JP2000239847A - Substrate heating device having cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To not only heat a substrate, but also to cool the substrate sufficiently. SOLUTION: A substrate heating device having a cooler comprises a soaking plate 10 excellent in heat conductivity to uniformly heat a substrate (a) under uniform temperature distribution, plural sets of heaters 25, 26 which are separately embedded on an outer peripheral side and an inner peripheral side of the soaking plate 10, a clearance part 24 which is formed between the heaters 25, 26 of the soaking plate 10 and free from any heaters 25, 26, and a cooler 13 which is on the back side of the soaking plate 10 to cool the substrate (a) through the soaking plate 10. This device is provided with a heating plate 1 on which the substrate (a) is placed, and the soaking plate 10 is arranged in contact with the back side of the heating plate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in the field of the manufacture of semiconductor devices and includes a cooler and a heater. In a process of forming or processing a semiconductor wafer, a substrate such as a semiconductor wafer is heated and cooled. And a substrate heating device with a cooler for maintaining the semiconductor wafer at a predetermined temperature.

[0002]

2. Description of the Related Art A substrate device with a cooler for heating a substrate such as a semiconductor wafer is provided with both a microheater (seed heater) for heating the semiconductor wafer and a cooler comprising a water cooling tube. The heater is arranged on the side closer to the heating plate on which the substrate to be heated is placed, and the cooler is arranged farther from the heating plate than the heater. Conversely, if the cooler is placed closer to the heating plate and the heater is placed farther from the heating plate, the substrate can be cooled efficiently, but when the substrate is heated, the cooling device side This is because heat transfer from the heater is interrupted by the space, and the substrate cannot be heated.

The heater is embedded in a spirally dug groove in a heat equalizing plate having good thermal conductivity for uniformly transmitting heat, and is fixed by means such as brazing. In addition, the water cooling tube that constitutes the cooler is spirally bent,
It is fixed by brazing while being in contact with the surface of the soaking plate where the heater is embedded.

[0004]

SUMMARY OF THE INVENTION Using such a substrate heating device with a cooler, a chemical vapor deposition (CVD) method is used.
When a metal film is formed on a substrate such as a silicon wafer by using (method) or the like, the film formation atmosphere is 300 to 500 ° C. At this ambient temperature, the substrate may be heated to about 500 ° C. or may be cooled to 50 ° C. or lower to form a film. Under these cooling conditions, it is necessary to always cool the substrate so that it becomes room temperature. At this time, water is caused to flow through a cooling pipe constituting the cooler, and the substrate is cooled via the soaking plate and the heating plate.

However, if there is a micro heater between the heating plate on which the substrate is mounted and the cooler, the heater is filled with an insulating material such as magnesia having a small thermal conductivity.
There is a problem that heat to be absorbed by the cooler is cut off from the heating plate side, and the substrate cannot be sufficiently cooled. An object of the present invention is to provide a substrate heating device with a cooler that can sufficiently cool not only the substrate but also the substrate in view of the problems in the conventional substrate heating device with a cooler.

[0006]

According to the present invention, in order to achieve the above object, a plurality of sets of heaters 25 and 26 are separated into an outer peripheral side and an inner peripheral side of a heat equalizing plate 10 having good thermal conductivity. And a gap portion 24 without the heaters 25 and 26 is provided between the heaters 25 and 26, and through the gap portion 24,
The heat can be transferred from the cooler 13 located behind the soaking plate 10 to the substrate placed on the heating plate 1.

The substrate heating apparatus with a cooler according to the present invention includes heaters 25 and 26 for heating the substrate a and a cooler 13 for cooling the substrate, and has a uniform temperature distribution to heat the substrate a uniformly. A heat equalizing plate 10 having good conductivity, and the heat equalizing plate 10
A plurality of sets of heaters 25 and 26 embedded separately on the outer peripheral side and the inner peripheral side of the heater, and a gap portion 24 formed between the heaters 25 and 26 of the heat equalizing plate 10 and having no heaters 25 and 26
And a cooler 13 behind the heat equalizing plate 10 for cooling the substrate a via the heat equalizing plate 10. This apparatus includes a heating plate 1 on which a substrate a is placed. A heating plate 10 is arranged behind the heating plate 1 so as to be in contact with the heating plate 1 and joined by brazing or the like.

[0008] In such a substrate heating apparatus with a cooler,
A gap portion where the cooler 13 is located behind the heaters 25 and 26 with respect to the substrate a mounted on the heating plate 1, but where the first and second heaters 25 and 26 are not provided at an intermediate portion of the heat equalizing plate 10. 24
Therefore, heat is conducted from the heating plate 1 side to the cooler 13 side through the gap portion 24, and the substrate a can be cooled reliably. Moreover, the heaters 25 and 26 and the cooler 13
Is provided so as to directly heat or cool the heat equalizing plate 10 having good heat conduction, so that the temperature distribution during heating and cooling can be made uniform, and the substrate a can be heated or cooled with a uniform temperature distribution. can do.

For example, the heaters 25 and 26
The first and second heaters 25, 2 arranged on the outer and inner circumferences of the
6, there is a gap portion 24 between the first and second heaters 25, 25 where no heaters 25, 26 are provided. These heaters 25 and 26 are embedded and fixed in grooves 27 provided spirally on the surface of the heat equalizing plate 10. In addition, the cooler 13 includes a spiral water-cooled tube 14 that is fixed in contact with the surface of the soaking plate 10 to which the heaters 25 and 26 are attached.

[0010]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings.
1 to 3 show a heating portion of a substrate heating apparatus with a cooler according to the present invention, in which a heating power source, a cooling water supply source, a reactive gas supply source, and the like are omitted.

A disk-shaped bottom plate 3 is fixed to an upper end of the pipe 4 in a flange shape, and a lower end of the pipe 4 is provided with a flange (not shown) attached to a port flange (not shown) of a vacuum chamber. Have been. By introducing the distal end of the pipe 4 into the port from the vacuum chamber and fixing the flange to the port flange, the substrate heating apparatus with a cooler is installed in the vacuum chamber.

A gas pipe 12 is disposed at the center of the pipe 4, and the gas pipe 12 passes through the centers of a heating plate 1 and a heat equalizing plate 10, which will be described later, and is fixed. Through this gas pipe 12, a reactive source gas such as a silane gas or a phosphine gas is supplied onto the film formation surface of the substrate a. The bottom plate 3
The bottom plate 3 and the cylindrical side plate 2 fitted around the outer periphery of the heating plate 1 in a state of being opposed to the disk-shaped heating plate 1 in parallel.
Are fixed to each other. The upper surface of the heating plate 1 is flat, and a substrate a (not shown) such as a semiconductor wafer to be heated is mounted thereon.

A heat equalizing plate 10 is superposed on the lower surface of the heating plate 1. The heat equalizing plate 10 is made of a copper plate or the like having good heat conductivity, and is fitted inside the side plate 2. . A spiral groove 27 is formed on the lower surface of the heat equalizing plate 10. Heaters 25 and 26 are embedded in the grooves 27,
It is fixed by means such as brazing. Furthermore, the heat equalizing plate 1
The heater supports 16 are radially attached to the lower surface of the heater 0 at 45 ° intervals, and the heater supports 16 are fixed to the lower surface of the heat equalizing plate 10 by screws 9.

FIG. 2 shows the arrangement of the heaters 25 and 26. The heaters 25 and 26 include a first heater 25 disposed on the outer peripheral side of the heat equalizing plate 10 and a second heater 26 disposed on the inner peripheral side of the heat equalizing plate 10. A gap portion 24 where the heaters 25 and 26 do not exist is provided between the portions of the heat equalizing plate 10 where the first and second heaters 25 and 26 are arranged. In this gap portion, a cylindrical rod-shaped guide pipe 11 is provided so as to penetrate the heating plate 1, the soaking plate 10 and the bottom plate 3, and a screw 9 for fixing the heater support 16 to the lower surface of the soaking plate 10 is provided. Is provided.

On the heat equalizing plate 10, thermocouples 27 and 28 are arranged as temperature measuring elements for measuring the temperature. In the illustrated embodiment, two thermocouples 27 and 28 are arranged. The first thermocouple 27 is arranged on the outer peripheral side of the heat equalizing plate 10 on which the first heater 25 is arranged, and the second thermocouple is
It is arranged on the inner peripheral side of the heat equalizing plate 10 on which the second heater 26 is arranged. These thermocouples 27 and 28 are used to control the heating and cooling temperatures when the substrate a placed on the heating plate 1 is heated and cooled.

As shown in FIG. 1, a water cooling tube 14 constituting a cooler 13 is attached to the lower surface of the heat equalizing plate 10 via the heater support 16. FIG. 3 shows the arrangement of the cooling pipes 14. The cooling pipe 14 connects the two cooling pipes 14 via a water cooling joint 15,
By sending water or other cooling liquid here, the heat equalizing plate 1
0 can be cooled. In order to enhance the cooling performance of the soaking plate 10, the cooling pipes 14 are provided with a soaking plate 10 and a heater support 16.
Are joined by brazing or the like.

The heat from the heating plate 1 is absorbed by the water cooling tube 14 through the soaking plate 10. In particular, as described above, the heat equalizing plate 10
Has a gap portion 24 without the heaters 25 and 26 at an intermediate portion between the outer circumference side and the inner circumference side, so that the gap portion 24 of the heat equalizing plate 10 becomes a heat passage, and the heat of the heating plate 1 side is Is absorbed smoothly. This makes it possible to quickly and surely cool the substrate a placed on the heating plate 1. In the above embodiment, the heaters 25 and 26 include two sets of heaters, but the number of the heaters 25 and 26 may be three or more. For example, in the case of three sets of heaters, two gap portions without heaters can be provided.

[0018]

As described above, according to the present invention, even when the cooler 13 is disposed behind the heaters 25 and 26, the heat equalizing plate 10 has the gap portion 24 without the heaters 25 and 26. Even if there is an insulating material such as magnesia contained in the heaters 25 and 26, heat transfer between the heating plate 1 and the cooler 13 is performed through the gap portion 24, so that the heat equalizing plate 1
0 and the substrate a on the heating plate 1 can be cooled smoothly and reliably via the heating plate 1. Thereby, the heating and cooling of the substrate a can be performed with good responsiveness, and accurate temperature control of the substrate a can be performed.

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view showing a main part of a substrate heating unit of a substrate heating apparatus with a cooler according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heating plate 10 Heat equalizing plate 13 Cooler 14 Water cooling tube 25 Heater 26 Heater 24 Gap part 27 Groove a Substrate

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shin Asaba 3-195-5 Namekawa Honcho, Hitachi City, Ibaraki Prefecture Inside Sukegawa Electric Industry Co., Ltd. No. 5 Sukegawa Electric Industry Co., Ltd. F term (reference) 4K030 CA04 KA24 KA26 4M104 DD44 HH20 5F045 AC01 EJ02 EJ09 EK08 EK22 EM02

Claims (6)

[Claims] A heater (25) for heating the substrate (a);
(26) and a cooler (13) for cooling a substrate, provided with a cooler (13) that cools the substrate and heats the substrate (a) uniformly with uniform temperature distribution.
0), a plurality of sets of heaters (25), (26) embedded separately on the outer peripheral side and inner peripheral side of the heat equalizing plate (10);
A gap (24) formed between the heaters (25) and (26) of the heat equalizing plate (10) and without the heaters (25) and (26), and a rear side of the heat equalizing plate (10). And a cooler (1) for cooling the substrate (a) via the soaking plate (10).
3) A substrate heating apparatus with a cooler, comprising: 2. A heating plate (1) on which a substrate (a) is placed, wherein a soaking plate (10) is arranged behind the heating plate (1). A substrate heating device with a cooler according to item 1. 3. The cooler (13) includes a heater (25),
The substrate heating device with a cooler according to claim 1 or 2, wherein the substrate heating device is provided also in a gap portion (24) having no (26). 4. The heaters (25) and (26) comprise first and second heaters (25) and (26) arranged on the outer and inner circumferences of the heat equalizing plate (10). Claim 2
4. The substrate heating device with a cooler according to any one of items 1 to 3. 5. The heater (25), (26) is embedded and fixed in a spiral groove (27) formed on the surface of the heat equalizing plate (10). ~ 4
The substrate heating device with a cooler according to any one of the above. 6. The cooler (13) includes a helical water cooling tube (14) abutting and fixed to a surface of the soaking plate (10) to which the heaters (25) and (26) are attached. The substrate heating device with a cooler according to any one of claims 2 to 5, wherein