JP2000246830A - Silica-coated plastic film and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a silica layer having good alkali resistance, adhesive properties, and gas-barrier properties even when the layer is heat-treated at a temperature at about 120 deg.C or below in a silica-coated plastic film produced by using polysilazane. SOLUTION: A PET film (with a hard coat layer) is coated with a polysilazane solution, and the applied solution is dried by hot air. The dry polysilazane is reacted by being contacted with an atmosphere of air containing triethylamine/steam to be converted into ceramic to form a silica layer. While the film with the silica layer being passed through a glow discharge box in a sputtering device, glow discharge is generated in the neighbourhood of the silica layer to be subjected to glow discharge treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silica-coated plastic film obtained by forming a layer derived from polysilazane on the surface of a plastic film and ceramicizing the layer.

[0002]

2. Description of the Related Art Polyethylene terephthalate (PET)
A silica-coated plastic film in which a silica (SiO ₂ ) layer is laminated on the surface of a plastic film such as a film is used for food packaging based on the properties of the silica layer such as transparency, gas barrier properties, and antireflection action. It is used for applications such as packaging materials and substrates for electronic components.

[0003] As a method for producing such a silica-coated plastic film, as disclosed in Japanese Patent Application Laid-Open No. 6-93120, a silica-based plastic film is formed on the surface of the plastic film by a dry plating method such as vacuum deposition, ion plating, and sputtering. Is generally used. In the case of this dry plating method, the treatment is carried out in a vacuum chamber. In addition, as disclosed in, for example, JP-A-4-80030, an alkoxysilane solution is coupled to the surface of a plastic film. A method of manufacturing by applying and heating a coating solution polycondensed using an agent or a sol-gel method catalyst, or as disclosed in JP-A-8-112879, polysilazane or polysilazane is applied to the surface of a plastic film. There is also known a technique in which a modified polysilazane is applied and heat-treated to form a ceramic layer to form a siliceous layer. Since these methods can be performed in the air, there is no need to perform treatment in a vacuum chamber as in the dry plating method, and a silica layer can be formed at low cost.

According to the method of forming a layer of a compound derived from polysilazane as described above (hereinafter referred to as "polysilazane layer"), heat treatment at a relatively low temperature of 150.degree. This is practical because a dense silica layer can be formed.

[0005]

However, the silica-coated plastic film may be required to have a performance against alkali resistance, adhesion and abrasion resistance depending on the application, and particularly when used as a base material for electronic parts. Is high. For example, when a silica-coated plastic film is used as a packaging material, a solar cell substrate, or a liquid crystal substrate, these characteristics are required. When used as a substrate for a touch panel or a liquid crystal, good adhesion and alkali resistance are required even in the production process thereof.

On the other hand, if the heat resistance of the plastic film to be used is not so high, it is necessary to keep the heat treatment temperature at a considerably low level. For example, when a PET film is used, heat shrinkage and yellowing occur, so that the heat treatment temperature needs to be suppressed to about 120 ° C. or less. When a polysilazane layer is formed on a plastic film and ceramized to produce a silica-coated plastic film as described above, if the heat treatment is performed at such a relatively low temperature, the alkali resistance, adhesion, and gas barrier properties of the silica layer are reduced. High performance is difficult to obtain.

The present invention has been made in view of such a background. In producing a silica-coated plastic film using polysilazane, a heat treatment is performed at 120 ° C.
It is an object of the present invention to provide a method for producing a silica-coated plastic film capable of forming a silica layer having good alkali resistance, adhesion and gas barrier properties even at a low temperature of the order of or less.

[0008]

In order to achieve the above-mentioned object, the present invention provides a method for forming a layer comprising a compound derived from polysilazane on a plastic film, and then forming the layer on a ceramic to form a siliceous layer. A gas discharge treatment was performed in addition to the heat treatment. The compound derived from polysilazane mentioned here includes not only polysilazane but also a compound obtained by modifying polysilazane and having the same basic structure as polysilazane, and those obtained by adding a metal or the like thereto.

[0009] Gas discharge is "formation of electric conduction in which electricity is supplied by the movement of ions generated by collision of electrons and gas molecules" (Electronic and Electronic Dictionary: Ohmsha).
Glow discharge is the main one. According to this manufacturing method,
Even if the heat treatment is performed at a low temperature, a silica layer having good alkali resistance, adhesion and gas barrier properties can be formed. This is thought to be because when the heat treatment of polysilazane is performed at a low temperature, the silica conversion rate tends to decrease, but the silica conversion rate is improved by performing high-energy treatment in a short time such as gas discharge treatment. .

[0010] Particularly, the plastic film is made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES),
When a material having low heat resistance such as polyarylate (PAR) is used, heat treatment cannot be performed at a very high temperature, and thus the effect of applying the present invention is large.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, the basic steps are a step of forming a polysilazane layer on a plastic film, a step of heating this or a chemical reaction treatment, and forming a siliceous layer by ceramicization. This is a step of performing a gas discharge treatment on the siliceous layer.

The material of the plastic film is not particularly limited. As specific examples, as described in JP-A-8-112879, polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), biaxially oriented polypropylene (OPP), polyphenylene sulfide (PPS), Polyethylene naphthalate (PEN), polyether sulfone (PES),
Examples include polyetherimide (PEI), polyetheretherketone (PEEK), and polyarylate (PAR).

There is no restriction on the thickness of the plastic film. However, when the film is wound into a roll at the time of coating, the thickness cannot be increased so much in practice. Deemed necessary. The plastic film may be provided with an undercoat layer such as a silane coupling agent on the surface on which the polysilazane layer is formed. Further, a thin layer such as a hard coat layer may be provided on either side. The hard coat layer is formed of, for example, a silicon-based, acrylic-based, melamine-based, urethane-based thermosetting resin or an ultraviolet-curable resin.

As described in JP-A-8-112879, a polysilazane layer may be formed as long as it is ceramicized at a relatively low temperature (150 ° C. or lower) and is transformed into silica. An example is as follows: (1) Those having a main skeleton consisting of a unit represented by the following chemical formula 1.

[0015]

Embedded image

However, each of R1, R2, and R3 in the formula is a hydrogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, an alkylsilyl group, an alkylamino group, an alkoxy group, and the like. Preferably, all of R2 and R3 are hydrogen. (2) A glycidol-added polysilazane obtained by reacting polysilazane of the above formula 1 with glycidol.

(3) An alcohol-added polysilazane obtained by reacting an alcohol (such as butanol, hexanol, octanol, octanol, nonanol, methoxyethanol, ethoxyethanol, or furfuryl alcohol) with the polysilazane of the above formula (1). (4) A metal carboxylate (metals such as nickel, titanium, platinum, rhodium,
Cobalt, iron, ruthenium, osmium, palladium,
Metal silicic acid-added polysilazane obtained by reacting iridium, aluminum, etc.).

(5) An acetylacetonano complex-added polysilazane obtained by reacting the polysilazane of the above formula 1 with an acetylacetonano complex containing nickel, platinum, palladium or aluminum as a metal. (6) Au, A is added to the solution containing the polysilazane of the above formula (1).
A polysilazane containing metal fine particles obtained by adding fine metal particles such as g, Pd, and Ni.

These polysilazane-derived compounds can be used as they are or as fillers (for example, oxide inorganic substances such as silica, alumina, zirconia, and mica, or non-oxide inorganic substances such as silicon carbide and silicon nitride). Powder)
Is mixed and applied to the plastic film,
Normally, the solution is applied after dilution with a solvent in order to adjust the viscosity of the solution.

As a method of applying to a plastic film, a method usually used for printing or painting may be used, and any of a batch type and a continuous type may be used. It is desirable to use a roll coating method such as a coating method. It is desirable to set the application amount of the polysilazane liquid so that the thickness of the coating film after the ceramicization is 10 to 300 nm. This is because if the thickness of the silica-based coating film exceeds 300 nm, micro-cracks tend to occur in the film, and if micro-cracks occur in the coating film, the gas barrier properties of the coating film deteriorate, and This is because there is a problem that a good film cannot be obtained when a thin film is formed.

After the formation of the polysilazane layer, it is heated to dry and ceramicize. This heating temperature is
Set according to the heat resistance of the plastic film,
In general, the temperature should be 150 ° C or less, and PET, PEN, PES,
120 for materials with relatively low heat resistance such as PAR
If the plastic film is previously coated with a thin layer, the temperature is set in consideration of the heat resistance of the thin layer.

Although the polysilazane layer is ceramicized by this heating, it is difficult for the polysilazane layer to be sufficiently ceramicized only by heating at 150 ° C. or lower (ie, the conversion rate to silica is low). It is desirable to perform such processing before or after the heating step. That is, as described in JP-A-8-112879, heat treatment is performed in a steam atmosphere,
It can be immersed in distilled water containing a base catalyst such as methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, pyridine, picoline, acetic acid, propionic acid, butyric acid, valeric acid, maleic acid, stearic acid, hydrochloric acid, nitric acid, Immerse in distilled water containing an acid catalyst such as sulfuric acid. Alternatively, JP-A-9-3133
As described in Japanese Unexamined Patent Publication (Kokai) No. 3-3, a treatment such as contact with a gas containing water vapor in the presence of amines or acids or contact with a gas containing amines and water vapor is performed.

By performing such a treatment, the unreacted portion of the polysilazane layer is hydrolyzed or oxidized, and most of the polysilazane layer is changed to silica (SiO ₂ ) (the conversion of silica is improved). However, even with the silica layer after performing such a treatment, it may not be possible to obtain sufficient alkali resistance, adhesion, or gas barrier properties, particularly when the heating temperature is 120 ° C. or lower. That tendency is strong. This is presumably because a portion not converted to silica remained.

In the present invention, alkali resistance, adhesion and gas barrier properties are improved by further subjecting such a silica layer to a gas discharge treatment. In the gas discharge treatment, the silica layer is treated by generating a gas discharge near the silica layer. The main type of gas discharge is glow discharge. Specifically, the glow discharge treatment is performed by, as described above, a silica-coated plastic film in which a polysilazane layer is ceramicized to form a silica layer (hereinafter, referred to as a silica-coated film). Is applied between electrodes arranged near the silica layer in a state of being placed in an atmosphere of a discharge gas to generate glow discharge.

This glow discharge treatment can be performed by either a batch system or a continuous system. Usually, such a glow discharge is performed under reduced pressure using a rare gas such as argon as a discharge gas, or a gas such as oxygen or nitrogen.
It can also be performed under atmospheric pressure. By such a gas discharge treatment, the alkali resistance, adhesion and gas barrier properties of the silica layer can be improved. However, ultraviolet rays are generated from the gas with the gas discharge, and this ultraviolet ray acts on the silica layer. This is considered to promote the conversion of the unreacted portion into silica.

Further, it is considered that the oxidation is promoted because the O ₂ radical directly attacks the polysilazane layer. After the silica layer is formed in this way to produce a silica-coated film, a thinner layer (for example, a conductive layer made of ITO) may be provided on the surface or the back side of the silica layer according to the application.

[0027]

EXAMPLE In this embodiment, a PE having a hard coat layer is used.
A method for producing a laminated film for a touch panel in which a silica layer and an ITO layer are laminated on a T film (see FIG. 3) will be described. FIG. 1 is a schematic configuration diagram of a thin film coating apparatus for coating polysilazane according to the present embodiment.

As shown in this figure, this thin film coating apparatus
A feeding section 10 for feeding a PET film (with a hard coat layer) wound in a roll shape, a coating section 20 for applying a polysilazane solution to the fed film,
The drying reaction tank 30 for forming a silica layer by drying and chemically reacting the applied polysilazane solution to form a ceramic layer and a winding unit 40 for winding a film having the silica layer formed on the surface into a roll form. It is configured.

The PET film has a thickness of 188 μm.
m, thickness of several μm made of acrylic UV curable resin
m coated with a hard coat layer of m. The coating unit 20 includes a gravure roller 21 which is immersed in a polysilazane solution placed in a tray and rotates and a doctor blade applied to the surface, and applies the polysilazane solution to the surface opposite to the hard coat layer of the film by a gravure method. . The coating thickness is about 55 nm.

The drying reaction tank 30 has an inlet drying section 31 for heating and drying the film coated with the polysilazane solution, and this layer is brought into contact with a nitrogen gas atmosphere containing triethylamine / water vapor to hydrolyze the remaining polysilazane components. A chemical reaction section 32 for decomposing and oxidizing, and an outlet section 33
It is composed of The inlet drying section 31 is provided with a hot-air jet nozzle 34, which blows hot air onto the polysilazane-coated surface of the passing film to heat and dry it. The temperature of the hot air is set at 50 ° C to 120 ° C in consideration of the heat resistance of the PET film itself and the hard coat layer.

The chemical reaction section 32 includes a reaction spray nozzle 3
5 are provided. Then, triethylamine vapor and air containing water vapor are sent into this. Each gas sent to the reaction spray nozzle 35 can be obtained by bubbling air into warm water or a triethylamine solution. By blowing the gas-phase contact gas in this manner, the chemical change of polysilazane progresses and the polysilazane is transformed into a silica layer.

The inside of the outlet 33 is heated by a heating device (not shown), and the film passing therethrough is exposed to an atmosphere of about 120 ° C. for 2.5 minutes. As a result, the polysilazane component remaining in the silica layer is hydrolyzed and oxidized, and most of the polysilazane component is silica (SiO ₂ ).
Becomes The silica-coated film having the siliceous layer formed on the surface in this way is once wound up in a roll shape at the winding section 40 and sent to the next step.

FIG. 2 is a diagram of a sputtering apparatus used for performing glow discharge processing and sputtering. The sputtering apparatus includes a feeding unit 60 for feeding a silica-coated film wound in a roll into a sealed container 50, a glow discharge box 70 for performing a glow discharge process on the fed film, and a sputtering method for forming a silica layer by sputtering. I on
A first sputtering chamber 80 and a second sputtering chamber 90 for forming a thin film of TO, a winding unit 100 for winding a film on which these thin films are laminated in a roll shape, and a rotating drum 110 for guiding the unwound film are provided. It is provided and configured.

A vacuum pump (not shown) is attached to the sealed container 50 so that the whole inside can be made high vacuum. The rotating drum 110 is provided in the vicinity of the center of the sealed container 50. After the fed-out film passes through the glow discharge box 70 and is transported on the outer peripheral surface of the rotating drum 110, the first sputtering is performed. Room 8
0 and the second sputtering chamber 90.

In the glow discharge box 70, a GND electrode 71 and a negative electrode 72 are provided on both sides of a film.
Are provided, and an external power supply Box 73 is connected to the electrode 7.
A DC voltage is applied between 1 and 72.
Further, a discharge gas (1: 1 mixture of Ar gas and O ₂ gas) is fed into the glow discharge box 70 from an external discharge gas source 74.

As a result, a glow discharge is generated near both surfaces of the film passing through the glow discharge box 70. In the power supply box 73, the electrodes 71 are supplied such that a predetermined current (10 to 100 mA) flows with the glow discharge.
-Adjust the voltage applied between 72. In the first sputtering chamber 80 and the second sputtering chamber 90, a thin film of ITO is formed on the silica layer by DC sputtering.

First and second sputtering chambers 80 and 90
Some of the cathodes 8 face the surface of the rotating drum 110.
1,91 were set up and ITO was set as a target
Ceramics are arranged. Further, a DC voltage is applied to the cathodes 81 and 91 from external DC power supplies 82 and 92. Also, the sputtering chambers 80 and 90
The inside is supplied with argon gas from inert gas supply sources 83 and 93.

Then, an ITO layer is formed on the surface of the silica layer of the film conveyed on the rotating drum 110. The laminated film after the formation of the ITO layer is wound by the winding unit 100. In the produced laminated film, as shown in FIG. 3, a hard coat layer was formed on one surface of a PET film, and a silica layer and an I
This is a structure in which TO layers are sequentially formed.

Then, this laminated film is processed and disposed via a spacer so as to face a glass substrate having an ITO layer formed on the surface, whereby a touch panel as shown in FIG. 3 is manufactured. At the time of processing this laminated film, since the resist ink is peeled off with an alkali solution, a printing step using various inks, and a foreign matter removal step on the ITO surface using various solvents, alkali resistance and adhesion of the laminated film are required. The laminated film produced according to the present example has alkali resistance and adhesion, and is suitable for such processing.

<Experiment and Consideration Regarding Glow Discharge Treatment> (Experiment 1) Based on the above embodiment, A was used as a discharge gas.
A 1: 1 mixed gas of r and O ₂ is supplied at a flow rate of 30 sccm and 50 s.
ccm, and Ar gas flow rate of 50 scc
In each case, the glow discharge was caused by changing the applied voltage in various ways, and the current flowing at that time was measured (sccm is standard ccmi).
nute).

FIG. 4 is a characteristic chart showing the relationship between current and voltage as a result of the measurement. From FIG. 4, it is understood that the current of the glow discharge can be adjusted to a desired current value by adjusting the applied voltage. (Experiment 2) Based on the above example, a PET film
A silica-coated film was prepared by applying a PHPS solution and performing a ceramic reaction by a chemical reaction using a gas-phase contact gas.

Using each of the silica-coated films thus produced, glow discharge treatment was performed by changing the type of discharge gas and the current. The type and flow rate of the discharge gas at the time of glow discharge are 50 scc for Ar gas.
50 sc for a mixed gas of m, Ar gas and O ₂ gas
cm and 30 sccm.

The glow discharge is 0, 10, 25, 40, 8
The measurement was performed at each current value such as 0, 130 mA. Using the silica-coated film subjected to the glow discharge treatment under various conditions as described above, an adhesion evaluation test, an alkali resistance test, an oxygen transmission coefficient measurement, and a measurement of a silica conversion rate by FTIR were performed.

Adhesion evaluation test: Surface of silica layer of each sample
With a cloth impregnated with ethanol at 400 g / cm ^Two
Rubbing repeatedly while applying pressure until the silica layer peels off.
Was measured. Table 1 shows this adhesion evaluation test.
5 is a table showing the results.

[0045]

[Table 1]

From the results shown in Table 1, the case where the glow discharge treatment was performed was the case where the glow discharge treatment was not performed (current 0 m).
It can be seen that the adhesion is excellent as compared with A). Also,
It can be seen that the adhesion increases as the current during glow discharge increases. On the other hand, it can be seen that the difference in adhesion due to the gas flow rate when using Ar gas + O ₂ gas is slight. This indicates that the silica conversion is more affected by the current than the gas flow rate.

When Ar gas is used, the adhesion is improved as in the case of using a mixed gas of Ar gas and O ₂ gas. The reason is that the conversion of silica by the glow discharge treatment is improved because ultraviolet rays (100 to 150 nm) are generated from argon with the glow discharge, and the ultraviolet rays act on the interface between the silica layer and the PET to increase the chemical bond. Suggest that it is.

Alkali resistance test: Each sample was immersed in a 2% aqueous sodium hydroxide solution (25 ° C.) for 1 minute, 5 minutes.
After 15 minutes, the state of the silica layer was examined. Table 2 is a table showing the results of the alkali resistance test.

[0049]

[Table 2]

The symbols in each column of Table 2 are one minute from the left,
The results after 5 minutes and 15 minutes have elapsed, and the meanings of the symbols A, B, C and B + are as follows. A: The silica layer does not peel off even if it is wiped with a waste cloth. B: The silica layer remains on the film, but peels off when wiped with a waste cloth. C: The silica layer peeled off and did not remain on the film.

B + is between A and B. The results in Table 2 also show the same tendency as the results in Table 1, and the results of glow discharge treatment show that alkali resistance is superior to those of glow discharge treatment, and the current during glow discharge. As the alkali resistance increases,
It can be seen that the difference in alkali resistance depending on the gas flow rate when using a mixed gas of Ar gas and O ₂ gas is slight.

Measurement of oxygen permeability coefficient:
PET film (thickness: 188μm)
And then perform glow discharge treatment after coating with polysilazane.
No sample, Ar gas + O _TwoUsing a gas mixture
Samples subjected to low discharge treatment (glow treatment current: 70 mA)
The oxygen permeability coefficient was measured for (Adhesion evaluation test,
An alkali resistance test was also performed).

The method for measuring the oxygen permeability coefficient is Mocon OX-
Performed based on ASTM D-3958 using TRAN200H. Table 3 is a table showing the results of the adhesion evaluation test, alkali resistance test, and measurement of oxygen permeability coefficient.

[0054]

[Table 3]

From this table, it can be seen that by performing the glow discharge treatment, the adhesion and the alkali resistance are improved, and the oxygen permeability coefficient is reduced (the oxygen barrier property is improved). Measurement of silica conversion rate by FTIR: A
Flow rate of 50 sccm using a mixed gas of r gas and O ₂ gas
And FTIR for glow discharge treatment at 30 sccm, and measurement results (chart)
The relative absorption intensities at 2180 cm ^-1 and 2250 cm ^-1 were determined from the above.

The absorption at 2180 cm ^-1 is due to the Si--H bond (n
= 1) or expansion and contraction of Si—H ₂ bond (n = 2), 225
The absorption at 0 cm ⁻¹ is due to the expansion and contraction of Si—H ₃ bonds (n = 3), and each absorption intensity indicates the remaining amount of these bonds in the silica layer and is an index indicating the silica conversion of polysilazane. Can be seen. FIG. 5 is a characteristic diagram showing the result, showing the relationship between the glow current and the relative absorption intensity.

In the figure, ● and ○ indicate that the gas flow rate is 30 sccm.
Is the case of ●, ● is 2250cm^-1Relative absorption of
Strength, ○ is 2180cm^-1Shows the relative absorption intensity of
You. Also, ▲ and △ indicate the case where the gas flow rate is 50 sccm.
▲ is 2250cm ^-1相 対 is the relative absorption intensity of
2180cm^-1Shows the relative absorption intensity. Figure 5
As a result, as the current during glow discharge increases, 2
250cm^-1And 2180cm^-1Has low relative absorption strength
(Ie, Si-H bond, Si-H_TwoBonding, Si-
H_ThreeTend to decrease the amount of bonds present)
You.

[0058] Also, than the relative absorption intensity of 2180 cm ^-1, also it is seen that they tend towards smaller relative absorption intensity of 2250 cm ^-1. This is because the Si—H ₃ bond is
This is considered to indicate that they are more easily broken by glow discharge treatment than H bonds or Si—H ₂ bonds. Next, a flow rate of 50 s was obtained using the above mixed gas of Ar gas and O ₂ gas.
From the FTIR measurement result chart of the sample subjected to glow discharge at ccm, 110 indicating the presence of Si—O bond
It examined the absorption of 3370cm ^-1 indicating the presence of 0 cm ^-1 and Si-N bonds.

Table 4 shows the results. Since the absorption peaks at these wavelengths are small and difficult to express as relative absorption intensities, they are qualitatively expressed.

[0060]

[Table 4]

[0061] a tendency to the Table 4 results, as current during the glow discharge increases, the absorption of the absorption is large 3370Cm ^-1 of 1100 cm ^-1 indicates the smaller tendency, i.e. improved silica conversion You can see that.

[0062]

As described above, according to the present invention, in the step of producing a silica-coated film, when a polysilazane layer is ceramicized to form a siliceous layer, glow discharge treatment is performed in addition to heat treatment. By performing the gas discharge treatment described above, even if the heat treatment is performed at a low temperature, a silica layer having good alkali resistance, adhesion and gas barrier properties can be formed.

In particular, when a plastic film made of a material with low heat resistance such as PET, PEN, PES, or PAR is used, or when the plastic film is previously coated with a layer made of a material with low heat resistance,
The effect of applying the present invention is great. Further, when the silica-coated film is used for applications requiring alkali resistance, adhesion, and gas barrier properties, such as a substrate of an electronic component, the practical effect is large.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a thin film coating apparatus for coating polysilazane according to an embodiment.

FIG. 2 is a schematic configuration diagram of a sputtering apparatus used for performing glow discharge processing and sputtering in an embodiment.

FIG. 3 is a configuration diagram of a touch panel according to an embodiment.

FIG. 4 is a characteristic diagram showing measurement results of Experiment 1.

FIG. 5 is a characteristic diagram showing measurement results of Experiment 2.

[Explanation of symbols]

 Reference Signs List 20 coating part 30 drying reaction tank 70 glow discharge box 71 GND electrode 72 negative electrode 74 discharge gas source 80, 90 sputtering chamber 81, 91 cathode 110 rotating drum

Continued on front page F-term (reference) 4F100 AA20B AD00B AK42 AK42A AK43A AK54A AK55A AK79B AT00 AT00A BA02 EH66 EJ42 EJ42B EJ54 EJ54B EJ61 EJ61B GB15 GB41 JB01 JL02 JL11 4K029 AA01A25A25A

Claims (7)

[Claims] The present invention is characterized in that a siliceous layer comprising a ceramic derived from a compound derived from polysilazane and subjected to a gas discharge treatment is laminated on at least one surface of the plastic film. Silica-coated plastic film. 2. The silica-coated plastic film according to claim 1, wherein the siliceous layer has a thickness of 10 to 300 nm. 3. The plastic film according to claim 1, wherein the plastic film is made of a material selected from polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, and polyarylate.
The silica-coated plastic film of the above. 4. A layer forming step of forming a polysilazane layer made of a compound derived from polysilazane on at least one surface of the plastic film, and the polysilazane layer formed in the layer forming step is chemically changed to be ceramicized. A method for producing a silica-coated plastic film, comprising: a ceramization step for converting the silica-based layer into a siliceous layer; 5. The discharge treatment step is characterized in that the platic film on which the siliceous layer is formed is treated by generating a glow discharge near the surface of the siliceous layer in an atmosphere of a discharge gas. The method for producing a silica-coated plastic film according to claim 4. 6. The method for producing a silica-coated plastic film according to claim 4, wherein in the ceramicizing step, the polysilazane layer is heated and then reacted in an atmosphere of water or steam. 7. The method for producing a silica-coated plastic film according to claim 4, wherein a heating temperature in the ceramicizing step is 120 ° C. or less.