JP2000252606A - Electronic component and structure for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep the positional relationship between the main body of an electronic component and a wiring board in a substantially fixed state by forming a projection to be brought into contact with the wiring board in the main body of an electronic component. SOLUTION: An electronic component 1 is mounted on a wiring board 7. The wiring board 7 is formed on its surface with wiring conductors 8 and 9, on which terminal sections of terminal members 5 and 6 are disposed respectively. Under this condition, soldering is executed to mount the electronic component 1 on the wiring board 7. The main body 2 of the electronic component 1 is formed with a projection 10 to be brought into contact with the wiring board 7. The projection 10 is preferably formed of resin. By bonding the projection 10 on the main body 2 of the electronic component, or hardening or solidifying the projection 10 on the main body 2 of the electronic component, the projection 10 is fixed to the main body 2 of the electronic component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a mounting structure thereof, and more particularly, to an electronic component in which a terminal member is joined to an electronic component main body and is attached to a wiring board via the terminal member. And its mounting structure.

[0002]

2. Description of the Related Art A ceramic electronic component such as a multilayer ceramic capacitor has an electronic component main body made of ceramic. In such a ceramic electronic component, this is mounted on a wiring board such as an aluminum substrate. When the surface mounting is performed, the difference in the behavior of the electronic component body and the wiring board with respect to thermal expansion is large, so that a problem is encountered that the ceramic electronic component is likely to be destroyed in a temperature cycle in which the temperature is repeatedly increased and decreased.

For the purpose of solving this problem, there has been proposed an electronic component having a structure in which a terminal member made of, for example, a metal plate or a lead wire is joined to a terminal electrode of an electronic component body by soldering or the like. According to the electronic component having such a structure, since it is mounted on the wiring board via the terminal member, even when the wiring board expands and contracts due to a temperature change, the stress is absorbed by the deformation or movement of the terminal member, It is possible not to directly apply to the electronic component main body, and accordingly, the destruction of the electronic component can be prevented.

[0004]

However, an electronic component having an electronic component body to which the above-mentioned terminal member is attached is used in an electronic device which is exposed to vibrations, such as a vehicle-mounted electronic device. In this case, the vibration is transmitted from the wiring board to the electronic component body via the terminal member, and therefore, stress is applied to the joint between the terminal member and the electronic component body or the joint between the terminal member and the wiring board. Occasionally, these joints can be broken down.

[0005] Such a problem is particularly likely to occur in an electronic component having a large electronic component body. This is because the large electronic component body is relatively heavy, and the stress applied to the joint due to the above-described vibration is relatively large.

An object of the present invention is to provide an electronic component and a mounting structure for the electronic component, which can solve the above-mentioned problems.

[0007]

The present invention comprises an electronic component main body and a plurality of terminal members respectively joined to the electronic component main body, and is used to attach each end of the terminal member to a wiring board. In order to solve the above-described technical problem, the electronic component body is provided with a projection for contacting the wiring board.

[0008] The above-mentioned projection is preferably made of resin.

Regarding the method of providing the projections, which is a feature of the present invention, the following structure can be adopted according to the form of the electronic component.

First, when the electronic component body is not covered by any case or exterior resin, the projections
It can be provided so as to protrude from the outer surface of the electronic component body.

Secondly, a case for accommodating the electronic component body while the electronic component is in a state where each end of the terminal member is pulled out, and a filling resin filled in the case with the electronic component body accommodated therein. In the case where the projections are further provided, the projections can be provided so as to protrude from the surface of the case or the filling resin. In this case, the protrusion may be formed integrally with the case or the filling resin, or may be made of a material or a member different from the case or the filling resin.

Third, when the electronic component further includes an exterior resin for covering the electronic component body while each end of the terminal member is pulled out, the projections protrude from the surface of the exterior resin. Can be provided. In this case, the projection may be formed integrally with the exterior resin, or may be made of a material or a member different from the exterior resin.

The present invention is also directed to a structure for mounting the above electronic component on a wiring board. The electronic component mounting structure according to the present invention is characterized in that each end of the terminal member is attached to the wiring board with the projection in contact with the wiring board.

In the above electronic component mounting structure, the projection is elastically deformed by contacting the wiring board,
Thereby, it is preferable to be in pressure contact with the wiring board.

[0015]

FIG. 1 is a front view showing an electronic component 1 and a mounting structure thereof according to a first embodiment of the present invention.

The electronic component 1 has an electronic component body 2. The electronic component body 2 is made of, for example, a ceramic. In this embodiment, an electronic component body for a multilayer ceramic capacitor is provided. External electrodes 3 and 4 are formed on two opposing end surfaces of the electronic component body 2. Inside the electronic component body 2,
A plurality of internal electrodes (not shown) that are electrically connected to one of the external electrodes 3 and 4 are formed in a stack, and these internal electrodes are connected to one of the external electrodes 3. Those connected to the other external electrode 4 are alternately arranged in the laminating direction.

Terminal members 5 and 6 are joined to the two opposing end surfaces of the electronic component body 2 via external electrodes 3 and 4, for example, by soldering.
The terminal members 5 and 6 are formed of a conductive metal plate in this embodiment.

Such an electronic component 1 is mounted on a wiring board 7 as shown in FIG. The wiring board 7 has wiring conductors 8 and 9 formed thereon, and the respective ends of the terminal members 5 and 6 are located on these wiring conductors 8 and 9, respectively, and soldering is applied in this state. By doing so, the electronic component 1 is attached to the wiring board 7.

In such an embodiment, the electronic component body 2 is characterized in that a projection 10 for contacting the wiring board 7 is provided. The protrusion 10 is preferably made of a resin. The protrusion 10 is fixed to the electronic component main body 2 by an adhesive or by being cured or solidified on the electronic component main body 2.

When the electronic component 1 is mounted, the projection 10 contacts the wiring board 7, whereby vibration is transmitted from the wiring board 7 to the electronic component body 2 via the terminal members 5 and 6. Even in the situation, the positional relationship between the electronic component body 2 and the wiring board 7 can be substantially fixed,
Therefore, the stress applied to the joint between terminal members 5 and 6 and electronic component body 2 or the joint between terminal members 5 and 6 and wiring board 7 can be reduced. As a result, the influence of the vibration of the electronic component 1 can be advantageously suppressed,
Destruction can be prevented from occurring at the above-described joints and the like.

In particular, when the projections 10 are made of resin, not only can an undesired electrical short circuit or the like on the wiring board 7 be prevented, but the projection 10 is brought into contact with the wiring board 7 based on the elasticity of the resin. At this time, the projection 10 can be elastically deformed. For this reason, the projection 10 can be brought into a state of being pressed against the wiring board 7, and the effect of suppressing the adverse effect on the electronic component 1 due to the vibration as described above can be further enhanced.

When the projection 10 is made of resin,
The flexure of the wiring board 7 can be advantageously dealt with.

That is, when the wiring board 7 bends, for example, so that the center in FIG.
The bending of the wiring board 7 is absorbed while deforming based on the elasticity, and the pressing force that the bending of the wiring board 7 exerts on the electronic component body 2 via the protrusion 10 can be reduced. This is particularly advantageous when the electronic component body 2 is made of ceramic. This is because the electronic component body 2 made of ceramic is easily broken by the pressing force exerted through the projections 10.

On the other hand, when the wiring board 7 is bent so that the center is lowered in FIG. 1, the projection 10 is brought into contact with the wiring board 7 in a state of being elastically deformed in advance, so that the wiring board 7 Even in such a bent state, the projections 10 can be deformed by following the projections, and the projections 10 can be kept in contact with the wiring board 7 to maintain the function of the projections 10.

FIG. 2 is a sectional view showing an electronic component 11 and a mounting structure thereof according to a second embodiment of the present invention.

The electronic component 11 has a plurality of, for example, two electronic component bodies 12. External electrodes 13 are provided on two opposing end surfaces of each electronic component body 12 respectively.
And 14 are formed. These electronic component bodies 12
Are stacked one above the other, facing in the same direction. The two electronic component bodies 12 may be joined to each other by, for example, an adhesive.

The terminal members 15 and 16 in this embodiment are also formed of, for example, a conductive metal plate.
One of the terminal members 15 is
Each of the electronic component bodies 12 is commonly joined to one external electrode 13, and the other terminal member 16 is commonly joined to the other external electrode 14.

The electronic component main body 12 includes a terminal member 15.
Each of the end portions 16 and 16 is housed in a case 17 made of, for example, resin while being pulled out. And
The resin 17 is filled in the case 17 with the electronic component body 12 accommodated therein.

Such an electronic component 11 is mounted on a wiring board 19 as shown in FIG. Wiring conductors 20 and 21 are formed on the wiring board 19, and each end of the terminal members 15 and 16 is connected to the wiring conductor 20.
By applying the soldering in this state, the electronic component 11 is mounted on the wiring board 19.

Also in this embodiment, the electronic component body 1
2 is provided with a projection 22 for making contact with the wiring board 19. The projection 22 is provided so as to protrude from the surface of the filling resin 18 filled in the case 17, and is particularly formed integrally with the filling resin 18 in this embodiment.

FIG. 3 is a sectional view showing an electronic component 31 and a mounting structure thereof according to a third embodiment of the present invention.

The electronic component 31 has an electronic component main body 32. External electrodes 33 and 34 are formed on opposing end surfaces of the electronic component body 32, respectively.

Terminal members 35 and 36 are joined to each end face of the electronic component body 32 via external electrodes 33 and 34, for example, by soldering.
In this embodiment, the terminal members 35 and 36 are constituted by, for example, lead wires.

An exterior resin 37 is applied so as to cover the electronic component main body 32 while each end of the terminal members 35 and 36 is pulled out.

The electronic component 31 is mounted on a wiring board 38 as shown in FIG. Wiring board 38
Has wiring conductors 39 and 40 on both main surfaces thereof, and has through holes 41 and 42 in regions where the wiring conductors 39 and 40 are respectively formed.
By inserting the terminal members 35 and 36 into the through holes 41 and 42 and soldering them to the wiring conductors 39 and 40, the electronic component 31 is connected to the wiring board 38.
Is obtained.

In this electronic component 31, the wiring board 3
A protrusion 43 for contacting the electronic component 8 is provided on the electronic component body 32. The projection 43 is provided so as to protrude from the surface of the exterior resin 37, and is particularly formed integrally with the exterior resin 37 in this embodiment.

In the embodiment shown in FIGS. 2 and 3, respectively, the projections 22 and 43 are respectively
In addition, since it is formed integrally with the exterior resin 37, there is an advantage that a special process or material for forming such a protrusion 22 or 43 is unnecessary. However, if such advantages are not desired, the protrusions may be made of a different material or member from the filling resin 18 or the exterior resin 37. In this regard, FIG.
This will be described with reference to FIGS.

FIG. 4 is a sectional view showing an electronic component 11a and a mounting structure thereof according to a fourth embodiment of the present invention. The electronic component 11a shown in FIG. 4 has many elements common to the electronic component 11 shown in FIG.
In FIG. 2, elements corresponding to the elements shown in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 4, protrusion 22a is provided so as to protrude from the surface of filling resin 18, but is formed of a material or member different from filling resin 18. Also in this case, it is preferable that the protrusion 22a is made of resin. In addition, the protrusion 22a is fixed to the filling resin 18 by an adhesive or by being cured or solidified on the filling resin 18.

FIG. 5 is a sectional view showing an electronic component 31a and a mounting structure thereof according to a fifth embodiment of the present invention. The electronic component 31a illustrated in FIG. 5 includes many elements common to the electronic component 31 illustrated in FIG.
In FIG. 3, elements corresponding to the elements shown in FIG. 3 are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 5, projection 43a is provided so as to protrude from the surface of exterior resin 37, but is made of a different material or member from exterior resin 37. Such projections 43a are fixed to the exterior resin 37 by an adhesive or by being cured or solidified on the surface of the exterior resin 37.

As described above, if the projections 22a or 43a are made of a material or a member different from the filling resin 18 or the exterior resin 37, regardless of the selection of the material for the filling resin 18 or the exterior resin 37. , Protrusion 2
The material for 2a or 43a can be selected. Therefore, considering the elasticity and the like, the protrusions 22a
Alternatively, it becomes easy to select the most suitable material as 43a.

In connection with the respective embodiments shown in FIGS. 4 and 5, projections 22a and 43a need not be provided so as to protrude from the surfaces of filling resin 18 and exterior resin 37, respectively. . For example, with reference to the embodiment shown in FIG. 4, when the lower surface of the lower electronic component body 12 is exposed from the opening of the case 17, the lower electronic component body 12 protrudes from the exposed lower surface of the electronic component body 12. A projection may be provided. In addition, with reference to the embodiment shown in FIG. 5, when the lower surface of the electronic component main body 32 is exposed from the exterior resin 37, the projection is formed so as to protrude from the exposed lower surface of the electronic component main body 32. May be provided.

When the case 17 is provided as in the embodiments shown in FIGS. 2 and 4, a projection may be provided so as to protrude from the case 17.

As described above, the present invention has been described with reference to the illustrated embodiment.
Various modifications are possible.

For example, as for the position of the projection, it is advantageous to locate it between two terminal members as in the illustrated embodiments, since the projection can be easily provided and the function of the projection can be more effectively exerted. However, it may be provided at another position. Also, the shape and number of the projections can be arbitrarily changed.

The form of the terminal members, such as a metal plate or a lead wire, can be appropriately changed, and the number and position thereof can be arbitrarily changed as necessary.

Further, in each of the illustrated embodiments, a ceramic electronic component in which the electronic component body is made of ceramic is intended. However, the present invention is not limited to this, provided that the electronic component includes a terminal member. It is equally applicable to electronic components.

[0049]

As described above, according to the present invention, in the electronic component used to attach each end of the terminal member joined to the electronic component body to the wiring board, the projection for contacting the wiring board is provided. Is provided on the electronic component body, so that when mounted on a wiring board, the protrusion can be brought into contact with the wiring board.

Therefore, the electronic component according to the present invention
For example, it is used in electronic devices that are exposed to vibration such as in-vehicle electronic devices. Therefore, even if the vibration is transmitted from the wiring board to the electronic component body via the terminal member, the electronic component body and the wiring board are Can be maintained in a substantially fixed state with respect to each other, so that the stress applied to the joint between the terminal member and the electronic component body or the joint between the terminal member and the wiring board due to vibration can be reduced. As a result, it is possible to prevent breakage from these joints and the like. Such an effect becomes more remarkable especially when applied to an electronic component having an electronic component body which is large in size and therefore relatively heavy.

In the present invention, if the projection is made of resin, the resin is not inconvenienced by an undesired electric short circuit because of the electric insulation property of the resin, and the projection is formed on the basis of the elasticity of the resin. It can be pressed against the wiring board while being elastically deformed. Therefore,
The state of contact with the wiring board is stabilized, and even when the wiring board is bent, the bending can be advantageously absorbed or followed by the elastic deformation of the projection. Therefore, when the wiring board is bent, it is possible to advantageously prevent the electronic component main body from being broken by the pressing force from the projection or the projection from separating from the wiring board.

When the electronic component according to the present invention further comprises a case accommodating the electronic component main body and a filling resin filled in the case, or further comprises an exterior resin covering the electronic component main body. The protrusions can be provided so as to protrude from the surface of the above-mentioned filling resin or exterior resin, and when such an arrangement is adopted, the projections are formed integrally with these filling resin or exterior resin. Can be. If the projections are integrally formed in this way, a special process and material for forming the projections are not required, and the electronic component and the electronic component according to the present invention can be manufactured without substantially increasing the cost. A mounting structure can be realized.

[Brief description of the drawings]

FIG. 1 is a front view showing an electronic component 1 and a mounting structure thereof according to a first embodiment of the present invention.

FIG. 2 is an electronic component 11 according to a second embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a mounting structure of the same.

FIG. 3 is an electronic component 31 according to a third embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a mounting structure of the same.

FIG. 4 is an electronic component 11 according to a fourth embodiment of the present invention.
FIG. 2A is a cross-sectional view showing the mounting structure of FIG.

FIG. 5 is an electronic component 31 according to a fifth embodiment of the present invention.
FIG. 2A is a cross-sectional view showing the mounting structure of FIG.

[Explanation of symbols]

 1, 11, 11a, 31, 31a Electronic component 2, 12, 32 Electronic component body 5, 6, 15, 16, 35, 36 Terminal member 7, 19, 38 Wiring board 10, 22, 22a, 43, 43a Projection 17 Case 18 Filling resin 37 Exterior resin

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yasuhiko Kubota 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd. (72) Kenichi Watanabe 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Inside of Murata Manufacturing Co., Ltd. Terms (reference) 5E001 AB03 AF01 AF06 AG00 5E082 AA02 AB03 BC40 CC05 FG26 GG08 HH03 HH06 HH28 HH47 HH51 JJ03 JJ09 JJ27 5E336 AA04 AA09 AA16 BB01 BC34 CC02 CC53 DD22 EE01 GG15

Claims (9)

[Claims] An electronic component main body; and a plurality of terminal members respectively joined to the electronic component main body, wherein each of the terminal members is used to attach each end to a wiring board.
An electronic component, wherein the electronic component body is provided with a protrusion for making contact with the wiring board. 2. The electronic component according to claim 1, wherein the projection is made of a resin. 3. The electronic component according to claim 1, wherein the projection is provided so as to protrude from an outer surface of the electronic component body. 4. A case accommodating the electronic component main body while each end of the terminal member is pulled out, and a filling resin filled in the case with the electronic component main body accommodated therein. 3. The electronic component according to claim 1, wherein the protrusion is provided so as to protrude from a surface of the case or the filling resin. 4. 5. The electronic component according to claim 4, wherein the projection is formed integrally with the filling resin. 6. The electronic device according to claim 6, further comprising an exterior resin for covering the electronic component body while each end of the terminal member is pulled out, wherein the projection is provided so as to project from a surface of the exterior resin. Item 3. The electronic component according to item 1 or 2. 7. The electronic component according to claim 6, wherein the projection is formed integrally with the exterior resin. 8. A structure for mounting the electronic component according to claim 1 on a wiring board, wherein each end of said terminal member is connected with said projection in contact with said wiring board. A mounting structure for an electronic component, wherein the mounting structure is mounted on the wiring board. 9. The electronic component mounting structure according to claim 8, wherein the protrusion is elastically deformed by contacting the wiring board, and thereby presses against the wiring board.