predetermined component is mounted on the footprint on which the solder paste is applied, including a capacitor having connection means, by an automatic component mounting machine or the like.

In the application of the solder paste in the step P033, a solder paste is applied to the surface of the main capacitor or the capacitor by a dispenser or the like in order to solder and join the capacitor or other components on the main capacitor or the capacitor.

Further, in the component mounting in step P034, a predetermined sub-capacitor or another component is mounted on the main capacitor coated with the solder paste in step P033 by an automatic component mounting machine or the like.

Next, in the reflow soldering in the process P035, the surface-mounted components after the component mounting in the process P032 and the component mounting in the process P034 are collectively exposed to an environment such as a predetermined gas phase and temperature at the same time. Melts the solder paste and joins by soldering.

FIG. 11 is a diagram showing an example of a mounting process of a capacitor in the case where a pre-processed main capacitor or a capacitor at the time of purchase of the present invention can be fitted by contacting a slave capacitor or other parts with a socket of a metal plate conductor. It is.

In the figure, first, in the solder paste application in step P041, a solder paste is applied by screen printing on a footprint which is a conductor for soldering and joining the surface mount components of the printed wiring board by reflow soldering.

Next, in component mounting in step P042, predetermined components are mounted on a footprint on which solder paste has been applied by an automatic component mounting machine or the like, including a main capacitor or a capacitor formed with a metal plate conductor welding conductor.

Further, in the reflow soldering in the step P043, the surface mount component after the component mounting in the step P042 is exposed to an environment such as a predetermined gas phase or temperature to melt and paste the solder paste.

Next, in component insertion in step P044, a predetermined secondary capacitor or another component is manually inserted into the main capacitor or the socket conductor on the capacitor.

[0057]

According to the present invention described above, the following effects can be expected.

First, a connection means for joining the main capacitor and the slave capacitor is provided so as to obtain predetermined characteristics. With this, since the connection means for joining the main capacitor and the sub capacitor is provided, the characteristics of the capacitor can be added and expanded according to the characteristics of the main capacitor, and the characteristics of the capacitor required for the circuit can be realized. Can,
A circuit that operates stably can be configured.

Next, the connection means is constituted by soldering a slave capacitor to an electrode formed on the surface of the master capacitor. Thus, since the slave capacitor can be soldered and stacked on the electrode formed on the surface of the main capacitor, in addition to the above-described effect, the mounting area of the capacitor on the printed circuit board is reduced to only the main capacitor portion. This allows efficient use of the mounting area.

The connecting means is configured by fitting a slave capacitor to a socket formed on the surface of the main capacitor. This allows the secondary capacitor to be fitted into the socket formed on the surface of the primary capacitor, so that in addition to the above-described effects, the secondary capacitor can be replaced and the capacitor required for the circuit can be selected with optimal characteristics. A circuit that operates more stably can be configured.

Further, the connection means is constituted by soldering or fitting a plurality of slave capacitors to electrodes or sockets formed on the surface of the master capacitor. With this, a plurality of slave capacitors can be soldered or fitted to the electrodes or sockets formed on the surface of the main capacitor, so that in addition to the above-described effects, a more efficient mounting area can be utilized and the main capacitor is provided. The characteristics of a plurality of sub-capacitors can be added to or expanded from the characteristics, or the sub-capacitors can be selected by replacement, and the characteristics of the capacitors required for the circuit can be realized in a wide range.

Further, a first step of forming connecting means for joining the sub-capacitors in advance on the surface of the main capacitor, and a printed wiring board on which a solder paste is applied, wherein the main capacitor having the conductor formed in the first step is applied A second step of applying a solder paste to a surface of the main capacitor mounted on the printed wiring board in the second step to mount a slave capacitor; And a fourth step of melting and joining the solder paste simultaneously with the other components. This allows the solder paste to be applied to the connection means formed on the surface of the main capacitor, so that the sub capacitor can be stacked and soldered simultaneously with components other than the component concerned, and a printed circuit board using ordinary surface mount components And can be efficiently mounted.

Next, the connecting means for joining the capacitor to the main capacitor was an electrode in which a thick conductor was formed on the surface of the main capacitor in advance. This allows the capacitor to be soldered and stacked together with the components other than the component at the same time as the electrodes formed on the surface of the main capacitor, so that the soldering is performed in the same manner as in the process of mounting a printed circuit board using ordinary surface mount components. Can be processed.

Further, the connecting means for joining the capacitor to the main capacitor is an electrode having a thin film conductor formed on the surface of the main capacitor in advance. This allows the secondary capacitor to be soldered and stacked on the electrode formed on the surface of the main capacitor, which can be easily formed, so that the soldering process can be performed in the same manner as the mounting process of a printed circuit board using ordinary surface mount components. .

Further, a first step of forming a socket on the surface of the main capacitor in which a metal plate conductor for joining the sub-capacitor is formed in advance, and a main capacitor having the conductor formed in the first step are connected to a solder paste. A second step of mounting on the printed wiring board coated with, and a third step of simultaneously melting and joining the solder paste to the main capacitor and other components mounted on the printed wiring board in the second step, And a fourth step of inserting and joining a capacitor in accordance with the main capacitor mounted on the printed wiring board in the third step. As a result, the electrode formed on the surface of the main capacitor can be used as an electrode or a socket, and the slave capacitor can be soldered or contacted and fitted. Can be selected by replacement, and the mounting area of the capacitor on the printed circuit board can be reduced to only the main capacitor part, and soldering is performed in the same way as the mounting process of the printed circuit board using normal surface mount components Can be processed.

Next, a connecting means for joining other components to the capacitor was provided, and the capacitor was configured to obtain predetermined characteristics. In this way, since the connection means for joining the capacitor and other parts is provided, the characteristics of the capacitor can be added and expanded in accordance with the characteristics of the main capacitor by itself without additional processing of the connection means. A capacitor capable of reducing the mounting area of the capacitor on the printed circuit board to only the capacitor portion can be provided, and the effective mounting area can be utilized.

[Brief description of the drawings]

FIG. 1 is a principle diagram of the present invention.

FIG. 2 is an embodiment diagram of the present invention.

FIG. 3 is another embodiment of the present invention.

FIG. 4 is another embodiment of the present invention.

FIG. 5 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 6 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 7 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 8 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 9 is a view showing another embodiment of the present invention.

FIG. 10 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 11 is a diagram illustrating an example of a mounting process according to the present invention.

FIG. 12 is an example of a conventional example.

[Explanation of symbols]

 1 main capacitor 2 slave capacitor 3 connection means 4 electrode 5 socket 6 capacitor 7 other parts

Claims (9)

[Claims] A main capacitor (1) and a secondary capacitor (2).
Characterized in that it comprises a connecting means (3) for joining the components, and is configured to obtain predetermined characteristics. 2. The connection means (3), wherein a secondary capacitor (2) is soldered to an electrode (4) formed on the surface of the main capacitor (1). The mounting structure of the described capacitor. 3. The connection means (3), wherein a secondary capacitor (2) is fitted into a socket (5) formed on the surface of the primary capacitor (1). The mounting structure of the described capacitor. 4. The connecting means (3) comprises a plurality of slave capacitors (2) soldered or fitted to electrodes (4) or sockets (5) formed on the surface of the master capacitor (1). The capacitor mounting structure according to claim 2 or 3, wherein: 5. A first means for forming connecting means (3) on a surface of a main capacitor (1) for joining a slave capacitor (2) in advance.
And a second step of mounting the main capacitor (1) having the conductor formed in the first step on the printed wiring board coated with the solder paste, and mounting the main capacitor (1) on the printed wiring board in the second step. A third step of applying a solder paste to the surface of the main capacitor (1) to mount the slave capacitor (2), and applying the solder paste to the main capacitor (1) and the slave capacitor (2) simultaneously with other components. And a fourth step of melting and joining. 6. The main capacitor (1) and the secondary capacitor (2).
2. The method according to claim 1, wherein the first step of forming the connecting means for joining the first and second electrodes is performed by an electrode having a thick film conductor formed on the surface of the main capacitor in advance. 5. The mounting method of the capacitor according to 5. 7. A capacitor (2) according to a main capacitor (1).
6. The method according to claim 5, wherein the first step of forming the connecting means for joining the first and second electrodes is performed by an electrode having a thin film conductor formed on the surface of the main capacitor in advance. The mounting method of the described capacitor. 8. A first step of forming a socket (5) on a surface of a main capacitor (1) on which a metal plate conductor for bonding a sub-capacitor (2) has been previously formed, and a step of forming a socket in the first step. A second step of mounting the main capacitor (1) formed with the solder paste on the printed wiring board to which the solder paste is applied, and a step of mounting the main capacitor (1) mounted on the printed wiring board in the second step and other components. At the same time, a third step of melting and joining the solder paste and a fourth step of inserting and joining the capacitor (2) according to the main capacitor (1) mounted on the printed wiring board in the third step. A method for mounting a capacitor, comprising: 9. A capacitor comprising a connecting means (3) for joining another component (7) to the capacitor (6) so as to obtain predetermined characteristics.