JP2000265258A - Production of hot-dip coated wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive producing method of a hot-dip coated wire by which the uneven coating or the ruggedness of a surface, or the like, are avoided. SOLUTION: Water drops 12 are intermittently or continuously supplied from the upper part of the hot-dip coated wire 3 by a water drop supplying device 10 so that the water drops 2 are dripped onto the hot-dip coated wire 3 just after pulling up from the surface of a molten metal bath 1. Then, the coated layer of the hot-dip coated wire 3 is cooled and solidified in short time by adjusting the pulling up speed of the hot-dip coated wire 3 or the dripping water amount so that the water drops 12 are balanced in a prescribed range. As a result, an upper pully 4 is not required of being disposed at a high position. Further, problems of the quality such as the uneven coated layer, the ruggedness of the surface are avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a hot-dip wire.

[0002]

2. Description of the Related Art As a method of manufacturing a hot-dip wire, a wire to be plated is run while being continuously immersed in a bath containing a molten metal, so that the outer periphery of the wire to be plated is continuously covered with a plating metal, and the bathtub is coated. It has been practiced to cool the plated wire immediately after being pulled up from the substrate to solidify the plated layer.

FIG. 3 is a conceptual diagram showing a conventional cooling method for cooling a plating wire immediately after plating.

This cooling method is a method of performing natural cooling by air cooling by passing the plating wire 3 immediately after being lifted from the bath 2 containing the molten metal 1 through the upper pulley 4 as it is. Reference numeral 5 denotes a sink roll (lower pulley) for immersing the plating wire 6 in the bathtub 2.

FIG. 4 is a conceptual diagram showing another conventional cooling method for cooling a plating wire immediately after plating.

[0006] This cooling method is a method in which forced cooling is performed by blowing air from an air blowing device 7 to the plating wire 3 immediately after being lifted from the bathtub 2.

FIG. 5 is a conceptual view showing another conventional cooling method for cooling a plating wire immediately after plating.

This cooling method is a method in which mist (mist) is sprayed by a mist spraying device 8 onto the plating wire 3 immediately after being lifted from the bathtub 2 to perform forced cooling.

FIG. 6 is a conceptual diagram showing another conventional example of a cooling method for cooling a plating wire immediately after plating.

This cooling method is a method of forcibly cooling by passing the plating wire 3 immediately after being lifted from the bathtub 2 through a cooling water bath 9.

[0011]

However, the conventional method shown in FIG. 3 has the lowest cooling capacity, and it takes time for the plating layer of the plating wire to solidify. For this reason, when plating is performed at a high speed, the upper pulley 4 must be arranged at an extremely high position, and there is a problem that it is difficult to make the manufacturing apparatus compact.

The conventional method shown in FIG. 4 has a higher cooling capacity than natural cooling, but air is blown by the air blowing device 7 while the plating layer is in a molten state. There is a problem of causing quality problems such as surface irregularities and the like.

Further, the conventional method shown in FIG. 5 is a method in which fog is sprayed instead of blowing air to the plating wire 3, and since there is no need for strong spraying as in the case of air, uneven thickness of the plating layer is required. However, there is a problem that the cooling capacity is not so high, though it is improved.

Furthermore, the conventional method shown in FIG.
Although the cooling capacity is the highest, since the cooling water tank 9 filled with a large amount of water is installed just above the bathtub 2 for cooling, the structure of the device becomes complicated, and if water leakage occurs in the cooling water tank 9, water vapor explodes. There are safety issues such as accidental occurrence. Moreover, since the temperature of the cooling water tank 9 rises due to the heat of the plating wire 3,
There was a problem that it was difficult to keep the cooling efficiency constant.

An object of the present invention is to solve the above-mentioned problems and to provide a method of manufacturing a hot-dip wire which can be manufactured at low cost without unevenness of the plating layer or unevenness of the surface.

[0016]

Means for Solving the Problems In order to achieve the above object, the method of the present invention for producing a hot-dip wire is provided by running a wire to be plated while continuously immersing it in a bath containing a molten metal. In a hot-dip plating method for producing a plated wire by continuously coating the outer periphery of a wire to be plated with a plated metal, the plated wire immediately after being pulled up from a bath is cooled by a cooling mechanism.

In addition to the above-mentioned constitution, the method of the present invention for producing a hot-dip galvanized wire comprises supplying water droplets along a galvanized wire running between a hot surface of a bathtub and a pulley for pulling up the coated wire from the bathtub. It is preferable to cool the plated wire immediately after the lifting.

In addition to the above configuration, in the method of manufacturing a hot-dip wire according to the present invention, the amount of supplied water may be adjusted so that water droplets stay in a predetermined position range between the molten metal surface and the pulley in a balanced manner. .

In addition to the above configuration, the method of manufacturing a hot-dip wire according to the present invention adjusts the traveling speed of the hot-dip wire so that water droplets stay in a predetermined position range between the molten metal surface and the pulley in a balanced manner. You may.

In addition to the above configuration, in the method of manufacturing a hot-dip wire according to the present invention, it is preferable that the hot-dip wire is dried by a drying mechanism between a position where a water droplet is supplied and a pulley.

According to the present invention, water droplets are supplied intermittently or continuously from above the plating wire so that the water droplets are transmitted to the plating wire immediately after plating pulled up from the surface of the molten metal. By adjusting the pulling speed of the plating wire or the amount of dripping water so as to balance within the position range, the plating layer of the plating wire is cooled and solidified in a short time. As a result, there is no need to arrange the upper pulley at a higher position. Also, such as uneven thickness and surface irregularities of the plating layer,
It will not cause quality problems.

FIG. 2 is a diagram illustrating the principle of the method for manufacturing a hot-dip wire according to the present invention.

When a water drop is supplied from above so as to be transmitted to a plating wire to be pulled up, the water drop carries a force (frictional force between the water drop and the wire surface) by linear running, and a downward force due to gravity. And the evaporation of water droplets due to the heat of the plating wire is added. By adjusting the traveling speed of the plating wire or the supply amount of water droplets, it is possible to balance these three factors (upward force, downward force, and evaporation amount). When these three factors are balanced, the water droplet is in a state as if it is stagnating at a certain position. When the amount of water is increased from such a balanced state, the balance position moves downward, and when the amount of water decreases, the balance position moves upward. Thus, the cooling position (the plating layer solidification position) can be easily controlled. Therefore, unevenness of the plating layer and unevenness on the surface are eliminated, and the cost can be reduced.

[0024]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a conceptual diagram showing one embodiment of a method for manufacturing a hot-dip wire according to the present invention.

A wire to be plated 6 whose surface has been cleaned by a pretreatment such as washing or polishing is applied to a bathtub 2 filled with a molten metal 1.
The plating wire 3 is manufactured continuously by being immersed in a bathtub 2 and pulled up vertically above the surface of the molten metal via a sink roll 4 arranged in the bathtub 2.

A water drop supply device 1 disposed above a bathtub 2
When 0, the water droplets 12 of the cooling water stored in the cooling water tank 11 are supplied so as to be transmitted to the plating wire 3 continuously or intermittently. When the amount of the water droplet 12 is very small, the water droplet 12 is completely evaporated by the heat of the plating wire 3, but when the amount of the water droplet 12 is large, the water droplet 12 moves downward due to gravity.

Therefore, by adjusting the amount of water of the water droplets 12 with the water amount adjusting device 13 provided between the cooling water tank 11 and the water droplet supply device 10, the stagnant position of the water droplets 12 can be set to a desired position. . The water volume adjusting device 13 may use a known technique such as a medical drip adjusting device. Further, it is preferable to use an injection needle, an extremely fine nozzle, or the like at the tip 10a of the water droplet supply device 10.

Here, when the upper pulley 4 gets wet with water,
Since water droplets hang down from the upper pulley 4 and the amount of water droplets 12 on the plating wire 3 fluctuates, the plating wire 1
5 needs to be dried by the drying device 14 before contacting the upper pulley 4. By completely drying the water on the surface of the plating wire 3 by the drying device 14 provided between the water droplet supply device 10 and the upper pulley 4, the amount of the water droplet 12 on the plating wire 3 becomes constant, Twelve stagnation positions can be made more stable.

According to such a method, the plating layer can be cooled with a very small amount of cooling water in a short time, and the temperature of the cooling water can be easily controlled.

In the present embodiment, the plating wire 3 is
However, the present invention is not limited to this, and the plating wire 3 may be pulled obliquely upward from the molten metal 1. Further, although water is used as a cooling medium to cool the plating wire 3 immediately after being pulled up, the cooling medium is not limited to water, and oil (silicone oil or the like) may be used.

Conventionally, the cooling method in the production of a plated wire by hot-dip plating has been carried out by natural cooling with air, cooling by air blowing, cooling by mist blowing, cooling by passing through a water tank, etc. In addition, the cooling ability was not obtained, and there were safety problems, and it was not possible to efficiently cool the plated wire.

However, according to the present invention, since a very small amount of water droplets are supplied so as to be transmitted directly to the plating wire, there are problems with the conventional method such as fluctuations in cooling water temperature, insufficient cooling capacity, and poor quality of the plating wire. Thus, the plating wire can be efficiently cooled at extremely low cost. According to the present invention, since the upper pulley can be set at a lower position,
The device can be made more compact.

[0034]

In summary, according to the present invention, the following excellent effects are exhibited.

It is possible to provide a method for manufacturing a hot-dip wire which can be manufactured at a low cost without unevenness in the thickness of the plating layer and unevenness on the surface.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing one embodiment of a method for manufacturing a hot-dip wire according to the present invention.

FIG. 2 is a principle diagram of a method for manufacturing a hot-dip wire according to the present invention.

FIG. 3 is a conceptual diagram showing a conventional example of a cooling method for cooling a plating wire immediately after plating.

FIG. 4 is a conceptual diagram showing another conventional example of a cooling method for cooling a plating wire immediately after plating.

FIG. 5 is a conceptual diagram showing another conventional example of a cooling method for cooling a plating wire immediately after plating.

FIG. 6 is a conceptual diagram showing another conventional example of a cooling method for cooling a plating wire immediately after plating.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Molten metal 2 Bathtub 3 Plating wire 4 Upper pulley 10 Water drop supply device 12 Water drop

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masao Oshima 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Prefecture Power Systems Research Laboratory, Hitachi Cable, Ltd. F-term (reference) 4K027 AA02 AA06 AB14 AC64 AD26 AE18 AE25

Claims (5)

[Claims] 1. A hot-dip plating method for producing a plated wire by continuously coating a periphery of the wire to be plated by continuously immersing the wire to be plated in a bath containing a molten metal and running the wire. A method for manufacturing a hot-dip wire, wherein the hot-dip wire immediately after being lifted from the bath is cooled by a cooling mechanism. 2. A plating wire immediately after being pulled up is cooled by supplying water droplets so as to travel along a plating wire running between a surface of the bathtub and a pulley for pulling up the plating wire from the bathtub. 2. The method for producing a hot-dip wire according to item 1. 3. The method for producing a hot-dip wire according to claim 2, wherein the supply amount of water is adjusted so that the water droplets stay in a predetermined position range between the molten metal surface and the pulley and stay stagnant. 4. The hot-dip galvanized wire according to claim 2, wherein the traveling speed of the galvanized wire is adjusted so that the water droplets stay in a predetermined position range between the molten metal surface and the pulley in a balanced manner. Production method. 5. The method according to claim 1, wherein the plating wire is dried by a drying mechanism between a position where the water droplet is supplied and the pulley.